TWM611895U - Exposure apparatus - Google Patents

Exposure apparatus Download PDF

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Publication number
TWM611895U
TWM611895U TW110200876U TW110200876U TWM611895U TW M611895 U TWM611895 U TW M611895U TW 110200876 U TW110200876 U TW 110200876U TW 110200876 U TW110200876 U TW 110200876U TW M611895 U TWM611895 U TW M611895U
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Taiwan
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film frame
working chamber
exposure machine
film
exposure
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TW110200876U
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Chinese (zh)
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張鴻明
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川寶科技股份有限公司
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Priority to TW110200876U priority Critical patent/TWM611895U/en
Publication of TWM611895U publication Critical patent/TWM611895U/en

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Abstract

An exposure apparatus comprising a working room, a first photographic film frame and a second photographic film frame is provided. The first photographic film frame is suitable to move between a first position outside the working room and a second position in the working room. The second photographic film frame is suitable to move between a third position outside the working room and a forth position in the working room. When the first photographic film frame is at the second position, the second photographic film frame is at the third position. When the second photographic film frame is at the forth position, the first photographic film frame is at the first position. The exposure assembly is disposed in the working room.

Description

曝光機台Exposure machine

本創作是有關於一種曝光機台,且特別是有關於一種具有底片框架的曝光機台。This creation is about an exposure machine, and especially an exposure machine with a film frame.

習知技術的曝光機台只具有一個底片框架。在進行曝光作業時,底片框架承載底片而位於曝光機台的工作腔室內,位於工作腔室內的曝光裝置對於底片進行曝光,以將底片上的圖案轉印至位於工作腔室內且位於底片框架下方的基板上。當工作人員需要進行另一種底片的曝光時,則必須先將曝光機台停止曝光作業,然後將底片框架由工作腔室抽離,以進行後續底片的置換。因此,習之技術的曝光機台的更換底片的作業會導致曝光機台停止曝光作業,降低曝光機台的使用效率。The conventional exposure machine has only one film frame. During the exposure operation, the film frame carries the film and is located in the work chamber of the exposure machine. The exposure device located in the work chamber exposes the film to transfer the pattern on the film to the work chamber and below the film frame. On the substrate. When the staff needs to expose another kind of negative film, they must first stop the exposure operation of the exposure machine, and then pull the negative film frame out of the working chamber for subsequent negative film replacement. Therefore, the work of replacing the negative film of the conventional exposure machine will cause the exposure machine to stop the exposure operation and reduce the use efficiency of the exposure machine.

本創作的一目的是提供一種具有兩個底片框架的曝光機台,方便使用者更換底片時,曝光機台仍可進行曝光作業,以提升曝光機台的使用效率。One purpose of this creation is to provide an exposure machine with two film frames, which is convenient for users to change the film while the exposure machine can still perform exposure operations, so as to improve the use efficiency of the exposure machine.

本創作提供一種曝光機台,包含一工作腔室、一第一底片框架與一第二底片框架。第一底片框架適於在工作腔室之外的一第一位置與在工作腔室之內的一第二位置之間作移動。第二底片框架適於在工作腔室之外的一第三位置與在工作腔室之內的第四位置之間作移動。當第一底片框架位於第二位置時,第二底片框架位於第三位置,並且當第二底片框架位於第四位置時,第一底片框架位於第一位置。This creation provides an exposure machine, including a working chamber, a first film frame and a second film frame. The first film frame is adapted to move between a first position outside the working chamber and a second position inside the working chamber. The second film frame is adapted to move between a third position outside the working chamber and a fourth position inside the working chamber. When the first film frame is in the second position, the second film frame is in the third position, and when the second film frame is in the fourth position, the first film frame is in the first position.

在本創作一實施例中,當第一底片框架在第一位置時,第一底片框架適於以一軸線為軸作一小於90度的轉動,使得第一底片框架的一承載面傾斜地朝上,且第一底片框架的一背面傾斜地朝下並面向工作腔室。第一底片框架的承載面與背面彼此相對。In an embodiment of the present creation, when the first film frame is in the first position, the first film frame is adapted to rotate less than 90 degrees with an axis as the axis, so that a bearing surface of the first film frame is inclined upward , And a back surface of the first film frame is inclined downward and facing the working chamber. The bearing surface and the back surface of the first film frame are opposite to each other.

