TWM602667U - Fingerprint sensing module and electronic device - Google Patents

Abstract

A fingerprint sensing module adapted to receiving sensing beam is provided. The fingerprint sensing module includes a flexible circuit board, a sensing element, a circuit structure, a first packaging structure and a second packaging structure. The flexible circuit board has an accommodating space and a platform part. The sensing element is disposed in the accommodating space, and the sensing element has a sensing surface. The circuit structure is connected to the platform part and the flexible circuit board. The first packaging structure is disposed in the accommodating space to fix the sensing element on the flexible circuit board. The second packaging structure is disposed on the first packaging structure to cover the circuit structure. The thermal conductivity of the first packaging structure is higher than that of the second packaging structure, and the ductility of the second packaging structure is greater than that of the first packaging structure.

Description

Fingerprint sensing module and electronic device

The present invention relates to a sensing module and an electronic device, and particularly relates to a fingerprint sensing module and an electronic device.

In the current ultra-thin fingerprint module, the gold wire is mainly protected by transparent glue. Therefore, the current packaging structure usually uses the same glue to complete the module packaging. However, it is difficult to use a plastic material to be able to withstand temperature and have a strong hardness to protect the module structure. For example, in an ultra-thin fingerprint module, it is usually necessary to use a rubber with higher hardness to protect the module structure. However, rubber materials with higher hardness usually perform poorly on heat dissipation. In addition, because the transparent plastic material cannot effectively isolate the ambient light source, it will cause light leakage and cause the fingerprint image exposure time to be wrong, so that the clear fingerprint cannot be taken out.

This new creation provides a fingerprint sensing module and an electronic device, which can effectively extend the service life of the internal circuit structure of the fingerprint sensing module, and obtain good structural strength and heat dissipation effects.

The present invention provides a fingerprint sensing module for receiving a sensing beam, and includes a flexible circuit board, a photosensitive element, a circuit structure, a first packaging structure, and a second packaging structure. The flexible circuit board has an accommodation space and a platform. The photosensitive element is arranged in the accommodating space, and the photosensitive element has a photosensitive surface. The circuit structure is connected to the photosensitive element and the platform part of the flexible circuit board. The first packaging structure is disposed in the accommodating space to fix the photosensitive element on the flexible circuit board. The second packaging structure is disposed on the first packaging structure to cover the circuit structure. The thermal conductivity of the first packaging structure is higher than the thermal conductivity of the second packaging structure, and the ductility of the second packaging structure is greater than the ductility of the first packaging structure.

The present invention provides an electronic device including a display panel and a fingerprint sensing module. The display panel is suitable for providing the illumination beam to the finger to reflect the sensing beam. The fingerprint sensing module is disposed under the display panel and is suitable for sensing the sensing beam reflected by the finger. The fingerprint sensing module includes a flexible circuit board, a photosensitive element, a circuit structure, a first packaging structure, and a second packaging structure. The flexible circuit board has an accommodation space and a platform. The photosensitive element is arranged in the accommodating space, and the photosensitive element has a photosensitive surface. The circuit structure is connected to the photosensitive element and the platform part of the flexible circuit board. The first packaging structure is disposed in the accommodating space to fix the photosensitive element on the flexible circuit board. The second packaging structure is disposed on the first packaging structure to cover the circuit structure. The thermal conductivity of the first packaging structure is higher than the thermal conductivity of the second packaging structure, and the ductility of the second packaging structure is greater than the ductility of the first packaging structure.

Based on the above, in the fingerprint sensing module created by the present invention, the fingerprint sensing module is formed by stacking packaging structures of different materials. Wherein, the thermal conductivity of the package structure connected to the flexible circuit board is higher than the thermal conductivity of another package structure. Therefore, the heat dissipation effect of the fingerprint sensor module can be improved. In addition, the ductility of the package structure covering the circuit structure is greater than the ductility of another package structure. Therefore, the phenomenon that the circuit structure is easily broken or damaged due to changes in heat can be effectively reduced. As a result, the use of a composite packaging structure can effectively extend the service life of the internal circuit structure of the fingerprint sensor module, and can make the fingerprint sensor module have good structural strength and heat dissipation effect.

In order to make the above-mentioned features and advantages of the new creation more obvious and understandable, the following embodiments are specially cited, and the accompanying drawings are described in detail as follows.

