TWM605776U - Movable baffle assembly - Google Patents
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- TWM605776U TWM605776U TW109211832U TW109211832U TWM605776U TW M605776 U TWM605776 U TW M605776U TW 109211832 U TW109211832 U TW 109211832U TW 109211832 U TW109211832 U TW 109211832U TW M605776 U TWM605776 U TW M605776U
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Abstract
一種活動式擋板組件包含一擋板本體、一邊框、複數個導電凸點、複數個限位螺絲及一導電彈性體。擋板本體開設有一連接埠開孔與複數個限位孔。邊框連結於擋板本體,並具有一接地面。導電凸點分別自接地面凸伸出。限位螺絲分別自外側面穿過限位孔而鎖固於一輸入輸出介面模組。導電彈性體設置於擋板本體與輸入輸出介面模組之間,當電路板固定於一機殼側板時,擋板本體會接觸到機殼背板而使導電彈性體受到擋板本體與端面之擠壓,並使導電凸點與端面之間由一第一距離縮減至一第二距離。A movable baffle assembly includes a baffle body, a frame, a plurality of conductive bumps, a plurality of limit screws and a conductive elastic body. The baffle body is provided with a connecting port opening and a plurality of limiting holes. The frame is connected to the baffle body and has a grounding surface. The conductive bumps respectively protrude from the ground plane. The limit screws respectively pass through the limit holes from the outer side and are locked to an input and output interface module. The conductive elastic body is arranged between the baffle body and the input and output interface module. When the circuit board is fixed to a side plate of the case, the baffle body will contact the back plate of the case, so that the conductive elastic body is affected by the difference between the baffle body and the end face. Squeeze to reduce the distance between the conductive bump and the end surface from a first distance to a second distance.
Description
本創作係關於一種應用於電腦主機之擋板組件,尤其是指一種用於保護輸入輸出介面之活動式擋板組件。This creation is about a baffle assembly applied to a computer host, especially a movable baffle assembly used to protect input and output interfaces.
在現有技術中,為了增加組裝便利性以及提升電腦主機的美觀程度,現有的電腦主機逐漸將主機機殼背板的I/O擋板改成直接組接於電路板I/O模組的一體式I/O擋板,藉以避免主機殼所附之I/O擋板之開孔與I/O模組之連接埠不相符的問題,以及藉由擋板一體式的設計來加強I/O模組的防護能力。In the prior art, in order to increase the convenience of assembly and improve the aesthetics of the computer host, the existing computer host gradually changes the I/O baffle on the back panel of the host chassis into an integrated unit directly connected to the circuit board I/O module. I/O baffle to avoid the problem that the opening of the I/O baffle attached to the main chassis does not match the port of the I/O module, and the integrated design of the baffle to strengthen the I/O The protective ability of the O module.
然而,當I/O擋板改成一體式連結於I/O模組時,I/O擋板主要是透過主機板鎖固於主機殼體時,直接抵接接觸主機機殼背板,然而當主機板的尺寸與主機殼體略為不符時,很容易會讓設置於I/O模組的I/O擋板無法接觸到機殼背板,使得I/O模組的靜電放電(ESD)或電磁感應( EMI)將無法透過I/O擋板接地到機殼背板,進而導致I/O模組或電路板上的電子零件毀損。此外,由於主機殼體通常為了兼顧輕量化與散熱的能力,通常會在框架以外的殼板使用鋁合金,因此當殼板受到衝擊或擠壓時,很容易會產生些微的變形,在此現象發生在機殼背板時,同樣也會讓一體式I/O擋板與機殼背板之間無法確實的接觸,進而導致上述之I/O模組接地不良的問題。However, when the I/O baffle is changed to an integrated connection to the I/O module, the I/O baffle is mainly locked to the mainframe housing through the mainboard, and directly abuts and contacts the mainframe backplane. However, when the size of the mainboard is slightly different from the mainframe casing, it is easy to prevent the I/O baffle provided on the I/O module from contacting the backplane of the casing, causing the electrostatic discharge of the I/O module ( ESD) or electromagnetic induction (EMI) will not be able to be grounded to the chassis backplane through the I/O baffle, resulting in damage to the I/O module or electronic components on the circuit board. In addition, because the mainframe shell usually uses aluminum alloy for the shell outside the frame in order to take into account the light weight and the ability of heat dissipation, when the shell is impacted or squeezed, it is easy to produce slight deformation. When the phenomenon occurs on the backplane of the chassis, it will also make the integrated I/O baffle and the backplane of the chassis unable to contact reliably, which will lead to the aforementioned problem of poor grounding of the I/O module.