在本創作一實施例中,當第二底片框架在第三位置時,第二底片框架適於以另一軸線為軸作一小於90度的轉動,使得第二底片框架的一承載面傾斜地朝上,且第二底片框架的一背面傾斜地朝下並面向工作腔室。第二底片框架的承載面與背面彼此相對。In an embodiment of the present creation, when the second film frame is in the third position, the second film frame is adapted to make a rotation of less than 90 degrees with another axis as the axis, so that a bearing surface of the second film frame is inclined to face And a back surface of the second film frame is inclined downward and facing the working chamber. The supporting surface and the back surface of the second film frame are opposite to each other.

在本創作一實施例中,當第一底片框架在第一位置時,第一底片框架適於從曝光機台拆離。In an embodiment of the present creation, when the first film frame is in the first position, the first film frame is suitable to be detached from the exposure machine.

在本創作一實施例中,當第二底片框架在第三位置時,第二底片框架適於從曝光機台拆離。In an embodiment of the present creation, when the second film frame is in the third position, the second film frame is suitable for being detached from the exposure machine.

在本創作一實施例中,第一底片框架與第二底片框架適於沿著一水平方向作移動。In an embodiment of the invention, the first film frame and the second film frame are adapted to move along a horizontal direction.

在本創作一實施例中,上述曝光機台更包含一基板承載平台,適於在工作腔室之外的一第五位置與在工作腔室之內的一第六位置之間沿著一另一水平方向作移動。此另一水平方向實質上垂直於上述水平方向。In an embodiment of the present invention, the above-mentioned exposure machine further includes a substrate carrying platform, which is adapted to move along a second position between a fifth position outside the working chamber and a sixth position inside the working chamber. Move in a horizontal direction. This other horizontal direction is substantially perpendicular to the aforementioned horizontal direction.

在本創作一實施例中,上述曝光機台更包含一基板承載平台與一曝光裝置。基板承載平台適於在工作腔室之外的一第五位置與在工作腔室之內的一第六位置之間作移動。曝光裝置位於工作腔室內。當基板承載平台位於第六位置且第一底片框架位於第二位置時,第一底片框架位於基板承載平台與曝光裝置之間。當基板承載平台位於第六位置且第二底片框架位於第四位置時,第二底片框架位於基板承載平台與曝光裝置之間。In an embodiment of the present invention, the above-mentioned exposure machine further includes a substrate carrying platform and an exposure device. The substrate carrying platform is adapted to move between a fifth position outside the working chamber and a sixth position inside the working chamber. The exposure device is located in the working chamber. When the substrate carrying platform is at the sixth position and the first film frame is at the second position, the first film frame is located between the substrate carrying platform and the exposure device. When the substrate carrying platform is at the sixth position and the second film frame is at the fourth position, the second film frame is located between the substrate carrying platform and the exposure device.

圖1繪示本創作一實施例之一種曝光機台的立體圖。請參考圖1,本創作一實施例之一種曝光機台200包含一工作腔室210、一基板承載平台220、一第一底片框架230、一第二底片框架240與一曝光裝置250。曝光裝置250位於工作腔室210內。基板承載平台220適於承載一基板300,圖1所示之基板承載平台220處於在工作腔室210之外的一位置P21。圖1所示之第一底片框架230處於在工作腔室210之內的一位置P31,第一底片框架230的一承載面232適於承載待曝光的一底片(未繪示),此底片具有多個圖案。圖1所示之第二底片框架240處於在工作腔室210之外的一位置P41。第二底片框架240的一承載面242適於承載待曝光的另一底片(未繪示)。Fig. 1 shows a three-dimensional view of an exposure machine according to an embodiment of the present creation. Please refer to FIG. 1, an exposure machine 200 according to an embodiment of the present creation includes a working chamber 210, a substrate carrying platform 220, a first film frame 230, a second film frame 240 and an exposure device 250. The exposure device 250 is located in the working chamber 210. The substrate carrying platform 220 is suitable for carrying a substrate 300, and the substrate carrying platform 220 shown in FIG. 1 is at a position P21 outside the working chamber 210. The first film frame 230 shown in FIG. 1 is located at a position P31 in the working chamber 210. A bearing surface 232 of the first film frame 230 is suitable for bearing a film (not shown) to be exposed. The film has Multiple patterns. The second film frame 240 shown in FIG. 1 is at a position P41 outside the working chamber 210. A bearing surface 242 of the second film frame 240 is suitable for bearing another film (not shown) to be exposed.

