TWM608986U - Heat dissipation plate, cooling module and processing system - Google Patents

Abstract

A processing system for processing a workpiece, comprising: a processing enclosure having an entrance end for receiving and an exit end for unloading a workpiece; a conveyor equipment that provides a returning path external of the process enclosure, the returning path is configured to move the workpiece from the exit end to the entrance end; and a cooling module in the returning path arranged in fluid communication with the ambient environment outside the processing enclosure. The cooling module includes: a heat dissipation plate having a cooling surface configured to contact the workpiece; and a liquid interface generating module arranged on the heat dissipation plate, configured to generate a liquid interface between the cooling surface and the workpiece.

Description

Cooling plate, cooling module and process system

The present disclosure relates to a process system, and particularly to a coating system with a cooling device.

Vacuum coating technology can be applied in many technical fields. For example, PVD coating technology can be used in system-in-package (System in package, SiP) conformal shielding (Conformal Shielding) production to achieve miniaturization, light weight, and high-efficiency prevention of electromagnetic interference (Electro-magnetic interference). , EMI). For example, chip modules (such as RF front end modules), communication modules (WiFi/BT), power modules, or NAND Flash memory modules of early electronic devices (such as smartphones) Group) EMI shielding technology mostly uses board level (Board Level) stamped metal shields, but it occupies PCB area and the internal space of electronic devices; package level (Package Level) conformal shielding technology uses PVD coating , Cover the shielding layer on the packaged chip. This conformal shielding technology has several advantages: 1. Reduce the interference or interference of the packaged chip by adjacent components, especially the requirements of 5G high-frequency communication, high-speed computing (HPC), etc.; 2. The package size is almost unchanged, saving equipment Space; 3. Shorten the design cycle; 4. Improve production efficiency and reduce the processing and assembly costs of special mask parts. In addition, vacuum coating technology can also be used to coat the shell of portable 3C electronic devices with Electro-magnetic interference (EMI) coating, or even to coat transparent substrates with transparent Electro-magnetic interference (Electro-magnetic interference, EMI) coated or coated with optical film (optical film) and other situations.

The system adopting continuous multi-chamber PVD coating technology has the advantages of fast speed, high output, excellent coating quality, high yield, and can greatly reduce production costs, and is widely used in large-scale applications. In the production process of coating. However, when the system is performing the coating process, the workpiece carrier often heats up due to the plasma environment, which may affect or damage the quality of the coating or the object to be plated.

One aspect of the present disclosure provides a cooling plate, assembled to carry an object to be cooled, comprising: a plate body having a bearing surface, the bearing surface having two side regions and a center located between the side regions Area; a first flow channel structure, distributed in the side area, configured to transport fluid in a first phase, the first flow channel structure has a plurality of distributions in the two side areas and openings formed in the plate A spout on the bearing surface of the body, where the spout is arranged to avoid the central area; and a second flow channel structure, buried in the plate body and corresponding to the central area, is configured to deliver a second phase fluid; Wherein, in the direction orthogonal to the side area, the width of the plate is smaller than the width of the object to be cooled.

One aspect of the present disclosure provides a cooling system configured to cool an object to be cooled. The cooling system includes: a cooling module, including a cooling plate for carrying the object to be cooled, the cooling plate having two side areas , And a central area located between the side areas; a sensing module configured to sense at least one of the temperature and humidity state of the environment where the cooling plate is located, and generate a sensing result; and a processing module , A signal is connected to the sensing module and the cooling module, configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module, and to control the temperature setting of the cooling module , So that the temperature state of the cooling plate is not higher than the dew point temperature of the environment, thereby condensing the cooling plate.

One aspect of the present disclosure provides a process system configured to process a workpiece, including a process station, including an inlet end and an outlet end, and the assembly receives the workpiece from the inlet end and removes the workpiece from the outlet end The process station; reflow equipment, including a reflow rail set outside the process station, the reflow rail is configured to move the workpiece from the outlet end to the inlet end; and a cooling module, located on the The return track is in fluid communication with the external environment. The cooling module includes: a cooling plate having a cooling surface configured to contact the workpiece, the cooling surface is defined with two side regions and a central region located between the side regions; and liquid interface generation The module is arranged on the cooling plate and assembled to generate a liquid interface between the cooling surface and the workpiece.

The following description will refer to the accompanying drawings to more fully describe the present disclosure. The drawings show exemplary embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms, and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. Similar reference numerals indicate the same or similar elements.

The terms used herein are only used for the purpose of describing specific exemplary embodiments, and are not intended to limit the present disclosure. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an" and "said" are intended to also include the plural forms. In addition, when used herein, "includes" and/or "includes" or "includes" and/or "includes" or "has" and/or "has", integers, steps, operations, elements and/or components , But does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. In addition, unless clearly defined in the text, terms such as those defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the related technology and the present disclosure, and will not be interpreted as idealized or overly formal meaning.

Exemplary embodiments will be described with reference to the drawings in FIGS. 1 to 9. DETAILED DESCRIPTION The present disclosure will be described in detail with reference to the accompanying drawings, wherein the depicted elements are not necessarily shown to scale, and through several views, the same or similar reference signs are represented by the same or similar reference signs. element.

FIG. 1 shows a schematic diagram of a process system according to some embodiments of the present disclosure. For the sake of simplicity and clarity of description, some details/subcomponents of the exemplary system are not clearly marked/shown in this figure.

Referring to FIG. 1, the processing system 100 includes a processing station 11 for processing a workpiece. In some embodiments, the process station (for example, process station 11) is configured to coat the workpiece (for example, the carrier C and the object to be plated thereon), and includes a vacuum chamber (for example, a vacuum chamber). 111). The sputtering target assembly (for example, the sputtering target assembly 112) arranged in the vacuum chamber, and the transmission mechanism 113 that is assembled to transport the workpiece (for example, the carrier C and the object to be plated on it) .

In some embodiments, the process system 100 is implemented as a coating system having a continuous multi-chamber (multi-chamber), wherein the vacuum chamber (such as the vacuum chamber 111) includes a plurality of alternately arranged buffer spaces (such as buffers). The interval 111a) and the coating interval (for example, the coating interval 111b), and both ends of each of the coating intervals are provided with the buffer zone. For example, the vacuum chamber 111 has four buffer zones 111a and three coating zones 111b alternately arranged along the arrangement direction x.

The process station 11 includes an inlet end (for example, an inlet valve 114) and an outlet end (for example, an outlet valve 115) for the workpiece to enter and move out of the process station, respectively. In the illustrated embodiment, the inlet end (for example, the inlet valve 114) is disposed at one end of the vacuum chamber 11 corresponding to the first buffer zone 111a (ie, the leftmost buffer zone 111a shown in FIG. 1 Left end). The outlet end (for example, the outlet valve 115) is arranged at the other end of the vacuum chamber 11 corresponding to the last buffer zone 111a (ie, the right end of the rightmost buffer zone 111a as shown in FIG. 1).

In some embodiments, the process station 100 further includes at least one vacuum unit (not shown) coupled to the vacuum chamber 11, which is configured to vacuum the vacuum chamber 11 to make the vacuum chamber 11 Each buffer zone 111a and each coating zone 111b of the vacuum chamber 11 have a working pressure.

In the embodiment shown in the figure, the number of the sputtering target assembly 112 is three, which are respectively arranged in the coating section 111b, that is, the position where the object is waiting to be coated. In other words, the process station 11 can simultaneously Three objects to be plated are subjected to the coating process. Each sputtering target assembly 112 has at least one target material (for example, target material 112a). For example, in some embodiments, the sputtering target assembly 12 has two target materials 112a; the target materials 112a may include the same or different materials. In some operating situations, the object to be plated may be a packaging element, an optical element, or a housing of an electronic product, and so on.

