TWM603553U - Display apparatus - Google Patents

Abstract

A display apparatus having a display area and a peripheral area surrounding the display area is provided. The display apparatus includes a display panel, a flexible printed circuit board, a plurality of first conductive wire segments and a plurality of second conductive wire segments. The display panel has a first substrate, a pixel circuit layer and display medium layer. The pixel circuit layer is disposed on the first substrate. The display medium layer is disposed on the pixel circuit layer. The flexible printed circuit board is electrically bonded to the peripheral area. The first conductive wire segments are disposed in the peripheral area. The second conductive wire segments are disposed on the flexible printed circuit board. The second conductive wire segments are electrically connected between the first conductive wire segments to form a coil loop around the display area.

Description

Display device

The present invention relates to a display device, and particularly to a display device with a built-in induction coil.

Near Field Communication (NFC), also known as Near Field Communication, is a short-distance high-frequency wireless communication technology, evolved from non-contact radio frequency identification (RFID) and interconnection technology . Near-field communication technology allows two electronic devices that want to communicate with each other to make a point-to-point connection by approaching or close contact, thereby realizing wireless transmission and exchange of data.

Since near-field communication technology is very convenient for data storage, management and transmission, if it is equipped with consumer electronic products such as mobile phones, portable game consoles or notebook computers, it can provide electronic products as identification and data Various purposes such as exchange and transaction payment to improve the functionality of electronic products. Generally speaking, most mobile phones with NFC function attach the NFC antenna to the inner surface of the mobile phone shell. Therefore, in order not to affect the transmission of NFC signals, the material selection of the mobile phone case is bound to be limited (for example, it cannot be a metal material). In order to solve the above-mentioned problems, a technology of integrating the NFC antenna into the display panel is proposed. However, such an approach will increase the number and complexity of the manufacturing process of the display panel.

The present invention provides a display device with a built-in coil loop, and the coil loop is highly integrated with the existing display panel or touch panel.

The display device created by the new model has a display area and a peripheral area surrounding the display area. The display device includes a display panel, a flexible circuit board, a plurality of first wire segments and a plurality of second wire segments. The display panel includes a first substrate, a pixel circuit layer and a display medium layer. The pixel circuit layer is disposed on the first substrate. The display medium layer is arranged on the pixel circuit layer. The flexible circuit board is electrically connected to the peripheral area. A plurality of first wire segments are arranged in the peripheral area. The multiple second wire segments are arranged on the flexible circuit board. The second wire segments are electrically connected between the first wire segments to form a coil loop surrounding the display area.

In an embodiment of the present invention, the above-mentioned display device further includes a plurality of signal lines, which are arranged in the display area and extend to the peripheral area. The flexible circuit board has a base material and a plurality of conductive traces. These conductive traces are arranged on the substrate and are electrically connected to the signal lines. The vertical projections of the conductive traces on the substrate intersect with the vertical projections of the plurality of second wire segments on the substrate.

In an embodiment of the present invention, the flexible circuit board of the above-mentioned display device further has a plurality of conductive through holes, and the conductive through holes penetrate through the opposite first surface and second surface of the substrate. A plurality of conductive traces are arranged on the first surface, and a plurality of conductive vias are respectively located on opposite sides of the conductive traces. Each of the plurality of second wire segments has a first part and a second part. The first part is electrically connected to the second part through one of the conductive vias. The first part is disposed on the first surface and located on opposite sides of the conductive traces. The second part is disposed on the second surface and the vertical projections of the conductive traces on the second surface intersect at the second part.

In an embodiment of the present invention, the above-mentioned display device further includes a shielding structure having a first extension section and a second extension section that are electrically connected to each other. The first extension section is arranged between the plurality of signal lines and the plurality of first wire sections. The second extension section is arranged on the first surface of the base material of the flexible circuit board and is located between the plurality of conductive traces and the plurality of first portions of the plurality of second wire segments.

In an embodiment of the present invention, the above-mentioned display device further includes a touch panel overlapped on the display panel. The touch panel includes a first touch substrate, a first sensing electrode layer, a second sensing electrode layer and a plurality of bonding pads. The first touch substrate has a first surface and a second surface opposite to each other. The display panel is located on the second surface of the first touch substrate. The first sensing electrode layer and the second sensing electrode layer are disposed on the first touch substrate, and at least one of the first sensing electrode layer and the second sensing electrode layer is located on the first surface of the first touch substrate on. A plurality of bonding pads are arranged on the first surface of the first touch substrate and located in the peripheral area. At least one of the first sensing electrode layer and the second sensing electrode layer and the plurality of first wire segments belong to the same film layer. The first wire segments are electrically connected to the bonding pads, and the flexible circuit board is electrically connected to the bonding pads.

In an embodiment of the present invention, the flexible circuit board of the above-mentioned display device further has an integrated chip disposed on the substrate. A plurality of signal lines and a plurality of second wire segments are electrically connected to the integrated chip. The integrated chip transmits wireless signals via the second wire segments and the first wire segments, and transmits at least one touch signal via the signal lines.