有鑒於在先前技術中,現有的一體式I/O擋板很容易因為主機板與機殼尺寸不符,或者因為機殼背板產生變形等問題而導致一體式I/O擋板無法有效接觸機殼背板,使I/O模組產生接地不良的問題;緣此,本創作的主要目的在於提供一種活動式擋板組件,可以在I/O模組與機殼背板之間存在些許公差,或者機殼背板產生些微變形時,使I/O模組可以透過活動式擋板組件來確實的接觸到機殼背板,進而使I/O模組可以有效的藉由活動式擋板組件接地至機殼背板。In view of the fact that in the prior art, the existing integrated I/O baffle is likely to be unable to effectively contact the machine due to the size of the motherboard and the chassis, or the deformation of the chassis backplane. The case backplane causes poor grounding of the I/O module; for this reason, the main purpose of this creation is to provide a movable baffle assembly that can have a slight tolerance between the I/O module and the case backplane , Or when the backplane of the chassis is slightly deformed, the I/O module can reliably contact the backplane of the chassis through the movable baffle assembly, so that the I/O module can effectively use the movable baffle The components are grounded to the chassis backplane.
本創作為解決先前技術之問題,所採用的必要技術手段是提供一種活動式擋板組件,係應用於一電腦機殼,電腦機殼包含一機殼側板與一機殼背板,機殼側板係用以固定一電路板,電路板設有一輸入輸出介面模組,輸入輸出介面模組具有至少一連接埠,至少一連接埠具有一端面,機殼背板鄰接於機殼側板,並開設有一開口,活動式擋板組件包含一擋板本體、一邊框、複數個導電凸點、複數個限位螺絲以及一導電彈性體。In order to solve the problems of the prior art, the necessary technical means adopted in this creation is to provide a movable baffle assembly, which is applied to a computer case. The computer case includes a case side plate and a case back plate. The case side plate It is used to fix a circuit board. The circuit board is provided with an input and output interface module. The input and output interface module has at least one connection port, and at least one connection port has an end surface. The casing back plate is adjacent to the casing side plate and has a Opening, the movable baffle assembly includes a baffle body, a frame, a plurality of conductive bumps, a plurality of limit screws and a conductive elastic body.
擋板本體係與開口相配合,具有相對設置之一外側面與一內側面,並開設有至少一對應於至少一連接埠之連接埠開孔與複數個限位孔,至少一連接埠開孔與限位孔係分別自內側面沿一第一方向貫穿至外側面。The baffle system cooperates with the opening and has an outer side surface and an inner side surface oppositely arranged, and at least one port opening corresponding to at least one port and a plurality of limiting holes are opened, and at least one port opening is provided And the limiting holes respectively penetrate from the inner side to the outer side along a first direction.
邊框係一體成型地連結於擋板本體,並具有一接地面。複數個導電凸點係分別自接地面沿第一方向凸伸出,並用以電性接觸開口。複數個限位螺絲係分別自外側面穿過限位孔而鎖固於輸入輸出介面模組,且每一限位螺絲具有一限位部,限位螺絲之限位部係用以卡抵於限位孔,藉以使擋板本體沿第一方向可移動地設置於限位部與輸入輸出介面模組之間。The frame is integrally connected to the baffle body and has a grounding surface. A plurality of conductive bumps respectively protrude from the ground plane along the first direction and are used to electrically contact the opening. A plurality of limit screws pass through the limit holes from the outer side to be locked to the input and output interface module, and each limit screw has a limit part, and the limit part of the limit screw is used to snap into The limiting hole is used to enable the baffle body to be movably arranged between the limiting portion and the input and output interface module along the first direction.
