TWM601459U - Substrate stacked breathable structure - Google Patents
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Abstract
本創作係提供一種基板堆疊式透氣結構,其包含:一基板,其於端面處凹設有至少一透氣部;至少一承接元件,其係覆設於該基板之所述透氣部處,且所述承接元件係非完全遮蔽所述透氣部,並令透氣部受所述承接元件之遮蔽而於所述承接元件相對之兩側分別形成一間隙;藉此,該基板係可設置供輸出、生產或熟化之基材,且於堆疊或捲收時,可藉由承接元件之設置,防止於堆疊時之迫壓而致基材受損,並能透過透氣部及其與承接元件形成之間隙而散熱,以防止高溫或溫度之不均而影響基材之品質或平整性,藉可提升基材於供料時之穩定性,以及所產出成品之品質及精度者。The present invention provides a substrate stacked air-permeable structure, which includes: a substrate with at least one air-permeable portion recessed at the end surface; at least one receiving element, which is covered at the air-permeable portion of the substrate, and The receiving element does not completely shield the air-permeable part, and the air-permeable part is shielded by the receiving element to form a gap on the opposite sides of the receiving element; thereby, the substrate can be set for output and production Or cured substrate, and when stacking or rolling, the support element can be arranged to prevent the substrate from being damaged due to pressure during stacking, and it can pass through the air-permeable part and the gap formed by the receiving element. Heat dissipation to prevent high temperature or uneven temperature from affecting the quality or flatness of the substrate, which can improve the stability of the substrate during feeding and the quality and precision of the finished product.
Description
本創作係一種基板堆疊式透氣結構,尤指一種透過承接元件及透氣部之設置,藉以防護基板上之基材,並能予以導熱,且可於上方以及側向方向透氣散熱者。This creation is a substrate-stacked air-permeable structure, especially one that protects the substrate on the substrate through the arrangement of the receiving element and the air-permeable part, and can conduct heat, and can ventilate and dissipate heat in the upper and lateral directions.
按,片狀之基材通常係設置於一載體,以利於收納堆疊及運輸,並於須進行加工時,基材連同載體進行加工,後續即可將基材分離載體而予應用之,故其製程常用於印刷電路板等中間產品。According to, the sheet-like substrate is usually set on a carrier to facilitate storage, stacking and transportation. When processing is required, the substrate and the carrier are processed, and then the substrate can be separated from the carrier for application. The process is often used for intermediate products such as printed circuit boards.
而習知片狀基材於載體上進行加熱工序時,常因受熱膨脹而致有表面不平整之缺失,故習知對於軟板材料熟化,其係藉由於金屬導熱板之下表面兩端設置鋼帶,且於鋼帶設有細孔,藉以於生產過程中,使軟板材料平貼於所述金屬導熱板之上表面,而進行捲收後加工,且過程中所述軟板材料始終與金屬導熱板貼合,藉以達致其平整性,且無需使用黏膠定位軟板材料;惟,前所揭者,因於鋼帶側端設置細孔之加工方式不易,導致鋼帶之製造工序及成本提高,且其所需之鋼帶厚度較高,使整體經捲收後之體積龐大,使其收納及運輸之效率不佳;再者,其設置僅能於側端進行熱對流,故其熱對流致外界之效率不佳,使整體加溫及散熱不均,故仍有致軟板材料因受熱不均而有基材不平整之疑慮。When the conventional sheet-like substrate is heated on the carrier, it often suffers from the lack of surface unevenness due to thermal expansion. Therefore, the conventional maturation of the soft board material is due to the fact that the lower surface of the metal heat-conducting plate is provided at both ends The steel strip is provided with fine holes, so that during the production process, the soft plate material is flatly attached to the upper surface of the metal heat conduction plate, and the post-winding process is performed, and the soft plate material is always It is laminated with the metal heat conduction plate to achieve its flatness and does not require the use of glue to locate the soft plate material; however, the method disclosed above is not easy to process the thin holes on the side ends of the steel strip, which leads to the manufacture of the steel strip The process and cost are increased, and the thickness of the steel strip required is relatively high, which makes the overall volume after coiling bulky, which makes the storage and transportation efficiency poor; moreover, its installation can only conduct heat convection at the side end. Therefore, the heat convection causes the external efficiency to be poor, and the overall heating and heat dissipation are uneven. Therefore, there is still doubt that the flexible board material may have uneven substrate due to uneven heating.
有鑑於此,本創作人特地針對基材於載體之設置及透氣結構加以研究及改良,期以一較佳創作改善上述問題,並在經過長期研發及不斷測試後,始有本創作之問世。In view of this, the creator specially researched and improved the base material on the carrier and the ventilation structure, hoping to improve the above problems with a better creation, and after long-term research and development and continuous testing, the creation of this creation came out.
