TWM602287U - Laser package structure - Google Patents

Laser package structure Download PDF

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Publication number
TWM602287U
TWM602287U TW109207593U TW109207593U TWM602287U TW M602287 U TWM602287 U TW M602287U TW 109207593 U TW109207593 U TW 109207593U TW 109207593 U TW109207593 U TW 109207593U TW M602287 U TWM602287 U TW M602287U
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Taiwan
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laser
package structure
laser light
light source
laser package
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TW109207593U
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Chinese (zh)
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陳宗慶
王耀德
朱信樺
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艾笛森光電股份有限公司
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Priority to TW109207593U priority Critical patent/TWM602287U/en
Publication of TWM602287U publication Critical patent/TWM602287U/en

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Abstract

The present disclosure provides a laser package structure. The laser package structure includes a stand, at least one laser light source, and at least one optical lens. The stand has a bottom portion and a supporting portion. The supporting portion is located on the bottom portion and has at least one reflective surface. The laser light source is disposed on the bottom portion of the stand. The laser light source has a light-emitting face toward the reflecting surface. The optical lens is disposed on the supporting portion and covers the laser light source, in which light emitted by the light-emitting face of the laser light source is reflected by the reflective surface of the supporting portion so as to pass through the optical lens.

Description

一種雷射封裝結構Laser packaging structure

本揭露是有關一種雷射封裝結構。This disclosure relates to a laser package structure.

隨著科技的進步,各式使用光學技術的家電在我們的日常生活更為常見,例如真空管電視、液晶螢幕、電漿顯示器、觸控面板或投影機等,都是應用光學技術所製造的產品,甚至近年來也應用於健康照護的領域中。With the advancement of technology, various home appliances using optical technology are more common in our daily lives. For example, vacuum tube TVs, liquid crystal screens, plasma displays, touch panels or projectors, etc., are all products manufactured using optical technology. , Even in the field of health care in recent years.

顯示裝置(例如投影機)的發光模組可具有多組獨立的發光二極體晶片組,並利用這些發光二極體晶片組產生不同色光,以達到混光的目的。然而,這樣的配置使得顯示裝置的體積難以縮小。因此,在使用光學技術顯像的同時,除了追求更細緻的畫質解析度之外,如何使設備的體積縮小,降低空間利用也是需重視的課題。The light emitting module of a display device (such as a projector) may have multiple independent light emitting diode chip sets, and these light emitting diode chip sets are used to generate light of different colors to achieve the purpose of light mixing. However, such a configuration makes it difficult to reduce the size of the display device. Therefore, while using optical technology to develop images, in addition to pursuing more detailed image quality and resolution, how to reduce the size of the equipment and reduce the use of space are also issues that need attention.

本揭露之一技術態樣為一種雷射封裝結構。One technical aspect of this disclosure is a laser packaging structure.

根據本揭露一實施方式,一種雷射封裝結構包括支架、雷射光源及光學透鏡。支架具有底部與支撐部,其中支撐部位於底部上,支撐部具有反射面。雷射光源設置於支架的底部上,雷射光源具有朝向反射面的出光面。光學透鏡設置於支撐部上且覆蓋雷射光源。其中雷射光源的出光面發出的光線經由支撐部的反射面反射而穿過光學透鏡。According to an embodiment of the present disclosure, a laser package structure includes a bracket, a laser light source, and an optical lens. The support has a bottom and a supporting part, wherein the supporting part is located on the bottom and the supporting part has a reflecting surface. The laser light source is arranged on the bottom of the bracket, and the laser light source has a light-emitting surface facing the reflecting surface. The optical lens is arranged on the supporting part and covers the laser light source. The light emitted from the light-emitting surface of the laser light source is reflected by the reflective surface of the supporting part and passes through the optical lens.

在本揭露一實施方式中,上述雷射封裝結構,其中反射面為一斜面,且斜面與底部之間的夾角在40度至50度的範圍中。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the reflective surface is an inclined surface, and the included angle between the inclined surface and the bottom is in the range of 40 degrees to 50 degrees.

