TWM602287U - Laser package structure - Google Patents
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Abstract
Description
本揭露是有關一種雷射封裝結構。This disclosure relates to a laser package structure.
隨著科技的進步,各式使用光學技術的家電在我們的日常生活更為常見,例如真空管電視、液晶螢幕、電漿顯示器、觸控面板或投影機等,都是應用光學技術所製造的產品,甚至近年來也應用於健康照護的領域中。With the advancement of technology, various home appliances using optical technology are more common in our daily lives. For example, vacuum tube TVs, liquid crystal screens, plasma displays, touch panels or projectors, etc., are all products manufactured using optical technology. , Even in the field of health care in recent years.
顯示裝置(例如投影機)的發光模組可具有多組獨立的發光二極體晶片組,並利用這些發光二極體晶片組產生不同色光,以達到混光的目的。然而,這樣的配置使得顯示裝置的體積難以縮小。因此,在使用光學技術顯像的同時,除了追求更細緻的畫質解析度之外,如何使設備的體積縮小,降低空間利用也是需重視的課題。The light emitting module of a display device (such as a projector) may have multiple independent light emitting diode chip sets, and these light emitting diode chip sets are used to generate light of different colors to achieve the purpose of light mixing. However, such a configuration makes it difficult to reduce the size of the display device. Therefore, while using optical technology to develop images, in addition to pursuing more detailed image quality and resolution, how to reduce the size of the equipment and reduce the use of space are also issues that need attention.
本揭露之一技術態樣為一種雷射封裝結構。One technical aspect of this disclosure is a laser packaging structure.
根據本揭露一實施方式,一種雷射封裝結構包括支架、雷射光源及光學透鏡。支架具有底部與支撐部,其中支撐部位於底部上,支撐部具有反射面。雷射光源設置於支架的底部上,雷射光源具有朝向反射面的出光面。光學透鏡設置於支撐部上且覆蓋雷射光源。其中雷射光源的出光面發出的光線經由支撐部的反射面反射而穿過光學透鏡。According to an embodiment of the present disclosure, a laser package structure includes a bracket, a laser light source, and an optical lens. The support has a bottom and a supporting part, wherein the supporting part is located on the bottom and the supporting part has a reflecting surface. The laser light source is arranged on the bottom of the bracket, and the laser light source has a light-emitting surface facing the reflecting surface. The optical lens is arranged on the supporting part and covers the laser light source. The light emitted from the light-emitting surface of the laser light source is reflected by the reflective surface of the supporting part and passes through the optical lens.
在本揭露一實施方式中,上述雷射封裝結構,其中反射面為一斜面,且斜面與底部之間的夾角在40度至50度的範圍中。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the reflective surface is an inclined surface, and the included angle between the inclined surface and the bottom is in the range of 40 degrees to 50 degrees.
在本揭露一實施方式中,上述雷射封裝結構,其中反射面為一凹面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the reflective surface is a concave surface.
在本揭露一實施方式中,上述雷射封裝結構進一步包括複數個雷射光源,其中支撐部圍繞雷射光源。In an embodiment of the present disclosure, the above-mentioned laser package structure further includes a plurality of laser light sources, wherein the support part surrounds the laser light source.
在本揭露一實施方式中,上述雷射封裝結構,其中支撐部具有複數個反射面,且雷射光源分別位置對應於支撐部的反射面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the support portion has a plurality of reflective surfaces, and the positions of the laser light sources respectively correspond to the reflective surfaces of the support portion.
在本揭露一實施方式中,上述雷射封裝結構,其中支撐部的俯視形狀為十字形。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the top view shape of the supporting portion is a cross shape.
在本揭露一實施方式中,上述雷射封裝結構,其中支撐部為管體,反射面位於管體的內壁,且反射面圍繞雷射光源。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the support portion is a tube body, the reflective surface is located on the inner wall of the tube body, and the reflective surface surrounds the laser light source.
在本揭露一實施方式中,上述雷射封裝結構,其中光學透鏡具有相對的頂面與底面,頂面與底面皆為平面,或者頂面與底面分別為凸面與平面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the optical lens has a top surface and a bottom surface opposite to each other, the top surface and the bottom surface are both flat, or the top surface and the bottom surface are respectively convex and flat.
在本揭露一實施方式中,上述雷射封裝結構,其中光學透鏡的數量為二,其中一者位在另一者與反射面之間。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the number of optical lenses is two, and one of them is located between the other and the reflective surface.
在本揭露一實施方式中,上述支架的底部與支撐部為一體成型的結構。In an embodiment of the present disclosure, the bottom of the bracket and the supporting portion are integrally formed.
