TWM614066U - Heat dissipation module - Google Patents

Abstract

This creation discloses a heat dissipation module which is arranged on a heating element. The heat dissipation module includes a heat pipe assembly and a fin assembly. The heat pipe assembly includes at least one heat pipe, and the heat pipe has a first surface and a second surface opposite to each other. The first surface corresponds to the heating element, and the shape of the second surface is different from the first surface. The fin assembly includes a plurality of heat dissipation fins arranged at intervals. Each of the heat dissipation fins includes a bottom side and at least one heat dissipation hole. The bottom side includes an installation port for installing a heat pipe. The installation opening includes an upper edge, and the shape of the upper edge matches the shape of the second surface of the heat pipe. The heat dissipation hole is close to the upper edge of the installation opening.

Description

Cooling module

This creation is about a heat dissipation module.

With the rapid development of science and technology, the operating speed and performance of electronic devices continue to increase, and the heating power of internal electronic components also continues to rise. In order to prevent electronic components from failing due to overheating, sufficient heat dissipation performance must be provided. For example, a fan is installed inside the electronic device, and the air flow generated by the fan is used to take the heat generated by the electronic component out of the electronic device. Moreover, for electronic components with high heating power, such as a central processing unit or a graphics chip, a heat dissipation module is usually installed in conjunction with the airflow generated by a fan to reduce the temperature of these electronic components.

FIG. 1 is a partial schematic diagram of a conventional heat dissipation module, please refer to FIG. 1. The main components of the common heat dissipation module 9 include a heat pipe 91 and a heat dissipation fin 92. Wherein, the heat pipe 91 is arranged on a surface of the heating element. The bottom side of the radiating fin 92 has an opening that cooperates with the heat pipe 91 so that the opening of the radiating fin 92 can be welded to the heat pipe 91. Since the upper surface of the heat pipe 91 is flat, and the heat dissipation fins 92 and the heat pipe 91 are in a closed structure, the air flow brought by the heat dissipation fins 92 is dispersed to the two sides of the heat pipe 91. In other words, only a small amount of airflow will flow above the heat pipe 91, so that the heat dissipation module 9 cannot achieve good heat dissipation performance, and there is really room for improvement.

In view of the above-mentioned problems, the main purpose of this creation is to provide a heat dissipation module that uses a novel structure of heat pipe and heat dissipation fins to solve the problem of poor heat dissipation performance of the conventional heat dissipation module.

In order to achieve the above-mentioned purpose, the present invention provides a heat dissipation module which is arranged on a heating element. The heat dissipation module includes a heat pipe assembly and a fin assembly. The heat pipe assembly includes at least one heat pipe, and the heat pipe has a first surface and a second surface opposite to each other. The first surface corresponds to the heating element, and the shape of the second surface is different from the first surface. The fin assembly includes a plurality of heat dissipation fins arranged at intervals. Each of the heat dissipation fins includes a bottom side and at least one heat dissipation hole. The bottom side includes an installation port for installing a heat pipe. The installation opening includes an upper edge, and the shape of the upper edge matches the shape of the second surface of the heat pipe. The heat dissipation hole is close to the upper edge of the installation opening.

According to an embodiment of the present creation, the first surface is a flat surface. The second surface is an inclined surface, an arc surface, or a tapered surface.

According to an embodiment of the invention, the heat dissipation hole communicates with the installation port.

According to an embodiment of the invention, the heat dissipation hole is located at a turning point of the upper edge of the mounting opening and corresponds to a lowest point of the second surface. The lowest point is the position of the second surface closest to the first surface.

According to an embodiment of the present invention, the heat pipe assembly includes a plurality of heat pipes, and the heat pipes are arranged adjacently.

According to an embodiment of the invention, the heat dissipation hole communicates with the mounting opening, and the heat dissipation hole is located between two adjacent heat pipes.

According to an embodiment of the present invention, each of the heat dissipation fins respectively includes a flow guiding structure, which is arranged on the upper edge of the installation opening and is in contact with the second surface of the heat pipe.

According to an embodiment of the present invention, the shape of the flow guiding structure and the second surface are matched with each other.

According to an embodiment of the present invention, the heat dissipation module further includes a metal bottom plate having a third surface and a fourth surface opposite to each other. The third surface is in contact with the heating element, and the first surface of the heat pipe is connected to the fourth surface of the metal bottom plate.

According to an embodiment of the present invention, a bottom side of each of the heat dissipation fins is connected to the fourth surface of the metal bottom plate.