Please refer to Figure 1 and Figure 2 at the same time. This embodiment provides an electronic device 10 including a display panel 50 and a fingerprint sensing module 100. The display panel 50 is adapted to provide the illumination light beam L1 to the finger 20 to reflect the sensing light beam L2. In this embodiment, the display panel 50 is, for example, an organic light-emitting diode (OLED) display panel. However, in other embodiments, the display panel 50 can also be a liquid crystal display panel or other suitable display panels, and the invention of the present invention is not limited to this.

The fingerprint sensing module 100 is disposed under the display panel 50 and is suitable for receiving the sensing beam L2 reflected by the finger 20 for fingerprint recognition. In other words, the electronic device 10 of this embodiment is an under-screen fingerprint recognition device, such as a smart phone, a tablet computer, a notebook computer, or a touch-sensitive display device, etc. The invention of the present invention is not limited to this. In this embodiment, the fingerprint sensor module 100 has an ultra-thin structure with a thickness of only about 300 microns, so it can be applied to a thin electronic device 10.

In this embodiment, the fingerprint sensing module 100 includes a flexible circuit board 110, a photosensitive element 120, a circuit structure 130, a first packaging structure 140, and a second packaging structure 150. The flexible circuit board 110 is used to carry electronic components and supply power. In this embodiment, the flexible circuit board 110 has an accommodating space 112 and a platform portion 114, wherein the accommodating space 112 is formed by the platform portion 114 being reduced in height, that is, the flexible circuit board 110 has a first height at the platform portion 114 H1, the accommodating space 112 has a second height H2, and the first height H1 is greater than the second height H2. Specifically, the fingerprint sensing module 100 of this embodiment further includes a support 160 disposed on the platform portion 114 of the flexible circuit board 110. In detail, the support 160 is, for example, a stiffener made of stainless steel. The supporting member 160 is used to strengthen the structural strength of the fingerprint sensing module 100 and prevent the flexible circuit board 110 from warping.

The photosensitive element 120 is disposed in the accommodating space 112 of the flexible circuit board 110 and has a photosensitive surface S1. In detail, the photosensitive element 120 includes a plurality of sensing units (not shown). The photosensitive element 120 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor, and the sensing unit is a sensing pixel in these image sensor crystals. However, in other embodiments, the photosensitive element 120 may also be an image sensor such as a charge coupled device (CCD), and the present invention does not limit the type of the photosensitive element 120 in the fingerprint sensor module 100. In some embodiments, a filter layer may be disposed on the photosensitive element 120 to filter out infrared light transmitted from the outside to the photosensitive element 120, thereby improving the sensing effect. In this embodiment, the fingerprint sensor module 100 further includes an adhesive layer 105 connected to the bottom side of the photosensitive element 120 and the flexible circuit board 110 for fixing the fingerprint sensor module 100 on the flexible circuit board 110.

The circuit structure 130 is, for example, a wire made of gold, connected to the top side of the photosensitive element 120 and the platform portion 114 of the flexible circuit board 110, so that the photosensitive element 120 and the flexible circuit board 110 are electrically connected.

The first packaging structure 140 is disposed in the accommodating space 112 of the flexible circuit board 110 to fix the photosensitive element 120 on the flexible circuit board 110. The second packaging structure 150 is disposed on the first packaging structure 140 to cover the circuit structure 130. In detail, the first packaging structure 140 fills the remaining space in the accommodating space 112 of the flexible circuit board 110 in a filling manner, so as to surround the side of the photosensitive element 120. After the first packaging structure 140 is filled, the second packaging structure 150 also fills the space continuously filled in the flexible circuit board 110 and the support 160 in a filling manner, thereby filling the internal space of the fingerprint sensing module 100. In other words, the first packaging structure 140 and the second packaging structure 150 jointly serve as the packaging structure of the fingerprint sensing module 100, as shown in FIG. 2.