在本揭露上述實施方式中,由於雷射封裝結構具有設置於支撐部上的反射面,且具有朝向反射面的雷射光源,因此當雷射光源發出光線時,光線可經由反射面反射,進而穿過光學透鏡。如此一來,雷射光源的光線可經由反射面從水平方向的光路改變為垂直方向的光路。此外,經由支撐部的反射面及雷射光源的配置,雷射封裝結構的體積可有效縮小,並可搭配位在支架上的光學透鏡進一步改變光路,以滿足所欲達成之光線投射效果。In the above-mentioned embodiments of the present disclosure, since the laser package structure has a reflective surface provided on the support portion and has a laser light source facing the reflective surface, when the laser light source emits light, the light can be reflected by the reflective surface, and thus Go through the optical lens. In this way, the light of the laser light source can be changed from a horizontal optical path to a vertical optical path via the reflecting surface. In addition, the volume of the laser package structure can be effectively reduced through the configuration of the reflective surface of the support part and the laser light source, and the optical lens on the bracket can be used to further change the light path to meet the desired light projection effect.
以下將以圖式揭露本揭露之複數個實施方式,為明確說明,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Hereinafter, a plurality of implementation manners of the present disclosure will be disclosed in diagrams. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.
第1圖繪示根據本揭露一實施方式之雷射封裝結構100的上視圖。第2圖繪示第1圖之雷射封裝結構100沿線段2-2的剖面圖。同時參閱第1圖及第2圖,雷射封裝結構100包括支架110、雷射光源120及光學透鏡130。支架110具有底部112與支撐部114,其中支撐部114位於底部112上。支撐部114至少一反射面115。雷射光源120設置於支架110的底部112上。雷射光源120具有朝向反射面115的出光面121。在本實施方式中,支撐部114圍繞雷射光源120。光學透鏡130設置於支撐部114上,且覆蓋雷射光源120。其中雷射光源120的出光面121發出的光線L經由支撐部114的反射面115反射而穿過光學透鏡130。在本實施方式中,支撐部114上設置單一光學透鏡130。光學透鏡130可為平透鏡或凸透鏡,且其頂面可具有微結構,但並不用以限制本揭露。FIG. 1 shows a top view of a
在本實施方式中,反射面115可為斜面。反射面115與底部112之間的夾角可在40度至50度的範圍中,在其他實施方式中,反射面115亦可為弧形的凹面。反射面115可為鍍在支撐部114上的金屬鍍層,例如銀層或者金層。支架110的底部112與支撐部114可採射出成型以製成一體成型的結構,材料可皆為陶瓷,或者皆為塑料。如此一來,可有效降低材料與組裝成本,此外,以射出形式所成型的表面較光滑平整,具有較佳的反射效果。或者,底部112與支撐部114亦可以不同材料製成,例如底部112為PCB或陶瓷等LED常見的封裝材料,而支撐部114以液晶高分子材料(Liquid Cystal Polymer, LCP)所製成,若底部112與支撐部114以不同材料製成則有降低製程成本的優點。此外,在本實施方式中,雷射光源120與導線150電性連接,並且導線150可電性連接於設置在底部112下方的導電墊140。導電墊140可電性連接電源,以對雷射光源120供電。In this embodiment, the
由於雷射封裝結構100具有設置於支撐部114上的反射面115,且具有朝向反射面115的雷射光源120,因此當雷射光源120發出光線L時,光線L可經由反射面115反射,進而穿過光學透鏡130。如此一來,雷射光源120的光線L可經由反射面115從水平方向的光路改變為垂直方向的光路。此外,經由支撐部114的反射面115及雷射光源120的配置,雷射封裝結構100的體積可有效縮小,並可搭配位在支架110上的光學透鏡130進一步改變光路,以滿足所欲達成之光線投射效果。Since the
應瞭解到,已敘述過的元件連接關係、材料與功效將不再重複贅述,合先敘明。在以下敘述中,將說明其他型式的之雷射封裝結構。It should be understood that the connection relationships, materials, and effects of the components that have been described will not be repeated, and will be described first. In the following description, other types of laser package structures will be explained.