爰是,本創作之目的係為解決前述問題,為達致以上目的,吾等創作人提供一種基板堆疊式透氣結構,其包含:一基板,其係於端面處凹設有至少一透氣部;以及至少一承接元件,其係覆設於該基板之所述透氣部處,且所述承接元件係非完全遮蔽至少其一所述透氣部,並令該至少其一所述透氣部受所述承接元件之遮蔽而於所述承接元件相對之兩側分別形成一間隙者。The purpose of this creation is to solve the aforementioned problems. In order to achieve the above goals, our creators provide a substrate-stacked air-permeable structure, which includes: a substrate with at least one air-permeable part recessed on the end surface; And at least one receiving element, which is arranged at the air-permeable portion of the substrate, and the receiving element does not completely shield at least one of the air-permeable portions, and make the at least one of the air-permeable portions receive the The shielding of the receiving element forms a gap on the opposite sides of the receiving element.
據上所述之基板堆疊式透氣結構,其中,係具有複數之所述透氣部,且所述透氣部係於該基板之進邊緣處間隔排列成型者。According to the above-mentioned substrate stacked venting structure, there are a plurality of the venting parts, and the venting parts are formed at intervals at the leading edge of the substrate.
據上所述之基板堆疊式透氣結構,其中,所述承接元件係呈長條狀設置者。According to the above-mentioned substrate-stacked air-permeable structure, the receiving element is arranged in a strip shape.
據上所述之基板堆疊式透氣結構,其中,該基板係呈長條狀設置,並於該基板橫向之兩側的進邊緣處,縱向間隔排列成型複數之所述透氣部;且該基板橫向之兩側係分別設有所述承接元件。According to the above-mentioned substrate stacked air-permeable structure, the substrate is arranged in a strip shape, and a plurality of the air-permeable portions are formed longitudinally at intervals at the edges of both sides of the substrate in the transverse direction; and the substrate is transversely The two sides are respectively provided with the receiving element.
據上所述之基板堆疊式透氣結構,其中,所述承接元件係呈長條狀設置,且該基板於橫向之兩側係分別設有一所述承接元件以分別覆設於兩側之所述透氣部。According to the above-mentioned substrate stacked air-permeable structure, wherein the receiving element is arranged in a strip shape, and the substrate is provided with a receiving element on both sides of the substrate to cover the two Ventilation department.
據上所述之基板堆疊式透氣結構,其中,該基板係具撓性設置,且該基板係沿一縱向方向捲收堆疊者。According to the above-mentioned substrate stacked air-permeable structure, the substrate is flexibly arranged, and the substrate is rolled and stacked along a longitudinal direction.
據上所述之基板堆疊式透氣結構,其中,該基板於該基板至少一端之表面處更設有至少一基材,且所述基材之厚度係等於或小於所述承接元件之高度者。According to the above-mentioned substrate stacked vent structure, the substrate is further provided with at least one substrate on the surface of at least one end of the substrate, and the thickness of the substrate is equal to or less than the height of the receiving element.
據上所述之基板堆疊式透氣結構,其中,所述基材係設置於該基板之中間或進中間處。According to the above-mentioned substrate stacked gas-permeable structure, the substrate is arranged in the middle or in the middle of the substrate.
據上所述之基板堆疊式透氣結構,其中,所述基材係金屬或高分子材料者。According to the above-mentioned substrate stacked gas permeable structure, the substrate is made of metal or polymer material.
據上所述之基板堆疊式透氣結構,其中,所述承接元件為金屬材質之帶體。According to the above-mentioned substrate-stacked air-permeable structure, the receiving element is a belt made of metal material.
據上所述之基板堆疊式透氣結構,其中,該基板為導熱材質設置者。According to the above-mentioned substrate-stacked air-permeable structure, the substrate is made of thermally conductive material.
據上所述之基板堆疊式透氣結構,其中,所述透氣部為貫穿設置之穿孔。According to the above-mentioned substrate stacked venting structure, the venting portion is a through hole.
據上所述之基板堆疊式透氣結構,其中,所述透氣部為非貫穿設置之凹部。According to the above-mentioned substrate-stacked air-permeable structure, the air-permeable portion is a non-penetrating recess.
據上所述之基板堆疊式透氣結構,其中,相鄰之所述透氣部係分別凹設間隔排列於該基板相異之端面者。According to the above-mentioned substrate stacked air-permeable structure, the adjacent air-permeable parts are respectively recessed and arranged on different end surfaces of the substrate at intervals.
