TWM604539U - Equipment assembly for cooling heat-generating electrical component, and electronic heat-generating device for insertion in rack having cold manifold and hot manifold - Google Patents

Abstract

An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.

Description

Equipment assembly for cooling heat-generating electronic parts and electronic heat-generating device for inserting into rack with cold manifold and heat manifold

This disclosure generally relates to cooling systems used in computer systems. More specifically, various aspects of the present disclosure relate to an immersion cooling system with a discharge mechanism of a coolant distribution unit to facilitate maintenance.

Electronic devices, such as servers, include many electronic components powered by a universal power supply. Due to the operation of internal electronic devices, the server generates extremely large amounts of heat, such as controllers, processors, and memory. Failure to effectively remove this heat will result in overheating, which may shut down or hinder the operation of these devices. Therefore, the existing server is designed to take away the heat generated by the electronic components by air flow through the inside of the server. The server usually includes various heat sinks attached to electronic components, such as processing units. The radiator absorbs heat from the electronic part, thereby moving the heat away from the electronic part. The heat of the radiator must be discharged from the server. Fan systems are usually used to generate airflow to dissipate this heat.

Due to the improvement of high-efficiency systems, the development of each new generation of electronic components has caused more and more heat to be removed. With the emergence of more powerful electronic parts, traditional gas cooling combined with fan systems are insufficient to sufficiently remove the heat generated by the newer generation of electronic parts. The growing demand for cooling has prompted the development of liquid cooling. Since liquid cooling exhibits superior thermal performance, liquid cooling is recently recognized as a fast cooling solution. At room temperature, the heat transfer coefficient of air is only 0.024 W/mK, while the coolant, such as water, has a heat transfer coefficient of 0.58 W/mK, which is 24 times that of air. Thus, liquid cooling can more efficiently transfer heat from the heat source to the radiator, and remove heat from the main components without noise pollution.

The well-known liquid cooling system is an immersion type system. In this system, the computing devices in the rack will be immersed in tanks containing coolant, such as servers, switches and storage devices. The casing of this type of system is not sealed, and the coolant liquid can circulate between and through these parts to dissipate the generated heat. However, this type of system makes the repair and replacement of parts cumbersome because the parts must be removed from the top of the tank. In addition, the parts can only be placed side by side in the immersion tank, so the power density of this type of system is low (low power density).

Another type of immersion system does not require a tank. This type of system includes a completely sealed housing and has an inlet connector and an outlet connector, which are connected to manifolds that supply coolant to the parts. FIG. 1A shows an example of a tankless submerged system 10 in the prior art. The immersion system 10 includes a rack 12, a series of heat generating parts 14 and a coolant distribution unit (CDU) 16. FIG. 1B is a close-up view of the coolant distribution unit 16. As can be seen in FIGS. 1A-1B, the frame 12 includes a bottom frame 20. The bottom frame 20 has wheels 22 that enable the rack 12 to move to a desired position in the data center. The bottom frame 20 supports vertical bars 24a, 24b, 24c, and 24d. The top plate 26 connects the tops of the vertical rods 24a, 24b, 24c, and 24d. Each of the vertical rods 24a, 24b, 24c, and 24d may include holes so that pins can be inserted into the holes to support the rack supported by the vertical rods 24a, 24b, 24c, and 24d.

The coolant distribution unit 16 is installed on the bottom frame 20 below all the heat generating parts 14. Thus, each shelf supported by the vertical rods 24a, 24b, 24c, and 24d can support one or more heat generating parts 14. In this example, the heat-generating component 14 may include storage servers, application servers, switches, or other devices. In this example, the part 14 is placed in the horizontal direction in the frame 12, but the frame can also support the vertical direction of the part.

The frame 12 supports the cold manifold 30 and the hot manifold 32, and the cold manifold 30 and the hot manifold 32 are placed between the bottom frame 20 and the top plate 26 of the frame 12. The cold manifold 30 is fluidly connected to the coolant distribution unit 16 through a cold coolant pipe 34 near the bottom of the rack 12. The heat manifold 32 is fluidly connected to the coolant distribution unit 16 through a hot coolant pipe 36 near the bottom of the rack 12. Each part 14 includes coolant connectors 40 and 42 that can be connected to couplers. The couplers are spaced apart along the length of the cold manifold 30 and the hot manifold 32. The part 14 may include an internal network of fluid pipes, which circulates the coolant through all the internal components of the part 14. For example, a part 14 may be an application server with an internal cold plate that contacts the processing device in the server's housing. The cold manifold 30 provides coolant through the coolant connector 40, and the coolant circulates through the cold plate to take away the heat generated by the processing device. The coolant returns to the heat manifold 32 through the coolant connector 42.