In summary, according to the heat dissipation module of this creation, because the shape of the second surface of the heat pipe is different from the first surface and matches the shape of the upper edge of the mounting opening of the heat dissipation fin, and the heat dissipation hole is close to the mounting opening, the air flow It can be guided close to the installation port and heat pipe to achieve better heat dissipation effect.

In order to let your review committee know more about the technical content of this creation, a preferred specific embodiment is described as follows.

2A and 2B are schematic diagrams of a heat dissipation module applied to a heating element according to an embodiment of the creation, FIG. 3 is an exploded schematic view of the heat dissipation module shown in FIG. 2A, and FIG. 4 is a schematic view of the heat dissipation module shown in FIG. 2A For the three-dimensional cross-sectional schematic diagram, please refer to FIG. 2A, FIG. 2B, FIG. 3, and FIG. 4. The heat dissipation module 1 of this embodiment can be applied to an electronic device, and is arranged inside the electronic device. The electronic device can be, for example, but not limited to, a computer, or a server, and the electronic device can include a heating element H. Among them, the heating element H may be, for example, but not limited to, elements such as a central processing unit (CPU), an image processing unit (GPU), or a hard disk drive. In this embodiment, the heat dissipation module 1 is disposed on the heating element H to dissipate the heat generated by the heating element H.

In this embodiment, the heat dissipation module 1 includes a heat pipe assembly 10 and a fin assembly 20. The heat pipe assembly 10 has at least one heat pipe 11, and the fin assembly 20 may have a plurality of heat dissipation fins 21. In other words, the heat dissipation module 1 includes at least one heat pipe 11 and a plurality of heat dissipation fins 21. Among them, the heat pipe assembly 10 of this embodiment is an example with a plurality of heat pipes 11, and the plurality of heat pipes 11 are arranged adjacently. In other embodiments, a plurality of heat pipes 11 can also be arranged at intervals, which is not limited in the present invention. As shown in FIG. 3, each heat pipe 11 has a first surface 111 and a second surface 112 opposite to each other. The first surface 111 corresponds to the heating element H, that is, the first surface 111 faces the heating element H, and the opposite side is the second surface 112. In this embodiment, the shape of the second surface 112 of the heat pipe 11 is different from the first surface 111. Specifically, the first surface 111 may be a plane, and the second surface 112 may have a non-planar structure. For example, the second surface 112 may not be parallel to the first surface 111, and may be a non-planar structure such as an inclined surface, a curved surface, or a tapered surface, which can achieve the effect of guiding the airflow direction generated by the fan, which will be further described later. .

In addition, each heat dissipation fin 21 includes a bottom side 213, and the bottom side 213 includes a mounting opening 211 (as shown in FIG. 3) for installing the heat pipe 11. That is, the heat pipe assembly 10 can be assembled in the installation port 211. In addition, each heat dissipation fin 21 further includes at least one heat dissipation hole 212, and the heat dissipation hole 212 is close to the installation opening 211.

The mounting opening 211 includes an upper edge 2111, and the shape of the upper edge 2111 matches the shape of the second surface 112 of the heat pipe 11. Since the shape of the installation opening 211 is matched with the configuration of the heat pipe 11, after the heat pipe assembly 10 is installed in the installation opening 211, the second surface 112 of the heat pipe 11 is attached to the upper edge 2111 of the installation opening 211. In addition, the heat dissipation fins 21 are arranged in the heat pipe assembly 10 at intervals. In this embodiment, the heat pipes 11 may be arranged adjacent to each other along a first direction X. As shown in FIG. 3, the long axis direction of the heat pipes 11 and the first direction X are parallel to each other. The heat dissipation fins 21 can be arranged at intervals along a second direction Y, and the first direction X and the second direction Y are perpendicular to each other.

In an embodiment, the heat pipe assembly 10 can be directly disposed on the heating element H. That is, the first surface 111 of the heat pipe 11 can be connected to the heating element H, so that the heat generated by the heating element H is directly transferred to the heat pipe 11.

Preferably, the heat dissipation module 1 of this embodiment further includes a metal bottom plate 30, such as a copper plate with good thermal conductivity and relatively low cost. The metal bottom plate 30 has a third surface 31 and a fourth surface 32 opposite to each other. The third surface 31 is in contact with the heating element H, and the first surface 111 of the heat pipe 11 is connected to the fourth surface 32 of the metal bottom plate 30 so that the heat generated by the heating element H can be conducted to the heat pipe 11 through the metal bottom plate 30. Preferably, the bottom side 213 of the heat dissipation fin 21 is also connected to the fourth surface 32 of the metal bottom plate 30 so that heat energy can be conducted to the heat pipe 11 through the metal bottom plate 30 to improve the heat dissipation efficiency. In addition, the heat pipe 11 and the heat dissipation fin 21 can preferably be connected to the metal bottom plate 30 by welding, and the heat dissipation fin 21 can also be connected to the heat pipe assembly 10 by welding.