第3圖繪示根據本揭露另一實施方式之雷射封裝結構100a的上視圖。第4圖繪示第3圖之雷射封裝結構100a沿線段4-4繪示的剖面圖。同時參閱第3圖及第4圖,雷射封裝結構100a包括支架110、兩個雷射光源120及光學透鏡130a、130b。如圖所示,支架110的支撐部114具有兩反射面115。兩個雷射光源120彼此反向設置於支架110的底部112上,且這兩個雷射光源120的出光面121分別朝向設置於其周圍的支撐部114,也就是分別朝向兩反射面115。FIG. 3 shows a top view of a
支撐部114將光學透鏡130支撐於反射面115上方,光線L從雷射光源120的出光面121照射反射面115後反射向上並穿過光學透鏡130a、130b。值得一提的是,在本實施方式中,支撐部114上方設有兩個光學透鏡130a、130b。光學透鏡130a位於光學透鏡130b和反射面115之間。在本實施方式中,光學透鏡130b的頂面131和底面132皆為凸面,光學透鏡130a的頂面為為凸面,底面為平面。在其他實施方式中,光學透鏡130b可以是頂面131和底面132皆為平面的光學透鏡,但並不用以限制本揭露,可依所欲達成的功能任意搭配光學透鏡的組合以控制其折射效果。依設計需求,所選用的透鏡類型可控制聚光與散光的效果,例如平透鏡不具聚光的作用,凸透鏡不論是平凸透鏡或是雙凸透鏡皆可使光線匯聚。The supporting
相似地,雷射光源120與導線150電性連接,並且導線150電性連接於設置在底部112下方的導電墊140,值得一提的是,兩個雷射光源120的導線150可以共同電性連接於相同導電墊140,以共用一電極。但,兩雷射光源亦可不共用同一電極,以此實施。Similarly, the
第5圖繪示根據本揭露又一實施方式之雷射封裝結構100b的上視圖。第5圖之雷射封裝結構100b沿線段4-4的剖面圖與第4圖相同。同時參閱第4圖與第5圖,雷射封裝結構100b具有四個雷射光源120。這些雷射光源120設置於支架110的底部112上,且四雷射光源120的四出光面121朝向於圍繞雷射光源120且呈矩形的支撐部114。FIG. 5 shows a top view of a
第6圖繪示根據本揭露另一實施方式之雷射封裝結構100c的上視圖,第7圖繪示第6圖之雷射封裝結構100c移除光學透鏡130之上視圖。同時參閱第6及第7圖,在本實施方式中,支架110的支撐部114a至少設置於底部112的中央區域上,非如圍繞底部112的支撐部114。支撐部114a的俯視形狀為十字形,支撐部114a與底部112可以為一體成型或者為分離式成型後組裝。支撐部114a具有八個反射面,如四組彼此鄰接且大致垂直的反射面115a、115b。每一反射面115a、115b與底部112的夾角在40度至50度的之間。第7圖之反射面115的傾斜示意可參閱第2圖、第4圖。雷射封裝結構100c具有設置於支架110上的八個雷射光源,如四組的雷射光源120a、120b,其中,各個雷射光源120a、120b的出光面121a、121b分別朝向相應的反射面115a、115b。如第7圖所示,雷射光源120a的出光面121a朝向對應的反射面115a,相似地,雷射光源120b的出光面121b朝向對應的反射面115b。光學透鏡130設置於支撐部114a的上方,光線L由出光面121a、121b分別經過反射面115 a、115b反射後穿過光學透鏡130。FIG. 6 is a top view of the
第8圖繪示根據本揭露另一實施方式之雷射封裝結構100d的上視圖。第9圖繪示第8圖之雷射封裝結構100d移除光學透鏡130之上視圖。同時參閱第8圖及第9圖,在本實施方式中,支架110的支撐部114b除了圍繞底部112外,還具有如第7圖的十字形結構,且支撐部114b與底部112可以為一體成型,共同形成支架110,如此生產將能降低成本。雷射封裝結構100d共設有十二個雷射光源,如四組的雷射光源120a、120b、120c。支撐部114b具有十二個反射面,如四組彼此鄰接且俯視形狀為三角形的反射面115a、115b、115c。其中,四個反射面115c位於圍繞底部112四周的支撐部114b上,另八個反射面115 a、115b則位於十字形的支撐部114b上。雷射光源120a、120b、120c的出光面121a、121b、121c分別朝向反射面115a、115b、115c。十二個反射面115a、115b、115c皆為斜面,斜面與底部112之間的夾角在40度至50度的範圍之間。FIG. 8 is a top view of a
如第9圖所繪示,雷射光源120a的出光面121a朝向對應的反射面115a,雷射光源120b的出光面121b朝向對應的反射面115b,雷射光源120c的出光面121c朝向對應的反射面115c。圖中的光線L射向反射面115a、115b、115c其中一者後將經由反射進而穿過覆蓋支架110的光學透鏡130。As shown in Figure 9, the light-emitting
第10圖繪示根據本揭露另一實施方式之雷射封裝結構100e移除光學透鏡後的上視圖。在此實施方式中,支架110的支撐部114c為一管體,且支撐部114c的反射面115d為凹面116。反射面115d設置於管體的支撐部114內壁上。此外,雷射封裝結構100e具有五個排列成一環型的雷射光源120,雷射光源120的出光面121皆向外朝向反射面115d。光線L射向反射面115d後可經由反射穿過覆蓋支架110的光學透鏡,設計者可以依據光強度的需求增加或減少雷射光源120的配置,且不論雷射光源120的數量為何,雷射光源120的出光面121皆可朝向反射面115d。FIG. 10 is a top view of the
在本揭露上述實施方式中,因雷射光源所設置的位置不同將造成光點的大小不同,可以用於不同的光學產品(例如不同的光學感測儀器或者光纖傳輸等科技),在透過光學透鏡組合的配置,可以在空間有限的雷射封裝結構中,達到最大的空間使用率及最適當的效果。In the above-mentioned embodiments of the present disclosure, the different positions of the laser light sources will result in different sizes of light spots, which can be used in different optical products (for example, different optical sensing instruments or optical fiber transmission technologies). The configuration of the lens combination can achieve the largest space utilization rate and the most appropriate effect in the laser package structure with limited space.