The materials of the first packaging structure 140 and the second packaging structure 150 can be silicone, epoxy, or other types of glue materials, and the creation of the present invention is not limited to this. It should be noted that, in this embodiment, the first packaging structure 140 and the second packaging structure 150 are made of different materials. In detail, the thermal conductivity of the first packaging structure 140 is higher than the thermal conductivity of the second packaging structure 150. Therefore, the heat dissipation effect of the first packaging structure 140 is better than that of the second packaging structure 150, so heat can be conducted to the flexible circuit board 110 by the first packaging structure 140 disposed close to the flexible circuit board 110. Furthermore, the heat dissipation effect of the fingerprint sensing module 100 is improved. On the other hand, in this embodiment, the ductility of the second packaging structure 150 is greater than the ductility of the first packaging structure 140. Therefore, the phenomenon that the circuit structure 130 covered by the second packaging structure 150 is easily broken or damaged due to changes in heat can be effectively reduced. As a result, the composite packaging structure used in this embodiment can effectively extend the service life of the internal circuit structure 130 of the fingerprint sensing module 100, and enable the fingerprint sensing module 100 to have good structural strength and heat dissipation effects. The extension of the second packaging structure 150 can be defined by the elongation. In this embodiment, the extension of the second packaging structure 150 is greater than 70%.

Please refer to Figure 3. The fingerprint sensing module 100A of this embodiment is similar to the fingerprint sensing module 100 shown in FIG. 2. The difference between the two is that, in this embodiment, the fingerprint sensing module 100A further includes a third packaging structure 170 and a micro lens module 180. The micro lens module 180 is disposed on the photosensitive surface S1 of the photosensitive element 120, and the third packaging structure 180 is disposed on the photosensitive element 120 and is disposed around the micro lens module 180. In other words, the second packaging structure 150 is located between the third packaging structure 170 and the support 160. The micro lens module 180 is used to guide the sensing light beam L2 to the photosensitive surface S1 of the photosensitive element 120, and the third packaging structure 170 is used to provide a light shielding effect. In this embodiment, the third packaging structure 170 is non-transparent. For example, the third packaging structure 170 is made of, for example, black glue. In this way, the non-sensing light can be further prevented from being transmitted to the photosensitive surface S1 of the photosensitive element 120, so that the sensing effect of the fingerprint sensor module 100A can be improved. In this embodiment, the top surface S2 of the first packaging structure 140A is aligned with the photosensitive surface S1 of the photosensitive element 120. Therefore, the difficulty of manufacturing the fingerprint sensing module 100A can be simplified.

In this embodiment, the hardness of the third packaging structure 170 is greater than or equal to the hardness of the first packaging structure 140A, and the hardness of the third packaging structure 170 is greater than the hardness of the second packaging structure 150. Therefore, the structural strength of the fingerprint sensing module 100A can be further improved, thereby increasing the service life of the fingerprint sensing module 100A. In addition, in this embodiment, the thermal conductivity of the third packaging structure 170 is higher than the thermal conductivity of the second packaging structure 150. Therefore, the heat dissipation effect on the top side of the fingerprint sensor module 100A can be further improved.

4 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation. Please refer to Figure 4. The fingerprint sensing module 100B of this embodiment is similar to the fingerprint sensing module 100A shown in FIG. 3. The difference between the two is that, in this embodiment, the third packaging structure 170A covers the top surface S3 of the second packaging structure 150. As a result, the shading effect can be further improved, and the sensing effect of the fingerprint sensing module 100B can be improved. In addition, the structural strength and heat dissipation effect of the fingerprint sensor module 100B can also be improved by the proportion of the third packaging structure 170A with higher hardness.

To sum up, in the fingerprint sensing module created by the present invention, the fingerprint sensing module is formed by a composite of packaging structures of different materials. Wherein, the thermal conductivity of the package structure connected to the flexible circuit board is higher than the thermal conductivity of another package structure. Therefore, the heat dissipation effect of the fingerprint sensor module can be improved. In addition, the ductility of the package structure covering the circuit structure is greater than the ductility of another package structure. Therefore, the phenomenon that the circuit structure is easily broken or damaged due to changes in heat can be effectively reduced. As a result, the use of a composite packaging structure can effectively extend the service life of the internal circuit structure of the fingerprint sensor module, and can make the fingerprint sensor module have good structural strength and heat dissipation effect.

Although the creation of this new type has been disclosed in the above embodiments, it is not intended to limit the creation of this new type. Anyone with ordinary knowledge in the technical field can make some changes and changes without departing from the spirit and scope of the new creation. Retouching, therefore, the scope of protection of the creation of the new model shall be subject to the scope of the attached patent application.

