TWM613580U - Laser processing system capable of quickly positioning robotic arm to three-dimensional coordinate system - Google Patents
Laser processing system capable of quickly positioning robotic arm to three-dimensional coordinate system Download PDFInfo
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Abstract
一種可快速將機械手臂定位到三維座標系統的雷射加工系統,包含一雷射加工機,用以發射雷射光束以進行加工之用;一校正模組安裝在該雷射加工機上的一加工振鏡的外部;該校正模組的下表面安裝三個探針為可伸縮的結構;該三個探針的擺設面形成二維平面;在測試時係使得該三個探針的針尖位在同一水平面上,且該校正模組也在水平面上;一機械手臂包含一夾持件用於夾持工件,使得該雷射加工機可將雷射光投射在該工件上;測試時該夾持件係夾持一測試板,並令該測試板近接該三個探針而頂抵該三個探針;應用各該探針的壓縮長度調整該機械手臂之該夾持件夾持該測試板的角度,重複進行上述的測試及角度調整,直到該三個探針受到頂抵時其壓縮長度相同,則表示該測試板已在水平面。 A laser processing system capable of quickly positioning a robot arm to a three-dimensional coordinate system, including a laser processing machine for emitting laser beams for processing; a correction module installed on a laser processing machine Process the outside of the galvanometer; the lower surface of the correction module is equipped with three probes to form a retractable structure; the placement surface of the three probes forms a two-dimensional plane; the needle tip of the three probes is On the same level, and the calibration module is also on the level; a mechanical arm includes a clamping piece for clamping the workpiece, so that the laser processing machine can project the laser light on the workpiece; the clamping during testing The component clamps a test board, and makes the test board abut the three probes close to the three probes; the compression length of each probe is used to adjust the clamping piece of the robot arm to clamp the test board Repeat the above-mentioned test and angle adjustment until the compressed length of the three probes is the same when they are pressed, which means that the test board is already on the horizontal plane.
Description
本創作係有關於雷射加工,尤其是一種可快速將機械手臂定位到三維座標系統的雷射加工系統。 This creative department is about laser processing, especially a laser processing system that can quickly position the robotic arm to the three-dimensional coordinate system.
雷射加工機是應用雷射光束經過透鏡的處理達到高度聚焦後,在雷射加工物件上應用雷射光束達到加工、除料、切割或雕刻的目的。一般將加工物件置於一滑台上。再應用馬達系統控制該滑台的移動及轉動,將該滑台移動到適合加工的位置以進行加工作業。其中主要是由電腦裝置先計算加工座標,再控制該雷射加工機進行加工。 The laser processing machine uses the laser beam to be processed by the lens to achieve a high degree of focus, and then the laser beam is applied to the laser processing object to achieve the purpose of processing, cutting, cutting or engraving. Generally, the processing object is placed on a sliding table. The motor system is then used to control the movement and rotation of the sliding table, and move the sliding table to a position suitable for processing for processing operations. Among them, the computer device first calculates the processing coordinates, and then controls the laser processing machine to perform processing.
但是在很多的應用中係將加工物件置於一機械手,但是因為機械手的移動空間其範圍相當大,再者機械手本身的定位也並非固定著,所以當機械手夾持加工物件時,所夾持物件的座標跟雷射振鏡所發射的雷射座標存在很大的誤差,如果不對此誤差進行校正,則電腦裝置所計算的座標與雷射加工機的實際加工點會有誤差,所以最後在加工物件上所產生的圖形會出現扭曲,而使得加工物件最後的加工圖案無法符合預期的結果 However, in many applications, the processing object is placed in a robot, but because the moving space of the robot is quite large, and the positioning of the robot itself is not fixed, so when the robot grips the processing object, There is a big error between the coordinates of the clamped object and the laser coordinates emitted by the laser galvanometer. If this error is not corrected, there will be errors between the coordinates calculated by the computer device and the actual processing point of the laser processing machine. Therefore, the final graphics generated on the processed object will be distorted, and the final processed pattern of the processed object cannot meet the expected result
故本案希望提出一種嶄新的可快速將機械手臂定位到三維座標系統的雷射加工系統,以解決上述先前技術上的缺陷。 Therefore, this case hopes to propose a new laser processing system that can quickly position the robotic arm to the three-dimensional coordinate system to solve the above-mentioned defects in the prior art.