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何熟習此技藝者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above implementation manner, it is not intended to limit the disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure is protected The scope shall be subject to those defined in the attached patent scope.
100、100a、100b、100c、100d、100e:雷射封裝結構
110:支架
112:底部
114、114a、114b、114c:支撐部
115、115a、115b、115c、115d:反射面
116:凹面
120、120a、120b、120c:雷射光源
121、121a、121b、121c:出光面
130、130a、130b:光學透鏡
131:頂面
132:底面
140:導電墊
150:導線
L:光線
2-2、4-4、4-4:線段
100, 100a, 100b, 100c, 100d, 100e: laser package structure
110: bracket
112: bottom
114, 114a, 114b, 114c:
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖繪示根據本揭露一實施方式之雷射封裝結構的上視圖。 第2圖繪示第1圖之雷射封裝結構沿線段2-2的剖面圖。 第3圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第4圖繪示第3圖之雷射封裝結構沿線段4-4線段的剖面圖。 第5圖繪示根據本揭露又一實施方式之雷射封裝結構的上視圖。 第6圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第7圖繪示第6圖之雷射封裝結構移除光學透鏡後之上視圖。 第8圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第9圖繪示第8圖之雷射封裝結構移除光學透鏡後之上視圖。 第10圖繪示根據本揭露另一實施方式之雷射封裝結構移除光學透鏡後的上視圖。 In order to make the above and other objectives, features, advantages and embodiments of this disclosure more obvious and understandable, the description of the accompanying drawings is as follows: FIG. 1 is a top view of a laser package structure according to an embodiment of the disclosure. Figure 2 shows a cross-sectional view of the laser package structure of Figure 1 along line 2-2. FIG. 3 is a top view of a laser package structure according to another embodiment of the disclosure. Figure 4 shows a cross-sectional view of the laser package structure of Figure 3 along the line 4-4. FIG. 5 is a top view of a laser package structure according to another embodiment of the present disclosure. FIG. 6 is a top view of a laser package structure according to another embodiment of the present disclosure. Fig. 7 is a top view of the laser package structure of Fig. 6 with the optical lens removed. FIG. 8 is a top view of a laser package structure according to another embodiment of the present disclosure. Fig. 9 is a top view of the laser package structure of Fig. 8 with the optical lens removed. FIG. 10 is a top view of the laser package structure according to another embodiment of the disclosure after the optical lens is removed.
100:雷射封裝結構 100: Laser package structure
110:支架 110: bracket
112:底部 112: bottom
114:支撐部 114: Support
115:反射面 115: reflective surface
120:雷射光源 120: Laser light source
121:出光面 121: Glossy Surface
130:光學透鏡 130: optical lens
140:導電墊 140: Conductive pad
150:導線 150: wire
L:光線 L: light
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109207593U TWM602287U (en) | 2020-06-17 | 2020-06-17 | Laser package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109207593U TWM602287U (en) | 2020-06-17 | 2020-06-17 | Laser package structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM602287U true TWM602287U (en) | 2020-10-01 |
Family
ID=74094206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW109207593U TWM602287U (en) | 2020-06-17 | 2020-06-17 | Laser package structure |
Country Status (1)
Country | Link |
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TW (1) | TWM602287U (en) |
-
2020
- 2020-06-17 TW TW109207593U patent/TWM602287U/en unknown
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