導電彈性體係設置於擋板本體與輸入輸出介面模組之間,並抵接於內側面與端面,且當導電彈性體處於一未壓縮狀態時,導電凸點與端面之間具有一第一距離,當電路板固定於機殼側板時,係使導電彈性體受到擋板本體與端面之擠壓而進入一被擠壓狀態,並使導電凸點與端面之間由第一距離縮減至一第二距離。The conductive elastic system is arranged between the baffle body and the input and output interface module, and abuts on the inner side and the end surface, and when the conductive elastic body is in an uncompressed state, there is a first distance between the conductive bump and the end surface When the circuit board is fixed to the side plate of the casing, the conductive elastic body is squeezed by the baffle body and the end surface to enter a squeezed state, and the distance between the conductive bump and the end surface is reduced from the first distance to the first Two distance.
在上述必要技術手段所衍生之一附屬技術手段中,接地面與外側面具有一落差距離,每一導電凸點自接地面沿第一方向凸伸有一高度,且高度小於落差距離。In one of the subsidiary technical means derived from the above necessary technical means, the ground plane and the outer mask have a drop distance, and each conductive bump protrudes from the ground plane to a height along the first direction, and the height is smaller than the drop distance.
在上述必要技術手段所衍生之一附屬技術手段中,導電彈性體開設有至少一連接埠穿孔,至少一連接埠係分別貼合地穿過連接埠穿孔而露出於連接埠開孔。In an auxiliary technical means derived from the above-mentioned necessary technical means, the conductive elastic body is provided with at least one port perforation, and at least one of the ports is respectively stuck through the port perforation and exposed to the port opening.
在上述必要技術手段所衍生之一附屬技術手段中,每一限位螺絲更包含一鎖接端與一滑動段,鎖接端係與限位部相對設置,並用以鎖接於輸入輸出介面模組,滑動段係位於鎖接端與限位部之間。In one of the auxiliary technical means derived from the above-mentioned necessary technical means, each limit screw further includes a locking end and a sliding section. The locking end is arranged opposite to the limit part and is used to lock the input and output interface modules. The sliding section is located between the locking end and the limit part.
如上所述,本創作之活動式擋板組件是利用限位螺絲將擋板本體可移動地連接於輸入輸出介面模組上,然後再將導電彈性體設置於擋板本體與輸入輸出介面之間,因此當電路板組件固定於電腦機殼時,不管機殼背板是否相較於預設位置更遠離輸入輸出介面模組,都能透過導電彈性體之彈性支撐而使導電凸點接觸到機殼背板,進而有效的使輸入輸出介面模組接地至機殼背板。As mentioned above, the movable baffle assembly of this creation uses the limit screw to movably connect the baffle body to the input and output interface module, and then the conductive elastic body is arranged between the baffle body and the input and output interface. Therefore, when the circuit board assembly is fixed to the computer case, no matter whether the case backplane is farther from the input and output interface module than the preset position, the conductive bumps can contact the computer through the elastic support of the conductive elastomer. The shell backplane effectively grounds the input and output interface modules to the shell backplane.
本創作所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments used in this creation will be further explained by the following embodiments and drawings.
請參閱第一圖至第三圖,第一圖係顯示本創作之活動式擋板組件與電路板組件之立體分解示意圖;第二圖係顯示本創作之活動式擋板組件之擋板本體另一角度之立體示意圖;第三圖係顯示本創作之活動式擋板組件組接於電路板組件之立體示意圖。Please refer to the first to third figures. The first figure shows the three-dimensional exploded schematic diagram of the movable baffle assembly and circuit board assembly of this creation; the second figure shows the baffle body of the movable baffle assembly of this creation. A three-dimensional schematic diagram from one angle; the third diagram is a three-dimensional schematic diagram showing the movable baffle assembly of this creation is assembled to the circuit board assembly.