所以本創作的目的係為解決上述習知技術上的問題,本創作中提出一種可快速將機械手臂定位到三維座標系統的雷射加工系統,係可以快速定 位機械手臂所夾持的測試板的水平方位、以及將該測試板在該水平方位下可以對齊雷射加工機的加工振鏡的座標,並且經由攝影焦距決定裝置決定該加工振鏡的焦距及焦點。所以在實現物件加工時,可以應用本案所量測的測試板水平方位、對齊該水平方位下該測試板的座標、該加工振鏡的焦距及焦點,而可以很快速的將該機械手臂調整到所需要的位置,使得該機械手臂在實際工作時所夾持的工件可以得到精準的雷射加工。 Therefore, the purpose of this creation is to solve the above-mentioned conventional technical problems. In this creation, a laser processing system that can quickly position the robotic arm to the three-dimensional coordinate system is proposed. The horizontal orientation of the test board held by the robotic arm, and the test board can be aligned with the coordinates of the processing galvanometer of the laser processing machine in this horizontal orientation, and the focal length of the processed galvanometer is determined by the camera focal length determining device. focus. Therefore, when processing the object, you can use the horizontal orientation of the test board measured in this case, align the coordinates of the test board in the horizontal orientation, and the focal length and focus of the processed galvanometer, and you can quickly adjust the robotic arm to The required position enables precise laser processing of the workpiece clamped by the robotic arm in actual work.
為達到上述目的本創作中提出一種可快速將機械手臂定位到三維座標系統的雷射加工系統,包含一雷射加工機,用以發射雷射光束以進行加工之用;其中各該雷射加工機配置有加工振鏡用於在X、Y、Z軸方向移動到所需要的位置,以將雷射光投射出去而達到加工的目的;一雷射加工控制器連接該雷射加工機;該雷射加工控制器用於接收所欲加工之座標資料,並控制對應之雷射加工機,以在該工件上進行所需要的加工作業;一校正模組安裝在該雷射加工機的加工振鏡的下方;其中該校正模組的中心有一空洞,該空洞對準該加工振鏡的下方,使得由該加工振鏡所發出的雷射可以經過該空洞而投射在所欲加工的物件上;該校正模組的下表面安裝三個探針,其為可伸縮的結構;該三個探針的擺設面形成二維平面;在測試時係使得該三個探針的針尖位在同一水平面上,且該校正模組也在水平面上;一機械手臂,該機械手臂包含一夾持件,在工作時該夾持件用於夾持工件,使得該雷射加工機的加工振鏡可以將雷射光投射在該工件上;在測試時,該機械手臂係應用該夾持件夾持一測試板以作為決定水平面之用;其中該測試板的上表面為一平坦的上平板;以及其中在測試時該機械手臂應用該夾持件夾持該測試板,並令該測試板近接該校正模組下表面的該三個探針;該三個探針受到該測試板的頂抵時會適當地往上縮;其中應用各該探針的壓縮長度調整該機械手臂之該夾持件的角度,而改變該夾持件夾 持該測試板的角度,重複進行上述的測試及角度調整,直到該三個探針受到頂抵時其壓縮長度相同,則表示該測試板已在水平面。 In order to achieve the above purpose, this creation proposes a laser processing system that can quickly position the robotic arm to the three-dimensional coordinate system, including a laser processing machine for emitting a laser beam for processing; wherein each of the laser processing The machine is equipped with a processing galvanometer to move to the required position in the X, Y, and Z axis directions to project the laser light to achieve the purpose of processing; a laser processing controller is connected to the laser processing machine; The laser processing controller is used to receive the coordinate data to be processed and control the corresponding laser processing machine to perform the required processing operations on the workpiece; a calibration module is installed in the processing galvanometer of the laser processing machine Below; Wherein the center of the correction module has a hole, the hole is aligned with the bottom of the processing galvanometer, so that the laser emitted by the processing galvanometer can pass through the hole and be projected on the object to be processed; the correction Three probes are installed on the lower surface of the module, which is a retractable structure; the placement surfaces of the three probes form a two-dimensional plane; during testing, the tips of the three probes are positioned on the same horizontal plane, and The correction module is also on the horizontal plane; a mechanical arm, the mechanical arm includes a clamping piece, the clamping piece is used to clamp the workpiece during work, so that the processing galvanometer of the laser processing machine can project laser light On the workpiece; during testing, the robotic arm uses the clamping piece to clamp a test board for determining the horizontal plane; where the upper surface of the test board is a flat upper plate; and where the The mechanical arm uses the clamping piece to clamp the test board, and makes the test board abut the three probes on the lower surface of the calibration module; the three probes will move up appropriately when pressed by the test board Shrink; wherein the compressed length of each probe is used to adjust the angle of the gripping part of the robotic arm, and the gripping part is changed Holding the angle of the test board, repeat the above-mentioned test and angle adjustment until the three probes have the same compressed length when they are pushed, which means that the test board is already on the horizontal plane.
