TWM600663U - Multi-axis driving chip breaking control system - Google Patents
Multi-axis driving chip breaking control system Download PDFInfo
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- TWM600663U TWM600663U TW109207187U TW109207187U TWM600663U TW M600663 U TWM600663 U TW M600663U TW 109207187 U TW109207187 U TW 109207187U TW 109207187 U TW109207187 U TW 109207187U TW M600663 U TWM600663 U TW M600663U
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本創作有關於一種數值控制技術領域,特別是關於一種多軸驅動斷屑控制系統。This creation is about a numerical control technology field, especially a multi-axis drive chip breaking control system.
在機床的切削加工製程中,其切屑會纏繞在刀具或工件上,導致刮傷工件或是損壞刀具。因此使用者會根據實際加工情況開啟機床的斷屑加工功能,如此一來可避免產生過長的切屑影響加工品質。一般而言,使用者可藉由機床的數值控制裝置來調整加工製程中的相關參數。數值控制裝置與多合一驅動器連接,多合一驅動器根據數值控制裝置傳來的控制命令用以驅動馬達以控制刀具或工件的動作。其中,多合一驅動器會根據馬達編碼器得知加工過程中刀具或工件的位置,並將位置數據傳給數值控制裝置。當使用者開啟斷屑功能時,數值控制裝置透過多合一驅動器控制刀具或工件用以斷屑,然而由於數值控制裝置無法即時得知刀具或工件的位置,因此無法精確地控制斷屑的品質。In the machining process of the machine tool, the chips will be entangled on the tool or workpiece, causing scratches on the workpiece or damage to the tool. Therefore, the user will turn on the chip breaking processing function of the machine tool according to the actual processing situation, so as to avoid the generation of excessively long chips that affect the processing quality. Generally speaking, the user can adjust the relevant parameters in the machining process through the numerical control device of the machine tool. The numerical control device is connected with the all-in-one driver, and the all-in-one driver is used to drive the motor to control the movement of the tool or the workpiece according to the control command from the numerical control device. Among them, the all-in-one driver knows the position of the tool or workpiece during the machining process according to the motor encoder, and transmits the position data to the numerical control device. When the user turns on the chip breaking function, the numerical control device controls the tool or workpiece for chip breaking through the all-in-one driver. However, because the numerical control device cannot know the position of the tool or workpiece in real time, it cannot accurately control the quality of chip breaking .
為了改善上述問題,本創作主要的目的在於提供一種多軸驅動斷屑控制系統及其控制方法,驅動器接收上位機命令後,驅動器可直接根據當下的加工命令、加工條件與機台性能自動計算出擺動振幅與擺動頻率。如此一來,使用者無須於斷屑加工製程中自行設定擺動振幅與擺動頻率,以提升操作便利性。另一方面,本創作的多合一驅動器自動計算出移動命令後,會根據移動命令、擺動振幅與擺動頻率計算出擺動移動命令,並將擺動移動命令輸出給馬達用以控制多個擺動軸以進行斷屑加工製程。In order to improve the above problems, the main purpose of this creation is to provide a multi-axis drive chip-breaking control system and its control method. After the driver receives the command from the host computer, the driver can directly calculate it according to the current processing command, processing conditions and machine performance. Swing amplitude and swing frequency. In this way, the user does not need to set the swing amplitude and frequency during the chip breaking processing process to improve the convenience of operation. On the other hand, after the all-in-one driver of this creation automatically calculates the movement command, it will calculate the oscillation movement command based on the movement command, oscillation amplitude and oscillation frequency, and output the oscillation movement command to the motor to control multiple oscillation axes. Carry out the chip breaking process.
本創作的另一目的在於提供一種多軸驅動斷屑控制系統及其控制方法,驅動器藉由馬達編碼器的回授值即時得知多個擺動軸的位置,並根據回授值進行該斷屑加工製程補償,以縮短一般斷屑加工製程中利用數值控制裝置進行補償的反應時間並可更有效的提升斷屑加工精度。Another purpose of this creation is to provide a multi-axis drive chip breaking control system and its control method. The driver knows the positions of multiple swing axes in real time by the feedback value of the motor encoder, and performs the chip breaking processing according to the feedback value. Process compensation can shorten the response time of compensation by numerical control device in general chip breaking process and can more effectively improve chip breaking accuracy.