是由上述說明及設置,顯見本創作主要具有下列數項優點及功效,茲逐一詳述如下:Based on the above description and settings, it is obvious that this creation mainly has the following advantages and effects, which are detailed as follows:
1.基板係可設置供輸出、生產或熟化之基材,而於堆疊或捲收時,可藉由承接元件之設置,防止於堆疊時之迫壓而致基材受損,且可均勻加溫,並能透過透氣部及其與承接元件形成之間隙而可於側向方向散熱,並於透氣部為穿孔時可於上方散熱,藉此,可防止高溫或溫度之不均而影響基材之品質或平整性,藉可提升基材於供料時之穩定性,以及所產出成品之品質及精度者。1. The substrate can be provided with a base material for output, production or curing. When stacking or winding, it can prevent the base material from being damaged due to pressure during stacking and can be evenly added Temperature, and can dissipate heat in the lateral direction through the gap formed by the venting part and the receiving element. When the venting part is perforated, it can dissipate heat above, thereby preventing high temperature or uneven temperature from affecting the substrate The quality or flatness of the substrate can improve the stability of the substrate during feeding, and the quality and precision of the finished product.
本創作係一種基板堆疊式透氣結構,其實施手段、特點及其功效,茲舉數種較佳可行實施例並配合圖式於下文進行詳細說明,俾供 鈞上深入瞭解並認同本創作。This creation is a substrate stacked air-permeable structure. Its implementation means, characteristics and effects are listed below in detail with several preferred and feasible embodiments in conjunction with the drawings to provide a thorough understanding and approval of this creation.
首先,請參閱第1圖至第3圖所示,本創作係一種基板堆疊式透氣結構,其包含:First of all, please refer to Figures 1 to 3, this creation is a substrate stacked air-permeable structure, which includes:
一基板1,其係於一端面處凹設有至少一透氣部11;以及A
至少一承接元件2,其係覆設於該基板1之所述透氣部11處,且所述承接元件2係非完全遮蔽至少其一所述透氣部11,並令該至少其一所述透氣部11受所述承接元件2之遮蔽而於所述承接元件2相對之兩側分別形成一間隙12。At least one receiving
就承接元件2之設置而言,其係可設置於基板1之上端面或下端面;藉此,當基板1予以進行直接堆疊或捲收堆疊時,所述承接元件2將可抵頂於其相鄰基板1之透氣部11處,藉以如第3圖所示,使堆疊相鄰之基板1間具有空氣流通,使加溫及散熱可予均勻化,且於側向方向而言,兩相鄰之基板1間之空氣,將可由其之間的承接元件2,經其上方或下方之間隙12而經其透氣部11而對流至另一對應之間隙12,使熱量得以繞過承接元件2而散除;As far as the setting of the
此外,因熱量因其密度而有朝上方流動之特性,故當透氣部11為貫穿設置之穿孔時,如第3圖所示,因承接元件2係抵頂於相鄰基板1之透氣部11處,並同樣形成間隙12,故熱量亦可直接經所述間隙12而向上方對流,藉以增進本創作透氣散熱之功效。In addition, since the heat has the characteristic of flowing upward due to its density, when the air-
就基板1而言,而如前述者,若係將基板1予以捲收堆疊,該基板1則係具撓性設置,且該基板1係沿一縱向方向捲收堆疊;此外,為利於本創作可進行加熱之工序,故該基板1亦可為導熱材質設置者。As far as the
如前所述,就透氣部11之配置而言,較佳者,係設置有複數之所述透氣部11,且就承接元件2之設置而言,係以如前述者,非完全遮蔽所述透氣部11,以於透氣部11受其遮蔽而兩側分別形成間隙12;此外,在一較佳之實施例中,為利於基板1可進行乘載之配置,故所述透氣部11係於該基板1之進邊緣處間隔排列成型者。As mentioned above, in terms of the arrangement of the
在一具體之實施例中,所述承接元件2係呈長條狀設置,其係可為金屬材質之帶體,如:鋼帶,藉以直接透過物理性或化學性之方式結合於基板1,並可透過單一之承接元件2而如前所述覆設於多個透氣部11並形成間隙12;此外,較佳者,該基板1係呈長條狀設置,故可知悉者,所述承接元件2係為較長之矩形設置,以利於進行捲收堆疊,使可易於進行收納及加工,故本創作所述之側向方向及橫向方向,係指非捲收方向,而位於短邊方向之兩側的方向者;而較佳之配置,係利於兩側之方向皆可予以散熱,故該基板1橫向之兩側的進邊緣處間隔排列成型複數之所述透氣部11;且該基板1於橫向之兩側係分別設有所述承接元件2,而如前述者,所述承接元件2係可分別設置於該基板1於橫向之兩側,且如前述分別覆設於兩側之所述透氣部11,藉以提升熱對流之效率者。In a specific embodiment, the
