TWM613699U - Retainer ring - Google Patents

Abstract

A retainer ring having a top surface, a bottom surface and an inner side surface is provided. The inner surface is located between the top surface and the bottom surface. The inner side surface is perpendicular to the top surface or the bottom surface to be suitable for fixing a wafer. The retainer ring includes a ring body and a polish-resistant layer. The polish-resistant layer covers the ring body. The retainer ring may have better abrasion resistance, a longer service life, and may improve the process stability in application. In addition, the retainer ring may be reproduced and the cost in use may be reduced.

Description

Grinding ring

The present invention relates to a grinding ring, and particularly to a grinding ring suitable for chemical mechanical grinding or other semiconductor manufacturing processes.

The existing grinding rings are mostly made of engineering plastics (such as PPS) and ceramic polyether ether ketone plates (ceramic PEEK). While the wafer is being polished, the polishing ring itself is also subject to wear. Therefore, the grinding ring must be replaced after processing a certain number of pieces or after a certain period of use. The existing grinding ring is often regarded as a consumable that must be replaced regularly and cannot be regenerated and reused.

The present invention provides a grinding ring, which can have better abrasion resistance, a longer service life, and can improve the process stability in application. In addition, the grinding ring can be remanufactured and the use cost can be reduced.

The grinding ring created by the new model has a top surface, a bottom surface and an inner side surface. The inner surface is located between the top surface and the bottom surface. The inner side surface is perpendicular to the top surface or the bottom surface to be suitable for fixing the wafer. The grinding ring includes a ring body and a wear-resistant layer. The wear-resistant layer covers the ring body.

In an embodiment of the present invention, the material of the ring body includes aluminum.

In an embodiment of the invention, the wear-resistant layer includes an intrinsic carbon film.

In an embodiment of the present invention, the wear-resistant layer is located at least on the bottom surface of the grinding ring.

In an embodiment of the present invention, the wear-resistant layer completely covers the ring body.

In an embodiment of the present invention, the surface roughness of the wear-resistant layer is less than or equal to 0.03 microns.

In an embodiment of the present invention, the Vickers hardness of the wear-resistant layer is between 1500 and 2500.

In an embodiment of the present invention, the friction coefficient of the wear-resistant layer is between 0.1 and 0.25.

In an embodiment of the present invention, the thickness of the wear-resistant layer is between 0.1 and 0.3 microns.

In an embodiment of the present invention, the grinding ring further has a plurality of grooves and a plurality of embedded holes. A plurality of grooves are located on the bottom surface. A plurality of recessed holes are located on the top surface.

Based on the above, since the grinding ring of the present invention includes a wear-resistant layer, it can have better abrasion resistance, longer service life, and improved process stability in application. In addition, the grinding ring can be remanufactured and the use cost can be reduced.

The new creative concept can be embodied in many different forms and should not be regarded as limited to the exemplary embodiments presented here. Rather, these exemplary embodiments are provided so that this disclosure will be complete and complete, and will fully express the creative concept of the present invention to those with ordinary knowledge in the technical field of the case. However, it should be understood that the new creative concept is not limited to the specific form of disclosure. On the contrary, the new creative concept will cover all modifications, equivalents and substitutes that fall within the spirit and scope of the new creative concept. Throughout the specification and the drawings, the same reference numerals represent the same elements. In the drawings, in order to make the creative concept of the present invention clear, the size of the structure is enlarged.

In the drawings, the shape shown can be modified as desired according to manufacturing technology and/or tolerances. Therefore, the exemplary embodiments should not be viewed as being limited to the specific shape of the illustrated area.

Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings commonly understood by those with ordinary knowledge in the technical field to which the creation of the new model belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having meaning consistent with the meaning in the relevant technical context, and should not be interpreted in an idealized or overly formal sense, unless in This is clearly defined as such.

Fig. 1 is a schematic top view of a grinding ring according to an embodiment of the invention. Fig. 2 is a schematic bottom view of a grinding ring according to an embodiment of the invention. Fig. 3 is a schematic partial bottom view of a grinding ring according to an embodiment of the invention. Fig. 4 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention. Fig. 5 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention. Fig. 6 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention. FIG. 3 may be an enlarged view corresponding to area C in FIG. 2. Fig. 4 may be a schematic diagram of a corresponding cross-section corresponding to the A-A' cross-section in Fig. 1. Fig. 5 may be a schematic diagram of a corresponding cross-section corresponding to the B-B' cross-section in Fig. 2.

Please refer to FIGS. 1 to 6, the grinding ring 100 has a top surface 101, a bottom surface 102 and an inner surface 103. The inner surface 103 is located between the top surface 101 and the bottom surface 102. The inner side surface 103 is perpendicular to the top surface 101 or the bottom surface 102. The inner surface 103 is suitable for fixing a wafer (not directly shown). The method of fixing the wafer by the polishing ring (the appearance may be similar to the polishing ring 100) is commonly used in the semiconductor manufacturing process (such as: chemical mechanical polishing process (CMP process); but not limited), so it is not applied here. Go into details.

In an embodiment, the grinding ring 100 may also be called a retaining ring, a fixing ring, a buckle ring or a snap ring, but the invention is not limited to this.

In this embodiment, the bottom surface 102 of the grinding ring 100 may have multiple grooves 120. The groove 120 extends outward from the inner side surface 103 (ie, in the direction of the outer side surface 104). The pattern or direction of the groove 120 can be adjusted according to design requirements, and is not limited in the creation of the present invention. In addition, for clarity, not all the grooves 120 are marked one by one in FIG. 2.

In one embodiment, during the grinding process or the polishing process, the groove 120 can be used as a channel through which the grinding liquid or the polishing liquid flows.