The transmission mechanism 113 is disposed in the vacuum chamber 11 and extends in the x-direction through the buffer zones 111a and the coating zones 111b. The transfer mechanism 113 is configured to transfer the workpieces (for example, the carrier C and the objects to be plated thereon), so that the workpieces move in the x direction in the vacuum chamber 11. The transmission mechanism 113 can be designed to simultaneously make the multiple carriers C stay, move forward, or retreat separately. For example, the conveying mechanism 113 may be implemented as a conveying component (such as a plurality of rollers arranged in the x-direction) configured to convey the workpiece, and a plurality of driving elements configured to drive the conveying component ( For example, a motor); each of the buffer zone 111a and each of the coating zone 111b is provided with a conveying assembly. By controlling the actuation or non-actuation of each driving element, the effect of making each carrier C stay, advance or retreat in the x direction can be achieved. In other embodiments, the conveyor assembly may have a plurality of rollers, conveyor belts, or a combination thereof arranged in the x direction.

In some embodiments, before performing each coating process, the transmission mechanism 113 causes each carrier C to pass through the inlet valve 114 along the arrangement direction x and sequentially enter the buffer zones 111a and the coating zones 111b in turn, so that Perform various coating procedures. During the coating process, the transmission mechanism 113 moves the carrier C in the coating section 111b (where the carrier C will be exposed to the plasma environment under the target 112a) and the two buffer spaces 111a located before and after it (where the carrier C will be exposed to the plasma environment under the target 112a). The interval carrier C will move away from the target 112a) reciprocatingly among the three. In this way, the object to be plated can be prevented from being continuously exposed to the plasma environment under the target 112a for a long time, thereby alleviating the problem of overheating of the object to be plated. The number of back-and-forth shifts or the time to stay in each buffer zone 111a can be set according to process requirements. In addition, each carrier 13 can correspondingly execute various coating procedures in each coating interval 111b, which can prevent the coating interval 111b from being in an idle state, and thus can effectively increase productivity and reduce invalid working hours.

In some embodiments, the processing station 11 further includes a load-out chamber 116 and a load-in chamber 117. In addition, the process station 11 also has two pumping pumps (not shown in the figure), which are respectively coupled to the load-out cavity 116 and the load-in cavity 117, and are assembled to make the load-out cavity 116 and the load-in cavity The pressure in 117 is substantially close to the working pressure in the two buffer zones 111a located at two opposite ends, respectively. In this embodiment, the transfer mechanism 113 not only extends through the vacuum chamber 111 in the x direction, but also extends to the load-out chamber 116 and the load-in chamber 117, so that the carrier C and the object to be plated are placed in the vacuum chamber. The body 111, the load-out cavity 116, and the load-in cavity 117 move between. In some embodiments, the process station 11 further includes a pretreatment chamber 118, which is connected to the inlet valve 114 of the vacuum chamber 111 for plasma treatment (such as etching, surface cleaning or surface activation modification, etc.) to be plated. Process). In some operation scenarios, the etching process performed in the pretreatment chamber 118 can be used to remove the coating material remaining on the periphery of the carrier C during the previous coating process.

The process system 100 further includes a reflow device 12 configured to transport the workpiece (such as the carrier C and the object to be coated) and move it from the outlet end (such as the outlet valve 115) to the inlet end (such as the inlet valve 114). The reflow device 12 includes a reflow track 123, which is configured to move the workpiece (for example, the carrier C and the object to be coated) from the loading cavity 116 to the loading cavity 117. In the illustrated embodiment, the return rail 123 has a settling section 1231 adjacent to the loading chamber 116, a climbing section 1232 adjacent to the loading chamber 117, and is disposed under the processing station 11 and located between the settling section 1231 and the settling section 1231. Climb the intermediate section 1233 between section 1232. In addition, the return device 12 further includes lifting devices 121 and 122, which are used to drive the descending section 1231 and the climbing section 1232 to move up and down, respectively. In some embodiments, the lifting devices 121 and 122 may be pneumatic cylinder lifting devices, electric cylinder lifting devices, or screw-driven lifting devices. In some embodiments, the settling section 1231, the climbing section 1232, and the relay section 1233 each have a conveying component (for example, the same conveying component as the aforementioned transmission mechanism), and a conveying component for driving the conveying component. Drive element (e.g. motor).

After the coating process is over, the transfer mechanism 113 sends the carrier C together with the object to be plated to the outlet valve 115, the load-out chamber 116, and the settling section 1231 in sequence, and then can be picked up by a mechanical arm or manually Take the finished product and clear the carrier C. Then, the settling section 1231 is driven by the lifting device 121 together with the carrier C to move down to connect with the intermediate section 1233, so that the carrier C can be transported to the climbing section 1232 through the intermediate section 1233. After the climbing section 1232 receives the carrier C from the relay section 1233, it is driven by the lifting device 122 to move upwards together with the carrier C, and transports the carrier C to the loading cavity 117 so that the carrier C can receive the waiting vehicle again. Plating and re-execute each coating procedure.

The process system 100 also includes a cooling system (for example, the cooling system 100a) configured to cool the carrier C and the objects/workpieces to be plated on it, which is arranged in one of the buffer cavities 111a of the vacuum cavity 111 Within. In the illustrated embodiment, the cooling system 100a is located in the buffer cavity 111a closest to the exit gate 115. In other embodiments, the cooling system is located in the buffer cavity 111a on both sides of the coating section 111b adjacent to the exit gate 115. In such an embodiment, the carrier C and the object to be plated on it have already performed the coating process in the three coating sections 111b before reaching the cooling system 100a, and therefore have a relatively high temperature state, so that the cooling system 100a There is a large temperature difference between the vehicle and the carrier C, thereby improving the cooling efficiency. In some embodiments, the cooling system 100a is located in the transmission path of the transmission mechanism 113, and the carrier C together with the object to be plated can be transported to the cooling system 100a by the transmission mechanism 113; when the cooling system 100a receives the carrier C together with the object to be plated It can be cooled while plating. In some embodiments, the first cooling system 100a may be a liquid-cooled cooling system configured to contact the carrier C.

In the illustrated embodiment, the process system 100 further includes a collimating optical pyrometer 14, which is installed in the vacuum chamber 111 and positioned corresponding to the cooling system 100a, and is assembled to measure The temperature state of the object to be plated on the carrier C on the cooling system 100a. In the illustrated embodiment, the collimating optical thermometer 14 is located directly above the cooling system 100a. In some embodiments, the process system further includes a processing module (not shown in the figure, which may include one or more processors), which is data connected to the collimating optical thermometer 14 and the cooling system 100a, and is assembled The parameters of the cooling system 100a (such as the temperature setting of the liquid supply) are dynamically controlled according to the sensing result of the collimating optical thermometer 14; in such an embodiment, the variability of the temperature state of the object to be plated can be reduced , Thereby improving the yield of finished products.

The process system 100 also includes cooling systems 100 b and 100 c provided in the reflow device 12, which are configured to cool the carrier C in the reflow device 12. It should be noted that the cooling systems 100b and 100c are installed at the position of the reflow device 12 to be in fluid communication with the outside (for example, exposed to the factory environment where the process system 100 is located). For example, the second cooling system 100b, 100c may be installed on the relay section 1233 of the return rail 123, and the relay section 1233 may be installed on an open rack (not shown). External fluid communication (for example, atmospheric communication). In some embodiments, the entire return rail 123 is in fluid communication with the outside. Similar to the cooling system 100a, the cooling systems 100b and 100c are respectively configured to cool the carrier C (carried to by the relay section 1233) thereon.