In an embodiment of the present invention, the touch panel of the above-mentioned display device further includes a second touch substrate, which is disposed on the first surface or one side of the second surface of the first touch substrate. The first sensing electrode layer and the second sensing electrode layer are respectively disposed on the first touch substrate and the second touch substrate.

In an embodiment of the present invention, the first sensing electrode layer, the second sensing electrode layer and the plurality of first wire segments of the above-mentioned display device belong to the same film layer.

In an embodiment of the present invention, the above-mentioned display device further includes a touch panel overlapped on the display panel. The touch panel includes a touch substrate, a first sensing electrode layer, a second sensing electrode layer, and a plurality of bonding pads. The touch substrate has a first surface and a second surface opposite to each other. The first sensing electrode layer and the second sensing electrode layer are respectively disposed on the first surface and the second surface of the touch substrate. One of the first sensing electrode layer and the second sensing electrode layer and the plurality of first wire segments belong to the same film layer. The bonding pads are located in the peripheral area and are respectively electrically connected to the first wire segments. The bonding pads and the first wire segments are arranged on the first surface or the second surface, and the flexible circuit board is electrically bonded to the bonding pads.

In an embodiment of the present invention, the above-mentioned display device further includes a touch panel overlapped on the display panel. The touch panel includes a transparent cover plate, a first sensing electrode layer, a second sensing electrode layer, and a plurality of bonding pads. The first sensing electrode layer and the second sensing electrode layer are arranged on the surface of the cover plate on the side of the transparent cover plate facing the display panel. A plurality of bonding pads are arranged on the surface of the transparent cover plate and located in the peripheral area. The first sensing electrode layer, the second sensing electrode layer and the plurality of first wire segments belong to the same film layer. The first wire segments are electrically connected to the bonding pads, and the flexible circuit board is electrically connected to the bonding pads.

In an embodiment of the present invention, the display panel of the above-mentioned display device further includes a plurality of bonding pads disposed on the first substrate and located in the peripheral area. A plurality of first wire segments are arranged between the first substrate and the display medium layer, the first wire segments are electrically connected to the bonding pads, and the flexible circuit board is electrically bonded to the bonding pads.

In an embodiment of the present invention, the display panel of the above-mentioned display device further includes a second substrate, a color filter layer, and a plurality of bonding pads. The second substrate is opposite to the first substrate. The color filter layer is disposed between the second substrate and the display medium layer. The plurality of first wire segments are arranged on the color filter layer and between the color filter layer and the first substrate. A plurality of bonding pads are arranged on the first substrate and located in the peripheral area. The pixel circuit layer has a plurality of signal lines arranged in the display area and extending to the peripheral area. The first wire segments and the signal lines are electrically connected to the bonding pads, and the flexible circuit board is electrically connected to the bonding pads.

In an embodiment of the present invention, the display panel of the above-mentioned display device further includes a second substrate, a first sensing electrode layer, a second sensing electrode layer, and a plurality of bonding pads. The second substrate is opposite to the first substrate. The first sensing electrode layer and the second sensing electrode layer are disposed on the surface of the second substrate facing away from the display medium layer. A plurality of bonding pads are arranged on the surface of the second substrate and located in the peripheral area. The first sensing electrode layer, the second sensing electrode layer and the plurality of first wire segments belong to the same film layer, and are electrically connected to the bonding pads respectively. The flexible circuit board is electrically connected to these bonding pads.

Based on the above, in the display device of an embodiment of the present invention, the coil loop used for wireless signal transmission is formed by alternately connecting multiple first wire segments and multiple second wire segments surrounding the display area of the display device. . By arranging the first wire segment and the second wire segment on the peripheral area of the display device and the flexible circuit board electrically connected to the peripheral area, the increase in the number of manufacturing processes of the display device can be avoided, and the complexity of the manufacturing process can be reduced. It helps to improve the integration of the coil circuit and the display device.

The aforementioned and other technical content, features and effects of the creation of the new model will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the creation of the new model.

FIG. 1 is a schematic top view of the display device according to the first embodiment of the invention. FIG. 2 is a schematic cross-sectional view of the display device of FIG. 1. 3 is a schematic cross-sectional view of a flexible circuit board of the display device of FIG. 1. In particular, for the sake of clarity, FIG. 1 omits the illustration of the second substrate 102, the polarizer POL1, the polarizer POL2, the display medium layer 120, and the color filter layer 130 in FIG.

1 and 2, the display device 10 has a display area DA and a peripheral area PA surrounding the display area DA. For example, the peripheral area PA here may be defined by an area other than the vertical projection of the display area DA on the first substrate 101. The display area DA is provided with a plurality of pixels PX arranged in an array, and these pixels PX are used to display image frames. More specifically, the display device 10 achieves the purpose of displaying image frames through the display panel 100. The display panel 100 includes a first substrate 101, a second substrate 102, a pixel circuit layer 110 and a display medium layer 120. The second substrate 102 is disposed opposite to the first substrate 101. The pixel circuit layer 110 is disposed on the first substrate 101. The display medium layer 120 is disposed between the pixel circuit layer 110 and the second substrate 102.