In this embodiment, the groove 120 has a depression 123 near the inner side surface 103, but the invention is not limited to this.

In this embodiment, the top surface 101 of the grinding ring 100 may have a plurality of insertion holes 110. The grinding ring 100 can be directly or indirectly mounted on the grinding head (not shown) through the insertion hole 110. The installation method of the polishing ring (the appearance may be similar to the polishing ring 100) and the polishing head is commonly used in the semiconductor manufacturing process (such as: Chemical Mechanical Polishing process (CMP process); but not limited), so I will not repeat it here. . The shape or configuration of the embedding hole 110 can be adjusted according to design requirements, and is not limited in the creation of the present invention.

In an embodiment, the embedded hole 110 may be a screw hole, but the invention is not limited to this.

In this embodiment, the embedded hole 110 may include a first embedded hole 111 and a second embedded hole 112. The diameter of the first recessed hole 111 may be larger than the diameter of the second recessed hole 112, but the invention is not limited to this. In addition, for clarity, not all the first insertion holes 111 and the second insertion holes 112 are indicated one by one in FIG. 1.

In this embodiment, in the normal direction of the top surface 101 or the bottom surface 102 (ie, a direction perpendicular to the top surface 101 or the bottom surface 102), the recessed hole 110 does not substantially overlap the groove 120.

In this embodiment, the top surface 101 of the grinding ring 100 may have an annular groove 130, but the invention is not limited to this. The insertion hole 110 may be located in a range surrounded by the annular groove 130.

The grinding ring 100 includes a ring body 140 and a wear-resistant layer 150. The wear-resistant layer 150 covers the ring body 140.

In this embodiment, the material of the ring body 140 includes metal. In one embodiment, the material of the ring body 140 is aluminum.

In this embodiment, the wear-resistant layer 150 includes an intrinsic carbon film (Intrinsic Carbon Film; ICF). In this way, if the wear-resistant layer 150 is worn out after multiple grindings, it can be reproduced by coating to achieve the purpose of regeneration and/or reuse.

In this embodiment, the wear-resistant layer 150 is at least located on the bottom surface 102 of the grinding ring 100. In other words, the bottom surface 102 of the grinding ring 100 may be at least a part of the wear-resistant layer 150.

In this embodiment, the wear-resistant layer 150 completely covers the ring body 140, but the invention is not limited to this.

In this embodiment, the surface roughness of the wear-resistant layer 150 is less than or equal to 0.03 microns (micrometer; µm). Compared to titanium nitride (TiN) films or other films formed by sputtering methods (such as Unbalanced Magnetron Sputtering, but not limited), those formed by intrinsic carbon films The surface roughness of the wear-resistant layer 150 is relatively small.

In an embodiment, the surface roughness of the wear-resistant layer 150 may be measured at the bottom surface 102 of the grinding ring 100. In addition, the surface roughness can be measured by an atomic force microscope (AFM), but the invention is not limited to this.

In this embodiment, the Vickers hardness (HV) of the wear-resistant layer 150 is between 1500 and 2500. In this way, the service life of the grinding ring 100 can be increased.

In this embodiment, the friction coefficient of the wear-resistant layer 150 is between 0.1 and 0.25. The friction coefficient can be tested by the pin-on-disk abrasion test method of commonly used standards (such as ASTM G99 standard, but not limited), for example.

In this embodiment, the thickness 151 of the wear-resistant layer 150 is between 0.1 and 0.3 microns.

In summary, the grinding ring created by the new invention can have better abrasion resistance, longer service life, and improved process stability in application. In addition, the grinding ring can be remanufactured and the use cost can be reduced.

100: Grinding ring 101: top surface 102: Bottom 103: inside 104: Outer side 110: recessed hole 111: first recessed hole 112: second recessed hole 120: groove 123: sunken 130: Ring groove 140: ring body 150: wear layer 151: Thickness C, D: area

Fig. 1 is a schematic top view of a grinding ring according to an embodiment of the invention. Fig. 2 is a schematic bottom view of a grinding ring according to an embodiment of the invention. Fig. 3 is a schematic partial bottom view of a grinding ring according to an embodiment of the invention. Fig. 4 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention. Fig. 5 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention. Fig. 6 is a schematic cross-sectional view of a grinding ring according to an embodiment of the invention.

100: Grinding ring

101: top surface

103: inside

104: Outer side

110: recessed hole

111: first recessed hole

112: second recessed hole

130: Ring groove

Claims (10)

A grinding ring has a top surface, a bottom surface and an inner side surface, the inner side surface is located between the top surface and the bottom surface, the inner side surface is perpendicular to the top surface or the bottom surface so as to be suitable for fixing a wafer, and the Grinding ring includes: A ring body; and A wear-resistant layer covers the ring body. The grinding ring according to claim 1, wherein the material of the ring body includes aluminum. The grinding ring according to claim 1, wherein the wear-resistant layer includes an intrinsic carbon film. The grinding ring according to claim 1, wherein the wear-resistant layer is located at least on the bottom surface of the grinding ring. The grinding ring according to claim 4, wherein the wear-resistant layer completely covers the ring body. The grinding ring according to claim 1, wherein the surface roughness of the wear-resistant layer is less than or equal to 0.03 microns. The grinding ring according to claim 1, wherein the Vickers hardness of the wear-resistant layer is between 1500 and 2500. The grinding ring according to claim 1, wherein the friction coefficient of the wear-resistant layer is between 0.1 and 0.25. The grinding ring according to claim 1, wherein the thickness of the wear-resistant layer is between 0.1 and 0.3 microns. The grinding ring as described in claim 1, further having: A plurality of grooves located on the bottom surface; and A plurality of embedded holes are located on the top surface.

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