In some embodiments, the process system 100 further has a temperature sensor (for example, the temperature sensor 321 shown in FIG. 3) disposed in the cooling system (for example, the cooling system 100b), and is connected to the cooling system (for example, The cooling system 100b) and the processing module (for example, the processing module 33 shown in FIG. 3) to which the temperature sensor data is connected. The processing module is configured to dynamically control the temperature setting of the cooling system (for example, the cooling system 100b) according to the sensing result of the temperature sensor, for example, by controlling the fluid output of the liquid cooling system of the cooling system (for example, the cooling system 100b) (For example, liquid temperature or flow rate setting) to control the temperature setting of the cooling plate of the cooling system (for example, cooling system 100b). In this way, the temperature setting of the cooling system (for example, the cooling system 100b) can be continuously adjusted according to the temperature state of the carrier C, thereby dynamically adjusting the temperature state of the carrier. In some cases, the maximum allowable temperature of the carrier C before feeding is 40°C; in some embodiments, the temperature is below 30°C. In some embodiments, the temperature is 25°C or less. In some embodiments, the temperature is below 20°C.

In the illustrated embodiment, the installation position of the cooling system 100b can be designed to be adjacent to the carrying out cavity 116 to receive the high-temperature carrier C nearby, resulting in a large temperature difference between the cooling system 100b and the carrier C ( For example, 60~70 degrees C) to improve the cooling efficiency. For example, in the illustrated embodiment, the cooling system 100b is provided at the head end of the relay section 1233 (located at the right end of FIG. 1). On the other hand, the installation position of the cooling system 100c can be designed to be adjacent to the loading cavity 117, so that the temperature state of the carrier C (for example, At 25°C), it is helpful to maintain the consistency of the coating process conditions. For example, in the illustrated embodiment, the cooling system 100c is provided at the end of the relay section 1233 (located at the left end of FIG. 1).

In some embodiments, the cooling system 100b or 100c can be configured in a group to cool the carrier C (carried to by the relay section 1233) thereon. For example, in some embodiments, the process system is only configured with the cooling system 100b. In such a situation, even if the carrier is cooled by the cooling system 100b with slight dew on the back (detailed later), the dew has evaporated during the conveying of the carrier to the feeding end, which can be avoided Dew affects the vacuum state of the loading chamber; in addition, the temperature state of the carrier can not be lower than room temperature, and the condition of condensation on the surface of the carrier can be reduced.

Figure 2 shows a schematic diagram of a cooling system according to some embodiments of the present disclosure. For the sake of simplicity and clarity of description, some details/subcomponents of the exemplary system are not clearly marked/shown in this figure. The cooling system 200b may be arranged in a reflux device (for example, the reflux device 12) to be in fluid communication with the outside. For example, the cooling system 200b shown in FIG. 2 is provided at one end of the relay section 2233 adjacent to the settlement section (for example, the settlement section 1231). In order to show the relative positions of the relay section 2233, the cooling system 200b, and the carrier C, a part of the carrier C is hidden in FIG. 2.

In the illustrated embodiment, the relay section 2233 has a plurality of conveying wheels 223a and a driving element (for example, a motor, not shown in the figure) configured to drive the conveying wheels 223a. The conveying wheel 223a is arranged in the x direction and assembled to carry the two long side regions of the carrier C extending in the x direction; by controlling the actuation mode of the driving element, the carrier C can be controlled in the x direction mobile.

The cooling system 200b includes a cooling plate 210 that is assembled to contact and cool the carrier C. In the illustrated embodiment, the cooling plate 210 is located between the conveying wheels 223a in the y direction. In addition, the process system further includes a driving mechanism 25, which is configured to drive the up and down movement (in the z direction) of the cooling plate 210 of the cooling system 200b. In the illustrated scenario, the carrier C has been transported to the top of the cooling plate 210 by the conveying wheel 223a; the current position of the cooling plate 210 is spaced from the carrier C in the z direction. At this time, the cooling plate 210 is driven by the driving mechanism 25 and can be raised to contact or support the carrier C, so as to cool the carrier C by means of heat conduction.

In order to prevent the conveying wheel 223a from interfering with or blocking the lifting movement of the cooling plate 210, the cooling plate 210 is designed to be formed with a plurality of recesses 216 recessed inward from the outer edge thereof, and the recesses 216 are in the lifting direction of the cooling plate 210 ( z direction) projectively overlaps the conveying wheel 223a. In the illustrated embodiment, the notches 216 are arranged at intervals on the long sides of the cooling plate 210 (extending in the x direction), and are recessed toward the inside of the cooling plate 210 along the y direction. The design of the notch 216 can allow the width W1 of the cooling plate 210 in the y direction to be greater than the distance between the pair of conveying wheels 223a in the y direction, thereby increasing the area of the cooling plate 210 and improving the heat dissipation efficiency. In other embodiments, if the cooling plate does not have a notch design, its width must be smaller than the distance between the aforementioned conveying wheels 223a, so as to prevent its lifting movement from being blocked by the conveying wheels. In some embodiments, the area of the top surface (used as a load-bearing surface or cooling surface) of the cooling plate 210 is at least 50% of the area of the carrier C; the design of the notch 216 can not affect the vertical direction of the cooling plate 210 Under the premise of covering movement, the width W1 of the cooling plate 216 is increased and the area of the cooling surface is increased to more than 70% of the area of the carrier C. In some embodiments, the cooling plate 210 has a material with high thermal conductivity, such as aluminum.

In some embodiments, the width of the carrier C in the x direction is about 30-100 cm. In some embodiments, the width range is between 40 and 70 cm, for example, 45 cm. In some embodiments, the x-direction width range is between 60 cm and 65 cm, such as 60 cm. In some embodiments, the x-direction width range is between 75 cm and 90 cm. In some embodiments, the width of the carrier C in the y direction is about 30-100 cm, for example 70 cm. In some embodiments, the width of the carrier C in the y direction is about 70 to 90 cm, for example, 85 cm. In some embodiments, the thickness of the carrier C is more than 5 mm, such as 10 mm. In some embodiments, the material of the carrier C includes metal materials, such as aluminum or aluminum alloy, copper or copper alloy, stainless steel, titanium or titanium alloy. In some embodiments, the material of the carrier C includes ceramic materials, such as aluminum oxide and aluminum nitride. In some embodiments, the material of the carrier C includes a composite material.

Figure 3 shows a schematic top view of a cooling system according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in this figure.

The cooling system 300b includes a cooling module 31, which includes a cooling plate 310 configured to carry an object to be cooled (for example, the carrier C shown in FIG. 2). FIG. 3 shows an exemplary top view profile of the cooling plate 310, the plate body 311 of which roughly has two side regions 311a and a central region 311b located between the side regions 311a. The side area 311a can be defined as an area extending a certain distance from the two long sides of the board 311 (extending in the x direction) toward the inside of the board 311 (along the y direction); the value of the distance is roughly the board 10-20%, for example, 15% of the value of the width of the body 311 in the y direction. The cooling plate 310 is designed to be formed with a plurality of notches 316 recessed inward from the outer edge thereof. In the illustrated embodiment, the notches 316 are arranged at intervals on the long side of the cooling plate 310 (extending in the x direction), and are recessed toward the inside of the cooling plate 310 along the y direction. In some embodiments, the plate body 311 includes a material with high thermal conductivity, such as metal.