In this embodiment, the display medium layer 120 is, for example, a liquid crystal layer including a plurality of liquid crystal molecules (not shown), and two electrode layers (not shown) can be selectively provided on opposite sides of the liquid crystal layer. A voltage can be applied between the two electrode layers to drive the liquid crystal molecules to rotate to adjust the polarization state of the incident light. That is, the display panel 100 of this embodiment is a liquid crystal display panel (liquid crystal display panel). Therefore, the display panel 100 may further include a polarizer POL1 and a polarizer POL2, which are respectively disposed on the first substrate 101 and the second substrate 102. In order to achieve the purpose of color display, a color filter layer 130 may be further provided on one side of the display medium layer 120. For example, the color filter layer 130 may be selectively disposed between the second substrate 102 and the display medium layer 120, but it is not limited to this.

However, the present invention is not limited to this. According to other embodiments, the display panel may also be an organic light emitting diode (OLED) panel or a micro light emitting diode (micro-LED) panel. Or sub-millimeter light emitting diode (mini light emitting diode, mini-LED) panel. It should be understood that when the display panel is a self-luminous display panel, the display panel may not have the aforementioned second substrate 102 and the color filter layer 130.

Furthermore, the pixel circuit layer 110 of the display panel 100 includes a plurality of signal lines SL1 and a plurality of signal lines SL2, which are disposed in the display area DA and extend to the peripheral area PA. The signal lines SL1 are arranged along the direction X and extend in the direction Y, and the signal lines SL2 are arranged along the direction Y and extend in the direction X. More specifically, the signal lines SL1 intersect the signal lines SL2 and define a plurality of pixel areas of the display panel 100, and the aforementioned plurality of pixels PX are respectively disposed in these pixel areas. In this embodiment, the signal lines SL1 are, for example, data lines, the signal lines SL2 are, for example, scan lines, and the respective active components (not shown) of the pixels PX are electrically connected to correspond to One signal line SL1 and one signal line SL2.

The display panel 100 further includes a plurality of bonding pads 105 arranged in the peripheral area PA and a flexible circuit board 150 electrically connected to the bonding pads 105. These bonding pads 105 are adjacent to one side edge of the first substrate 101. In this embodiment, the display panel 100 can optionally be provided with a driver chip 140 in the peripheral area PA, and the driver chip 140 is disposed on the first chip through a chip on glass (COG) process, for example. On a substrate 101. For example, a plurality of signal lines SL1 located in the display area DA may extend to the peripheral area PA to be electrically connected to the driver chip 140, and the driver chip 140 is further electrically connected to a part of the bonding pad 105 through a plurality of connection wires 145. But the creation of this new type is not limited to this. In other embodiments, the driving chip 140 may not be provided on the first substrate 101 of the display panel, and the aforementioned multiple signal lines SL1 can be directly connected to a part of the bonding pad 105 after extending to the peripheral area PA.

Please also refer to FIG. 3. On the other hand, the flexible circuit board 150 includes a substrate 151, a plurality of bonding pins 152 and a plurality of conductive traces 153. The substrate 151 has a first surface 151a and a second surface 151b opposite to each other. The bonding pins 152 respectively correspond to the bonding pads 105 and are provided on one side edge of the base material 151 on the first surface 151a. A plurality of conductive traces 153 are disposed on the first surface 151a of the substrate 151, and are electrically connected to the bonding pins 152 of a part. More specifically, these conductive traces 153 are electrically connected to the aforementioned multiple signal lines SL1 through the electrical bonding relationship between the partial bonding pins 152 and the partial bonding pads 105.

On the other hand, the display device 10 further includes a coil circuit 160 arranged on the display panel 100 and the flexible circuit board 150. The coil circuit 160 allows the display device 10 to realize wireless transmission and exchange of data. For example, the display device 10 may adopt a short-range high-frequency radio technology, such as near field communication (NFC) technology, to achieve the purpose of wireless transmission. That is, the coil circuit 160 can operate at a frequency of 13.56 MHz, and wirelessly transmit data within a distance of 20 cm.

Furthermore, the coil loop 160 here is formed by alternately connecting a plurality of first wire segments 161 and a plurality of second wire segments 162 surrounding the display area DA of the display device 10. For example, in this embodiment, the first wire segment 161 is disposed on the first substrate 101 of the display panel 100 and is located in the peripheral area PA. The second wire segment 162 is disposed on the flexible circuit board 150 and is electrically connected to a corresponding first wire segment 161 through the bonding relationship between the bonding pin 152 of the flexible circuit board 150 and the bonding pad 105 of the display panel 100. Accordingly, the increase in the number of manufacturing processes of the display device 10 can be avoided, and the complexity of the manufacturing process can be reduced, which helps to improve the degree of integration between the coil circuit 160 and the display device 10.