由下文的說明可更進一步瞭解本創作的特徵及其優點,閱讀時並請參考附圖。 The following description can further understand the features and advantages of this creation. Please refer to the attached drawings when reading.
10:雷射加工機 10: Laser processing machine
12:加工振鏡 12: Processing galvanometer
15:校正模組 15: Calibration module
40:機械手臂 40: Robotic arm
41:夾持件 41: Clamping parts
42:測試板 42: test board
44:探針 44: Probe
45:感測器 45: Sensor
48:夾持方位控制器 48: Clamping Orientation Controller
50:攝影焦距決定裝置 50: Camera focal length determining device
52:攝影機 52: Camera
54:比對器 54: Comparator
55:控制處理器 55: control processor
60:雷射加工控制器 60: Laser processing controller
70:垂直座標校準器 70: vertical coordinate calibrator
100:雷射光照範圍 100: laser light range
151:空洞 151: Hollow
200:L型路徑 200: L-shaped path
421:上平板 421: upper plate
422:二維溝槽 422: Two-dimensional groove
圖1顯示本案之主要元件組合示意圖。 Figure 1 shows a schematic diagram of the main components of this case.
圖2顯示圖1之底側視角之示意圖。 FIG. 2 shows a schematic diagram of the bottom view angle of FIG.
圖3顯示本案之探針、感測器、控制處理器及機械手臂的連接架構示意圖。 Figure 3 shows a schematic diagram of the connection architecture of the probe, sensor, control processor and robotic arm in this case.
圖4顯示本案之探針之配置方式之平面示意圖。 Figure 4 shows a schematic plan view of the configuration of the probe in this case.
圖5顯示本案之另一元件組合示意圖。 Figure 5 shows a schematic diagram of another component combination in this case.
圖6顯示本案之雷射加工機、垂直座標校準器及機械手臂的連接架構示意圖。 Figure 6 shows a schematic diagram of the connection structure of the laser processing machine, the vertical coordinate calibrator and the robotic arm in this case.
圖7A顯示本案之雷射光在測試板上所投射的雷射光照範圍之一示意圖。 FIG. 7A shows a schematic diagram of the laser illumination range projected by the laser light on the test board in this case.
圖7B顯示本案之雷射光在測試板上所投射的雷射光照範圍之另一示意圖。 FIG. 7B shows another schematic diagram of the laser illumination range projected by the laser light on the test board in this case.
圖7C顯示本案之雷射光在測試板上所投射的雷射光照範圍之又一示意圖。 Fig. 7C shows another schematic diagram of the laser illumination range projected by the laser light on the test board in this case.
圖8A顯示本案之另一種對齊X軸及Y軸的方法中,三個探針正剛碰到該測試板的示意圖。 FIG. 8A shows a schematic diagram of another method of aligning the X-axis and the Y-axis in this case, where three probes are just touching the test board.