根據上述目的,本創作揭露一種多軸驅動斷屑控制系統,其包括:驅動器及多個擺動軸,其中驅動器包括:命令接收單元、斷屑單元及路徑規劃單元。命令接收單元用以接收加工命令、至少一個加工條件及至少一個機台性能,且命令接收單元根據加工命令與加工條件計算移動命令;斷屑單元接收由命令單元所傳送的至少一個加工條件及至少一個機台性能,且斷屑單元根據加工條件及機台性能計算擺動振幅和擺動頻率;路徑規劃單元接收由命令接收單元計算得到的移動命令,及接收由斷屑單元計算得到的擺動振幅及擺動頻率,且路徑規劃單元根據移動命令、擺動振幅與擺動頻率計算擺動移動命令。多個擺動軸與驅動器連接,且驅動器根據擺動命令同時控制各個擺動軸以對工件進行斷屑加工製程。According to the above objective, the present creation discloses a multi-axis drive chip breaking control system, which includes a driver and a plurality of swing shafts, wherein the driver includes a command receiving unit, a chip breaking unit and a path planning unit. The command receiving unit is used to receive a processing command, at least one processing condition and at least one machine performance, and the command receiving unit calculates a movement command according to the processing command and the processing condition; the chip breaking unit receives at least one processing condition and at least one processing condition transmitted by the command unit A machine performance, and the chip breaking unit calculates the swing amplitude and frequency according to the processing conditions and machine performance; the path planning unit receives the movement command calculated by the command receiving unit, and receives the swing amplitude and swing calculated by the chip breaking unit Frequency, and the path planning unit calculates the swing movement command according to the movement command, the swing amplitude, and the swing frequency. A plurality of swing shafts are connected to the driver, and the driver simultaneously controls each swing shaft according to the swing command to perform chip breaking processing on the workpiece.
在本創作的較佳實施例中,斷屑單元根據機台性能設定擺動頻率參考區間,且斷屑單元將擺動頻率參考區間與擺動頻率進行比較,當擺動頻率未包含在擺動頻率參考區間內,斷屑單元根據加工條件及機台性能重新計算以得到另一擺動頻率。In the preferred embodiment of this creation, the chip breaking unit sets the swing frequency reference interval according to the machine performance, and the chip breaking unit compares the swing frequency reference interval with the swing frequency. When the swing frequency is not included in the swing frequency reference interval, The chip breaking unit recalculates according to the processing conditions and machine performance to obtain another oscillation frequency.
在本創作的較佳實施例中,斷屑單元根據機台性能設定擺動振幅參考區間,且斷屑單元將擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含於擺動振幅參考區間內,斷屑單元根據加工條件及機台性能重新計算以得到另一擺動振幅。In the preferred embodiment of this creation, the chip breaking unit sets the swing amplitude reference interval according to the machine performance, and the chip breaking unit compares the swing amplitude with the swing amplitude reference interval. When the swing amplitude is not included in the swing amplitude reference interval, The chip breaking unit recalculates according to the processing conditions and machine performance to obtain another swing amplitude.
在本創作的較佳實施例中,驅動器更包含記憶單元用以接收並儲存由使用者所輸入的加工條件與機台性能。In the preferred embodiment of the present invention, the driver further includes a memory unit for receiving and storing the processing conditions and machine performance input by the user.
在本創作的較佳實施例中,將共振頻率區間儲存於記憶單元中,當擺動頻率包含於共振頻率區間內,斷屑單元根據加工條件及機台性能重新計算擺動頻率以得到又一擺動頻率。In the preferred embodiment of this creation, the resonance frequency interval is stored in the memory unit. When the oscillation frequency is included in the resonance frequency interval, the chip breaking unit recalculates the oscillation frequency according to the processing conditions and machine performance to obtain another oscillation frequency .
在本創作的較佳實施例中,部份擺動軸或多個擺動軸與擺動單元連接,擺動單元包括主軸及/或進給軸、加工條件包括主軸的轉速、進給軸的進給速度與工件的至少一個工件特徵,以及機台性能包括速度回路增益、速度回路積分時間常數及/或位置回路增益。In the preferred embodiment of this creation, part of the swing axis or multiple swing axes are connected to the swing unit. The swing unit includes the spindle and/or the feed axis. The processing conditions include the spindle speed, the feed speed of the feed axis and At least one feature of the workpiece and the machine performance include speed loop gain, speed loop integral time constant and/or position loop gain.
在本創作的較佳實施例中,工件特徵包括工件的形狀、尺寸及/或至少一種材料特性。In the preferred embodiment of the present creation, the features of the workpiece include the shape, size and/or at least one material characteristic of the workpiece.
在本創作的較佳實施例中,斷屑單元根據速度、進給速度、速度回路增益與速度回路積分時間常數計算擺動振幅,且斷屑單元根據轉速、進給速度、工件特徵、速度回路增益與速度回路積分時間常數計算得到擺動頻率。In the preferred embodiment of this creation, the chip breaking unit calculates the swing amplitude according to the speed, feed speed, speed loop gain and the speed loop integral time constant, and the chip breaking unit calculates the swing amplitude according to the speed, feed speed, workpiece characteristics, and speed loop gain Calculate the swing frequency with the integral time constant of the speed loop.