The cooling module 31 also includes a fluid supply system 314 configured to cool the cooling plate 310. The plate body 311 has a bearing surface (for example, a top surface), and the bearing surface is formed with a first flow channel structure 312 and a second flow channel structure 313 that are in fluid communication with the fluid supply system 314; In the channel structure 312 or the second flow channel structure 313, the temperature state of the cooling plate 310 is reduced to be able to cool the object to be cooled. For example, the fluid supply system 314 is configured to provide the second phase fluid to the second flow channel structure 313 of the cooling plate 310, thereby reducing the temperature state of the plate body 311. In the illustrated embodiment, the second flow channel structure 313 has a curved and extended profile, and its distribution area roughly occupies most of the top-view area of the central area 311b of the plate body 311; thus, when the flow is from fluid The low-temperature fluid of the supply system 314 flows through the second flow channel structure 313, which can have a better cooling effect. In some embodiments, the fluid in the second phase is a liquid. In other words, the second flow channel structure 313 may be a liquid flow channel configured to transport liquid. In other embodiments, in addition to the fluid supply system 314, a refrigeration chip or a fan may be arranged under the cooling plate instead or further to cool the cooling plate.

In some embodiments, the first flow channel structure 312 has a plurality of side regions 311a distributed in two (extending in the x direction), and openings are formed on the bearing surface (for example, the top surface) of the plate body 311 The spout 312a. In the illustrated embodiment, the nozzle 312a faces upward (toward the z direction), and can be implemented as a through hole (in the z direction) that penetrates the top and bottom surfaces of the plate 311, and is fluidly connected to The buffer chamber 315 is located on the bottom surface of the board 311 and extends along the two side regions 311a. In other embodiments, the through holes may be arranged obliquely (for example, toward the middle area of the bearing surface of the plate body 311). The fluid supply system 314 is configured to provide fluid in the first phase to the first flow channel structure. For example, the fluid supply system 314 is coupled to one end of the buffer chamber 315 (as shown by the light bold arrow in FIG. 3), and is in fluid communication with the nozzle 312a through the buffer chamber 315, and can communicate with the buffer chamber 315. 315 Inject the fluid in the first phase. In some embodiments, the fluid in the first phase may be a gas, and the nozzle 312a is configured to allow the gas to be ejected toward the top surface of the cooling plate 311 (along the z direction) through the buffer chamber 315. In some embodiments, the diameter of the nozzle 312a is not greater than 2 mm, and is approximately 0.5-1 mm. If the nozzle diameter is too large (for example, greater than 2mm), a large amount of gas will be consumed, and the ejected gas may cause the carrier to float, thereby increasing the distance between the carrier and the cooling system, resulting in excessive interface thermal resistance. In addition, the excessively large diameter may also cause dust to affect the cleanliness of the carrier. Conversely, if the nozzle diameter is too small, it is not easy to process. In some embodiments, there is no fluid communication between the first and second flow channel structures 312 and 313. In other embodiments, the fluids in the first phase and the second phase may be the same, for example, both are liquids.

In some embodiments, the projection range of the first and second flow channel structures 312 and 313 in the thickness direction of the cooling plate 310 (for example, the z direction in the figure) is arranged in a staggered manner. For example, the first flow channel structure 312 is distributed in the peripheral area of the plate body 311; the second flow channel structure 313 is buried in the plate body 311 and corresponds to the central area 311b, and avoids the side areas 311a. In the illustrated embodiment, the distribution position of the nozzles 312a avoids the central area 311b of the plate body 311; the liquid channel 312 buried in the cooling plate is located between the nozzles 312a in the y direction It is arranged in a staggered position with the nozzle 312a.

In some cases, the object to be cooled (for example, the carrier C shown in FIG. 1) rises sharply due to the long-term coating process, or undergoes sandblasting treatment, which may cause its temperature to rise and deform and/or surface smoothness Degree is destroyed. At this time, when the top surface of the cooling plate 310 carries the bottom surface of the object to be cooled (for example, the carrier C shown in FIG. 1), a gap will be formed between the two. Since the thermal conductivity value of the air existing in the gap (approximately 0.026 Wm ^-1 K ^-1 ) is extremely low, it will damage the object to be cooled (for example, the carrier C shown in FIG. 1) and the cooling plate 310 The heat transfer efficiency between. In order to reduce the gap between the cooling plate 310 and the carrier C, a thermally conductive pad can be covered on the top surface of the cooling plate 310, so that even if the carrier C is deformed, its bottom surface is expected to be better with the thermally conductive pad. The closeness. However, the existing thermal pads cannot be completely conformally and tightly sealed, resulting in too high interface thermal resistance, which may significantly reduce the thermal conductivity efficiency.

In some embodiments, the cooling system 300b further includes a liquid interface generation module, which is assembled between the cooling surface (for example, the top surface) of the cooling plate 310 and the workpiece (for example, the carrier C) Generate a liquid interface. In some embodiments, the cooling plate 310 of the cooling system 300b is arranged in a relay section (for example, the relay section 2233) of the reflux system (for example, the reflux system 12) to be in fluid communication with the outside. In such an embodiment, the liquid interface The generating module may be designed to reduce the temperature state of the cooling plate 310 to be close to (for example, not higher than) the Dew point temperature, so that dew is condensed on the top surface, thereby generating the liquid interface. When dew (the thermal conductivity is about 0.6 Wm ^-1 K ^-1 ) replaces the air in the gap (the thermal conductivity is about 0.026 Wm ^-1 K ^-1 ), it can make up for the sacrificed heat transfer efficiency due to the air and reduce the interface Thermal resistance. The following will explain how the liquid interface generation module can make the cooling plate 310 lower than the dew point temperature.

In the illustrated embodiment, the liquid interface generation module includes a sensing module 32 and a processing module 33. The sensing module 32 is assembled to sense at least one of the temperature and humidity state of the environment where the cooling plate 310 is located, and generate a sensing result. For example, in the illustrated embodiment, the sensing module 32 includes five temperature sensors 321 (such as thermocouples) arranged on (for example attached to) the top surface of the cooling plate 310, which are respectively located on the cooling plate. The four corners and central area of 310. In other implementation aspects, the number and location of temperature sensors are not limited to those shown in the figure. It should be noted that the cooling system 300b is located in a relay section (for example, the relay section 1233) and is in fluid communication with the outside, so the sensing result of the temperature sensor 321 reflects the temperature state of the outside. In some embodiments, the sensing module 32 further includes a hygrometer (not shown in the figure), which is configured to sense the relative humidity of the environment where the cooling plate 310 is located. The hygrometer may be set in a relay section (for example, the relay section 1233) that is in fluid communication with the outside, and can sense the humidity state of the outside.

The processing module 33 may include one or more processors, data connected to the sensing module 32 and the cooling module 31, and configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module 32 , And control the temperature setting of the cooling module 31 so that the temperature state of the cooling plate 310 is close to (for example, not higher than) the dew point temperature of the environment, thereby condensing the cooling plate 310. For example, in an operating situation, when the processing module 33 obtains, according to the sensing result of the sensing module 32, that the relative humidity of the environment where the cooling plate is located is 50% and the temperature is 25 degrees C, the processing module 33 Based on the relative humidity and temperature, the dew point temperature is calculated to be 15°C. Accordingly, the processing module 33 controls the output of the fluid (such as liquid) supplied to the cooling plate 310 by the fluid supply system 314 of the cooling module 31 (such as the setting of the temperature or flow rate of the liquid), thereby reducing the temperature of the cooling plate 310 To the dew point temperature below 15 degrees C. In this way, the cooling plate 310 can condense dew. (The definition of dew point temperature: when the air pressure and humidity remain unchanged, if the temperature is gradually reduced, until the water vapor reaches saturation and begins to condense into dew.) In some operating scenarios, in order to further improve The dew condensed on the cooling plate 310 forms a water film to obtain a better cooling effect. The processing module 33 is further configured to control the temperature setting of the cooling module 31 so that the temperature state of the cooling plate 310 is lower than that of the environment. The dew point temperature is 10 to 20 degrees C lower, for example 15 degrees C. In some embodiments, the temperature setting is further based on the principle that the cooling plate does not freeze. In some embodiments, a constant temperature temperature setting (or artificially setting) may be adopted for the cooling module 31, so that the temperature state of the cooling plate is not higher than the dew point temperature, and the effect of condensing the cooling plate can also be achieved.