圖2A至圖2B繪示圖1之第二底片框架進行更換底片時的作動側視示意圖。請同時參考圖1、圖2A與圖2B,當曝光機台200以第一底片框架230進行曝光作業時,圖1所示之基板承載平台220會由在工作腔室210之外的位置P21沿著一第一水平方向D1作移動而行進至在工作腔室210之內的另一位置P22(見圖2A與圖2B),使得基板承載平台220所承載的基板300定位在第一底片框架230(其位於工作腔室210之內的位置P31)的下方。此時,位於工作腔室210內且位於第一底片框架230上方的曝光裝置250對於第一底片框架230之承載面232所承載的底片(未繪示)進行曝光,以將底片上的圖案轉印至位於工作腔室210內且位於第一底片框架230下方的基板300上。2A to 2B are schematic side views showing the action of the second film frame of FIG. 1 when changing the film. Please refer to FIG. 1, FIG. 2A and FIG. 2B at the same time. When the exposure machine 200 uses the first film frame 230 to perform the exposure operation, the substrate carrying platform 220 shown in FIG. Moving in a first horizontal direction D1 to move to another position P22 within the working chamber 210 (see FIGS. 2A and 2B), so that the substrate 300 carried by the substrate carrying platform 220 is positioned on the first film frame 230 (It is located below the position P31 in the working chamber 210). At this time, the exposure device 250 located in the working chamber 210 and above the first film frame 230 exposes the film (not shown) carried on the bearing surface 232 of the first film frame 230 to transfer the pattern on the film It is printed on the substrate 300 located in the working chamber 210 and under the first film frame 230.

曝光完畢後的基板300可被基板承載平台220承載而沿著第一水平方向D1退出工作腔室210,亦即基板承載平台220由工作腔室210之內的位置P22移動至工作腔室210之外的位置P21。此時,曝光完畢後的基板300可藉由一輸送裝置(未繪示)的輸送而離開基板承載平台220,且另一待曝光的基板(未繪示)可藉由輸送裝置的輸送而配置於基板承載平台220以準備進行後續曝光作業。After exposure, the substrate 300 can be carried by the substrate carrying platform 220 and exit the working chamber 210 along the first horizontal direction D1, that is, the substrate carrying platform 220 can be moved from the position P22 in the working chamber 210 to the position of the working chamber 210. Outside the position P21. At this time, the exposed substrate 300 can be conveyed by a conveying device (not shown) to leave the substrate carrying platform 220, and another substrate to be exposed (not shown) can be configured by conveying the conveying device The substrate carrying platform 220 is ready for subsequent exposure operations.

請參考圖2A與圖2B,當曝光機台200以第一底片框架230進行上述曝光作業時,位於工作腔室210之外的位置P41上的第二底片框架240可以一軸線A41為軸由水平狀態作一小於90度的轉動,使得第二底片框架240的承載面242傾斜地朝上,且第二底片框架240的一背面244傾斜地朝下並面向工作腔室210。軸線A41實質上平行於第一水平方向D1,且第二底片框架240的承載面242與背面244彼此相對。第二底片框架240的傾斜地朝上的承載面242可方便使用者卸除承載面242所承載的底片(未繪示),並且方便使用者將另一底片(未繪示)利用抽真空的方式貼附於第二底片框架240的的承載面242上。接著,使用者可將傾斜的第二底片框架240轉回至圖2A所示的水平狀態,以待後續交換底片框架的作業。在另一實施例中,當第二底片框架240位於工作腔室210之外的位置P41時,第二底片框架240可適於從曝光機台200拆離而讓使用者進行更換底片的作業。然而,此另一實施例並未以圖面繪示。2A and 2B, when the exposure machine 200 uses the first film frame 230 to perform the above exposure operation, the second film frame 240 located on the position P41 outside the working chamber 210 can be horizontal with an axis A41 as the axis The state makes a rotation of less than 90 degrees, so that the bearing surface 242 of the second film frame 240 is inclined upward, and a back surface 244 of the second film frame 240 is inclined downward and faces the working chamber 210. The axis A41 is substantially parallel to the first horizontal direction D1, and the supporting surface 242 and the back surface 244 of the second film frame 240 are opposite to each other. The slanted upward carrying surface 242 of the second film frame 240 can facilitate the user to remove the film (not shown) carried by the carrier surface 242, and facilitate the user to vacuum another film (not shown). It is attached to the supporting surface 242 of the second film frame 240. Then, the user can turn the inclined second film frame 240 back to the horizontal state shown in FIG. 2A to wait for the subsequent operation of replacing the film frame. In another embodiment, when the second film frame 240 is located at the position P41 outside the working chamber 210, the second film frame 240 may be adapted to be detached from the exposure machine 200 to allow the user to perform the operation of changing the film. However, this other embodiment is not shown in the drawings.