圖8B顯示本案之另一種對齊X軸及Y軸的方法中,該測試板沿著自身的X軸進行旋轉的示意圖。 FIG. 8B shows a schematic diagram of the test board rotating along its own X-axis in another method of aligning the X-axis and the Y-axis in this case.
圖9顯示本案之校正模組的另一配置位置之示意圖。 FIG. 9 shows a schematic diagram of another configuration position of the calibration module in this case.
茲謹就本案的結構組成,及所能產生的功效與優點,配合圖式,舉本案之一較佳實施例詳細說明如下。 With regard to the structural composition of this case, and the effects and advantages that can be produced, in conjunction with the drawings, a preferred embodiment of this case is described in detail as follows.
請參考圖1至圖9所示,顯示本創作之可快速將機械手臂定位到三維座標系統的雷射加工系統,包含下列元件: Please refer to Figure 1 to Figure 9, which shows the laser processing system created by this invention that can quickly position the robotic arm to the three-dimensional coordinate system, including the following components:
一雷射加工機10,用以發射雷射光束以進行加工之用,例如進行打標。在操作時各該雷射加工機10所發出的雷射光束可以投射到一工件(圖中未顯示)上,而在該工件呈現經雷射光束加工的圖形。其中各該雷射加工機10配置有加工振鏡12用於在X、Y、Z軸方向移動到所需要的位置,以將雷射光投射出去而達到加工的目的。
A
一雷射加工控制器60連接該雷射加工機10。該雷射加工控制器60用於接收所欲加工之座標資料,並控制對應之雷射加工機10,以在該工件上進行所需要的加工作業。
A laser processing controller 60 is connected to the
一校正模組15安裝在該雷射加工機10的加工振鏡12的外部。其中該雷射加工控制器60儲存有該校正模組15與該加工振鏡12之間的相對位置關係,並且該雷射加工控制器60能夠將該相對位置關係轉換為該加工振鏡12的加工位置座標。該校正模組15可以位在該加工振鏡12的下方、前方、後方、左方或右方。如圖1所示,當該校正模組15位在該加工振鏡12的下方時,該校正模組15的中心有一空洞151,該空洞151對準該加工振鏡12的下方,使得由該加工振鏡12所發出的雷射可以經過該空洞151而投射在所欲加工的物件上。而當該校正模組15位在該加工振鏡12的前方、後方、左方或右方時,則該校正模組15與該加工振鏡12係位在同一水平面。圖9顯示該校正模組15位在該加工振鏡12的右方。
A
如圖2所示,該校正模組15的下表面安裝三個可伸縮的探針44,各該探
針44具有相當的靈敏度,且為可伸縮的結構,其伸縮的範圍可為10mm,伸縮時的最小解析度可為0.001mm。如圖4所示,該三個探針44係位在一L型路徑200上的兩端及轉角處。其中該L型路徑200的轉角為直角。各該探針44安裝有感測器45,用於感測各該探針44的壓縮長度。
As shown in Figure 2, the lower surface of the
一機械手臂40,該機械手臂40包含一夾持件41,在工作時該夾持件41用於夾持工件,使得該雷射加工機10的加工振鏡12可以將雷射光投射在該工件上。在測試時,該機械手臂40係應用該夾持件41夾持一測試板42以作為決定水平面之用。其中該測試板42的上表面為一相當平坦的上平板421。應用該測試板42決定水平面之後,工作時再應用該機械手臂40夾持工件。如圖3所示,該機械手臂40尚包含一夾持方位控制器48,係用於調整該機械手臂40的夾持方位。
A
在測試前,會調整各該探針44的針尖,使該三個探針44的針尖位在同一水平面上,且該校正模組15也在水平面上。
Before the test, the tip of each probe 44 is adjusted so that the tip of the three probes 44 are on the same horizontal plane, and the
一控制處理器55連接各該探針44的該感測器45及該機械手臂40的該夾持方位控制器48。
A control processor 55 connects the
測試時,該機械手臂40應用該夾持件41夾持該測試板42,而該測試板42則近接該校正模組15下表面的該三個探針44。該三個探針44受到該測試板42的頂抵時會適當地往上縮,此時各該探針44的感測器45會感測到各該探針44的壓縮長度,並且將各該探針44的壓縮長度傳送到該控制處理器55。
During testing, the
由於在測試前,該三個探針44的針尖已經調整在同一水平面上。因此當各該探針44的壓縮長度一致時,則表示該測試板42的上平板421位在水平面。