在本揭露一實施方式中,上述雷射封裝結構,其中反射面為一凹面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the reflective surface is a concave surface.

在本揭露一實施方式中,上述雷射封裝結構進一步包括複數個雷射光源,其中支撐部圍繞雷射光源。In an embodiment of the present disclosure, the above-mentioned laser package structure further includes a plurality of laser light sources, wherein the support part surrounds the laser light source.

在本揭露一實施方式中,上述雷射封裝結構,其中支撐部具有複數個反射面,且雷射光源分別位置對應於支撐部的反射面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the support portion has a plurality of reflective surfaces, and the positions of the laser light sources respectively correspond to the reflective surfaces of the support portion.

在本揭露一實施方式中,上述雷射封裝結構,其中支撐部的俯視形狀為十字形。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the top view shape of the supporting portion is a cross shape.

在本揭露一實施方式中,上述雷射封裝結構,其中支撐部為管體,反射面位於管體的內壁,且反射面圍繞雷射光源。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the support portion is a tube body, the reflective surface is located on the inner wall of the tube body, and the reflective surface surrounds the laser light source.

在本揭露一實施方式中,上述雷射封裝結構,其中光學透鏡具有相對的頂面與底面,頂面與底面皆為平面,或者頂面與底面分別為凸面與平面。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the optical lens has a top surface and a bottom surface opposite to each other, the top surface and the bottom surface are both flat, or the top surface and the bottom surface are respectively convex and flat.

在本揭露一實施方式中,上述雷射封裝結構,其中光學透鏡的數量為二,其中一者位在另一者與反射面之間。In an embodiment of the present disclosure, in the above-mentioned laser package structure, the number of optical lenses is two, and one of them is located between the other and the reflective surface.

在本揭露一實施方式中,上述支架的底部與支撐部為一體成型的結構。In an embodiment of the present disclosure, the bottom of the bracket and the supporting portion are integrally formed.

在本揭露上述實施方式中,由於雷射封裝結構具有設置於支撐部上的反射面,且具有朝向反射面的雷射光源,因此當雷射光源發出光線時,光線可經由反射面反射,進而穿過光學透鏡。如此一來,雷射光源的光線可經由反射面從水平方向的光路改變為垂直方向的光路。此外,經由支撐部的反射面及雷射光源的配置,雷射封裝結構的體積可有效縮小,並可搭配位在支架上的光學透鏡進一步改變光路,以滿足所欲達成之光線投射效果。In the above-mentioned embodiments of the present disclosure, since the laser package structure has a reflective surface provided on the support portion and has a laser light source facing the reflective surface, when the laser light source emits light, the light can be reflected by the reflective surface, and thus Go through the optical lens. In this way, the light of the laser light source can be changed from a horizontal optical path to a vertical optical path via the reflecting surface. In addition, the volume of the laser package structure can be effectively reduced through the configuration of the reflective surface of the support part and the laser light source, and the optical lens on the bracket can be used to further change the light path to meet the desired light projection effect.

以下將以圖式揭露本揭露之複數個實施方式,為明確說明,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Hereinafter, a plurality of implementation manners of the present disclosure will be disclosed in diagrams. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.