如第一圖至第三圖所示,一種活動式擋板組件100包含一擋板本體1、一邊框2、複數個導電凸點3(圖中僅標示一個)、四個限位螺絲4(圖中僅標示一個)以及一導電彈性體5。As shown in the first to third figures, a
其中,活動式擋板組件100是用以固設於一電路板組件200,電路板組件200包含一電路板201與一輸入輸出介面模組202。輸入輸出介面模組202包含一保護殼體2021與複數個連接埠2022(圖中僅標示一個);其中,保護殼體2021是固定於電路板201上,並具有二間隔設置之固定端部20211與20212,固定端部20211開設有二固接孔202111與202112,固定端部20212同樣開設有二固接孔202121與202122。此外,每一連接埠2022皆具有一端面20221(圖中僅標示一個),且每一連接埠2022之端面20221大致同平面。Among them, the
擋板本體1具有相對設置之一外側面11與一內側面12,並開設複數個連接埠開孔13(圖中僅標示一個)與四個限位孔14(圖中僅標示一個)。連接埠開孔13與限位孔14係分別自內側面12沿一第一方向D1貫穿至外側面11。邊框2係一體成型地連結於擋板本體1,並具有一接地面21。複數個導電凸點3係分別自接地面21沿第一方向D1凸伸出。其中,接地面21與外側面11之間具有一落差距離(圖未標示),而導電凸點3自接地面21沿第一方向D1凸伸有一高度(圖未標示),且高度小於落差距離。The
四個限位螺絲4係分別自外側面11穿過限位孔14而由內側面12穿出,進而鎖固於固接孔202111、202112、202121與202122;其中,每一限位螺絲4依序包含一鎖接端41(標示於第七圖)、一滑動段42(標示於第七圖)與一限位部43(標示於第七圖),鎖接端41係鎖接於輸入輸出介面模組202,滑動段42是自鎖接端41沿第二方向D2一體成型地延伸出,而限位部43是一體成型地連結於滑動段42相對於鎖接端41之另一端,且限位部43是在限位螺絲4之鎖接端41穿過限位孔14而鎖固於固接孔202111時,用以卡抵於限位孔14。此外,滑動段42是指不具有螺紋,僅用以受限位孔14限位而限制限位螺絲4只能第二方向D2往復移動,但在其他實施例中則不限於此,即使滑動段42具有螺紋,只要滑動段42不鎖入固接孔202111即可,例如鎖接端41與滑動段42在第二方向D2上之長度超過固接孔202111之螺接深度時,也可使滑動段42無法鎖入固接孔202111中,進而達到僅用來限制限位螺絲4在第二方向D2往復移動的功能。The four
導電彈性體5係設置於擋板本體1與輸入輸出介面模組202之間,並抵接於內側面12與端面20221,且導電彈性體5開設有複數個連接埠穿孔51(圖中僅標示 一個),複數個連接埠2022係分別貼合地穿過連接埠穿孔51而露出於連接埠穿孔51。此外,在本實施例中導電彈性體5例如為一鋁箔導電泡棉,是由密度介於29kg/m
3至35kg/m
3之間的PU泡棉與鋁箔所構成,但不限於此,亦可利用金、銀、銅或碳等導電材質與PE、EVA或橡膠等彈性體所形成之泡棉構成導電彈性體5。
The conductive
請繼續參閱第四圖至第八圖,第四圖係顯示組接有本創作之活動式擋板組件之電路板組件與電腦機殼之立體分解示意圖;第五圖係顯示組接有本創作之活動式擋板組件之電路板組件置入電腦機殼內之立體示意圖;第六圖係顯示組接有本創作之活動式擋板組件之電路板組件置入電腦機殼內之平面示意圖;第七圖係為第六圖之圈A放大示意圖;第八圖係顯示電路板組件沿第二方向移動而使本創作之活動式擋板組件之導電彈性體受到壓縮之放大示意圖。Please continue to refer to Figures 4 to 8. The fourth figure shows the three-dimensional exploded schematic diagram of the circuit board assembly with the movable baffle assembly of this creation and the computer case; the fifth figure shows the combination of this creation The three-dimensional schematic diagram of the circuit board assembly of the movable baffle assembly placed in the computer case; Figure 6 is a schematic plan view showing the circuit board assembly of the movable baffle assembly of this creation placed in the computer case; Figure 7 is an enlarged schematic view of circle A in Figure 6; Figure 8 is an enlarged schematic view showing that the circuit board assembly moves in the second direction to compress the conductive elastic body of the movable baffle assembly of the present invention.