Because before the test, the tips of the three probes 44 have been adjusted on the same level. Therefore, when the compressed lengths of the probes 44 are the same, it means that the
當各該探針44的壓縮長度不一致時,則該控制處理器55將該壓縮長度換算為該機械手臂40的該夾持件41所需要調整的角度,並將此計算的角度傳送
到該夾持方位控制器48,以令該機械手臂40調整到對應的夾持方位,而改變該夾持件41夾持該測試板42的角度。接著令該機械手臂40應用該夾持件41夾持該測試板42,並令該測試板42近接該校正模組15下表面,重複進行上述的測試及角度調整,直到該三個探針44受到頂抵時其壓縮長度相同,則表示該測試板42已在水平面。
When the compressed lengths of the probes 44 are inconsistent, the control processor 55 converts the compressed length to the angle that the
如圖1所示,本案中該測試板42的上表面的上平板421有一個二維溝槽422,經由調整該測試板42的方位而使得該三個探針44全部落入該二維溝槽422時即表示該測試板42其水平面的座標重疊該加工振鏡12的座標。
As shown in FIG. 1, in this case, the
其中在上述測定該測試板42的水平面時,該三個探針44並不會接觸該二維溝槽422,而是應用該上平板421上位在該二維溝槽422外側的平面決定水平面。當經上述的測試確定該測試板42已在水平面後,則進行將該校正模組15的三個探針44對齊該二維溝槽422的動作,其方式為令該機械手臂40移動該測試板42,使得該三個探針44中的兩個探針44落入該二維溝槽422的一側,並經由該機械手臂40緩緩移動或旋轉該測試板42使得該三個探針44中的另一探針44落入該二維溝槽422的另一側。如此完成對齊的動作。此操作的目的在於使得該測試板42不僅可以維持在水平面,而且其水平面的座標也可以重疊該加工振鏡12的座標。其中較佳者該二維溝槽422的深度均相同,所以當三個探針44均落入該二維溝槽422時,則表示已經對準X座標及Y座標。
When the horizontal plane of the
本案中的二維溝槽422為L型的溝槽,但並不限於此型態,只要是任何型態的二維溝槽422,且探針的位置擺設也對應該二維溝槽422,即可達到對準X座標及Y座標的目的。
The two-
如圖8A及圖8B所示,本案中尚提出另一種進行對齊X軸及Y軸的操作方法,其方式為將該測試板42的座標與該機械手臂40的座標對齊,使得該機械
手臂40可以知道該測試板42的座標位置。然後將該機械手臂40以不旋轉的方式平移,而使得該測試板42正剛同時碰到該校正模組15的三個探針44(如圖8A所示),此時紀錄該三個探針44的頂點所構成的第一平面;然後將該測試板42沿著其自身的X軸轉動一角度(如圖8B所示),並進行同樣的操作使得該測試板42正剛同時碰到該校正模組15的三個探針44,此時紀錄該三個探針44的頂點所構成的第二平面。計算該第一平面及該第二平面的交線,即得到在該校正模組15處所觀察的該測試板42的X軸;應用同樣的方式將該測試板42對其自身的Y軸旋轉,也可以得到在該校正模組15處所觀察的該測試板42的Y軸。所以該校正模組15可以得到該測試板42的X軸及Y軸,將此測試板42的X軸及Y軸與該校正模組15本身的X軸及Y軸做比較,可以知道兩者座標的差值。然後將此差值輸入到該機械手臂40進行補償,或者在該雷射加工機10的程式端進行運算上的補償。本計算補償值的方法為求準確起見,可以執行多次的決定X軸及Y軸的座標的操作及差值計算,並將多次的計算值進行平均以做為補償之用。
As shown in Figures 8A and 8B, another operation method for aligning the X-axis and Y-axis is proposed in this case. The method is to align the coordinates of the
如圖5所示,本案尚包含一垂直座標校準器70信號連接該機械手臂40,用於校正垂直座標,使得該測試板可以位在雷射投射的焦點上。當已決定該測試板42的水平面及水平面的座標之後,該垂直座標校準器70記憶該機械手臂40在此位置的定位方式,並校正垂直座標,使得該測試板42可以位在雷射投射的焦點上,以達到最佳的投射效果。
As shown in Fig. 5, this case also includes a vertical coordinate
如圖6所示,該垂直座標校準器70包含一攝影焦距決定裝置50,用於決定該加工振鏡12與該測試板42之間的距離。其中該攝影焦距決定裝置50包含一攝影機52用於攝錄該測試板42的影像,以及一比對器54連接該攝影機52,其中該攝影機52將投射的影像輸入該比對器54中。
As shown in FIG. 6, the vertical coordinate
其中決定焦距的方式為將該機械手臂40所夾持的測試板42沿著雷射射