第1圖繪示根據本揭露一實施方式之雷射封裝結構100的上視圖。第2圖繪示第1圖之雷射封裝結構100沿線段2-2的剖面圖。同時參閱第1圖及第2圖,雷射封裝結構100包括支架110、雷射光源120及光學透鏡130。支架110具有底部112與支撐部114,其中支撐部114位於底部112上。支撐部114至少一反射面115。雷射光源120設置於支架110的底部112上。雷射光源120具有朝向反射面115的出光面121。在本實施方式中,支撐部114圍繞雷射光源120。光學透鏡130設置於支撐部114上,且覆蓋雷射光源120。其中雷射光源120的出光面121發出的光線L經由支撐部114的反射面115反射而穿過光學透鏡130。在本實施方式中,支撐部114上設置單一光學透鏡130。光學透鏡130可為平透鏡或凸透鏡,且其頂面可具有微結構,但並不用以限制本揭露。FIG. 1 shows a top view of a laser package structure 100 according to an embodiment of the present disclosure. FIG. 2 shows a cross-sectional view of the laser package structure 100 of FIG. 1 along the line 2-2. Referring to FIGS. 1 and 2 at the same time, the laser package structure 100 includes a bracket 110, a laser light source 120 and an optical lens 130. The bracket 110 has a bottom 112 and a supporting portion 114, wherein the supporting portion 114 is located on the bottom 112. The supporting portion 114 has at least one reflective surface 115. The laser light source 120 is arranged on the bottom 112 of the bracket 110. The laser light source 120 has a light emitting surface 121 facing the reflective surface 115. In this embodiment, the supporting portion 114 surrounds the laser light source 120. The optical lens 130 is disposed on the supporting portion 114 and covers the laser light source 120. The light L emitted from the light-emitting surface 121 of the laser light source 120 is reflected by the reflective surface 115 of the support portion 114 and passes through the optical lens 130. In this embodiment, a single optical lens 130 is provided on the supporting portion 114. The optical lens 130 may be a flat lens or a convex lens, and the top surface thereof may have a microstructure, but it is not used to limit the disclosure.

在本實施方式中,反射面115可為斜面。反射面115與底部112之間的夾角可在40度至50度的範圍中,在其他實施方式中,反射面115亦可為弧形的凹面。反射面115可為鍍在支撐部114上的金屬鍍層,例如銀層或者金層。支架110的底部112與支撐部114可採射出成型以製成一體成型的結構,材料可皆為陶瓷,或者皆為塑料。如此一來,可有效降低材料與組裝成本,此外,以射出形式所成型的表面較光滑平整,具有較佳的反射效果。或者,底部112與支撐部114亦可以不同材料製成,例如底部112為PCB或陶瓷等LED常見的封裝材料,而支撐部114以液晶高分子材料(Liquid Cystal Polymer, LCP)所製成,若底部112與支撐部114以不同材料製成則有降低製程成本的優點。此外,在本實施方式中,雷射光源120與導線150電性連接,並且導線150可電性連接於設置在底部112下方的導電墊140。導電墊140可電性連接電源,以對雷射光源120供電。In this embodiment, the reflective surface 115 may be an inclined surface. The included angle between the reflective surface 115 and the bottom 112 may be in the range of 40 degrees to 50 degrees. In other embodiments, the reflective surface 115 may also be an arc-shaped concave surface. The reflective surface 115 may be a metal plating layer plated on the support portion 114, such as a silver layer or a gold layer. The bottom 112 and the supporting portion 114 of the bracket 110 can be injection-molded to form an integral structure, and the materials can be both ceramics or both plastics. In this way, material and assembly costs can be effectively reduced. In addition, the surface formed by injection molding is smoother and smoother, and has a better reflection effect. Alternatively, the bottom 112 and the support 114 can also be made of different materials. For example, the bottom 112 is made of common LED packaging materials such as PCB or ceramics, and the support 114 is made of liquid crystal polymer (LCP), if The bottom 112 and the supporting portion 114 are made of different materials, which has the advantage of reducing the manufacturing cost. In addition, in this embodiment, the laser light source 120 is electrically connected to the wire 150, and the wire 150 may be electrically connected to the conductive pad 140 disposed under the bottom 112. The conductive pad 140 can be electrically connected to a power source to supply power to the laser light source 120.

由於雷射封裝結構100具有設置於支撐部114上的反射面115,且具有朝向反射面115的雷射光源120,因此當雷射光源120發出光線L時,光線L可經由反射面115反射,進而穿過光學透鏡130。如此一來,雷射光源120的光線L可經由反射面115從水平方向的光路改變為垂直方向的光路。此外,經由支撐部114的反射面115及雷射光源120的配置,雷射封裝結構100的體積可有效縮小,並可搭配位在支架110上的光學透鏡130進一步改變光路,以滿足所欲達成之光線投射效果。Since the laser package structure 100 has a reflective surface 115 disposed on the supporting portion 114 and has a laser light source 120 facing the reflective surface 115, when the laser light source 120 emits light L, the light L can be reflected by the reflective surface 115, It then passes through the optical lens 130. In this way, the light L of the laser light source 120 can be changed from a horizontal optical path to a vertical optical path via the reflecting surface 115. In addition, through the configuration of the reflective surface 115 of the support portion 114 and the laser light source 120, the volume of the laser package structure 100 can be effectively reduced, and the optical lens 130 located on the bracket 110 can be used to further change the optical path to meet the requirements. The light projection effect.