FIG. 5 is a schematic diagram of the air flow direction of the heat dissipation module shown in FIG. 4, please refer to FIG. 5. It should be noted that the electronic device applied to the heat dissipation module 1 of this embodiment is equipped with a fan (not shown), and the air flow generated by the fan can be used to bring the heat generated by the heating element H out of the electronic device. outer. Since the second surface 112 (that is, the windward surface) of the heat pipe 11 of this embodiment has a different shape from the first surface 111, it has a non-planar structure, and the heat dissipation fins 21 are designed with heat dissipation holes 212 to guide airflow It flows to the heat dissipation hole 212 along the non-planar structure. In addition, each of the heat dissipation fins 21 has at least one heat dissipation hole 212, which can further enable airflow to flow between the heat dissipation fins 21, and further enhance the effect of the heat energy transferred to the heat pipe 11. In addition, the heat dissipation hole 212 of this embodiment is close to the upper edge 2111 of the installation opening 211 (as shown in FIG. 3 ), so that the airflow can be guided close to the installation opening 211 and the heat pipe 11. Preferably, the heat dissipation hole 212 can communicate with the mounting opening 211 so that the guided airflow can contact the second surface 112 of the heat pipe 11 to achieve a better heat dissipation effect.

In addition, the present invention does not limit the configuration of the second surface 112. As mentioned above, it may be an inclined surface, a curved surface, or a tapered surface. Preferably, the configuration of the second surface 112 can be matched with the position of the heat dissipation hole 212 to achieve a better guiding effect. In this embodiment, because the second surface 112 of each heat pipe 11 is a tapered surface, and the heat pipe assembly 10 is arranged adjacently by a plurality of heat pipes 11, the heat pipe assembly 10 forms a jagged surface corresponding to the second surface 112. The upper edge 2111 of the mounting opening 211 corresponding to the second surface 112 is a matching jagged surface. The heat dissipation hole 212 is located at the turning point T of the jagged surface of the upper edge 2111 of the mounting opening 211, and corresponds to a lowest point L of the second surface 112 (as shown in FIGS. 3 and 4), and the lowest point L is the second surface 112 is the position closest to the first surface 111. For example, the second surface 112 of this embodiment is a tapered surface, and the center is the highest point, and its two sides are the lowest points L. In other words, in this embodiment, most of the lowest point L is located between two adjacent heat pipes 11. Preferably, the heat dissipation hole 212 may be located between two adjacent heat pipes 11. In other embodiments, if the second surface 112 is an upwardly convex arc surface, the two sides of the second surface 112 are also the lowest points, and the heat dissipation hole 212 is also located between two adjacent heat pipes 11.

Preferably, each of the heat dissipation fins 21 respectively includes a flow guiding structure 214, which is disposed on the upper edge 2111 of the mounting opening 211, and is in contact with the second surface 112 of the heat pipe 11. Specifically, the flow guiding structure 214 is a structure extending outward from the heat dissipation fin 21 and is adjacent to the upper edge 2111 of the mounting opening 211 (as shown in FIG. 3 ). In other words, the extending direction of the air guiding structure 214 faces toward the outside or the adjacent heat dissipation fins 21. The shape of the flow guiding structure 214 also matches the shape of the upper edge 2111 of the installation opening 211. As shown in FIG. 4, in this embodiment, the diversion structure 214 is composed of a plurality of adjacent conical covers 2141, so that the entire diversion structure 214 is also in a sawtooth shape. In addition, the heat dissipation hole 212 is located at the turning point of the zigzag-shaped flow guiding structure 214 and is located between two adjacent conical covers 2141. In other words, there is a heat dissipation hole 212 between two adjacent tapered covers 2141. Preferably, the flow guiding structure 214 and the adjacent heat dissipation fins 21 can be welded to each other or integrally formed. As shown in FIG. 5, the airflow on the heat dissipation fin 21 can be guided to the heat dissipation hole 212 by the tapered cover 2141 of the flow guiding structure 214. The airflow passing through the heat dissipation hole 212 can also be further guided to the outside or adjacent heat dissipation fins 21 to achieve a better heat dissipation effect. Since the shape of the upper edge 2111 of the installation opening 211 matches the shape of the second surface 112 of the heat pipe 11, the shape of the flow guiding structure 214 also matches the second surface 112. With the flow guiding structure 214 extending outward and matching with the second surface 112 in configuration, it is more convenient for the manufacturer to assemble the heat dissipation fins 21 to the heat pipe 11 by welding.