在本創作的較佳實施例中,斷屑單元更根據轉速、進給速度、速度回路增益、速度回路積分時間常數與位置回路增益計算第一擺動振幅,且斷屑單元更根據轉速、進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動頻率。In the preferred embodiment of this creation, the chip breaking unit further calculates the first swing amplitude according to the rotation speed, feed speed, speed loop gain, speed loop integral time constant and position loop gain, and the chip breaking unit further calculates the first swing amplitude according to the speed and feed speed. Speed, workpiece characteristics, speed loop gain, speed loop integral time constant and position loop gain are calculated to obtain the first swing frequency.
在本創作的較佳實施例中,工件在斷屑加工製程中的第一時間會產生第一斷屑量,在第二時間會產生第二斷屑量,第一斷屑量與第二斷屑量皆包含於公差區間內。In the preferred embodiment of this creation, the workpiece will have a first chip breaking amount at the first time in the chip breaking processing process, and a second chip breaking amount will be generated at the second time. The first chip breaking amount and the second chip breaking The amount of chips is included in the tolerance interval.
在本創作的較佳實施例中,部份擺動軸或多個擺動軸由斷屑加工製程的至少一個移動軸中選擇。In the preferred embodiment of the present invention, part of the swing axis or multiple swing axes are selected from at least one moving axis of the chip breaking process.
在本創作的較佳實施例中,工件在斷屑加工製程中的第三時間根據第三擺動振幅與第三擺動頻率進行斷屑加工製程,且工件在斷屑加工製程中的第四時間根據第四擺動振幅與第四擺動頻率進行斷屑加工製程,且第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,其中擺動單元在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。In the preferred embodiment of this creation, the third time of the workpiece in the chip breaking process is performed according to the third oscillation amplitude and the third oscillation frequency, and the fourth time of the workpiece in the chip breaking process is according to The fourth oscillating amplitude and the fourth oscillating frequency are subjected to a chip-breaking processing process, and the third oscillating amplitude is greater than the fourth oscillating amplitude, and the third oscillating frequency is lower than the fourth oscillating frequency. The third processing that the oscillating unit moves at the third time The distance is smaller than the fourth machining distance moved at the fourth time.
在本創作的較佳實施例中,路徑規劃單元更包括:接收每一個擺動軸對工件進行斷屑加工製程的回授值;比較回授值與擺動移動命令以產生回授移動命令;根據回授移動命令、第二移動命令、第二擺動振幅與第二擺動頻率計算擺動回授移動命令;以及根據擺動回授移動命令控制每一個擺動軸以對工件進行斷屑加工製程補償,其中移動命令的發生時間點早於第二移動命令的發生時間點。In the preferred embodiment of the present creation, the path planning unit further includes: receiving the feedback value of each swing axis for the chip breaking processing process of the workpiece; comparing the feedback value with the swing movement command to generate the feedback movement command; Calculate the swing feedback movement command by granting the movement command, the second movement command, the second swing amplitude and the second swing frequency; and control each swing axis according to the swing feedback movement command to compensate the workpiece for chip-breaking processing. The movement command The occurrence time of is earlier than the occurrence time of the second move command.
另外,本創作更揭露一種多軸驅動斷屑控制方法,其步驟包括:在加工區間開啟斷屑加工製程;接收加工命令、至少一個加工條件及至少一台機台性能;根據加工命令計算移動命令;根據加工條件及機台性能計算擺動振幅與擺動頻率;根據移動命令、擺動振幅與擺動頻率計算擺動移動命令;以及根據擺動移動命令同時控制多個擺動軸以對工件進行斷屑加工製程。In addition, this creation further discloses a multi-axis drive chip breaking control method, the steps of which include: starting the chip breaking processing process in the processing interval; receiving processing commands, at least one processing condition and at least one machine performance; and calculating the movement command according to the processing commands Calculate the swing amplitude and frequency according to the processing conditions and machine performance; calculate the swing movement command according to the movement command, the swing amplitude and the swing frequency; and simultaneously control multiple swing axes according to the swing movement command to perform chip breaking processing on the workpiece.
在本創作的另一較佳實施例中,根據機台性能設定擺動頻率參考區間,並將擺動頻率與擺動頻率參考區間進行比較,當擺動頻率未包含在擺動頻率參考區間內,根據加工條件及機台性能重新計算另一擺動頻率。In another preferred embodiment of this creation, the swing frequency reference interval is set according to the machine performance, and the swing frequency is compared with the swing frequency reference interval. When the swing frequency is not included in the swing frequency reference interval, according to the processing conditions and The machine performance recalculates another swing frequency.