Figures 4a and 4b respectively show the results of two experiments according to some embodiments of the present disclosure. In the two experiments, the area ratio of the top surface of the cooling plate (such as the cooling plate 310) to the carrier is set to 70%; the fluid supply module (such as the fluid supply module 314) is provided to the liquid flow channel (such as The temperature of the liquid in the second flow channel structure 313) is set to 18 degrees C. The difference between the two experiments is that the experiment corresponding to Figure 4a used a thermally ^{conductive gasket with a thermal conductivity of 12 Wm -1} K ^-1 and placed it between the carrier and the cooling plate; and Figure 4b In the experiment, the cooling plate was condensed (for example, the aforementioned liquid interface generation module was used), and no thermal pad was used. Curves 41a, 41b represent the sensing results of a temperature sensor (such as thermocouple 321) placed in the center of the cooling plate (such as cooling plate 310); curves 42a, 42b represent the sensing results of a temperature sensor (such as thermocouple 321) placed in the center of the cooling plate (such as cooling plate 310). ) The sensing result of the temperature sensor (such as thermocouple 321) in the corner. Comparing Figures 4a and 4b, it can be seen that if a thermal pad is used, it takes about 250-400 seconds to cool the carrier C to close to 30 degrees C; if it is changed to condense the cooling plate, it only takes 150-200 seconds, which is very cool. The rate is significantly faster.

Looking back at FIG. 3, in some embodiments, the liquid interface generation module may be designed to further include a fluid restraint module to further restrain the dew generated on the top surface of the cooling plate 310 in the central area 311b of the cooling plate 310. Thereby, the heat dissipation efficiency of the carrier C is further improved. In the illustrated embodiment, since the distribution position of the nozzles 312a is in the peripheral area of the cooling plate 310, when the fluid supply system 314 provides gas (for example, via the buffer chamber 315) to the nozzles 312a, Then, the gas sprayed through the nozzle 312a will confine the formed dew in the central area 311b of the plate body 311. Based on the function of restraining the fluid, the first flow channel structure 312 (for example, the nozzle 312a) and the fluid supply system 314 can jointly serve as a fluid restraint module. In other embodiments, the fluid restraint module is implemented as an annular hydrophobic area formed on the top surface of the cooling plate, which surrounds the central area 311b of the cooling plate, thereby achieving the purpose of restraining dew.

In order to confine the dew in the central area 311b, the distribution area of the nozzle 312a is approximately symmetrical to the center of the plate body 311. According to this design rule, in other embodiments, the nozzles can be designed to be distributed on the two short sides of the plate (for example, the side of the plate 311 extending along the y direction as shown in the figure); or The four side regions of the substantially rectangular plate body surround the second flow channel structure 313.

In some embodiments, the fluid restraint module can further concentrate the dew toward the central area 311b of the plate body 311. For example, the distribution positions of the nozzles (such as nozzles 212a, 312a) can be designed to be cooled by the object to be cooled (such as the carrier C) when the cooling plate (such as the cooling plate 210, 310) carries the object to be cooled. In addition, the fluid supply system 314 can provide gas to the nozzle during the period when the cooling plate 310 receives the object to be cooled (for example, the carrier C) (for example, via the control of the processing module 33). 312a; When the gas is released through the nozzle 312a, a part of the gas will be concentrated along the bottom surface of the carrier C from the side area 311a of the cooling plate 310 toward the central area 311b, thereby blowing the dew water toward the central area of the plate 311 311b concentrated.

Recalling FIG. 2, the nozzles 212a are designed to be distributed in the two side regions (long side regions) 211a of the cooling plate 210 extending in the x direction, and avoid the central region 211b. On the other hand, the plate body 211 is in the y direction ( The width W1 in the direction orthogonal to the side area 211a) is designed to be smaller than the width W2 of the object to be cooled (for example, the carrier C); this structural design allows the carrier C to cover the nozzle 212a when being carried by the cooling plate 210 . In other embodiments, the nozzles can be designed to be distributed on the two side regions (short side regions) of the cooling plate extending in the y direction, and the width of the plate in the x direction is designed to be smaller than the object to be cooled ( For example, the width of the carrier C) can also make the spout covered by the object to be cooled.

In order to properly concentrate or restrain the dew, in some embodiments, the pressure of the gas provided by the fluid supply system 314 is approximately between 0.1 kg/cm ² and 2 kg/cm ² . In some situations, when the pressure is greater than the upper limit (for example, 2 kg/cm ² ), the gas may blow off the coating material attached to the carrier C, contaminating the process system, or causing the carrier to float . In some situations, when the pressure is less than the lower limit (for example, 0.1 kg/cm ² ), the effect of the gas blowing dew water will be significantly reduced.

Figure 5 shows simulated experimental data according to some embodiments of the present disclosure. In the experimental setting of FIG. 5, the temperature of the carrier is set to 110 degrees C; the temperature of the liquid provided by the fluid supply module (for example, the fluid supply module 314) to the liquid channel (for example, the liquid channel 313) is Set to 20 degrees C. The experiment represented by the curve 501 did not use the fluid restraint module to restrain the dew; while the experiment represented by the curve 502 used the fluid restraint module according to the embodiment of this case to restrain the dew. It can be seen from the experimental result graph that the experimental curve 502 using the fluid restraint module has a better cooling efficiency. For example, at the 75th second, the curve 502 is 8 degrees C lower than the curve 501.

6a and 6b show schematic diagrams of cooling plates according to some embodiments of the present disclosure. For simplicity and clarity of description, some details/sub-components of the exemplary system are not clearly marked/shown in this figure. In some embodiments, FIGS. 6a and 6b may be schematic cross-sectional views along a cross-section parallel to the plane P3 shown in FIG. 3.

As shown in FIG. 6a, in some embodiments, in order to further increase the heat transfer efficiency in the z direction, the plate body 611 of the cooling plate 610 may adopt a composite metal structure. For example, the board body 611 shown in FIG. 6a includes a main board layer 611c having a first thermally conductive material, and an upper board layer 611d provided on the main board layer 611c and having a second thermally conductive material. The thermal conductivity is smaller than the thermal conductivity of the second thermally conductive material. The first thermally conductive material of the main board layer 611c may include aluminum (thermal conductivity of 237 Wm ⁻¹ K ^-1 ), and the second thermally conductive material of the upper plate layer 611 d may include copper (thermal conductivity of 400 Wm ^{− 1} K ^-1 ). The main board layer 611c and the upper board layer 611d may have substantially the same top-view profile (viewed from the z direction). In some embodiments, the nozzle (for example, the nozzle 312a) may be implemented to penetrate the main plate layer 611c and the upper plate layer 611d. In some embodiments, the main board layer (for example, 611c in FIG. 6a) and the upper board layer (for example, 611d in FIG. 6b) may use the same material. In some embodiments, the main board layer (for example, the main board layer 611c' of FIG. 6b) and the upper board layer (for example, the upper board layer 611d' of FIG. 6b) may use heterogeneous materials or homogeneous materials. In some embodiments, the main plate layer 611c' and the upper plate layer 611d' can be made of metal materials, such as copper, copper alloy, aluminum, aluminum alloy, stainless steel, titanium, titanium alloy, and the like. In some embodiments, the thermal conductivity of the material of the upper plate layer 611d' is equal to or greater than the thermal conductivity of the main plate layer 611c'. As shown in the embodiment shown in FIG. 6b, when the main board layer 611c' and the upper board layer 611d' are made of heterogeneous materials, friction welding, electron beam welding, laser welding, vacuum brazing, or O-ring sealing can be used to join the two. , Or deep hole drilling and other technologies. The second flow channel structure may be formed on the main board layer. For example, in the embodiment shown in FIG. 6b, the second flow channel structure 613' can be formed using a computer numerical control (CNC) process. For example, the formation of the second runner structure 613' may include: using a computer numerical control (Computer Numerical Control; CNC) process to form a bent and extended channel 613a' on the top surface of the main board layer 611c', and bonding the upper board layer 611d' (For example, using friction welding, electron beam welding, laser welding, vacuum brazing, O-ring sealing, or deep hole drilling) the top surface of the main board layer 611c' and close the channel 613a' , Thereby forming a second flow channel structure 613'. When the main board layer (such as 611c') is made of the same material as the upper board layer (611d'), the difference in thermal expansion coefficient between the two materials can be reduced, and the peeling or warping of the upper sub-layer 611f caused by temperature changes can be reduced. The chance of bending, thereby avoiding the destruction of the liquid flow channel (second flow channel structure 613).