出路徑上下挪動而停留在不同的位置,然後該加工振鏡12將投射雷射光於該測試板42上,經由沿著雷射射出路徑上下挪動該測試板42,應用該攝影機52在不同的位置攝錄該測試板42的影像,並將該影像輸入該比對器54。該比對器54計算出該影像中雷射光在該測試板42上投射的雷射光照範圍100。圖7A至圖7C顯示雷射光在不同高度位置的該測試板42上所投射的雷射光照範圍100。如圖7C所示,當投射的雷射光照範圍100達到最小時,則此時該測試板42所在的高度即為焦點的位置,計算焦點與該加工振鏡12中雷射射出點之間的距離即為焦距。因此在實際執行雷射加工作業時,可以將該工件放在此高度,以達到最好的加工效應。
The method of determining the focal length is to shoot the
本案的優點在於可以快速定位機械手臂所夾持的測試板的水平方位、以及將該測試板在該水平方位下可以對齊雷射加工機的加工振鏡的座標,並且經由攝影焦距決定裝置決定該加工振鏡的焦距及焦點。所以在實現物件加工時,可以應用本案所量測的測試板水平方位、對齊該水平方位下該測試板的座標、該加工振鏡的焦距及焦點,而可以很快速的將該機械手臂調整到所需要的位置,使得該機械手臂在實際工作時所夾持的工件可以得到精準的雷射加工。 The advantage of this case is that the horizontal position of the test board clamped by the robotic arm can be quickly positioned, and the test board can be aligned with the coordinates of the processing galvanometer of the laser processing machine in this horizontal position, and the camera focal length determining device determines the Process the focal length and focus of the galvanometer. Therefore, when processing the object, you can use the horizontal orientation of the test board measured in this case, align the coordinates of the test board in the horizontal orientation, and the focal length and focus of the processed galvanometer, and you can quickly adjust the robotic arm to The required position enables precise laser processing of the workpiece clamped by the robotic arm in actual work.
綜上所述,本案人性化之體貼設計,相當符合實際需求。其具體改進現有缺失,相較於習知技術明顯具有突破性之進步優點,確實具有功效之增進,且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上,已符合專利法規定。 In summary, the humanized and considerate design of this case is quite in line with actual needs. Compared with the conventional technology, the specific improvement of the existing defects is obviously a breakthrough advantage, and it does have an increase in efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in domestic and foreign documents and markets, and it has complied with the provisions of the Patent Law.
上列詳細說明係針對本創作之一可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of this creation. However, this embodiment is not used to limit the scope of patent of this creation. Any equivalent implementation or modification that does not deviate from the spirit of this creation technique should be included in In the scope of the patent in this case.
10:雷射加工機 10: Laser processing machine
12:加工振鏡 12: Processing galvanometer
15:校正模組 15: Calibration module
40:機械手臂 40: Robotic arm
41:夾持件 41: Clamping parts
42:測試板 42: test board
421:上平板 421: upper plate
422:二維溝槽 422: Two-dimensional groove
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