在本創作的另一較佳實施例中,根據機台性能設定擺動振幅參考區間,並將擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含在擺動振幅參考區間內,根據加工條件及機台性能重新計算以得到另一擺動振幅。In another preferred embodiment of this creation, the swing amplitude reference interval is set according to the performance of the machine, and the swing amplitude is compared with the swing amplitude reference interval. When the swing amplitude is not included in the swing amplitude reference interval, according to the processing conditions and The machine performance is recalculated to obtain another swing amplitude.
在本創作的另一較佳實施例中,加工條件與機台性能可由使用者自行輸入或儲存於記憶單元中。In another preferred embodiment of the present invention, the processing conditions and machine performance can be input by the user or stored in the memory unit.
在本創作的另一較佳實施例中,更包括將至少一個共振頻率區間儲存於記憶單元中,當擺動頻率包含在共振頻率區間內,根據加工條件及機台性能重新計算擺動頻率以得到又一擺動頻率。In another preferred embodiment of the present creation, it further includes storing at least one resonance frequency interval in the memory unit. When the oscillation frequency is included in the resonance frequency interval, the oscillation frequency is recalculated according to the processing conditions and machine performance to obtain another A swing frequency.
在本創作的另一較佳實施例中,加工條件包括主軸的轉速、進給軸的進給速度與工件的至少一個工件特徵、擺動單元包括主軸及/或進給軸、且擺動單元與部份擺動軸或多個擺動軸連接及機台性能包括速度回路增益、速度回路積分時間常數及/或位置回路增益。In another preferred embodiment of the present creation, the processing conditions include the rotation speed of the spindle, the feed speed of the feed axis and at least one feature of the workpiece, the swing unit includes the spindle and/or the feed axis, and the swing unit and the part Part swing axis or multiple swing axis connection and machine performance include speed loop gain, speed loop integral time constant and/or position loop gain.
在本創作的另一較佳實施例中,工件特徵包括工件的形狀、尺寸及/或至少一種材料特性。In another preferred embodiment of the present creation, the features of the workpiece include the shape, size and/or at least one material characteristic of the workpiece.
在本創作的另一較佳實施例中,擺動振幅是根據轉速、進給速度、速度回路增益與速度回路積分時間常數計算得到及擺動頻率是根據轉速、進給速度、工件特徵、速度回路增益與速度回路積分時間常數計算得到。In another preferred embodiment of this creation, the swing amplitude is calculated based on the speed, feed rate, speed loop gain, and speed loop integral time constant, and the swing frequency is based on the speed, feed speed, workpiece characteristics, and speed loop gain. Calculated with the integral time constant of the speed loop.
在本創作的另一較佳實施例中,更包括根據轉速、進給速度、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動振幅,且更根據轉速、進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動頻率。In another preferred embodiment of this creation, it further includes calculating the first swing amplitude based on the rotation speed, feed speed, speed loop gain, speed loop integral time constant, and position loop gain, and further based on the rotation speed, feed speed, Workpiece characteristics, speed loop gain, speed loop integral time constant and position loop gain are calculated to obtain the first swing frequency.
在本創作的另一較佳實施例中,工件在斷屑加工製程中的第一時間會產生第一斷屑量,在第二時間會產生第二斷屑量,第一斷屑量與第二斷屑量皆包含於公差區間內。In another preferred embodiment of the present invention, the workpiece will have a first chip breaking amount at the first time in the chip breaking processing process, and a second chip breaking amount will be produced at the second time. Both chip breaking amounts are included in the tolerance interval.
在本創作的另一較佳實施例中,第一擺動軸與第二擺動軸由斷屑加工製程的至少一個移動軸中選擇。In another preferred embodiment of the present invention, the first swing axis and the second swing axis are selected from at least one moving axis in the chip breaking process.
在本創作的另一較佳實施例中,工件在該斷屑加工製程中的第三時間根據第三擺動振幅與第三擺動頻率進行斷屑加工製程,且工件在斷屑加工製程中的第四時間根據第四擺動振幅與第四擺動頻率進行斷屑加工製程,且第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,其中擺動單元在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。In another preferred embodiment of the present invention, the workpiece is in the chip breaking process at the third time according to the third oscillation amplitude and the third oscillation frequency to perform the chip breaking process, and the workpiece is in the first chip breaking process. Four-time chip breaking processing is performed according to the fourth swing amplitude and the fourth swing frequency, and the third swing amplitude is greater than the fourth swing amplitude, and the third swing frequency is less than the fourth swing frequency. The swing unit moves at the third time The third machining distance is smaller than the fourth machining distance moved at the fourth time.