圖3A至圖3B繪示圖1之第一底片框架進行更換底片時的作動側視示意圖。請參考圖3A與圖3B,當曝光機台200要進行另一批號的基板400的曝光作業時,使用者可藉由手動或電力驅動的方式將第一底片框架230與第二底片框架240沿著一第二水平方向D2(其實質上垂直於第一水平方向D1)移動,使得第二底片框架240在工作腔室210之內的一位置P42,且第一底片框架230在工作腔室210之外的一位置P32。此時,位於工作腔室210內且位於第二底片框架240上方的曝光裝置250對於第二底片框架240之承載面242所承載的底片(未繪示)進行曝光,以將底片上的圖案轉印至位於工作腔室210內且位於第二底片框架240下方的基板400上。3A to 3B are schematic side views showing the action of the first film frame of FIG. 1 when the film is replaced. 3A and 3B, when the exposure machine 200 is to perform the exposure operation of another batch of the substrate 400, the user can manually or electrically drive the first film frame 230 and the second film frame 240 along Moving in a second horizontal direction D2 (which is substantially perpendicular to the first horizontal direction D1), the second film frame 240 is at a position P42 within the working chamber 210, and the first film frame 230 is in the working chamber 210 A position outside of P32. At this time, the exposure device 250 located in the working chamber 210 and above the second film frame 240 exposes the film (not shown) carried on the bearing surface 242 of the second film frame 240 to transfer the pattern on the film It is printed on the substrate 400 located in the working chamber 210 and under the second film frame 240.

當曝光機台200以第二底片框架240進行上述曝光作業時,位於工作腔室210之外的位置P32上的第一底片框架230可以一軸線A31為軸由水平狀態作一小於90度的轉動,使得第一底片框架230的承載面232傾斜地朝上,且第一底片框架230的一背面234傾斜地朝下並面向工作腔室210。軸線A31實質上平行於第一水平方向D1,且第一底片框架230的承載面232與背面234彼此相對。第一底片框架230的傾斜地朝上的承載面232可方便使用者卸除承載面232所承載的底片(未繪示),並且方便使用者將另一底片(未繪示)利用抽真空的方式貼附於第一底片框架230的的承載面232上。接著,使用者可將傾斜的第一底片框架230轉回至圖3A所示的水平狀態,以待後續交換底片框架的作業。在另一實施例中,當第一底片框架230位於工作腔室210之外的位置P32時,第一底片框架230可適於從曝光機台200拆離而讓使用者進行更換底片的作業。然而,此另一實施例並未以圖面繪示。When the exposure machine 200 uses the second film frame 240 to perform the above exposure operation, the first film frame 230 located at the position P32 outside the working chamber 210 can rotate with an axis A31 as the axis from the horizontal state to a rotation of less than 90 degrees , So that the bearing surface 232 of the first film frame 230 is inclined upward, and a back surface 234 of the first film frame 230 is inclined downward and faces the working chamber 210. The axis A31 is substantially parallel to the first horizontal direction D1, and the bearing surface 232 and the back surface 234 of the first film frame 230 are opposite to each other. The inclined upward carrying surface 232 of the first film frame 230 can facilitate the user to remove the film (not shown) carried by the carrier surface 232, and facilitate the user to vacuum another film (not shown). It is attached to the supporting surface 232 of the first film frame 230. Then, the user can turn the inclined first film frame 230 back to the horizontal state shown in FIG. 3A to wait for the subsequent work of replacing the film frame. In another embodiment, when the first film frame 230 is located at the position P32 outside the working chamber 210, the first film frame 230 may be adapted to be detached from the exposure machine 200 to allow the user to perform the operation of changing the film. However, this other embodiment is not shown in the drawings.