For example, in this embodiment, the materials of the first wire segment 161, the signal line SL2, and the bonding pad 105 of the coil circuit 160 can be selectively the same; that is, the first wire segment 161, the signal line SL2, and the bonding pad 105 The pad 105 can belong to the same film layer, but is not limited to this. On the other hand, based on the consideration of conductivity, the material of the coil circuit 160 is generally a metal material. However, the present invention is not limited to this. In other embodiments, the coil circuit 160 may also use other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, and oxynitrides of metal materials. , Or other suitable materials, or stacked layers of metal materials and other conductive materials.

It should be noted that, in order to form the coil loop 160, the vertical projections of the plurality of second wire segments 162 provided on the flexible circuit board 150 on the substrate 151 intersect the vertical projections of the plurality of conductive traces 153 on the substrate 151 . In detail, the second wire segment 162 has a first portion 162 a and a second portion 162 b disposed on opposite sides of the substrate 151. The first part 162 a is disposed on the first surface 151 a of the substrate 151 and located on opposite sides of the plurality of conductive traces 153. The first portions 162a of the second wire segments 162 are electrically connected to the bonding pins 152 respectively. The second portion 162b is disposed on the second surface 151b of the substrate 151, and the vertical projection of the conductive trace 153 on the second surface 151b intersects the second portion 162b. That is, the extension direction (for example, direction X) of the second portion 162 b intersects the extension direction (for example, direction Y) of the conductive trace 153.

It is worth mentioning that by arranging the conductive trace 153 and the second portion 162b of the second wire segment 162 on opposite sides of the substrate 151, additional manufacturing steps (such as the formation of an insulating layer) can be avoided. . In order to electrically conduct the first portion 162a and the second portion 162b of the second wire segment 162, the flexible circuit board 150 further has a plurality of conductive through holes CH. For example, the substrate 151 has a plurality of through holes 151h penetrating through the first surface 151a and the second surface 151b, and the substrate 151 defines the inner wall of the through holes 151h and connects a portion of the first surface 151a and a portion of the inner wall. The second surface 151b may be covered with a conductive layer 155 to form the aforementioned conductive via CH. As shown in FIG. 3, through the first portion 162a and the second portion 162b located on opposite sides of the substrate 151 respectively contacting the two portions of the conductive layer 155 located on the first surface 151a and the second surface 151b, the second wire segment 162 can be realized The first part 162a and the second part 162b are electrically connected. For example, the flexible circuit board 150 may further include a plurality of input terminals (or bonding pins), and the plurality of second conductive segments 162 and the plurality of conductive traces 153 may be electrically connected to the input terminals to receive external signals. Control signal, but not limited to this.

On the other hand, in order to suppress signal crosstalk between the signal line SL1 and the signal line SL2 when the coil circuit 160 is operating, the display device 10 may optionally include a shielding structure 170. Similarly, the shielding structure 170 has a first extension 171 and a second extension 172 that are electrically connected to each other. The first extension 171 is disposed on the plurality of signal lines SL1 (or the signal line SL2) and the plurality of first wire segments 161 between. The second extension section 172 is disposed on the first surface 151 a of the substrate 151 of the flexible circuit board 150 and is located between the plurality of conductive traces 153 and the plurality of first portions 162 a of the plurality of second wire sections 162. It should be understood that the electrical connection relationship between the first extension section 171 and the second extension section 172 of the shielding structure 170 is also achieved through the bonding relationship between the bonding pad 105 of the display panel 100 and the bonding pin 152 of the flexible circuit board 150 .

Other embodiments will be listed below to describe the disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and will not be repeated hereafter.

4 is a schematic cross-sectional view of the display device according to the second embodiment of the present invention. Please refer to FIG. 4, the difference between the display device 11 of this embodiment and the display device 10 of FIG. 2 is that the arrangement of the first wire segment of the coil loop is different. Specifically, the multiple first wire segments 161A of the coil circuit 160A of the display device 11 are arranged on the second substrate 102A. In this embodiment, the first wire segment 161A is disposed on the color filter layer 130A and is located between the color filter layer 130A and the first substrate 101. However, the present invention is not limited to this. In other embodiments, the first wire segment of the coil loop may also be directly disposed on the second substrate 102A and surround the color filter layer.

Specifically, in this embodiment, in order to electrically conduct the first wire segment 161A on the second substrate 102A with the bonding pad 105 on the first substrate 101, the display panel 100A can be located on the first substrate 101. The conductive structure (such as silver glue dots, not shown) between the second substrate 102A and the second substrate 102A is achieved.

5 is a schematic cross-sectional view of the display device according to the third embodiment of the invention. Please refer to FIG. 5, the difference between the display device 12 of this embodiment and the display device 11 of FIG. 4 lies in the difference in the composition of the display device and the setting of the coil loop. Specifically, the display device 12 of this embodiment has a touch function. In other words, the display device 12 further includes a touch circuit layer 180. The touch circuit layer 180 is disposed on the surface 102Bs of the second substrate 102B facing away from the display medium layer 120, and is located between the polarizer POL2 and the second substrate 102B.