如第一圖至第八圖所示,當活動式擋板組件100組接於輸入輸出介面模組202後,便能隨著電路板組件200置入一電腦機殼300中;其中,電腦機殼300包含一機殼側板301與一機殼背板302,且機殼背板302開設有一開口3021。As shown in Figures 1 to 8, when the
且在第四圖至第七圖中,電路板組件200只是先置入電腦機殼300中,此時導電彈性體5透過端面20221之支撐,會將擋板本體1往第二方向D2推到固接孔202111卡抵住限位部43,而設置於接地面21之複數個導電凸點3則會電性接觸開口3021,此時導電彈性體5處於一未壓縮狀態,而導電凸點3與端面20221之間具有一第一距離d1。Moreover, in the fourth to seventh figures, the
承上所述,在電路板組件200置入電腦機殼300後,使用者更可將電路板組件200沿第二方向D2移動而使電路板201之鎖孔(圖未標示)對準機殼側板301之電路板鎖孔(圖未標示),並同步使輸入輸出介面模組202之端面20221沿第二方向D2移動,此時由於導電凸點3已經抵接住開口3021,因此會使得位於擋板本體1與端面20221之間的導電彈性體5受到擠壓而進入一被擠壓狀態,並使導電凸點3與端面20221之間由第一距離d1縮減至一第二距離d2。Continuing from the above, after the
其中,不管導電彈性體5是處於未壓縮狀態或者壓縮狀態,擋板本體1都會受到導電彈性體5之支撐而使導電凸點抵接於機殼背板302,意即整個輸入輸出介面模組202可以透過導電彈性體5、擋板本體1、邊框2與導電凸點3接地至機殼背板302。此外,由於在電路板組件200組裝於機殼側板301時,導電彈性體5已處於壓縮狀態,因此即使機殼背板302因為公差或者變形等因素而相較於原本的位置更加遠離輸入輸出介面模組202時,也可以透過導電彈性體5之恢復彈力推抵擋板本體1,進而使導電凸點3仍維持在接觸到機殼背板302之開口3021的狀態。Wherein, no matter whether the conductive
綜上所述,相較於先前技術具有一體式擋板之輸入輸出介面模組很容易因為機殼背板變形而無法有效的透過一體式擋板接地至機殼背板,由於本創作之活動式擋板組件是利用限位螺絲將擋板本體可移動地連接於輸入輸出介面模組上,然後再將導電彈性體設置於擋板本體與輸入輸出介面之間,因此當電路板組件固定於電腦機殼時,不管機殼背板是否相較於預設位置更遠離輸入輸出介面模組,都能透過導電彈性體之彈性支撐而使導電凸點接觸到機殼背板,進而有效的使輸入輸出介面模組接地至機殼背板。In summary, compared with the prior art, the input/output interface module with integrated baffle is easily grounded to the chassis back through the integrated baffle due to the deformation of the chassis back panel. Due to the activity of this creation The type of baffle assembly uses a limit screw to movably connect the baffle body to the input and output interface module, and then the conductive elastic body is arranged between the baffle body and the input and output interface, so when the circuit board assembly is fixed on In the case of a computer case, regardless of whether the case backplane is farther from the input and output interface module than the preset position, the conductive bumps can contact the case backplane through the elastic support of the conductive elastomer, thereby effectively making The input/output interface module is grounded to the back panel of the chassis.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本創作之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本創作之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本創作所欲申請之專利範圍的範疇內。Based on the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the creation can be described more clearly, and the scope of the creation is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to cover various changes and equivalent arrangements within the scope of the patent application for this creation.