Thus, the coolant liquid will flow into the part 14 from the cold coolant pipe 34 and the cold manifold 30. The coolant will circulate through the internal components of the part 14 to absorb heat, then flow out of the part 14 and pass through the heat manifold 32 to the hot coolant pipe 36. The heated coolant will be sent through the coolant distribution unit 16. The coolant distribution unit 16 includes an internal heat exchanger and a pump. The heat exchanger removes the heat of the heated coolant flowing from the hot coolant pipe 36, and the pump recirculates the now cooled coolant back to the cold coolant pipe 34. The heat exchanger may include a series of internal fins, which can be cooled by a fan unit. In this example, the heat exchanger is integrated in the coolant distribution unit 16. Alternatively, a door may be attached to the rack 12, and the heat exchanger and fan unit may be installed on the door.

Unlike the trough system, each part 14 is placed in a more efficient stacked arrangement, resulting in higher power density. When one of the parts 14 requires repair, the technician can interrupt the connection of the individual coolant connectors 40 and 42 to the cold manifold 30 and the hot manifold 32. The technician can then seal the coolant connectors 40 and 42 on the part 14 to avoid coolant leakage. The technician can then remove the part 14 from the frame 12. However, the sealed casing of the part 14 is filled with liquid coolant. Thus, the part 14 is very heavy and hinders the technician's ability to repair the part. For example, a server with coolant may weigh 26 kilograms (kg) (58 lbs), but the same server without any coolant may weigh about 14 kg (30 lbs).

Therefore, there is a need to provide a method for discharging the coolant from the computing device parts on the rack before the computing device parts on the rack are removed from the server. Separate pipes are also required, which can be connected to drain the coolant from the parts of the rack before the parts are repaired.

An disclosed example is an equipment assembly that includes a rack for accommodating electronic components. The parts include coolant inlet, coolant outlet and drain connector. The cold manifold supplies the coolant to the heat-generating electronic parts through the coolant inlet. The heat manifold collects the coolant from the heat-generating electronic parts through the coolant outlet. The exhaust manifold contains a coupler. The coolant inlet and coolant outlet system and the cold manifold and hot manifold are not connected. The discharge connector is fluidly connected to the discharge manifold to discharge the coolant from the heat-generating electronic parts before the heat-generating electronic parts are removed from the rack.

Another disclosed example is a method of discharging coolant from heat-generating parts in the rack. The rack contains a cold manifold, a hot manifold, and an exhaust manifold. The heat generating parts include a coolant inlet that is in fluid communication with the cold manifold, a coolant inlet that is in communication with the heat manifold, and a discharge connector. The coolant inlet and the cold manifold are not connected. The coolant outlet and the heat manifold are not connected. The exhaust connector is connected to the exhaust manifold so that the coolant in the heat generating parts can be exhausted to the exhaust manifold. After draining the coolant, remove the heat generating parts from the rack.

The content of the above brief description does not represent every embodiment or all aspects of this disclosure. Rather, the foregoing brief description only provides examples of some of the novel aspects and features described herein. Through the following detailed description of a number of representative embodiments and methods of implementing the present invention, coupled with a number of drawings and the scope of the attached patent application, the above features and benefits as well as other features and benefits of the present disclosure will be easily apparent.

The present invention can be realized in many different forms. A number of representative embodiments are shown in the drawings and will be described in detail here. The present disclosure is an example or illustration of the principle of the present disclosure, and is not intended to limit the broad aspects of the disclosure content of the embodiments. The extent, elements, and limitations disclosed are, for example, in the abstract, new content, and implementation sections, but are not explicitly stated in the scope of the patent application, and should not be implicitly or speculated or otherwise incorporated into the patent application individually or collectively In range. As far as this embodiment is concerned, unless expressly excluded, the singular form includes the plural form and vice versa; and the word "include" represents "including but not limited to." In addition, words that indicate rough estimates, such as "about", "almost", "approximately", "approximately", etc., can be used here, for example, to mean "at the value", "close to the value" or " Almost at the value" or "within 3-5% difference from the value" or "within allowable manufacturing tolerance" or any logical combination.