In this embodiment, the touch circuit layer 180 has a first sensing electrode layer SE1 and a second sensing electrode layer SE2 that are electrically independent of each other. For example, the first sensing electrode layer SE1 and the second sensing electrode layer SE2 are driving electrodes (transmitter) and sensing electrodes (receiver), respectively. On the other hand, the display device 12 further includes a plurality of bonding pads 106 and another flexible circuit board 190. A plurality of bonding pads 106 are disposed on the surface 102Bs of the second substrate 102B, and the flexible circuit board 190 is electrically bonded to these bonding pads 106. More specifically, the flexible circuit board 190 is electrically connected through the bonding relationship between the bonding pins 192 provided on the base material 191 and the bonding pads 106 on the second substrate 102B.

Furthermore, the first wire segment 161B of the coil circuit 160B of the display device 12 is disposed on the surface 102Bs of the second substrate 102B. Therefore, the second wire segment 162 as shown in FIG. 1 can be modified on the flexible circuit board 190. In other words, the flexible circuit board 150A electrically connected to the bonding pad 105 on the first substrate 101 may not be provided with the second wire segment 162 of FIG. 1. Since the flexible circuit board 190 of this embodiment is similar to the flexible circuit board 150 of the aforementioned first embodiment, a detailed description, for example, the configuration of the second wire segment (not shown) of the coil loop 160B on the flexible circuit board 190 For the method, please refer to the relevant paragraphs of the foregoing embodiment, and will not be repeated here.

In this embodiment, the first sensing electrode layer SE1, the second sensing electrode layer SE2, the first wire segment 161B of the coil loop 160B, and the bonding pad 106 may selectively belong to the same film layer. Accordingly, the increase in the number of manufacturing processes of the display device 12 can be avoided, and the complexity of the manufacturing process can be reduced, which helps to improve the integration of the coil circuit 160B and the display device 12. Based on the consideration of conductivity, the material of the coil circuit 160B is generally a metal material. However, the present invention is not limited to this. In other embodiments, the coil circuit 160 may also use other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, and oxynitrides of metal materials. , Or other suitable materials, or stacked layers of metal materials and other conductive materials.

On the other hand, in order to ensure that the touch circuit layer 180 is not damaged by an unexpected external force, the display device 12 may also optionally include a transparent cover CS disposed above the polarizer POL2. In this embodiment, the material of the transparent cover CS is, for example, glass, but it is not limited to this.

Fig. 6 is a schematic top view of the display device according to the fourth embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of the display device of FIG. 6. In particular, for the sake of clarity, FIG. 6 omits the illustration of the display panel 100B, the flexible circuit board 150A, the transparent cover CS, and the adhesive layer 240 in FIG. 7. 6 and 7, the difference between the display device 20 of this embodiment and the display device 10 of FIGS. 1 and 2 lies in the difference in the composition of the display device and the configuration of the coil loop. In this embodiment, the display device 20 further includes a touch panel 200 overlapped on the display panel 100B and a flexible circuit board 250 electrically connected to the touch panel 200. Specifically, the coil circuit 260 of the display device 20 is disposed on the touch panel 200 and the flexible circuit board 250. In other words, the second wire segment 262 of the coil loop 260 is not provided on the flexible circuit board 150A electrically connected to the display panel 100B.

Different from the display device 12 of FIG. 5, the touch circuit layer 210 of the display device 20 is not disposed on the second substrate 102 of the display panel 100B. In this embodiment, the touch panel 200 includes a first touch substrate 201, a touch circuit layer 210 and a plurality of bonding pads 205. The first touch substrate 201 has a first surface 201a and a second surface 201b opposite to each other. The display panel 100B and the touch circuit layer 210 are respectively located on the first surface 201a and the second surface 201b of the first touch substrate 201. A plurality of bonding pads 205 are disposed on the first surface 201a of the first touch substrate 201 and located in the peripheral area PA.

Furthermore, the touch circuit layer 210 of the touch panel 200 includes a plurality of signal lines SL3, a plurality of signal lines SL4, a first sensing electrode layer SE1, and a second sensing electrode layer SE2. The plurality of signal lines SL3 are electrically connected to the first sensing electrode layer SE1, and extend to the peripheral area PA to electrically connect a portion of the bonding pad 205. The plurality of signal lines SL4 are electrically connected to the second sensing electrode layer SE2 and extend to the peripheral area PA to electrically connect to another part of the bonding pad 205. For example, the first sensing electrode layer SE1 and the second sensing electrode layer SE2 can be implemented in a metal mesh manner, but not limited to this. In other embodiments, the sensing electrode layer can also be implemented in any touch electrode pattern known to those with ordinary knowledge in the technical field to which the invention belongs.