應瞭解到,已敘述過的元件連接關係、材料與功效將不再重複贅述,合先敘明。在以下敘述中,將說明其他型式的之雷射封裝結構。It should be understood that the connection relationships, materials, and effects of the components that have been described will not be repeated, and will be described first. In the following description, other types of laser package structures will be explained.

第3圖繪示根據本揭露另一實施方式之雷射封裝結構100a的上視圖。第4圖繪示第3圖之雷射封裝結構100a沿線段4-4繪示的剖面圖。同時參閱第3圖及第4圖,雷射封裝結構100a包括支架110、兩個雷射光源120及光學透鏡130a、130b。如圖所示,支架110的支撐部114具有兩反射面115。兩個雷射光源120彼此反向設置於支架110的底部112上,且這兩個雷射光源120的出光面121分別朝向設置於其周圍的支撐部114,也就是分別朝向兩反射面115。FIG. 3 shows a top view of a laser package structure 100a according to another embodiment of the present disclosure. FIG. 4 is a cross-sectional view of the laser package structure 100a of FIG. 3 along the line 4-4. Referring to FIGS. 3 and 4 at the same time, the laser package structure 100a includes a bracket 110, two laser light sources 120, and optical lenses 130a and 130b. As shown in the figure, the supporting portion 114 of the bracket 110 has two reflecting surfaces 115. The two laser light sources 120 are arranged on the bottom 112 of the bracket 110 opposite to each other, and the light-emitting surfaces 121 of the two laser light sources 120 respectively face the supporting portions 114 arranged around them, that is, respectively face the two reflective surfaces 115.

支撐部114將光學透鏡130支撐於反射面115上方,光線L從雷射光源120的出光面121照射反射面115後反射向上並穿過光學透鏡130a、130b。值得一提的是,在本實施方式中,支撐部114上方設有兩個光學透鏡130a、130b。光學透鏡130a位於光學透鏡130b和反射面115之間。在本實施方式中,光學透鏡130b的頂面131和底面132皆為凸面,光學透鏡130a的頂面為為凸面,底面為平面。在其他實施方式中,光學透鏡130b可以是頂面131和底面132皆為平面的光學透鏡,但並不用以限制本揭露,可依所欲達成的功能任意搭配光學透鏡的組合以控制其折射效果。依設計需求,所選用的透鏡類型可控制聚光與散光的效果,例如平透鏡不具聚光的作用,凸透鏡不論是平凸透鏡或是雙凸透鏡皆可使光線匯聚。The supporting portion 114 supports the optical lens 130 above the reflective surface 115, and the light L is reflected upward from the light exit surface 121 of the laser light source 120 to irradiate the reflective surface 115 and passes through the optical lenses 130a, 130b. It is worth mentioning that, in this embodiment, two optical lenses 130a and 130b are provided above the supporting portion 114. The optical lens 130a is located between the optical lens 130b and the reflective surface 115. In this embodiment, both the top surface 131 and the bottom surface 132 of the optical lens 130b are convex surfaces, the top surface of the optical lens 130a is convex surface, and the bottom surface is flat. In other embodiments, the optical lens 130b may be an optical lens whose top surface 131 and bottom surface 132 are both flat, but it is not used to limit the disclosure. The combination of optical lenses can be arbitrarily matched to control the refraction effect according to the desired function. . According to the design requirements, the selected lens type can control the effect of condensing and astigmatism. For example, a flat lens does not have a condensing function, and a convex lens can converge light whether it is a plano-convex lens or a double-convex lens.