In summary, the heat dissipation module according to this creation includes a heat pipe assembly and a fin assembly. The heat pipe assembly includes at least one heat pipe, and the first surface of the heat pipe corresponds to the heating element, and the shape of the second surface is different from the first surface. For example, the first surface can be a flat surface, and the second surface can be an inclined surface, a curved surface, or a tapered surface. Non-planar structures such as surfaces. The fin assembly includes a plurality of heat dissipation fins, and the heat dissipation fin includes a bottom side and at least one heat dissipation hole, and the bottom side includes a mounting hole. Because the shape of the second surface of the heat pipe is different from the first surface and matches the shape of the upper edge of the mounting opening of the heat dissipation fins, and the heat dissipation hole is close to the mounting opening, the airflow generated by the fan can be guided close to the mounting opening and At the heat pipe, in order to achieve a better heat dissipation effect.

It should be noted that many of the above-mentioned embodiments are given as examples for the convenience of description, and the scope of rights claimed in this creation should be subject to the scope of the patent application, and not limited to the above-mentioned embodiments.

1: Cooling module 10: Heat pipe assembly 11: Heat pipe 111: first surface 112: second surface 20: Fin assembly 21: cooling fins 211: Installation port 2111: upper edge 212: cooling hole 213: bottom side 214: Diversion structure 2141: Conical cover 30: Metal bottom plate 31: third surface 32: fourth surface 9: Cooling module 91: heat pipe 92: cooling fins H: heating element L: lowest point T: turning point X: first direction Y: second direction

FIG. 1 is a partial schematic diagram of a conventional heat dissipation module. 2A and 2B are schematic diagrams of a heat dissipation module applied to a heating element according to an embodiment of the creation. FIG. 3 is an exploded schematic diagram of the heat dissipation module shown in FIG. 2A. FIG. 4 is a three-dimensional cross-sectional schematic diagram of the heat dissipation module shown in FIG. 2A. FIG. 5 is a schematic diagram of the air flow direction of the heat dissipation module shown in FIG. 4.

1: Cooling module

10: Heat pipe assembly

11: Heat pipe

112: second surface

20: Fin assembly

21: cooling fins

212: cooling hole

213: bottom side

214: Diversion structure

30: Metal bottom plate

32: fourth surface

Claims (10)

A heat dissipation module is arranged on a heating element, and the heat dissipation module includes: A heat pipe assembly including at least one heat pipe having a first surface and a second surface opposite to each other, the first surface corresponding to the heating element, and the second surface having a shape different from the first surface; and A fin assembly includes a plurality of radiating fins spaced apart from each other, and each of the radiating fins includes: A bottom side, including a mounting opening for arranging the heat pipe, the mounting opening includes an upper edge, the shape of the upper edge matches the shape of the second surface of the heat pipe; and At least one heat dissipation hole, the heat dissipation hole is close to the upper edge of the mounting opening. The heat dissipation module according to claim 1, wherein the first surface is a flat surface, and the second surface is an inclined surface, an arc surface, or a tapered surface. The heat dissipation module according to claim 1, wherein the heat dissipation hole is communicated with the installation port. The heat dissipation module according to claim 3, wherein the heat dissipation hole is located at a turning point of the upper edge of the mounting opening and corresponds to a lowest point of the second surface, and the lowest point is the second surface closest to the The location of the first surface. The heat dissipation module according to claim 1, wherein the heat pipe assembly includes a plurality of heat pipes, and the heat pipes are arranged adjacently. The heat dissipation module according to claim 5, wherein the heat dissipation hole is communicated with the mounting opening, and the heat dissipation hole is located between two adjacent heat pipes. The heat dissipation module according to claim 1, wherein each of the heat dissipation fins respectively includes a flow guiding structure, which is arranged on the upper edge of the mounting opening and is in contact with the second surface of the heat pipe. The heat dissipation module according to claim 7, wherein the shape of the air guiding structure and the second surface are matched with each other. The heat dissipation module as described in claim 1, further including: A metal bottom plate has a third surface and a fourth surface opposite to each other. The third surface is in contact with the heating element. The first surface of the heat pipe is connected to the fourth surface of the metal bottom plate. The heat dissipation module according to claim 9, wherein the bottom side of each heat dissipation fin is connected to the fourth surface of the metal bottom plate.

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