In the embodiment shown in FIG. 6a, the main board layer 611c has a double-layer structure including a lower sublayer 611e and an upper sublayer 611f. In some embodiments, the formation of the second runner structure 613 may include: using a computer numerical control (Computer Numerical Control; CNC) process to form a bent and extended channel 613a on the top surface of the lower sub-layer 611e of the main board layer 611c, and The sub-layer 611f is joined to (for example, friction welding, electron beam welding, laser welding, vacuum brazing, O-ring sealing, or deep hole drilling) the top surface of the lower sub-layer 611e and closes the groove 613a, thereby forming a second flow channel structure 613. The upper sub-layer 611f can be made of the same material as the lower sub-layer 611e to reduce the thermal expansion coefficient difference between the two materials, reduce the chance of peeling or warping of the upper sub-layer 611f due to temperature changes, thereby avoiding liquid The runner (second runner structure 613) is destroyed. In some embodiments, the upper/lower sub-board layers (for example, 611e/f in FIG. 6a) of the main board layer (for example, the main board layer 611c in FIG. 6a) may use heterogeneous materials. In some embodiments, the upper sub-layer 611f and the lower sub-layer 611e may be made of metal materials, such as copper, copper alloy, aluminum, aluminum alloy, stainless steel, titanium, titanium alloy, and the like.

In some embodiments, when the plate body adopts a composite plate structure, in order to form the second flow channel structure on the main plate layer and maintain the structural strength of the main plate layer, the thickness ratio between the heterogeneous plate layers is set to approximately Between 4 and 5, for example between 4.2 and 4.4. For example, as shown in FIG. 6a, the lower limit of the thickness of the main plate layer 611c is approximately 9-15 mm, such as 13mm; the lower limit of the thickness of the heterogeneous upper plate layer 611d is approximately 2-4 mm, such as 3mm. In other embodiments, for example, as shown in FIG. 6b, the lower limit of the thickness of the main plate layer 611c' is 9-13 mm; the lower limit of the thickness of the heterogeneous upper plate layer 611d' is 2 mm, such as 3 mm or 6 mm. In some embodiments, the upper board layer (for example, the upper board layer 611d) may be implemented as a copper metal formed on the main board layer (for example, the main board layer 611c) using a process method such as cold spraying or copper plating or copper electroplating. Layer, or implemented as a copper plate layer (such as the upper plate layer 611d') that is joined to the motherboard layer (such as the motherboard layer 611c') by welding; the latter has better material density and adheres to the motherboard layer (such as The main board layer 611c') has relatively better thermal conductivity.

FIG. 7 shows a three-dimensional schematic diagram of a cooling plate of a cooling system according to some embodiments of the present disclosure, which roughly presents the top surface of the cooling plate. For the sake of simplicity and clarity of description, some details/subcomponents of the exemplary system are not clearly marked/shown in this figure.

The plate body 711 of the cooling plate 710 is substantially rectangular, and has two side regions (for example, side regions 711a) and a central region (for example, central region 711b) between the side regions. The side area 711a can be defined as an area extending a certain distance from the two long sides of the board body 711 in the x direction along the y direction toward the inside of the board body 711; the value of the distance is roughly the board body 711 10-20% of the value of the width in the y direction, for example 15%. The cooling plate 710 is designed to be formed with a plurality of notches 716 recessed inward from its outer edge. In the illustrated embodiment, the notches 716 are arranged at intervals on the long side of the cooling plate 710 (extending in the x direction), and are recessed toward the inside of the cooling plate 710 along the y direction. In some embodiments, the plate body 711 includes a material with high thermal conductivity, such as metal.

The plate body 711 is formed with a first flow channel structure 712 which is configured to receive the first phase fluid provided by the fluid supply system (for example, the fluid supply system 314). In the illustrated embodiment, the first flow channel structure 712 has a first direction flow channel 712x, a second direction flow channel 712y, and a third direction flow channel 712z extending along the x, y, and z directions, respectively. One, two, and three-direction flow channels are designed to be in fluid communication with each other. In some embodiments, the first and second direction flow channels 712x and 712y include (in the x and y directions) blind holes recessed from the side of the plate body 711; the third direction flow channel 712z includes (in the z direction) Top) A blind hole recessed downward from the top surface of the plate body 711, and its upward (toward the z direction) opening defines a spout 712a. The distribution position of the first flow channel structure 712 is designed to avoid the central area 711b of the plate body 711. In the illustrated embodiment, the distribution area of the nozzle 712a is symmetrical to the center of the plate body 711. According to the same design rule, in other embodiments, the nozzles can be designed to be distributed on the two short sides of the plate (for example, the side of the plate 711 that extends along the y direction); or, The nozzles may be designed to be distributed on the four side regions of the substantially rectangular plate body to surround the second flow channel structure (for example, the second flow channel structure 813).

Fig. 8 shows a schematic bottom view of the cooling plate of the cooling system according to some embodiments of the present disclosure. For the convenience of description, the shaded area in FIG. 8 is presented in perspective, and the channel cover (for example, the channel cover 913b) is omitted.

The first flow channel structure 812 is distributed in the side area 811a of the plate body 811 of the cooling plate 810, and has a first direction flow channel 812x, a second direction flow channel 812y, and a third direction flow channel (third direction flow channel) in fluid communication with each other. It is covered in the current view), and the spout (is covered in the current view). In some embodiments, the first flow channel structure 812 also has an air inlet (for example, air inlet 812c) formed on the bottom, side, and/or top surface of the plate 811, which is configured to couple to a fluid supply system (for example, Fluid supply system 314). For example, the air inlet 812c extends from the bottom surface of the plate body 811 in the z direction toward the top surface and is in fluid communication with the first direction flow channel 812x. In some embodiments, the fluid supply system has a joint (not shown in the figure) that is assembled to connect to the intake port 812c, and is in fluid communication with the first flow passage structure 812 through the intake port, and can connect to the intake port The fluid in the first phase is injected so that the fluid in the first phase is ejected from the nozzle 812a. In some embodiments, the cooling plate 810 further has a plurality of plugs 810, which are respectively assembled to fill the openings of the first and second direction flow channels 812x, 812y facing the x and y directions, thereby suppressing x, Exhalation in the y direction.

The second flow channel structure 813 has an inlet end 813e and an outlet end 813f assembled to be coupled to the fluid supply system; the fluid supply system has a joint (not shown) assembled to connect to the inlet end 813e and the outlet end 813f, And the second phase fluid can be injected into the second flow channel structure 813 to cool the plate body 811. In the embodiment shown in FIG. 8, the second flow channel structure 813 has a bent and extended contour, and its distribution not only corresponds to the central area 811b but also extends to the side area 811a, thereby occupying the plate. Most of the top-view area of the body 811; in this way, when the low-temperature fluid from the fluid supply system flows through the second flow channel structure 813, a better cooling effect can be obtained. In some embodiments, the projection range of the second flow channel structure 813 in the z direction overlaps the first flow channel structure 812. For example, the bent section of the second flow channel structure 813 and the section extending in the x direction overlap with the first flow channel structure 812 in projection.