請參考圖2A、圖2B、圖3A與圖3B,綜言之,本實施例之曝光機台200中,第一底片框架230適於在工作腔室210之外的位置P32與在工作腔室之內的位置P31之間作移動。第二底片框架240適於在工作腔室210之外的位置P41與在工作腔室210之內的位置P42之間作移動。此外,當第一底片框架230位於工作腔室之內的位置P31時,第二底片框架240在工作腔室210之外的位置P41,並且當第二底片框架240位於在工作腔室210之內的位置P42時,第一底片框架230位於在工作腔室210之外的位置P32。此外,在本實施例中,第一底片框架230與第二底片框240架可適於沿著第二水平方向D2作移動。Please refer to FIGS. 2A, 2B, 3A and 3B. In summary, in the exposure machine 200 of this embodiment, the first film frame 230 is adapted to be positioned at a position P32 outside the working chamber 210 and in the working chamber. Move between positions P31 within. The second film frame 240 is adapted to move between a position P41 outside the working chamber 210 and a position P42 inside the working chamber 210. In addition, when the first film frame 230 is located at the position P31 inside the working chamber, the second film frame 240 is at the position P41 outside the working chamber 210, and when the second film frame 240 is located inside the working chamber 210 At the position P42, the first film frame 230 is located at a position P32 outside the working chamber 210. In addition, in this embodiment, the first film frame 230 and the second film frame 240 may be adapted to move along the second horizontal direction D2.

基於上述,本創作實施例的曝光機台至少具有以下的優點的其中之一。本創作實施例的具有兩個底片框架的曝光機台,方便使用者更換底片時,曝光機台仍可進行曝光作業,以提升曝光機台的使用效率。Based on the above, the exposure machine of this creative embodiment has at least one of the following advantages. The exposure machine with two film frames in this creative embodiment is convenient for the user to change the film, the exposure machine can still perform exposure operations, so as to improve the use efficiency of the exposure machine.

200:曝光機台 210:工作腔室 220:基板承載平台 230:第一底片框架 232、242:承載面 234、244:背面 240:第二底片框架 250:曝光裝置 300、400:基板 A31、A41:軸線 D1:第一水平方向 D2:第二水平方向 P21、P22、P31、P32、P41、P42:位置 200: Exposure machine 210: working chamber 220: substrate carrier platform 230: The first film frame 232, 242: bearing surface 234, 244: Back 240: second film frame 250: Exposure device 300, 400: substrate A31, A41: axis D1: The first horizontal direction D2: second horizontal direction P21, P22, P31, P32, P41, P42: position

圖1繪示本創作一實施例之一種曝光機台的立體圖。Fig. 1 shows a three-dimensional view of an exposure machine according to an embodiment of the present creation.

圖2A至圖2B繪示圖1之第二底片框架進行更換底片時的作動側視示意圖。2A to 2B are schematic side views showing the action of the second film frame of FIG. 1 when changing the film.

圖3A至圖3B繪示圖1之第一底片框架進行更換底片時的作動側視示意圖。3A to 3B are schematic side views showing the action of the first film frame of FIG. 1 when the film is replaced.

200:曝光機台 200: Exposure machine

210:工作腔室 210: working chamber

220:基板承載平台 220: substrate carrier platform

230:第一底片框架 230: The first film frame

232、242:承載面 232, 242: bearing surface

240:第二底片框架 240: second film frame

250:曝光裝置 250: Exposure device

300:基板 300: substrate

A41:軸線 A41: Axis

D1:第一水平方向 D1: The first horizontal direction

D2:第二水平方向 D2: second horizontal direction

P21、P31、P41:位置 P21, P31, P41: position

Claims (8)