相似地,雷射光源120與導線150電性連接,並且導線150電性連接於設置在底部112下方的導電墊140,值得一提的是,兩個雷射光源120的導線150可以共同電性連接於相同導電墊140,以共用一電極。但,兩雷射光源亦可不共用同一電極,以此實施。Similarly, the laser light source 120 is electrically connected to the wire 150, and the wire 150 is electrically connected to the conductive pad 140 disposed under the bottom 112. It is worth mentioning that the wires 150 of the two laser light sources 120 can be electrically connected. Connect to the same conductive pad 140 to share an electrode. However, the two laser light sources can also be implemented without sharing the same electrode.

第5圖繪示根據本揭露又一實施方式之雷射封裝結構100b的上視圖。第5圖之雷射封裝結構100b沿線段4-4的剖面圖與第4圖相同。同時參閱第4圖與第5圖,雷射封裝結構100b具有四個雷射光源120。這些雷射光源120設置於支架110的底部112上,且四雷射光源120的四出光面121朝向於圍繞雷射光源120且呈矩形的支撐部114。FIG. 5 shows a top view of a laser package structure 100b according to another embodiment of the present disclosure. The cross-sectional view of the laser package structure 100b in FIG. 5 along the line 4-4 is the same as that in FIG. 4. Referring to FIGS. 4 and 5 at the same time, the laser package structure 100 b has four laser light sources 120. The laser light sources 120 are arranged on the bottom 112 of the bracket 110, and the four light-emitting surfaces 121 of the four laser light sources 120 face the rectangular support portion 114 surrounding the laser light source 120.

第6圖繪示根據本揭露另一實施方式之雷射封裝結構100c的上視圖,第7圖繪示第6圖之雷射封裝結構100c移除光學透鏡130之上視圖。同時參閱第6及第7圖,在本實施方式中,支架110的支撐部114a至少設置於底部112的中央區域上,非如圍繞底部112的支撐部114。支撐部114a的俯視形狀為十字形,支撐部114a與底部112可以為一體成型或者為分離式成型後組裝。支撐部114a具有八個反射面,如四組彼此鄰接且大致垂直的反射面115a、115b。每一反射面115a、115b與底部112的夾角在40度至50度的之間。第7圖之反射面115的傾斜示意可參閱第2圖、第4圖。雷射封裝結構100c具有設置於支架110上的八個雷射光源,如四組的雷射光源120a、120b,其中,各個雷射光源120a、120b的出光面121a、121b分別朝向相應的反射面115a、115b。如第7圖所示,雷射光源120a的出光面121a朝向對應的反射面115a,相似地,雷射光源120b的出光面121b朝向對應的反射面115b。光學透鏡130設置於支撐部114a的上方,光線L由出光面121a、121b分別經過反射面115 a、115b反射後穿過光學透鏡130。FIG. 6 is a top view of the laser package structure 100c according to another embodiment of the present disclosure, and FIG. 7 is a top view of the laser package structure 100c of FIG. 6 with the optical lens 130 removed. Referring to FIGS. 6 and 7 at the same time, in this embodiment, the supporting portion 114 a of the bracket 110 is provided at least on the central area of the bottom 112, not like the supporting portion 114 surrounding the bottom 112. The top view shape of the support portion 114a is a cross shape, and the support portion 114a and the bottom 112 may be integrally formed or assembled after being separately formed. The supporting portion 114a has eight reflecting surfaces, such as four groups of reflecting surfaces 115a and 115b adjacent to each other and substantially perpendicular to each other. The angle between each reflecting surface 115a, 115b and the bottom 112 is between 40 degrees and 50 degrees. The inclination of the reflecting surface 115 in Fig. 7 can be referred to Figs. 2 and 4. The laser package structure 100c has eight laser light sources arranged on the bracket 110, such as four groups of laser light sources 120a, 120b, wherein the light-emitting surfaces 121a, 121b of each laser light source 120a, 120b face the corresponding reflective surfaces, respectively 115a, 115b. As shown in FIG. 7, the light-emitting surface 121a of the laser light source 120a faces the corresponding reflective surface 115a, and similarly, the light-emitting surface 121b of the laser light source 120b faces the corresponding reflective surface 115b. The optical lens 130 is disposed above the support portion 114a, and the light L is reflected by the light-emitting surfaces 121a and 121b through the reflective surfaces 115a and 115b, and then passes through the optical lens 130.