The present disclosure relates to a submerged cooling system on a rack, which has a liquid discharge mechanism in a sealed casing to discharge coolant from the sealed casing. The exhaust mechanism includes an additional exhaust connector, and the additional exhaust connector is located in a completely sealed housing of each of the many heat generating parts supported by the frame. The drain connector is connected to an additional drain manifold and reservoir on the rack to store the drained liquid coolant during parts maintenance. When parts require repair, liquid coolant can be drained from the drain connector. Thus, the parts will not contain coolant and therefore have a lighter weight to remove from the rack. After repairing or replacing parts, the reservoir can provide the stored coolant to the coolant distribution unit, so that the discharged liquid coolant can be recycled for replacement parts.

FIG. 2A shows an exemplary fully sealed enclosure immersion cooling system 100, which includes a rack 102, a series of heat generating parts 104, a coolant distribution unit (CDU) 106, and a reservoir 108. FIG. 2B is a close-up top perspective view of the coolant distribution unit 106 and the reservoir 108. FIG. 2C is a side view of an exemplary enclosed enclosure submerged cooling system 100. Figure 2D is a close-up bottom perspective view of the coolant distribution unit 106 and the reservoir 108. Similar components in Figures 2A-2D are labeled with the same component symbols. As can be seen in FIGS. 2A-2D, in the rack 102, a plurality of heat generating parts 104 are stacked on the reservoir 108 and the coolant distribution unit 106. Each heat-generating part 104 has a completely sealed casing to allow the circulation of coolant to cool multiple internal components in the casing.

As shown in FIGS. 2A-2D, the rack 102 includes a rectangular bottom frame 110. The bottom frame 110 includes a set of wheels 112 attached to the bottom of the bottom frame 110. The wheels 112 enable the rack 102 to be moved to a desired position in the data center. The side members of the bottom frame 110 support vertical supports 114a, 114b, 114c, and 114d. The top plate 116 is connected to the tops of the vertical supports 114a, 114b, 114c, and 114d. The top plate 116 holds the lateral brace members 118 and 120, and the lateral brace members 118 and 120 are respectively connected to the tops of the vertical supports 114a, 114b, 114c, and 114d. Each of the vertical supports 114a, 114b, 114c, and 114d may include a hole to allow a pin to be inserted into the hole to support a shelf mountable between the vertical supports 114a, 114b, 114c, and 114d. The support members 114a and 114b define the rear end of the frame 102. The vertical bus bar 122 extends from behind the top plate 116 to the bottom frame 110. The bus bar 122 can supply power to a plurality of parts 104. The bus bar 122 can also support multiple cables, and the multiple cables can be connected to multiple parts 104. The front end of the frame 102 is defined by the support members 114c and 114d. The multiple parts 104 are usually installed between the front end of the rack 102 and the supports 114c and 114d, and are located in one of the multiple shelves. Thereby, a plurality of parts 104 can be pushed into the frame 102 until they contact the bus bar 122. The individual parts 104 can also be pulled out of the frame 102 from the front end of the frame 102 (between the support members 114c and 114d) to replace or repair the individual parts 104.

In this example, the coolant distribution unit 106 is installed on the bottom frame 110 under the stack of all the heat generating parts 104. In this example, the heat-generating component 104 can be a storage server, an application server, a switch, or other electronic devices. Each shelf between the support members 114a-114d can hold one or more heat generating parts 104. The shelves can be configured to have different heights among multiple shelves. It should be understood that any number of shelves and corresponding heat generating parts 104 may be installed in the rack 102. In this example, in the frame 102, the part 104 is placed in a horizontal orientation. However, in the case of having an additional internal structure connected to the support members 114a, 114b, 114c, and 114d, the heat generating part 104 may be placed in a vertical orientation.

The frame 102 supports a cold manifold 124, a heat manifold 126, and a discharge manifold 128. The cold manifold 124, the heat manifold 126 and the discharge manifold 128 respectively extend behind the frame 102 and between the support members 114a and 114b At the height of the rack 102. The cold manifold 124 is fluidly connected to the coolant distribution unit 106 through the cold coolant pipe 130. The heat manifold 126 is fluidly connected to the coolant distribution unit 106 through the hot coolant pipe 132. Each of the cold manifold 124 and the hot manifold 126 may allow coolant to circulate along individual lengths of the manifold. The cold manifold 124 and the hot manifold 126 have respective fluid couplers to allow fluid communication with one of the parts 104.