On the other hand, in this embodiment, the base material 251 of the flexible circuit board 250, the bonding pins 252, the configuration relationship between the conductive traces 253 and the conductive vias CH, and the first wire segment 261 and the second wire of the coil loop 260 The first part 262a and the second part 262b of the segment 262, and the first extension 171A and the second extension 172A of the shielding structure 170A are arranged on the touch panel 200 and the flexible circuit board 250. The arrangement relationship is similar to that of the aforementioned first embodiment. The arrangement relationship of the base material 151, the bonding pins 152, the conductive traces 153 and the conductive vias CH of the circuit board 150, and the first wire segment 161 and the first portion 162a and the second portion 162b of the second wire segment 162 of the coil loop 160 , The first extension section 171 and the second extension section 172 of the shielding structure 170 are arranged on the display panel 100 and the flexible circuit board 150. Therefore, for detailed description, please refer to the relevant paragraphs of the foregoing embodiment, and will not be repeated here. .

For example, in this embodiment, the multiple first wire segments 261, the first sensing electrode layer SE1, the second sensing electrode layer SE2, and the bonding pad 205 of the coil loop 260 can selectively belong to the same film layer. But not limited to this. Accordingly, the increase in the number of manufacturing processes of the display device 20 can be avoided, and the complexity of the manufacturing process can be reduced, which helps to improve the integration of the coil circuit 260 and the display device 20. Furthermore, the flexible circuit board 250 can also optionally include an integrated chip 255, and a plurality of signal lines SL3, a plurality of signal lines SL4, and a plurality of first wire segments 261 respectively pass through a plurality of conductive traces 253 and a plurality of The two wire segments 262 are electrically connected to the integrated chip 255.

More specifically, the integrated chip 255 can transmit wireless signals via the second conductive segments 262 and the first conductive segments 261, and transmit at least one touch signal via the signal lines SL3 and the signal lines SL4. It should be understood that the flexible circuit board 250 may further include a plurality of input terminals (not shown) electrically connected to the integrated chip 255 to receive control signals from the outside. However, the invention is not limited to this. According to other embodiments, the flexible circuit board electrically connected to the touch panel 200 may not have the integrated chip 255.

In order to ensure that the touch circuit layer 210 is not damaged by unexpected external forces, the display device 20 may also optionally include a transparent cover CS disposed above the touch circuit layer 210, and the transparent cover CS may be adhered to The layer 240 is attached to the touch circuit layer 210. In this embodiment, the material of the transparent cover CS is, for example, glass. The material of the coating layer 240 may include Optically Clear Adhesive (OCA), Liquid Optical Adhesive (Optically Clear Resin, OCR), or other adhesive materials with high light transmittance, but not limited thereto.

Fig. 8 is a schematic cross-sectional view of a display device according to a fifth embodiment of the present invention. In particular, for clarity of presentation, FIG. 8 omits the illustration of the display panel 100B in FIG. 7. Please refer to FIG. 8, the difference between the display device 21 of this embodiment and the display device 20 of FIG. 7 is that the configuration of the sensing electrode layer is different. Specifically, in this embodiment, the first sensing electrode layer SE1 and the second sensing electrode layer SE2' of the touch circuit layer 210A of the touch panel 200A are respectively disposed on the first surface of the first touch substrate 201 201a and the second surface 201b. That is, the two sensing electrode layers belong to different film layers, and the first wire segment 261 of the coil circuit 260 and one of the two sensing electrode layers (for example, the first sensing electrode layer SE1) belong to the same film. Layer, but not limited to this.

In this embodiment, the touch panel 200A further includes a plurality of bonding pads 206 disposed on the second surface 201b of the first touch substrate 201, and these bonding pads 206 are used for electrically bonding the flexible circuit board 250'. For example, the flexible circuit board 250' here only has a plurality of conductive traces (not shown) electrically connected to the second sensing electrode layer SE2'. However, the present invention is not limited to this. According to other unshown embodiments, the display device may not have the flexible circuit board 250', and the second sensing electrode SE2' may be formed through a suitable conductive structure (such as a conductive via). The bonding pad 205 on the first surface 201a is electrically connected.

9 is a schematic cross-sectional view of the display device according to the sixth embodiment of the invention. In particular, for clarity of presentation, FIG. 9 omits the illustration of the display panel 100B in FIG. 7. 9, the main difference between the display device 22 of this embodiment and the display device 20 of FIG. 7 is that the touch circuit layer 210B is disposed on the cover surface CS's of the transparent cover CS' facing the display panel 100B. Correspondingly, the first wire segment 261 of the coil circuit 260, the bonding pad 205A, and the flexible circuit board 250A are also arranged on one side of the cover surface CS's of the transparent cover CS'. In other words, the touch panel 200B of this embodiment may not have the first touch substrate 201 of FIG. 7. Accordingly, the overall thickness of the display device 22 can be reduced.