FIG. 9 shows a schematic cross-sectional view of a cooling plate of a cooling system according to some embodiments of the present disclosure. In some embodiments, FIG. 9 may be a schematic cross-sectional view along a cross-section parallel to the plane P8 shown in FIG. 8.

Referring to FIG. 9, the first, second, and third-direction flow channels 912x, 912y, and 912z of the first flow channel structure 912 are in fluid communication. In some embodiments, the first flow passage structure 912 further has an intake passage 912c, which extends from the bottom surface of the plate body 911 in the z direction toward the top surface and is in fluid communication with the first direction flow passage 912x. The fluid supply system (such as the fluid supply system 314) is in fluid communication with the first flow passage structure 912 through the inlet 912c, and can inject the first phase fluid into the inlet 912c, so that the first phase fluid (such as gas ) Spray from the nozzle 912a toward the top surface of the cooling plate 911 (along the z direction). In the illustrated embodiment, the three-directional flow channel 912z extends along the z-direction; in other embodiments, the three-directional flow channel may be designed to be inclined (for example, toward the cooling plate 911). The middle area of the top surface extends).

In the side area 911a of the cooling plate 911, the distribution ranges of the first and second runner structures 912, 913 are staggered in the thickness direction (z direction). For example, in the illustrated embodiment, the distribution range of the first, second, and third flow channels 912x, 912y, and 912z in the z direction is relatively higher (relative to the bottom surface of the plate 911) than the second flow channel structure 913 in the z direction. The distribution range in the direction. Such a height difference design allows the projection range of the second runner structure 913 in the z direction to overlap with the first runner structure 912, which helps to maximize the distribution range of the second runner structure 913, thereby improving cooling efficiency.

In some embodiments, the second flow channel structure 913 has a first depth D ₁ corresponding to the side area 911 a and a second depth D ₂ corresponding to the central area 911 b. The first depth D ₁ is designed to be relatively shallower than the second depth D ₂ . In some embodiments, such a design can simultaneously allow the projection areas of the second flow channel structure 913 and the first flow channel structure 912 to overlap each other in the z direction, and maintain the volume of the second flow channel structure 913 corresponding to the central area. Effect.

In some embodiments, the formation of the second runner structure 913 may include: using a computer numerical control (Computer Numerical Control; CNC) process to form a bent and extended channel 913a on the bottom surface of the plate body 911, and a bent and extended channel. The cover plate 913 b is joined to the plate body 911 (for example, using a welding process) and closes the channel 913 a, thereby forming a second flow channel structure 913. The plate body 911 can be made of the same material as the channel cover plate 911b to reduce the difference in thermal expansion coefficient between the two materials and reduce the damage of the liquid flow channel due to temperature changes. In the embodiment shown in FIG. 9, when the plate body 911 uses the same material as the cover body, the lower limit of the thickness of the plate body 911 can be about 12 mm; this thickness range can allow the use of CNC technology to process the plate body 911 The first flow channel structure 912 and the second flow channel structure 913 overlapping each other are projected (in the z direction), and the structural strength of the plate body 911 can be maintained. In some embodiments, when the plate body (such as the plate body 911) is made of high-strength metal (such as high-strength aluminum alloy, high-strength copper alloy, stainless steel, titanium or titanium alloy), the lower limit of its thickness can be lowered to about 6mm.

Therefore, one aspect of the present disclosure provides a cooling plate, assembled to carry an object to be cooled, comprising: a plate body having a bearing surface, the bearing surface having two side regions and located between the side regions The central area of the first flow channel structure, distributed in the side area, configured to transport the fluid in the first phase, the first flow channel structure has a plurality of distribution in the two side areas and openings formed in the The nozzles on the bearing surface of the plate body are arranged to avoid the central area; and the second flow channel structure is buried in the plate body and corresponds to the central area and is configured to convey the second phase State fluid; wherein, in the direction orthogonal to the side area, the width of the plate is smaller than the width of the object to be cooled.

In some embodiments, the board has: a main board layer with a first thermally conductive material, wherein the second flow channel structure is provided in the main board layer; an upper board layer is provided on the main board layer Above, there is a second thermally conductive material; wherein the thermal conductivity of the first thermally conductive material is less than the thermally conductive coefficient of the second thermally conductive material.

In some embodiments, the thickness ratio between the main plate layer and the upper plate layer is approximately between 4 and 5.

Therefore, one aspect of the present disclosure provides a cooling system configured to cool an object to be cooled, the cooling system comprising: a cooling module, including a cooling plate for carrying the object to be cooled, the cooling plate has two sides A side area and a central area located between the side areas; a sensing module configured to sense at least one of the temperature and humidity state of the environment where the cooling plate is located, and generate a sensing result; and processing A module, a signal connected to the sensing module and the cooling module, configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module, and to control the cooling module The temperature is set so that the temperature state of the cooling plate is not higher than the dew point temperature of the environment, thereby condensing the cooling plate.

In some embodiments, the cooling plate is further formed with a flow channel structure; the cooling module further includes a fluid supply system configured to provide fluid to the flow channel structure of the cooling plate; the processing module further The signal is connected to the fluid supply system, and is configured to control the fluid output of the fluid supply system according to the sensing result.

In some embodiments, the cooling plate is formed with a plurality of nozzles that are in fluid communication with the fluid supply system and open upward; the position of the nozzles avoids the central area of the cooling plate; the nozzles are arranged as When the cooling plate carries the object to be cooled, it can be covered by the object to be cooled; the processing module is also configured to enable the fluid supply system to release fluid to the object while the cooling plate receives the object to be cooled The spout.

Therefore, one aspect of the present disclosure provides a process system configured to process a workpiece, including a process station, including an inlet end and an outlet end. The assembly receives the workpiece from the inlet end, and the outlet end transfers the workpiece. The workpiece is moved out of the process station; the reflow equipment includes a recirculation track arranged outside the processing station, the reflow track is configured to move the workpiece from the outlet end to the inlet end; and a cooling module is arranged at The return rail is in fluid communication with the external environment. The cooling module includes: a cooling plate having a cooling surface configured to contact the workpiece, the cooling surface is defined with two side regions and a central region located between the side regions; and liquid interface generation The module is arranged on the cooling plate and assembled to generate a liquid interface between the cooling surface and the workpiece.

In some embodiments, the liquid interface generation module includes a fluid confinement module, which is configured to confine the fluid on the cooling surface.

In some embodiments, the fluid restraint module has a plurality of nozzles, the openings of which face upward and are distributed in the peripheral area of the cooling plate and are arranged to avoid the central area; and a fluid supply system, which is assembled Provide fluid to the spout during the cooling plate receiving the workpiece; wherein the spout is configured to be covered by the workpiece when the workpiece is carried by the cooling plate.

In some embodiments, the system further includes a driving mechanism configured to drive the lifting movement of the cooling plate; wherein the return rail has a plurality of conveying wheels configured to convey the workpiece; wherein, the The cooling plate is formed with a plurality of notches recessed inward from the outer edge thereof; and wherein, the notches projectively overlap the conveying wheel.

However, the above are only examples of the present model, and should not be used to limit the scope of implementation of the present model, all simple equivalent changes and modifications made in accordance with the patent scope of the present model application and the contents of the patent specification still belong to This new patent covers the scope.