Each part 104 includes a completely sealed housing 138, and the completely sealed housing 138 surrounds a plurality of electronic devices of the part 104. In this example, the rear of the housing 138 of each part 104 includes an inlet connector 140, and the inlet connector 140 can be connected to one of the fluid couplers of the cold manifold 124. The rear of the casing 138 also includes an outlet connector 142, and the outlet connector 142 can be connected to one of a plurality of fluid couplers of the thermal manifold 126. The rear of the casing 138 of each component 104 also includes a drain connector 144. The drain connector 144 is connected to a recessed area behind the cabinet 138. In this example, the discharge connector 144 is a pipe, and thus, the discharge connector 144 can be extended to connect to the discharge manifold 128 to discharge the coolant. During normal operation, the exhaust connector 144 is not connected to the exhaust manifold 128 and can be retracted into the recess of the casing 138.

The completely sealed casing 138 encloses multiple electronic components, power supplies, circuit boards, device cards, processors, memory devices, and other components. The housing 138 may include an internal network of fluid pipes that circulates the coolant around the multiple internal components of the multiple parts 104. The coolant is completely sealed by the casing 138, and the coolant can only enter or exit the casing 138 through the inlet connector 140, the outlet connector 142 or the discharge connector 144.

For example, one of the multiple components 104 may be an application server with multiple processing devices, such as central processing units (CPUs) and graphics processing units (GPUs). The application server may include a cold plate that contacts the central processing unit and the graphics processor, and adjacent memory devices, such as dual-line memory modules (DIMMs). The coolant circulates through the cold plate to take away the heat generated by the processing device and the memory device. In this example, the individual heat-generating parts 104 can be inserted into the rack from the front of the rack 102. Once positioned, the inlet connector 140 is fluidly connected to one of the multiple couplers of the cold manifold 124 and the outlet connector 142 is fluidly connected to one of the multiple couplers of the hot manifold 126. The component 104 can be connected to a power supply and other cables, such as cables supported by the bus bar 122.

The cold manifold 124 and the hot manifold 126 circulate the coolant to the part 104 through a closed loop formed by the coolant distribution unit 106. Thus, coolant liquid will flow from the cold manifold 124 from the inlet connector 140 into each part 104. The coolant will circulate through the multiple internal pipes of the part 104 to absorb heat from the multiple internal components, and flow out of the part 104 through the outlet connector 142 to the heat manifold 126. The heated coolant will circulate to the coolant distribution unit 106 from the outlet pipe (hot coolant pipe 132). The coolant distribution unit 106 includes an internal heat exchanger and a pump installed inside the casing. The heat exchanger is used to remove heat from the heated coolant, and the pump recirculates the now cooled coolant through the inlet pipe (cold coolant pipe 130) back to the cold manifold 124. Typically, the heat exchanger dissipates the collected heat through an open loop cooling system, such as a fan system. In this example, the heat exchanger and the pump system are integrated units. However, a rear door may be attached behind the rack 102. The rear door can support a heat exchanger and an open circuit cooling system, such as a fan wall.

Before removing the part 104 from the rack 102, the discharge mechanism composed of the reservoir 108 and the discharge manifold 128 allows the coolant to be discharged from any part 104. The exhaust manifold 128 passes through the length of the frame 102 and is between the bottom frame 110 and the top plate 116. The discharge manifold 128 is fluidly connected to the reservoir 108 through the connecting pipe 150. The exhaust manifold 128 includes a plurality of couplers 152 that are placed in vertical alignment with each part 104. A plurality of couplers 152 can be connected to the exhaust connector 144 of the part 104. The connecting pipe 154 fluidly connects the reservoir 108 to the coolant distribution unit 106. In this way, the coolant collected in the reservoir 108 can be supplied to the coolant distribution unit 106.

The reservoir 108 can store liquid coolant, and the liquid coolant can be discharged from any part 104 removed from the rack 102. Figures 3A, 3B and 3D are top views of one of the parts 104 in the rack 102 during the removal and discharge process. FIG. 3C is a side view of one of the parts 104 in the removal process. Similar components in Figures 2A-2D are marked with the same component symbols in Figures 3A-3D. In the normal operating state of the part 104, the discharge connector 144 of the part 104 is not connected to the discharge manifold 128, as shown in FIG. 3A. The drain connector 144 is usually plugged to prevent the coolant from leaking from the casing 138. The inlet connector 140 and outlet connector 142 are connected to the respective cold manifold 124 and hot manifold 126 couplers 210 and 212 to allow the coolant to circulate to the part 104.