在本創作的另一較佳實施例中,多軸驅動斷屑控制方法更包括:接收每一個擺動軸對工件進行斷屑加工製程的回授值;比較回授值與擺動移動命令以產生回授移動命令;根據回授移動命令、第二移動命令、第二擺動振幅與第二擺動頻率計算擺動回授移動命令;以及根據擺動回授移動命令控制每一個擺動軸以對工件進行斷屑加工製程補償,其中移動命令的發生時間點早於第二移動命令的發生時間點。In another preferred embodiment of the present creation, the multi-axis drive chip breaking control method further includes: receiving the feedback value of each swing axis for the chip breaking processing process of the workpiece; comparing the feedback value with the swing movement command to generate the feedback Calculate the swing feedback movement command according to the feedback movement command, the second movement command, the second swing amplitude and the second swing frequency; and control each swing axis according to the swing feedback movement command to perform chip breaking processing on the workpiece Process compensation, wherein the occurrence time of the movement command is earlier than the occurrence time of the second movement command.
首先請參考圖1。在說明圖1的同時也一併配合圖2來說明,其中圖1是根據本創作所揭露的技術,表示多軸驅動斷屑控制方法的步驟流程圖以及圖2是表示多軸驅動斷屑控制系統的示意圖。多軸驅動斷屑控制方法其步驟包含:步驟S52:在加工區間開啟斷屑加工製程。於此步驟中,使用者依照實際加工製程需求於上位機2開啟斷屑加工功能,上位機2可以是加工機台(未在圖中表示)控制器、桌上型電腦、筆記型電腦、智慧型手機或遠端伺服器等裝置,且上位機2與驅動器3透過有線或無線方式連接。步驟S54:接收加工命令、至少一個加工條件及至少一個機台性能。於此步驟中,驅動器3中的命令接收單元30接收由上位機2傳來的加工命令、加工條件及機台性能,而加工命令、加工條件及機台性能的定義將在以下詳細說明。值得注意的是,機台性能可由上位機2獲得,也可內建於驅動器3的記憶單元(未在圖中表示,如記憶體)中。接著步驟S56:根據加工命令與加工條件計算移動命令。於此步驟中,命令接收單元30根據上位機2所傳來的加工命令與加工條件計算出移動命令。加工機台對工件(未在圖中表示)執行加工製程前,需經由上位機2的加工命令得知工件的加工態樣,如切削孔徑大小或深度等。步驟S58:根據至少一個加工條件及至少一個機台性能計算擺動振幅與擺動頻率。於此步驟中,由斷屑單元32依據上位機2傳來的加工條件及機台性能計算出擺動振幅與擺動頻率。機台性能可視為加工機台剛性,主要包括速度回路增益、速度回路積分時間常數及/或位置回路增益等資訊。步驟S60:根據移動命令、擺動振幅與擺動頻率計算擺動移動命令。於此步驟是利用命令接收單元30將移動命令傳送至路徑規劃單元34,擺動振幅與擺動頻率是由斷屑單元32傳送至路徑規劃單元34,再由路徑規劃單元34根據移動命令、擺動振幅與擺動頻率來計算出擺動移動命令。最後步驟S62:根據擺動移動命令同時控制多個擺動軸以對工件進行斷屑加工製程。於此步驟,驅動器3可以依據步驟S60由路徑規劃單元34計算得到的擺動移動命令分配至各個擺動軸41、42…4n,並且來控制每一個擺動軸41、42…4n對工件(未在圖中表示)進行斷屑加工製程。針對上述的上位機2、驅動器3、命令接收單元30、斷屑單元32及路徑規劃單元34的功能於後詳細說明。Please refer to Figure 1 first. While explaining Fig. 1, it is also explained in conjunction with Fig. 2. Among them, Fig. 1 is a flow chart showing the steps of a multi-axis drive chip breaking control method according to the technology disclosed in this creation, and Fig. 2 shows a multi-axis drive chip breaking control Schematic diagram of the system. The multi-axis drive chip breaking control method includes the following steps: Step S52: Turn on the chip breaking processing process in the processing interval. In this step, the user turns on the chip breaking processing function on the