10: Electronic device 20: finger 50: display panel 100, 100A, 100B: fingerprint sensor module 105: Adhesive layer 110: flexible circuit board 112: housing space 114: Platform Department 120: photosensitive element 130: circuit structure 140, 140A: The first package structure 150: second package structure 160: Support 170, 170A: third package structure H1: first height H2: second height L1: Illumination beam L2: Sensing beam S1: photosensitive surface S2, S3: top surface

1 is a schematic cross-sectional view of an electronic device according to an embodiment of the new creation. FIG. 2 is a schematic cross-sectional view of the fingerprint sensing module of FIG. 1. 3 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation. 4 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation.

100: Fingerprint sensor module

105: Adhesive layer

110: flexible circuit board

112: housing space

114: Platform Department

120: photosensitive element

130: circuit structure

140: The first package structure

150: second package structure

160: Support

H1: first height

H2: second height

L2: Sensing beam

S1: photosensitive surface

Claims (16)

A fingerprint sensing module for receiving a sensing beam, including: Flexible circuit board with accommodating space and platform part; The photosensitive element is arranged in the accommodating space, and the photosensitive element has a photosensitive surface; A circuit structure connected to the photosensitive element and the platform portion of the flexible circuit board; A first packaging structure, configured in the accommodating space to fix the photosensitive element on the flexible circuit board; and The second packaging structure is disposed on the first packaging structure to cover the circuit structure, wherein the thermal conductivity of the first packaging structure is higher than the thermal conductivity of the second packaging structure, and the second packaging structure The ductility of is greater than the ductility of the first package structure. The fingerprint sensing module according to claim 1, wherein the top surface of the first packaging structure is aligned with the photosensitive surface of the photosensitive element. The fingerprint sensing module according to claim 1, further comprising: The support is configured on the platform part. The fingerprint sensing module according to claim 3 further includes: The third packaging structure is configured on the photosensitive element, the second packaging structure is located between the third packaging structure and the support, and the third packaging structure is non-transparent. The fingerprint sensing module according to claim 4 further includes: The micro lens module is configured on the photosensitive surface of the photosensitive element, and the third packaging structure is configured around the micro lens module. The fingerprint sensing module according to claim 4, wherein the hardness of the third packaging structure is greater than or equal to the hardness of the first packaging structure, and the hardness of the third packaging structure is greater than that of the second packaging structure The hardness. The fingerprint sensing module according to claim 4, wherein the thermal conductivity of the third packaging structure is higher than the thermal conductivity of the second packaging structure. The fingerprint sensing module according to claim 4, wherein the third packaging structure covers the top surface of the second packaging structure. An electronic device including: The display panel is suitable for providing an illumination beam to the finger to reflect the sensing beam; and The fingerprint sensing module is disposed under the display panel and is suitable for sensing the sensing light beam reflected by the finger. The fingerprint sensing module includes: Flexible circuit board with accommodating space and platform part; The photosensitive element is arranged in the accommodating space, and the photosensitive element has a photosensitive surface; A circuit structure connected to the photosensitive element and the platform portion of the flexible circuit board; A first packaging structure, configured in the accommodating space to fix the photosensitive element on the flexible circuit board; and The second packaging structure is disposed on the first packaging structure to cover the circuit structure, wherein the thermal conductivity of the first packaging structure is higher than the thermal conductivity of the second packaging structure, and the second packaging structure The ductility of is greater than the ductility of the first package structure. The electronic device according to claim 9, wherein the top surface of the first packaging structure is aligned with the photosensitive surface of the photosensitive element. The electronic device according to claim 9, wherein the fingerprint sensing module further includes a supporting member disposed on the platform part. The electronic device according to claim 11, wherein the fingerprint sensing module further includes a third packaging structure disposed on the photosensitive element, and the second packaging structure is located between the third packaging structure and the supporting member In between, the third package structure is non-transparent. The electronic device according to claim 12, wherein the fingerprint sensing module further includes a microlens module configured on the photosensitive surface of the photosensitive element, and the third packaging structure is configured on the microlens mold Around the group. The electronic device according to claim 12, wherein the hardness of the third packaging structure is greater than or equal to the hardness of the first packaging structure, and the hardness of the third packaging structure is greater than the hardness of the second packaging structure. The electronic device according to claim 12, wherein the thermal conductivity of the third packaging structure is higher than the thermal conductivity of the second packaging structure. The electronic device according to claim 12, wherein the third packaging structure covers the top surface of the second packaging structure.

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