When the part 104 needs maintenance, a part of the casing 138 is pulled out from the front of the frame 102, as shown in FIGS. 3B and 3C. In this example, the front end of the casing 138 may include a handle 220 to assist in pulling out the part 104. The inlet connector 140 and the outlet connector 142 are disconnected from or disconnected from the couplers 210 and 212 of the cold manifold 124 and the hot manifold 126, respectively. Then, the technician can pull out the part 104 from the front part of the frame 102. The inlet connector 140 and the outlet connector 142 are plugged to prevent the coolant from leaking from the part 104. As shown in Figures 3B-3C, the casing 138 is pulled out a distance in which the exhaust connector 144 can be connected to the coupler 152 of the exhaust manifold 128, and this is to connect the inlet connector 140 to the outlet The distance between the device 142 and the couplers 210 and 212 is sufficient. When the casing 138 is in this position, the exhaust connector 144 is not plugged (eg, the plug is removed) and is connected to the coupler 152 of the exhaust manifold 128. Thus, all the coolant in the casing 138 will be discharged to the discharge manifold 128 through the discharge connector 144. The discharged coolant will flow from the discharge manifold 128 through the connecting pipe 150 to the reservoir 108 to store the coolant.

As shown in FIG. 3D, after all the coolant in the casing 138 is discharged, the discharge connector 144 can be disconnected from the discharge manifold 128. The coupler 152 of the discharge manifold 128 can be plugged to avoid coolant leakage. Then, the part 104 for discharging the coolant can be completely pulled out from the frame 102 for maintenance or replacement. The removal of the coolant makes the part 104 lighter and easier to handle.

When new parts or repaired parts 104 are inserted back into the rack 102, the inlet connector 140 and the outlet connector 142 will be connected to the coupler of the cold manifold 124 and the hot manifold 126. Then, the connected part 104 will be filled with liquid coolant from the inlet connector 140 and from the cold manifold 124. After the new or repaired part 104 has been filled with liquid coolant, the power of the part 104 can be turned on.

The terminology used here is only to describe a specific number of examples, and not as a limitation of the present invention. Unless the content is clearly defined, the singular forms "one" and "the" used here also include the possibility of plural forms. In addition, the words "include", "have", "have" or their variations used in the implementation and/or the scope of the patent application are similar to the word "include" to a certain extent.

Unless there are other definitions, all words (including technical or scientific terms) used herein have the same meaning as commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs. In addition, words, such as those defined by commonly used dictionaries, should be interpreted as having meaning consistent with their meaning in the relevant technical content, and will not be interpreted as ideal or excessively superficial meaning unless clearly defined here .

Although several embodiments of the present invention have been described above, it should be understood that they are merely illustrative and not a limitation of the present invention. Without departing from the spirit or scope of the present invention, the disclosed examples can be changed in many ways according to the content disclosed herein. Therefore, the breadth and scope of the present invention should not be limited by any of the above examples. More precisely, the scope of the present model should be defined in accordance with the following patent application scope and its equivalent content.

Although the present invention has been described and described with reference to one or more embodiments, those skilled in the art can make equivalent changes and modifications after reading and understanding the specification and the drawings. In addition, although a specific feature of the present invention may only be disclosed in one of several embodiments, this feature can be combined with one or more other features of other embodiments as required, and can be beneficial to any specific or specific application.

10: Immersion system 12, 102: rack 14,104: parts 16,106: Coolant distribution unit 20,110: bottom frame 22, 112: wheels 24a~24d: vertical rod 26,116: top plate 30,124: cold manifold 32,126: Heat Manifold 34,130: cold coolant pipe 36,132: Hot coolant pipe 40, 42: Coolant connector 100: Submerged cooling system 108: Storage 114a~114d: support 118, 120: transverse strut members 122: bus bar 128: discharge manifold 138: Chassis 140: inlet connector 142: Outlet connector 144: Drain connector 150,154: connecting pipe 152,210,212: coupler 220: handle