接著請參考圖2。圖2是表示多軸驅動斷屑控制系統的示意圖。在圖2中,多軸驅動斷屑控制系統1至少包含:上位機2、驅動器3及多個擺動軸41、42…4n,其中n是正整數,代表擺動軸的數量。另一方面,在斷屑加工製程中,擺動單元(未在圖中表示)可於多個擺動軸41、42…4n擺動以進行斷屑,其中擺動單元包括主軸(未在圖中表示)及/或進給軸(未在圖中表示)。值得注意的是,擺動單元的選擇可由上位機2傳給驅動器3,也可設定於驅動器3的記憶單元中。在一實施例中,當擺動單元為進給軸(依照實際加工流程對應於刀具或工件)時,進給軸可於x、y及/或z軸(對應於多個擺動軸41、42…4n)擺動。其中,進給軸可依照實際加工流程於x、y及/或z軸擺動用以斷屑,例如當加工流程為直線斷屑時,進給軸可於x、y或z軸中任一軸擺動用以斷屑;另一方面,當加工流程為斜線或圓弧時,進給軸可於x、y或z軸中任兩軸擺動用以斷屑。Then please refer to Figure 2. Fig. 2 is a schematic diagram showing a multi-axis drive chip breaking control system. In Fig. 2, the multi-axis drive chip breaking control system 1 at least includes: a
在另一實施例中,當擺動單元為主軸(依照實際加工流程對應於刀具或工件)時,主軸可於a、b及/或c軸(對應於多個擺動軸41、42…4n)擺動。其中,主軸可依照實際加工流程於a、b及/或c軸擺動用以斷屑,例如當加工流程為直線斷屑時,主軸可於a、b或c軸中任一軸擺動用以斷屑;另一方面,當加工流程為斜線或圓弧時,主軸可於a、b或c軸中任兩軸擺動用以斷屑。在又一實施例中,當擺動單元為進給軸與主軸(依照實際加工流程對應於刀具或工件)時,進給軸可於x、y或z軸中任一軸擺動,且主軸可於a、b或c軸中任一軸擺動用以斷屑。In another embodiment, when the swing unit is a spindle (corresponding to the tool or workpiece according to the actual machining process), the spindle can swing on the a, b and/or c axis (corresponding to multiple swing axes 41, 42...4n) . Among them, the spindle can swing in a, b, and/or c axis for chip breaking according to the actual machining process. For example, when the machining process is linear chip breaking, the spindle can swing in any of the a, b or c axis for chip breaking. ; On the other hand, when the machining process is oblique or arc, the main shaft can swing in any two of the a, b or c axis for chip breaking. In another embodiment, when the swing unit is the feed axis and the spindle (corresponding to the tool or the workpiece according to the actual machining process), the feed axis can swing in any of the x, y, or z axes, and the spindle can be at a , B or c axis swing for chip breaking.
另一方面,驅動器3分別與上位機2及多個擺動軸41、42…4n連接,且多個擺動軸41、42…4n可由多個馬達(未在圖中表示)分別控制。在一實施例中,驅動器3為多合一驅動器,連接至多個馬達以同時控制多個擺動軸41、42…4n以進行斷屑加工製程。驅動器3接收由上位機2傳來的加工命令、加工條件及/或機台性能,其中,加工命令為工件加工態樣;加工條件包含了主軸的轉速、進給軸的進給速度與工件特徵(例如工件的形狀、工件的尺寸及/或材料特性);以及機台性能至少包括速度回路增益、速度回路積分時間常數及/或位置回路增益。驅動器3至少包括有命令接收單元30、斷屑單元32以及路徑規劃單元34。On the other hand, the
在本創作的實施例中,使用者經由上位機2將斷屑加工製程的需求傳給驅動器3。驅動器3的命令接收單元30接收上位機2傳來的加工命令、加工條件及/或機台性能後,命令接收單元30根據加工命令與加工條件中的主軸轉速與進給軸的進給速度計算出移動命令,並將此移動命令傳送至路徑規劃單元34。另外,命令接收單元30接收加工條件中的主軸轉速、進給軸的進給速度、工件的工件特徵及機台性能後將其傳送至斷屑單元32,斷屑單元32根據上述資訊計算出擺動振幅及擺動頻率。其中,擺動振幅是由斷屑單元32根據主軸轉速、進給軸的進給速度、機台性能中的速度回路增益以及速度回路積分常數來計算得到。另一方面,擺動頻率是斷屑單元32根據主軸轉速、進給軸的進給速度、工件特徵及機台性能中的速度回路增益以及速度回路積分常數計算得到。值得注意的是,加工條件中的工件特徵為工件在斷屑加工製程中每一階段的工件特徵。In the embodiment of this creation, the user transmits the demand of the chip breaking processing process to the
於本創作的另一實施例中,斷屑單元32可以根據主軸轉速、進給軸的進給速度、速度回路增益、速度回路積分時間常數與位置回路增益來計算第一擺動振幅以及根據主軸轉速、進給軸的進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算以得到第一擺動頻率。值得注意的是,斷屑單元32將機台性能中的位置回路增益也納入考量用以計算第一擺動振幅與第一擺動頻率實為一種優化方式,可提升斷屑加工製程的穩定性與精準度。In another embodiment of the present creation, the