10 is a schematic cross-sectional view of the display device according to the seventh embodiment of the present invention. In particular, for clarity of presentation, FIG. 10 omits the illustration of the display panel 100B in FIG. 7. Please refer to FIG. 10, the main difference between the display device 23 of this embodiment and the display device 20 of FIG. 7 is that the composition of the touch panel is different. In this embodiment, the number of touch substrates of the touch panel 200C of the display device 23 is two, which are the first touch substrate 201 and the second touch substrate 202 respectively. Correspondingly, the first touch substrate 201 and the second touch substrate 202 are respectively provided with a first touch circuit layer 210A and a second touch circuit layer 211, wherein the first touch circuit layer 210A has a first sensing electrode Layer SE1, the second touch circuit layer 211 has a second sensing electrode layer SE2".

On the other hand, in order to attach the second touch substrate 202 and the second touch circuit layer 211 on the second surface 201 b of the first touch substrate 201, the touch panel 200C may further have an adhesive layer 241. It should be understood that, in other embodiments, the first wire segment 261 of the coil circuit 260 and the bonding pad 205 may also be selectively disposed on the second touch substrate 202. Accordingly, the flexibility of the coil circuit can be increased.

In summary, in the display device of an embodiment of the present invention, the coil loop used for wireless signal transmission is composed of multiple first wire segments and multiple second wire segments that are alternately connected to surround the display area of the display device. Become. By arranging the first wire segment and the second wire segment on the peripheral area of the display device and the flexible circuit board electrically connected to the peripheral area, the increase in the number of manufacturing processes of the display device can be avoided, and the complexity of the manufacturing process can be reduced. It helps to improve the integration of the coil circuit and the display device.

10, 11, 12, 20, 21, 22, 23: display device 100, 100A, 100B: display panel 101: first substrate 102, 102A, 102B: second substrate 102Bs: surface 105, 106, 205, 205A, 206: bonding pad 110: Pixel circuit layer 120: display medium layer 130, 130A: color filter layer 140: driver chip 145: Connection routing 150, 150A, 190, 250, 250’, 250A: flexible circuit board 151, 191, 251: base material 151a, 201a: first surface 151b, 201b: second surface 151h: Through hole 152, 192, 252: bonding pins 153, 253: conductive trace 155: conductive layer 160, 160A, 160B, 260: coil circuit 161, 161A, 161B, 261: the first wire segment 162, 262: second wire segment 162a, 262a: part one 162b, 262b: part two 170, 170A: shielding structure 171, 171A: first extension 172, 172A: second extension 180, 210, 210A, 210B, 211: touch circuit layer 200, 200A, 200B, 200C: touch panel 201: The first touch substrate. 202: second touch substrate 240, 241: Adhesive layer CH: conductive via CS, CS’: Transparent cover CS’s: Cover surface DA: display area PA: Surrounding area PX: pixel POL1, POL2: Polarizer SE1: The first sensing electrode layer SE2, SE2’, SE2": the second sensing electrode layer SL1, SL2, SL3, SL4: signal line X, Y, Z: direction

FIG. 1 is a schematic top view of the display device according to the first embodiment of the invention. FIG. 2 is a schematic cross-sectional view of the display device of FIG. 1. 3 is a schematic cross-sectional view of a flexible circuit board of the display device of FIG. 1. 4 is a schematic cross-sectional view of the display device according to the second embodiment of the present invention. 5 is a schematic cross-sectional view of the display device according to the third embodiment of the invention. Fig. 6 is a schematic top view of the display device according to the fourth embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of the display device of FIG. 6. Fig. 8 is a schematic cross-sectional view of a display device according to a fifth embodiment of the present invention. 9 is a schematic cross-sectional view of the display device according to the sixth embodiment of the invention. 10 is a schematic cross-sectional view of the display device according to the seventh embodiment of the present invention.

10: Display device

100: display panel

101: first substrate

105: Bonding pad

110: Pixel circuit layer

140: driver chip

145: Connection routing

150: flexible circuit board

151: Substrate

152: Bonding pin

153: Conductive trace

160: coil circuit

161: The first wire segment

162: second wire segment

162a: Part One

162b: Part Two

170: shielding structure

171: The first extension

172: second extension

CH: conductive via

DA: display area

PA: Surrounding area

PX: pixel

SL1, SL2: signal line

X, Y, Z: direction

Claims (13)