Through the following description of a number of exemplary embodiments and with reference to the accompanying drawings, the present disclosure will be better understood: Figure 1A shows a perspective view of the immersed cooling system on the rack shell of the known prior art; Figure 1B is a close-up view of the prior art rack housing with a coolant distribution unit in Figure 1A; Figure 2A is a perspective view of an exemplary rack-mounted liquid immersion system with a drainage mechanism according to certain aspects of the present disclosure; Figure 2B is a close-up top perspective view of an example of the liquid immersion system with a discharge mechanism in Figure 2A in accordance with certain aspects of the present disclosure; Figure 2C shows a side view of the exemplary rack-mounted liquid immersion system with a drain mechanism in Figure 2A according to certain aspects of the present disclosure; Figure 2D is a close-up bottom perspective view of an example of the liquid immersion system with a discharge mechanism in Figure 2A in accordance with certain aspects of the present disclosure; Figure 3A is a top cross-sectional view of an exemplary heat-generating part (with an unconnected discharge mechanism) in an operating position according to certain aspects of the present disclosure; FIG. 3B is a top cross-sectional view showing the position of the exemplary heat-generating parts in FIG. 3A relative to the rack to allow coolant discharge according to certain aspects of the present disclosure; Fig. 3C is a side view of the exemplary heat generating part in Fig. 3A relative to the position of the frame to discharge the coolant to the reservoir; and Figure 3D is a top cross-sectional view of the exemplary heat generating part in Figure 3A after the coolant has been discharged from the rack.

This disclosure can be understood as various changes and alternative forms. Some representative embodiments have been shown by examples in multiple drawings, and will be described in detail here. However, it should be understood that the present invention is not limited to the specific forms disclosed. More precisely, the spirit and scope of the present model are defined by the scope of the attached patent application, and this disclosure should cover all changes, equivalents, and alternatives falling within the spirit and scope of the present model.

100: Submerged cooling system

102: rack

104: Parts

106: Coolant distribution unit

108: Storage

110: bottom frame

114a: 114d: support

116: top plate

118, 120: transverse strut members

122: bus bar

124: Cold Manifold

126: Heat Manifold

128: discharge manifold

130: cold coolant pipe

132: Hot coolant pipe

Claims (10)

An equipment assembly for cooling a heat-producing electronic component, including: A rack for accommodating the heat-generating electronic part, the heat-generating electronic part including a coolant inlet, a coolant outlet and a discharge connector; A cold manifold for supplying coolant to the heat-generating electronic part through the coolant inlet; A heat manifold for collecting the coolant from the heat-generating electronic part through the coolant outlet; and A discharge manifold comprising a coupler, wherein the coolant inlet and the coolant outlet are not connected to the cold manifold and the heat manifold, and wherein the discharge connector is fluidly connected to the discharge manifold to Before removing the heat-generating electronic part from the rack, the coolant is discharged from the heat-generating electronic part. The equipment assembly according to claim 1, further comprising a coolant distribution unit fluidly coupled to the hot manifold and the cold manifold, and the coolant distribution unit includes a heat exchanger, a The pump, a cold coolant tube, and a hot coolant tube, the cold coolant tube being fluidly connected to the cold manifold, and the hot coolant tube being fluidly connected to the heat manifold. The equipment assembly according to claim 2, wherein the coolant distribution unit is located at the bottom of the rack and under the heat-generating electronic part. The equipment assembly according to claim 1, further comprising a reservoir, the reservoir having a fluid pipe in fluid communication with the discharge manifold. The equipment assembly according to claim 1, further comprising a door located on the rack, wherein a cooling system in fluid communication with the cold manifold and the hot manifold is installed on the door. The equipment assembly according to claim 1, wherein the heat-generating electronic part comprises a sealed casing, accommodating a plurality of internal components and a plurality of internal pipes, the internal pipes being coupled to the coolant inlet and the coolant outlet So that the coolant circulates around the internal components. The equipment assembly according to claim 1, wherein the heat-generating electronic component is one of a storage server, an application server, or a switch device. An electronic heat generating device for inserting into a rack having a cold manifold and a heat manifold, the electronic heat generating device includes: A sealed casing with at least one heat generating element; A coolant inlet, which is fluidly connected to the cold manifold; A coolant outlet, which is fluidly connected to the heat manifold; A plurality of internal pipes for circulating coolant around the at least one heat generating element in the sealed casing; and A discharge connector is used to discharge the liquid coolant from the internal pipes when the electronic heat generating device is removed from the rack. The electronic heat-generating device according to claim 8, wherein the at least one heat-generating element is one of a processor or a memory device. The electronic heat-generating device according to claim 8, wherein the electronic heat-generating device is one of a storage server, an application server, or a switch device.

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