斷屑單元32將上述計算求得的擺動振幅以及擺動頻率(另一實施例中為第一擺動振幅及第一擺動頻率)傳送至路徑規劃單元34,路徑規劃單元34根據由命令接收單元30所傳送的移動命令以及由斷屑單元32所傳送的擺動振幅以及擺動頻率計算擺動移動命令,使得驅動器3可以根據擺動移動命令驅動各擺動軸41、42…4n,來控制每一個擺動軸41、42…4n對工件(未在圖中表示)進行斷屑加工製程。在此要說明的是,驅動器3可以分別控制各個擺動軸41、42…4n,但是不限制各個擺動軸是否同動,同時也不會限定是哪一個擺動軸來執行斷屑的加工製程,也就是說,在斷屑加工製程中,使用者可以由加工機台所有的移動軸中來選擇擺動軸41、42…4n以對工件進行斷屑加工製程。舉例來說,當加工機台的三個線性軸(x、y及z軸)與三個旋轉軸(a、b及c軸)共6個軸皆可作動時,使用者可由上述6個軸中依照實際加工需求選擇其中幾個軸作為擺動軸41、42…4n。The
於本創作的實施例中,斷屑單元32主要根據機台性能來設定擺動頻率參考區間(也可根據使用者設定),且斷屑單元32將擺動頻率參考區間與先前計算得到的擺動頻率來進行比較,當擺動頻率未包含在擺動頻率參考區間內,斷屑單元32會重新計算另一個包含在擺動頻率參考區間中的擺動頻率。舉例來說,當斷屑單元32計算出的擺動頻率(以擺動頻率f
1稱之)小於擺動頻率參考區間的最小值(以擺動頻率f
A稱之)或大於擺動頻率參考區間的最大值(以擺動頻率f
B稱之)時(即擺動頻率f
1未落入擺動頻率參考區間),斷屑單元32不會直接將計算出的擺動頻率f
1輸出至路徑規劃單元34,而是根據擺動頻率f
A與擺動頻率f
B計算出包含於擺動頻率參考區間的另一個擺動頻率(以擺動頻率f
2稱之),後續斷屑單元32會將擺動頻率f
2輸出至路徑規劃單元34。
In the embodiment of this creation, the
另一方面,斷屑單元32主要根據機台性能來設定擺動振幅參考區間(也可根據使用者設定),且斷屑單元32將先前所計算得到的擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含在擺動振幅參考區間內(即擺動振幅未落入擺動振幅參考區間),斷屑單元32會重新計算另一個包含在擺動振幅參考區間中的擺動振幅。舉例來說,當斷屑單元32計算出的擺動振幅(以擺動振幅h
1稱之)小於擺動振幅參考區間的最小值(以擺動振幅h
A稱之)或大於擺動振幅參考區間的最大值(以擺動振幅h
B稱之)時(即擺動振幅h
1未落入擺動振幅參考區間),斷屑單元32不會直接將計算出的擺動振幅h
1輸出至路徑規劃單元34,而是根據擺動振幅h
A與擺動振幅h
B計算出包含於擺動振幅參考區間的另一個擺動振幅(以擺動振幅h
2稱之),後續斷屑單元32會將擺動振幅h
2輸出至路徑規劃單元34。
On the other hand, the
路徑規劃單元34根據接命令接收單元30傳來的移動命令與斷屑單元32傳來的擺動頻率與擺動振幅計算出擺動移動命令。驅動器3根據路徑規劃單元34計算出的擺動移動命令以控制每一個擺動軸41、42…4n對工件(未在圖中表示)進行斷屑加工製程。The
在本創作的實施例中,驅動器3更包含記憶單元(未在圖中表示),用以儲存加工條件、機台性能、擺動頻率參考區間、擺動振幅參考區間以及公差區間。此外,記憶單元中還儲存有共振頻率區間,當斷屑單元32計算出的擺動頻率(以擺動頻率f
3稱之)包含在預設於驅動器3內的共振頻率區間時(即擺動頻率f
3落入共振頻率區間),則表示擺動軸41、42…4n在進行斷屑加工製程的過程所產生的振動頻率會與機台產生共振,這會造成斷屑加工製程無法順利進行,也容易讓機台以及相關零件因共振而造成損壞。此時,斷屑單元32不會直接將計算出的擺動頻率f
3輸出至路徑規劃單元34,而是避開共振頻率區間中的所有頻率重新計算出擺動頻率f
4,後續斷屑單元32會將擺動頻率f
4輸出至路徑規劃單元34。
In the embodiment of this creation, the
在本創作的一實施例中,在對工件進行斷屑加工製程的過程中會產生斷屑量。當各個擺動軸41、42…4n依據擺動移動命令來對工件進行斷屑加工製程時,所產生的斷屑量若包含在公差區間內,則表示斷屑單元32計算出的擺動頻率與擺動振幅可穩定斷屑。若是斷屑量沒有包含在公差區間內,使用者可依照實際加工情況來決定斷屑單元32是否需重新計算擺動頻率與擺動振幅,使得在不同的單位時間進行的斷屑加工製程所產生的斷屑量都應該包含在公差區間內。在本創作的實施例中,斷屑量可以是重量或是體積。舉例來說,工件在斷屑加工製程中的第一時間會產生第一斷屑量,在第二時間會產生第二斷屑量,當第一斷屑量與第二斷屑量的重量或體積皆包含於公差區間內時,代表目前機台的斷屑效果穩定。In an embodiment of the present invention, the amount of chip breaking occurs during the chip breaking processing process of the workpiece. When each swing axis 41, 42...4n performs chip breaking processing on the workpiece according to the swing movement command, if the amount of chip breaking generated is included in the tolerance interval, it means the swing frequency and swing amplitude calculated by the