100: Process system 11: Process station 111: Vacuum chamber 111a: Buffer room 111b: Coating area 112: Cathodic sputtering target combination 112a: Target material 113: Transmission mechanism 114: Inlet valve 115: Outlet valve 116: Load out chamber 117 : Loading chamber 118: Pretreatment chamber 12: Reflow equipment 121, 122: Lifting device 123: Return rail 1231: Settlement section 1232: Climbing section 1233: Relay section 100a: Cooling system 100b, 100c: Cooling system 14: Collimation Type thermometer x, y, z: direction C: carrier 200b: cooling system 2233: relay section 223a: conveying wheel 25: driving mechanism 210: cooling plate 216: notch 300b: cooling system 31: cooling module 310: cooling Plate 311: plate body 311a: side area 311b: central area 316: notch 314: fluid supply system 312: first flow channel structure 313: second flow channel structure 312a: spout 315: buffer chamber 41a, 41b, 42a, 42b: curve 501, 502: curve 610: cooling plate 611: plate body 611c: main board layer 611d: upper board layer 611c': main board layer 611d': upper board layer 611e: lower sub-layer 611f: upper sub-layer 613a: trench 613c : Second runner structure 710: Cooling plate 711: Plate body 711a: Side area 711b: Central area 716: Notch 712: First runner structure 712x: First direction runner 712y: Second direction runner 712z: No. Three-direction flow channel 810: cooling plate 811: plate body 811a: side area 811b: central area 812: first flow channel structure 812x: first direction flow channel 812y: second direction flow channel 812z: third direction flow channel 812c: Inlet 813: second runner structure 911: plate body 911a: side area 911b: central area 912: first runner structure 912x: first direction runner 912y: second direction runner 912z: third direction runner 912c: inlet 913a: channel 913b: channel cover D _1: the first depth D _2: the second depth

In order to understand the features recorded above in this case carefully, a more specific description of the above case can be provided by referring to the implementation aspects. Some implementation aspects are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate the typical implementation aspects of this case and are therefore not regarded as limiting the scope of this case, as other equivalent implementation aspects can be recognized in this case. Figure 1 shows a schematic diagram of a manufacturing system according to some embodiments of the present disclosure; Figure 2 shows a three-dimensional schematic diagram of a cooling system according to some embodiments of the present disclosure; Figure 3 shows a schematic top view of a cooling system according to some embodiments of the present disclosure; Figures 4a and 4b respectively show experimental data according to some embodiments of the present disclosure; Figure 5 shows simulated experimental data according to some embodiments of the present disclosure; 6a and 6b respectively show a schematic cross-sectional view of a cooling plate according to some embodiments of the present disclosure; Figure 7 shows a three-dimensional schematic diagram of a cooling plate according to some embodiments of the present disclosure; Figure 8 shows a schematic bottom view of a cooling plate according to some embodiments of the present disclosure; and FIG. 9 shows a schematic cross-sectional view of a cooling plate according to some embodiments of the present disclosure. However, it should be noted that the drawings only show exemplary embodiments of the present disclosure, and therefore should not be considered as limiting the scope thereof, as the present disclosure may allow other equivalent embodiments. It should be noted that these drawings are intended to illustrate the general characteristics of the methods, structures and/or materials used in certain example embodiments and to supplement the written description provided below. However, these drawings are not drawn to scale, and may not accurately reflect the precise structure or performance characteristics of any given embodiment, and should not be construed as defining or limiting the range of values or characteristics covered by example embodiments . For example, for clarity, the relative thickness and location of layers, regions, and/or structural elements may be reduced or enlarged. The use of similar or identical reference signs in various drawings is intended to indicate the presence of similar or identical elements or features.

100: Process system

11: Process station

111: vacuum chamber

111a: buffer zone

111b: Coating interval

112: Cathodic sputtering target combination

112a: target

113: Transmission mechanism

114: inlet valve

115: outlet valve

116: Carry out the cavity

117: Loading cavity

118: pretreatment chamber

12: Reflow equipment

121, 122: Lifting device

123: Return Orbit

1231: Settlement section

1232: climbing section

1233: hop

100a: cooling system

100b, 100c: cooling system

14: Collimating thermometer

x, y, z: direction

C: Vehicle

Claims (10)

A cooling plate, assembled to carry objects to be cooled, including: A plate body having a bearing surface, the bearing surface having two side regions and a central region located between the side regions; The first flow channel structure is distributed in the side area and is configured to transport the fluid in the first phase. The first flow channel structure has a plurality of openings formed in the plate body distributed in the two side areas. The spout of the bearing surface, the setting position of the spout avoids the central area; and A second flow channel structure, buried in the plate body and corresponding to the central area, configured to transport the fluid in the second phase; Wherein, in the direction orthogonal to the side area, the width of the plate is smaller than the width of the object to be cooled. The cooling plate according to claim 1, wherein the plate body has The main board layer has a first thermally conductive material, wherein the second flow channel structure is provided in the main board layer; The upper board layer is arranged on the main board layer and has a second thermally conductive material; and Wherein, the thermal conductivity of the first thermally conductive material is smaller than the thermal conductivity of the second thermally conductive material. The cooling plate according to claim 2, wherein the thickness ratio between the main plate layer and the upper plate layer is approximately between 4 and 5. A cooling system configured to cool an object to be cooled, the cooling system comprising: The cooling module includes a cooling plate for carrying the object to be cooled, and the cooling plate has two side regions and a central region between the side regions; A sensing module, configured to sense at least one of the temperature and humidity status of the environment where the cooling plate is located, and generate a sensing result; and The processing module is signally connected to the sensing module and the cooling module, configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module, and control the cooling module The temperature setting of the cooling plate makes the temperature state of the cooling plate not higher than the dew point temperature of the environment, thereby condensing the cooling plate. The cooling system as described in claim 4, Wherein, the cooling plate is also formed with a flow channel structure; Wherein, the cooling module further includes a fluid supply system configured to provide fluid to the flow channel structure of the cooling plate; and Wherein, the processing module is also signally connected to the fluid supply system, and configured to control the fluid output of the fluid supply system according to the sensing result. The cooling system as described in claim 5, Wherein, the cooling plate is formed with a plurality of nozzles that are in fluid communication with the fluid supply system and open upward; Wherein, the position of the spout avoids the central area of the cooling plate; Wherein, the spout is configured to be covered by the object to be cooled when the cooling plate carries the object to be cooled; and Wherein, the processing module is further configured to enable the fluid supply system to release fluid to the nozzle when the cooling plate receives the part to be cooled. A process system configured to process workpieces, including The process station includes an inlet end and an outlet end, the assembly receives the workpiece from the inlet end, and the outlet end moves the workpiece out of the process station; The reflow equipment includes a reflow rail provided outside the process station, the reflow rail being configured to move the workpiece from the outlet end to the inlet end; and The cooling module is arranged on the return rail and is in fluid communication with the external environment, and the cooling module includes A cooling plate having a cooling surface assembled to contact the workpiece, the cooling surface is defined with two side regions and a central region located between the side regions; and The liquid interface generating module is arranged on the cooling plate and assembled to generate a liquid interface between the cooling surface and the workpiece. The process system according to claim 7, wherein the liquid interface generating module includes a fluid confinement module, which is configured to confine the fluid on the cooling surface. The process system according to claim 8, wherein the fluid restraint module has A plurality of nozzles, the openings of which face upwards and are distributed in the peripheral area of the cooling plate and are arranged avoiding the central area; and A fluid supply system configured to provide fluid to the nozzle during the period when the cooling plate receives the workpiece; Wherein, the spout is configured to be covered by the workpiece when the workpiece is carried by the cooling plate. The process system as described in claim 7, further including Drive mechanism, assembled to drive the lifting movement of the cooling plate; Wherein, the return rail has a plurality of conveying wheels, which are assembled to convey the workpiece; Wherein, the cooling plate is formed with a plurality of notches recessed inward from the outer edge thereof; and Wherein, the notch projectively overlaps the conveying wheel.

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