一種曝光機台,包含: 一工作腔室; 一第一底片框架,適於在該工作腔室之外的一第一位置與在該工作腔室之內的一第二位置之間作移動;以及 一第二底片框架,適於在該工作腔室之外的一第三位置與在該工作腔室之內的該第四位置之間作移動,其中當該第一底片框架位於該第二位置時,該第二底片框架位於該第三位置,並且當該第二底片框架位於該第四位置時,該第一底片框架位於該第一位置。 An exposure machine, including: A working chamber; A first film frame adapted to move between a first position outside the working chamber and a second position inside the working chamber; and A second film frame adapted to move between a third position outside the working chamber and the fourth position inside the working chamber, wherein when the first film frame is located at the second position When the second film frame is located at the third position, and when the second film frame is located at the fourth position, the first film frame is located at the first position. 如申請專利範圍第1項所述之曝光機台,其中當該第一底片框架在該第一位置時,該第一底片框架適於以一軸線為軸作一小於90度的轉動,使得該第一底片框架的一承載面傾斜地朝上,且該第一底片框架的一背面傾斜地朝下並面向該工作腔室,其中該第一底片框架的該承載面與該背面彼此相對。For the exposure machine set forth in item 1 of the scope of patent application, when the first film frame is in the first position, the first film frame is adapted to rotate less than 90 degrees with an axis as an axis, so that the A bearing surface of the first film frame is inclined upward, and a back surface of the first film frame is inclined downward and facing the working chamber, wherein the bearing surface and the back surface of the first film frame are opposite to each other. 如申請專利範圍第1項所述之曝光機台,其中當該第二底片框架在該第三位置時,該第二底片框架適於以一軸線為軸作一小於90度的轉動,使得該第二底片框架的一承載面傾斜地朝上,且該第二底片框架的一背面傾斜地朝下並面向該工作腔室,其中該第二底片框架的該承載面與該背面彼此相對。For the exposure machine described in item 1 of the scope of patent application, when the second film frame is in the third position, the second film frame is adapted to rotate less than 90 degrees with an axis as the axis, so that the A bearing surface of the second film frame is inclined upward, and a back surface of the second film frame is inclined downward and facing the working chamber, wherein the bearing surface and the back surface of the second film frame are opposite to each other. 如申請專利範圍第1項所述之曝光機台,其中當該第一底片框架在該第一位置時,該第一底片框架適於從該曝光機台拆離。According to the exposure machine described in item 1 of the scope of patent application, when the first negative film frame is in the first position, the first negative film frame is suitable to be detached from the exposure machine. 如申請專利範圍第1項所述之曝光機台,其中當該第二底片框架在該第三位置時,該第二底片框架適於從該曝光機台拆離。According to the exposure machine described in item 1 of the scope of patent application, when the second film frame is in the third position, the second film frame is suitable to be detached from the exposure machine. 如申請專利範圍第1項所述之曝光機台,其中該第一底片框架與該第二底片框架適於沿著一水平方向作移動。According to the exposure machine described in item 1 of the scope of patent application, the first film frame and the second film frame are adapted to move along a horizontal direction. 如申請專利範圍第6項所述之曝光機台,更包含一基板承載平台,適於在該工作腔室之外的一第五位置與在該工作腔室之內的一第六位置之間沿著一另一水平方向作移動,其中該另一水平方向實質上垂直於該水平方向。As described in item 6 of the scope of patent application, the exposure machine further includes a substrate carrying platform, which is suitable for between a fifth position outside the working chamber and a sixth position inside the working chamber Move along another horizontal direction, wherein the other horizontal direction is substantially perpendicular to the horizontal direction. 如申請專利範圍第1項所述之曝光機台,更包含: 一基板承載平台,適於在該工作腔室之外的一第五位置與在該工作腔室之內的一第六位置之間作移動;以及 一曝光裝置,位於該工作腔室內; 其中當該基板承載平台位於該第六位置且該第一底片框架位於該第二位置時,該第一底片框架位於該基板承載平台與該曝光裝置之間;以及 其中當該基板承載平台位於該第六位置且該第二底片框架位於該第四位置時,該第二底片框架位於該基板承載平台與該曝光裝置之間。 For example, the exposure machine mentioned in item 1 of the scope of patent application includes: A substrate carrying platform adapted to move between a fifth position outside the working chamber and a sixth position inside the working chamber; and An exposure device located in the working chamber; Wherein when the substrate carrying platform is at the sixth position and the first film frame is at the second position, the first film frame is located between the substrate carrying platform and the exposure device; and When the substrate carrying platform is at the sixth position and the second film frame is at the fourth position, the second film frame is located between the substrate carrying platform and the exposure device.
TW110200876U 2021-01-25 2021-01-25 Exposure apparatus TWM611895U (en)

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