在一實施例中,隨著工件的加工時間不同,擺動頻率與擺動振幅也會隨之調整。以工件為安裝於主軸的棒材,且擺動單元為安裝於進給軸的刀具為例,在斷屑加工製程中,刀具會由棒材的外徑表面往棒材圓心的方向進行加工。刀具在第三時間(例如棒材直徑50mm)時,會根據第三擺動振幅與第三擺動頻率對棒材進行斷屑加工製程; 刀具在第四時間(例如棒材直徑40mm)時,會根據第四擺動振幅與第四擺動頻率對棒材進行斷屑加工製程。其中第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,且刀具在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。In one embodiment, as the processing time of the workpiece is different, the swing frequency and swing amplitude are also adjusted accordingly. Taking the workpiece as a bar mounted on the spindle and the swing unit as a tool mounted on the feed axis as an example, in the chip breaking process, the tool is processed from the outer diameter surface of the bar to the center of the bar. When the tool is at the third time (for example, the diameter of the bar is 50mm), it will perform chip-breaking processing on the bar according to the third oscillation amplitude and the third oscillation frequency; when the tool is at the fourth time (for example, the diameter of the bar is 40mm), it will be based on The fourth oscillating amplitude and the fourth oscillating frequency perform chip breaking processing on the bar. The third swing amplitude is greater than the fourth swing amplitude, the third swing frequency is less than the fourth swing frequency, and the third machining distance moved by the tool at the third time is smaller than the fourth machining distance moved at the fourth time.
另外,本創作對於擺動軸在對工件進行斷屑加工製程進行補償。主要是利用路徑規劃單元34來接收各個擺動軸41、42…4n對工件進行斷屑加工製程時的回授值,其中此回授值是由馬達編碼器(未在圖中表示)所產生。接著,路徑規劃單元34根據此回授值與先前由斷屑單元32依據擺動振幅及擺動頻率所計算得到的擺動移動命令進行比較,以得到回授移動命令;緊接著,路徑規劃單元34依據回授移動命令、在下一個單位時間,依據加工命令、加工條件及/或機台性能所計算得到的移動命令(第二移動命令)、擺動振幅(第二擺動振幅)及擺動頻率(第二擺動頻率)來計算出擺動回授移動命令,要說明的是,在下一個單位時間所得到的移動命令所產生的時間點晚於先前所述的使用者透過上位機2於驅動器3的命令接收單元30輸入加工命令、加工條件及機台性能,命令接收單元30根據加工命令計算出的移動命令的時間點。最後,驅動器3依據此擺動回授移動命令來控制至少一個擺動軸或是多個擺動軸來對工件進行斷屑加工製程補償。In addition, this creation compensates for the chip breaking process of the workpiece with the swing axis. The
步驟S52-步驟S62:多軸驅動斷屑控制方法步驟流程 1:多軸驅動斷屑控制系統 2:上位機 3:驅動器 30:命令接收單元 32:斷屑單元 34:路徑規劃單元 41、42、:擺動軸Step S52-Step S62: Multi-axis drive chip breaking control method step flow 1: Multi-axis drive chip breaking control system 2: Host computer 3: drive 30: Command receiving unit 32: Chip breaking unit 34: Path Planning Unit 41, 42,: swing shaft
圖1是根據本創作所揭露的技術,表示多軸驅動斷屑控制方法的步驟流程示意圖。 圖2是根據本創作所揭露的技術,表示多軸驅動斷屑控制系統的方塊示意圖。 Fig. 1 is a schematic diagram showing the steps of a multi-axis drive chip breaking control method according to the technology disclosed in this creation. FIG. 2 is a block diagram of a multi-axis drive chip breaking control system according to the technology disclosed in this creation.
1:多軸驅動斷屑控制系統 1: Multi-axis drive chip breaking control system
2:上位機 2: Host computer
3:驅動器 3: drive
30:命令接收單元 30: Command receiving unit
32:斷屑單元 32: Chip breaking unit
34:路徑規劃單元 34: Path Planning Unit
41、42、4n:擺動軸 41, 42, 4n: swing axis
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