第8圖繪示根據本揭露另一實施方式之雷射封裝結構100d的上視圖。第9圖繪示第8圖之雷射封裝結構100d移除光學透鏡130之上視圖。同時參閱第8圖及第9圖,在本實施方式中,支架110的支撐部114b除了圍繞底部112外,還具有如第7圖的十字形結構,且支撐部114b與底部112可以為一體成型,共同形成支架110,如此生產將能降低成本。雷射封裝結構100d共設有十二個雷射光源,如四組的雷射光源120a、120b、120c。支撐部114b具有十二個反射面,如四組彼此鄰接且俯視形狀為三角形的反射面115a、115b、115c。其中,四個反射面115c位於圍繞底部112四周的支撐部114b上,另八個反射面115 a、115b則位於十字形的支撐部114b上。雷射光源120a、120b、120c的出光面121a、121b、121c分別朝向反射面115a、115b、115c。十二個反射面115a、115b、115c皆為斜面,斜面與底部112之間的夾角在40度至50度的範圍之間。FIG. 8 is a top view of a laser package structure 100d according to another embodiment of the present disclosure. FIG. 9 is a top view of the laser package structure 100d of FIG. 8 with the optical lens 130 removed. Referring to FIGS. 8 and 9 at the same time, in this embodiment, in addition to surrounding the bottom 112, the supporting portion 114b of the bracket 110 also has a cross-shaped structure as shown in FIG. 7, and the supporting portion 114b and the bottom 112 can be integrally formed , The bracket 110 is formed together, so that the production will reduce the cost. The laser packaging structure 100d is provided with a total of twelve laser light sources, such as four groups of laser light sources 120a, 120b, and 120c. The supporting portion 114b has twelve reflective surfaces, such as four groups of reflective surfaces 115a, 115b, 115c that are adjacent to each other and have a triangular shape in plan view. Among them, four reflective surfaces 115c are located on the support portion 114b surrounding the bottom 112, and the other eight reflective surfaces 115a, 115b are located on the cross-shaped support portion 114b. The light-emitting surfaces 121a, 121b, and 121c of the laser light sources 120a, 120b, and 120c face the reflective surfaces 115a, 115b, and 115c, respectively. The twelve reflecting surfaces 115a, 115b, 115c are all inclined surfaces, and the angle between the inclined surface and the bottom 112 is in the range of 40 degrees to 50 degrees.

如第9圖所繪示,雷射光源120a的出光面121a朝向對應的反射面115a,雷射光源120b的出光面121b朝向對應的反射面115b,雷射光源120c的出光面121c朝向對應的反射面115c。圖中的光線L射向反射面115a、115b、115c其中一者後將經由反射進而穿過覆蓋支架110的光學透鏡130。As shown in Figure 9, the light-emitting surface 121a of the laser light source 120a faces the corresponding reflecting surface 115a, the light-emitting surface 121b of the laser light source 120b faces the corresponding reflecting surface 115b, and the light-emitting surface 121c of the laser light source 120c faces the corresponding reflecting surface.面115c. The light L in the figure hits one of the reflective surfaces 115a, 115b, 115c, and then passes through the optical lens 130 covering the support 110 through reflection.