綜如前述,本創作係可透過有膠或無膠方式承接至少一基材3,一般而言,基材3係小於該基板1,且係如同基板1呈長條狀設置,惟其僅係舉例說明,並不以此作為限定;而就基材3而言,其厚度係可等於或小於所述承接元件2之高度,於厚度小於承接元件2之高度時,可使承接元件2可確實承接相鄰之基板1,使防止於捲收過程中,導致產生對於基材3物理性之破壞,使維持基材3之完整性,並可令基材3與相鄰基板1間具有縫隙,以利於可藉由前述之熱對流,使均勻加溫或散熱,令基材3不易因受熱不均而產生變形之現象;而當厚度等於承接元件2之高度時,基材3可被物理性的限位於基板1之間,使其無法膨脹產生型變,同樣可增進其於加熱後之平整性,且空氣仍可如前述進行上方方向之對流,亦可達致散熱之效率。In summary, this creation system can accept at least one
而為利於進行散熱以及對於基材3之設置及分離輸出之處理,故所述基材3係設置於該基板1之中間或進中間處,亦即,基材3將被設置於基板1兩側之透氣部11之間;而如前述者,所述基材3係可為任一需予輸出、生產或熟化之基材3,以利於後續產品或中間產品使用,故基材3可為金屬或高分子材料,諸如:銅箔、鋁、聚對苯二甲酸乙二酯(PET)、聚氯乙烯(PVC)、聚乙烯(PE)、聚醯亞胺(PI)等材料,以利於後續之製造流程者。In order to facilitate the heat dissipation and the processing of the installation and separation of the
在另一實施例中,如第4至6圖所示,本創作亦可將透氣部11’設置為非貫穿設置之凹部,相鄰之所述透氣部11’係可凹設於該基板1同側之端面,在另一實施例中,為利於加工以及兼顧其成型後之強度,故如第5圖所示,亦可將透氣部11’配置為分別凹設間隔排列於該基板相異之端面者,藉此,如第6圖所示,雖透氣部11’為非貫穿設置之凹部而致空氣無法向上方散熱,惟仍可如前述者進行橫向兩側之側向方向散熱,以同樣達致散熱功效者。In another embodiment, as shown in Figures 4 to 6, the present invention can also provide the air-permeable portion 11' as a non-penetrating recess, and the adjacent air-permeable portions 11' can be recessed on the
綜觀上述,本創作所揭露之技術手段不僅為前所未見,且確可達致預期之目的與功效,故兼具新穎性與進步性,誠屬專利法所稱之新型無誤,以其整體結構而言,確已符合專利法之法定要件,爰依法提出新型專利申請。In summary, the technical means disclosed in this creation is not only unprecedented, but also achieves the expected purpose and effect. Therefore, it is both novel and progressive. It is truly a new type in the patent law. In terms of structure, it has indeed met the statutory requirements of the Patent Law, and Yan has filed a new patent application in accordance with the law.
惟以上所述者,僅為本創作之較佳實施例,當不能以此作為限定本創作之實施範圍,即大凡依本創作申請專利範圍及說明書內容所作之等效變化與修飾,皆應仍屬於本創作專利涵蓋之範圍內。However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation, that is, all equivalent changes and modifications made in accordance with the scope of patent application for this creation and the contents of the specification should still be used. It belongs to the scope of this creation patent.
1:基板 11、11’:透氣部 12:間隙 2:承接元件 3:基材 1: substrate 11.11’: Ventilation part 12: gap 2: Undertake components 3: Substrate
第1圖係本創作之俯視示意圖。 第2圖係第1圖於A-A位置之剖視示意圖。 第3圖係本創作之剖視暨堆疊之使用狀態示意圖。 第4圖係本創作另一實施例之俯視示意圖。 第5圖係第4圖於B-B位置之剖視示意圖。 第6圖係第4圖於C-C位置之剖視暨堆疊之使用狀態示意圖。 Figure 1 is a schematic top view of this creation. Figure 2 is a schematic cross-sectional view of Figure 1 at position A-A. Figure 3 is a cross-sectional view of this creation and a schematic diagram of the stacking state of use. Figure 4 is a schematic top view of another embodiment of this creation. Figure 5 is a schematic cross-sectional view of Figure 4 at position B-B. Figure 6 is a cross-sectional view of Figure 4 at the position C-C and a schematic diagram of the stacking state in use.
1:基板 1: substrate
11:透氣部 11: Breathable part
12:間隙 12: gap
2:承接元件 2: Undertake components
3:基材 3: Substrate
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785585B (en) * | 2021-04-29 | 2022-12-01 | 孫維嶺 | Curing and drying equipment of air-permeable base plate |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785585B (en) * | 2021-04-29 | 2022-12-01 | 孫維嶺 | Curing and drying equipment of air-permeable base plate |
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