100:活動式擋板組件
1:擋板本體
11:外側面
12:內側面
13:連接埠開孔
14:限位孔
2:邊框
21:接地面
3:導電凸點
4:限位螺絲
41:鎖接端
42:滑動段
43:限位部
5:導電彈性體
51:連接埠穿孔
200:電路板組件
201:電路板
202:輸入輸出介面模組
2021:保護殼體
20211,20212:固定端部
202111,202112:固接孔
202121,202122:固接孔
2022:連接埠
20221:端面
300:電腦機殼
301:機殼側板
302:機殼背板
3021:開口
d1:第一距離
d2:第二距離
D1:第一方向
D2:第二方向
100: movable baffle assembly
1: Baffle body
11: Outer side
12: Inside
13: Port opening
14: Limit hole
2: border
21: Ground plane
3: conductive bumps
4: limit screw
41: Locking terminal
42: sliding section
43: limit part
5: Conductive elastomer
51: Port hole
200: Circuit board assembly
201: circuit board
202: Input and output interface module
2021:
第一圖係顯示本創作之活動式擋板組件與電路板組件之立體分解示意圖; 第二圖係顯示本創作之活動式擋板組件之擋板本體另一角度之立體示意圖; 第三圖係顯示本創作之活動式擋板組件組接於電路板組件之立體示意圖; 第四圖係顯示組接有本創作之活動式擋板組件之電路板組件與電腦機殼之立體分解示意圖; 第五圖係顯示組接有本創作之活動式擋板組件之電路板組件置入電腦機殼內之立體示意圖; 第六圖係顯示組接有本創作之活動式擋板組件之電路板組件置入電腦機殼內之平面示意圖; 第七圖係為第六圖之圈A放大示意圖;以及 第八圖係顯示電路板組件沿第二方向移動而使本創作之活動式擋板組件之導電彈性體受到壓縮之放大示意圖。 The first figure is a three-dimensional exploded schematic diagram showing the movable baffle assembly and circuit board assembly of this creation; The second figure is a three-dimensional schematic diagram showing the baffle body of the movable baffle assembly of this creation from another angle; The third figure is a three-dimensional schematic diagram showing the movable baffle assembly of this creation and the circuit board assembly; The fourth figure is a three-dimensional exploded schematic diagram showing the circuit board assembly and the computer case combined with the movable baffle assembly of this creation; The fifth figure is a three-dimensional schematic diagram showing the circuit board assembly with the movable baffle assembly of this creation placed in the computer case; The sixth figure is a schematic plan view showing the circuit board assembly with the movable baffle assembly of this creation placed in the computer case; The seventh picture is an enlarged schematic diagram of circle A in the sixth picture; and Figure 8 is an enlarged schematic diagram showing that the circuit board assembly moves along the second direction to compress the conductive elastic body of the movable baffle assembly of the present invention.
100:活動式擋板組件 100: movable baffle assembly
1:擋板本體 1: Baffle body
11:外側面 11: Outer side
13:連接埠開孔 13: Port opening
14:限位孔 14: Limit hole
2:邊框 2: border
21:接地面 21: Ground plane
3:導電凸點 3: conductive bumps
4:限位螺絲 4: limit screw
5:導電彈性體 5: Conductive elastomer
51:連接埠穿孔 51: Port hole
200:電路板組件 200: Circuit board assembly
201:電路板 201: circuit board
202:輸入輸出介面模組 202: Input and output interface module
2021:保護殼體 2021: Protective shell
20211,20212:固定端部 20211, 20212: fixed end
202111,202112:固接孔 202111, 202112: Fixing hole
202121,202122:固接孔 202121, 202122: Fixing hole
2022:連接埠 2022: Port
20221:端面 20221: end face
D1:第一方向 D1: First direction
D2:第二方向 D2: second direction
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109211832U TWM605776U (en) | 2020-09-10 | 2020-09-10 | Movable baffle assembly |
JP2020004393U JP3230471U (en) | 2020-09-10 | 2020-10-09 | Movable shield plate assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109211832U TWM605776U (en) | 2020-09-10 | 2020-09-10 | Movable baffle assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM605776U true TWM605776U (en) | 2020-12-21 |
Family
ID=74225895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109211832U TWM605776U (en) | 2020-09-10 | 2020-09-10 | Movable baffle assembly |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3230471U (en) |
TW (1) | TWM605776U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220098518A (en) * | 2021-01-04 | 2022-07-12 | 주식회사 플랜플러스 | Motherboard assembly having shielding structure for electromagnetic field |
-
2020
- 2020-09-10 TW TW109211832U patent/TWM605776U/en unknown
- 2020-10-09 JP JP2020004393U patent/JP3230471U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220098518A (en) * | 2021-01-04 | 2022-07-12 | 주식회사 플랜플러스 | Motherboard assembly having shielding structure for electromagnetic field |
Also Published As
Publication number | Publication date |
---|---|
JP3230471U (en) | 2021-02-04 |
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