第10圖繪示根據本揭露另一實施方式之雷射封裝結構100e移除光學透鏡後的上視圖。在此實施方式中,支架110的支撐部114c為一管體,且支撐部114c的反射面115d為凹面116。反射面115d設置於管體的支撐部114內壁上。此外,雷射封裝結構100e具有五個排列成一環型的雷射光源120,雷射光源120的出光面121皆向外朝向反射面115d。光線L射向反射面115d後可經由反射穿過覆蓋支架110的光學透鏡,設計者可以依據光強度的需求增加或減少雷射光源120的配置,且不論雷射光源120的數量為何,雷射光源120的出光面121皆可朝向反射面115d。FIG. 10 is a top view of the laser package structure 100e according to another embodiment of the disclosure after the optical lens is removed. In this embodiment, the support portion 114c of the bracket 110 is a tube, and the reflective surface 115d of the support portion 114c is a concave surface 116. The reflecting surface 115d is arranged on the inner wall of the supporting portion 114 of the tube body. In addition, the laser package structure 100e has five laser light sources 120 arranged in a ring shape, and the light-emitting surface 121 of the laser light source 120 faces outward toward the reflective surface 115d. After the light L is directed to the reflecting surface 115d, it can pass through the optical lens of the covering bracket 110 through reflection. The designer can increase or decrease the configuration of the laser light source 120 according to the demand of light intensity, and regardless of the number of the laser light source 120, the laser The light emitting surface 121 of the light source 120 can all face the reflective surface 115d.

在本揭露上述實施方式中,因雷射光源所設置的位置不同將造成光點的大小不同,可以用於不同的光學產品(例如不同的光學感測儀器或者光纖傳輸等科技),在透過光學透鏡組合的配置,可以在空間有限的雷射封裝結構中,達到最大的空間使用率及最適當的效果。In the above-mentioned embodiments of the present disclosure, the different positions of the laser light sources will result in different sizes of light spots, which can be used in different optical products (for example, different optical sensing instruments or optical fiber transmission technologies). The configuration of the lens combination can achieve the largest space utilization rate and the most appropriate effect in the laser package structure with limited space.

雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何熟習此技藝者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above implementation manner, it is not intended to limit the disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure is protected The scope shall be subject to those defined in the attached patent scope.

100、100a、100b、100c、100d、100e:雷射封裝結構 110:支架 112:底部 114、114a、114b、114c:支撐部 115、115a、115b、115c、115d:反射面 116:凹面 120、120a、120b、120c:雷射光源 121、121a、121b、121c:出光面 130、130a、130b:光學透鏡 131:頂面 132:底面 140:導電墊 150:導線 L:光線 2-2、4-4、4-4:線段 100, 100a, 100b, 100c, 100d, 100e: laser package structure 110: bracket 112: bottom 114, 114a, 114b, 114c: support part 115, 115a, 115b, 115c, 115d: reflective surface 116: concave 120, 120a, 120b, 120c: laser light source 121, 121a, 121b, 121c: light emitting surface 130, 130a, 130b: optical lens 131: top surface 132: Bottom 140: Conductive pad 150: wire L: light 2-2, 4-4, 4-4: line segment

為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖繪示根據本揭露一實施方式之雷射封裝結構的上視圖。 第2圖繪示第1圖之雷射封裝結構沿線段2-2的剖面圖。 第3圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第4圖繪示第3圖之雷射封裝結構沿線段4-4線段的剖面圖。 第5圖繪示根據本揭露又一實施方式之雷射封裝結構的上視圖。 第6圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第7圖繪示第6圖之雷射封裝結構移除光學透鏡後之上視圖。 第8圖繪示根據本揭露另一實施方式之雷射封裝結構的上視圖。 第9圖繪示第8圖之雷射封裝結構移除光學透鏡後之上視圖。 第10圖繪示根據本揭露另一實施方式之雷射封裝結構移除光學透鏡後的上視圖。 In order to make the above and other objectives, features, advantages and embodiments of this disclosure more obvious and understandable, the description of the accompanying drawings is as follows: FIG. 1 is a top view of a laser package structure according to an embodiment of the disclosure. Figure 2 shows a cross-sectional view of the laser package structure of Figure 1 along line 2-2. FIG. 3 is a top view of a laser package structure according to another embodiment of the disclosure. Figure 4 shows a cross-sectional view of the laser package structure of Figure 3 along the line 4-4. FIG. 5 is a top view of a laser package structure according to another embodiment of the present disclosure. FIG. 6 is a top view of a laser package structure according to another embodiment of the present disclosure. Fig. 7 is a top view of the laser package structure of Fig. 6 with the optical lens removed. FIG. 8 is a top view of a laser package structure according to another embodiment of the present disclosure. Fig. 9 is a top view of the laser package structure of Fig. 8 with the optical lens removed. FIG. 10 is a top view of the laser package structure according to another embodiment of the disclosure after the optical lens is removed.