A display device has a display area and a peripheral area surrounding the display area. The display device includes: A display panel, including: A first substrate; A pixel circuit layer disposed on the first substrate; and A display medium layer arranged on the pixel circuit layer; A flexible circuit board electrically connected to the peripheral area; A plurality of first wire segments are arranged in the peripheral area; and A plurality of second wire segments are arranged on the flexible circuit board, wherein the second wire segments are electrically connected between the first wire segments to form a coil loop surrounding the display area. The display device according to claim 1, further comprising: A plurality of signal lines are arranged in the display area and extend to the peripheral area, wherein the flexible circuit board has a substrate and a plurality of conductive traces, and the conductive traces are disposed on the substrate and are electrically connected to the The vertical projections of the signal lines and the conductive traces on the substrate intersect the vertical projections of the second wire segments on the substrate. The display device according to claim 2, wherein the flexible circuit board further has a plurality of conductive through holes, the conductive through holes penetrate through a first surface and a second surface opposite to the substrate, and the conductive traces are arranged On the first surface, the conductive vias are respectively located on opposite sides of the conductive traces, the second wire segments each have a first portion and a second portion, and the first portion passes through the conductive vias One of them is electrically connected to the second part, the first part is disposed on the first surface and located on opposite sides of the conductive traces, the second part is disposed on the second surface and the conductive traces The vertical projection of the trace on the second surface intersects the second part. The display device according to claim 3 further includes: A shielding structure having a first extension section and a second extension section electrically connected to each other, the first extension section is disposed between the signal lines and the first wire sections, and the second extension section is disposed on The flexible circuit board is on the first surface of the base material and is located between the conductive traces and the first portions of the second wire segments. The display device according to claim 2, further comprising: A touch panel overlapped on the display panel, and the touch panel includes: A first touch substrate having a first surface and a second surface opposite to each other, wherein the display panel is located on the second surface of the first touch substrate; A first sensing electrode layer and a second sensing electrode layer are disposed on the first touch substrate, and at least one of the first sensing electrode layer and the second sensing electrode layer is located in the first On the first surface of the touch substrate; and A plurality of bonding pads are disposed on the first surface of the first touch substrate and located in the peripheral area, wherein at least one of the first sensing electrode layer and the second sensing electrode layer and the The first wire segments belong to the same film layer, the first wire segments are electrically connected to the bonding pads, and the flexible circuit board is electrically bonded to the bonding pads. The display device according to claim 5, wherein the flexible circuit board further has an integrated chip disposed on the substrate, the signal lines and the second wire segments are electrically connected to the integrated chip, the integrated The mold chip transmits a wireless signal through the second wire segments and the first wire segments, and transmits at least one touch signal through the signal wires. The display device according to claim 5, wherein the touch panel further includes: A second touch substrate is disposed on the first surface or one side of the second surface of the first touch substrate, and the first sensing electrode layer and the second sensing electrode layer are respectively disposed on the first On the touch substrate and the second touch substrate. The display device according to claim 5, wherein the first sensing electrode layer, the second sensing electrode layer and the first wire segments belong to the same film layer. The display device according to claim 1, further comprising: A touch panel overlapped on the display panel, and the touch panel includes: A touch substrate having a first surface and a second surface opposite to each other; A first sensing electrode layer and a second sensing electrode layer are respectively disposed on the first surface and the second surface of the touch substrate, the first sensing electrode layer and the second sensing electrode layer One of and the first wire segments belong to the same film layer; and A plurality of bonding pads are located in the peripheral area and are electrically connected to the first wire segments, wherein the bonding pads and the first wire segments are disposed on the first surface or the second surface, and the The flexible circuit board is electrically connected to the bonding pads. The display device according to claim 1, further comprising: A touch panel overlapped on the display panel, and the touch panel includes: A transparent cover; A first sensing electrode layer and a second sensing electrode layer are disposed on a surface of a cover plate of the transparent cover plate facing the display panel; and A plurality of bonding pads are arranged on the surface of the cover plate of the transparent cover plate and located in the peripheral area, wherein the first sensing electrode layer, the second sensing electrode layer and the first wire segments are the same In the film layer, the first wire segments are electrically connected to the bonding pads, and the flexible circuit board is electrically connected to the bonding pads. The display device according to claim 1, wherein the display panel further includes: A plurality of bonding pads are disposed on the first substrate and located in the peripheral area, wherein the first wire segments are disposed between the first substrate and the display medium layer, and the first wire segments are electrically respectively The bonding pads are connected, and the flexible circuit board is electrically bonded to the bonding pads. The display device according to claim 1, wherein the display panel further includes: A second substrate arranged opposite to the first substrate; A color filter layer is disposed between the second substrate and the display medium layer, and the first wire segments are disposed on the color filter layer and located between the color filter layer and the first substrate; as well as A plurality of bonding pads are arranged on the first substrate and located in the peripheral area, wherein the pixel circuit layer has a plurality of signal lines arranged in the display area and extending to the peripheral area, the first wires The segments and the signal lines are respectively electrically connected to the bonding pads, and the flexible circuit board is electrically connected to the bonding pads. The display device according to claim 1, wherein the display panel further includes: A second substrate arranged opposite to the first substrate; A first sensing electrode layer and a second sensing electrode layer are disposed on a surface of the second substrate facing away from the display medium layer; and A plurality of bonding pads are arranged on the surface of the second substrate and located in the peripheral area, wherein the first sensing electrode layer, the second sensing electrode layer and the first wire segments belong to the same film layer , And are respectively electrically connected to the bonding pads, and the flexible circuit board is electrically bonded to the bonding pads.

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