100:雷射封裝結構 100: Laser package structure

110:支架 110: bracket

112:底部 112: bottom

114:支撐部 114: Support

115:反射面 115: reflective surface

120:雷射光源 120: Laser light source

121:出光面 121: Glossy Surface

130:光學透鏡 130: optical lens

140:導電墊 140: Conductive pad

150:導線 150: wire

L:光線 L: light

Claims (10)

一種雷射封裝結構,包括: 一支架,具有一底部與一支撐部,其中該支撐部位於該底部上,該支撐部具有至少一反射面; 至少一雷射光源,設置於該支架的該底部上,該雷射光源具有朝向該反射面的一出光面;以及 至少一光學透鏡,設置於該支撐部上且覆蓋該雷射光源, 其中該雷射光源的該出光面發出的光線經由該支撐部的該反射面反射而穿過該光學透鏡。 A laser packaging structure, including: A bracket having a bottom and a supporting portion, wherein the supporting portion is located on the bottom, and the supporting portion has at least one reflective surface; At least one laser light source disposed on the bottom of the bracket, the laser light source having a light emitting surface facing the reflecting surface; and At least one optical lens arranged on the supporting part and covering the laser light source, The light emitted from the light-emitting surface of the laser light source is reflected by the reflective surface of the support portion and passes through the optical lens. 如請求項1所述之雷射封裝結構,其中該反射面為一斜面,且該斜面與該底部之間的夾角在40度至50度的範圍中。The laser package structure according to claim 1, wherein the reflective surface is an inclined surface, and the angle between the inclined surface and the bottom is in the range of 40 degrees to 50 degrees. 如請求項1所述之雷射封裝結構,其中該反射面為一凹面。The laser package structure according to claim 1, wherein the reflective surface is a concave surface. 如請求項1所述之雷射封裝結構,包括複數個該雷射光源,其中該支撐部圍繞該些雷射光源。The laser package structure according to claim 1, comprising a plurality of the laser light sources, wherein the support part surrounds the laser light sources. 如請求項4所述之雷射封裝結構,其中該支撐部具有複數個該反射面,且該些雷射光源分別位置對應於該支撐部的該些反射面。The laser package structure according to claim 4, wherein the support portion has a plurality of the reflective surfaces, and the positions of the laser light sources correspond to the reflective surfaces of the support portion. 如請求項1所述之雷射封裝結構,其中該支撐部的俯視形狀為十字形。The laser package structure according to claim 1, wherein the top view shape of the supporting portion is a cross shape. 如請求項3所述之雷射封裝結構,其中該支撐部為一管體,該反射面位於該管體的一內壁,且該反射面圍繞該些雷射光源。The laser package structure according to claim 3, wherein the supporting portion is a tube body, the reflective surface is located on an inner wall of the tube body, and the reflective surface surrounds the laser light sources. 如請求項1所述之雷射封裝結構,其中該光學透鏡具有相對的一頂面與一底面,該頂面與該底面皆為一平面,或者該頂面與該底面分別為一凸面與一平面。The laser package structure according to claim 1, wherein the optical lens has a top surface and a bottom surface opposite to each other, the top surface and the bottom surface are both a flat surface, or the top surface and the bottom surface are respectively a convex surface and a bottom surface. flat. 如請求項1所述之雷射封裝結構,其中該光學透鏡的數量為二,其中一者位在另一者與該反射面之間。The laser package structure according to claim 1, wherein the number of the optical lenses is two, and one of them is located between the other and the reflective surface. 如請求項1所述之雷射封裝結構,其中該支架的該底部與該支撐部為一體成型的結構。The laser package structure according to claim 1, wherein the bottom of the bracket and the supporting portion are integrally formed.
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