TWI739468B - Chip breaking control system and the control method thereof - Google Patents
Chip breaking control system and the control method thereof Download PDFInfo
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本發明有關於一種數值控制技術領域,特別是關於一種斷屑控制系統及其控制方法。 The present invention relates to the technical field of numerical control, in particular to a chip breaking control system and a control method thereof.
在機床的切削加工製程中,其切屑會纏繞在刀具或工件上,導致刮傷工件或是損壞刀具。因此使用者會根據實際加工情況開啟機床的斷屑加工功能,如此一來可避免產生過長的切屑影響加工品質。 In the cutting process of the machine tool, the chips will be entangled on the tool or workpiece, causing scratches on the workpiece or damage to the tool. Therefore, the user will turn on the chip breaking processing function of the machine tool according to the actual processing situation, so as to avoid the generation of excessively long chips that affect the processing quality.
現有的斷屑切削技術通常會遇到以下問題:(1)需要由使用者根據實際加工參數自行設定至少一組最符合加工情況的參數來進行斷屑切削功能。(2)因為每一台機台剛性具有差異,即使設定相同的加工條件,斷屑的效果也不一定會相同因此,在現有的數值控制裝置無法因應使用者所設定的加工條件、機台剛性自動擺動振幅擺動頻率且精確的控制斷屑品質。 The existing chip-breaking cutting technology usually encounters the following problems: (1) The user needs to set at least one set of parameters most suitable for the processing conditions according to the actual processing parameters to perform the chip-breaking cutting function. (2) Because the rigidity of each machine is different, even if the same processing conditions are set, the effect of chip breaking may not be the same. Therefore, the existing numerical control device cannot respond to the processing conditions and machine rigidity set by the user. Automatic oscillation amplitude oscillation frequency and precise control of chip breaking quality.
為了改善上述問題,本發明主要的目的在於提供一種斷屑控制系統及其控制方法,在數值控制裝置中增加路徑規劃的斷屑功能,使得數值控制裝置可以根據當下的加工條件、機台性能自行計算出擺動振幅與擺動頻率。機台的使用者只需要在使用此功能的加工區間開啟此功能即可,不 需要再設定任何參數,也不需要再依據每一個加工條件或是不同機台來調整斷屑的參數,大幅的提高使用者的操作友善性且精確控制斷屑的品質。 In order to improve the above-mentioned problems, the main purpose of the present invention is to provide a chip breaking control system and its control method. The chip breaking function of path planning is added to the numerical control device, so that the numerical control device can automatically according to the current processing conditions and machine performance. Calculate the swing amplitude and swing frequency. The user of the machine only needs to turn on this function in the processing section where this function is used. It is necessary to set any parameters, and there is no need to adjust the chip breaking parameters according to each processing condition or different machines, which greatly improves the user's operating friendliness and accurately controls the quality of chip breaking.
本發明的另一目的在於提供一種斷屑控制系統及其控制方法,在考慮機台性能的情況下,可以根據不同機台的機台性能進行調整斷屑的參數,因此不會因為一樣的加工參數,但是不一樣的機台,在進行斷屑加工時會導致斷屑不穩定或是機台強烈振動,而影響加工精確度或是加工品質。在考慮加工條件的情況下,可以根據不一樣的主軸轉速、進給速率、棒材直徑參數來進行計算斷屑的參數,以改善因為加工條件的改變而導致斷屑過長,而斷屑纏繞在刀具上的問題,進一步也可以改善機台機械振動、擺動過大造成加工物件的表面光潔度下降的問題。 Another object of the present invention is to provide a chip breaking control system and its control method. In the case of considering the machine performance, the chip breaking parameters can be adjusted according to the machine performance of different machines, so there is no need for the same processing Parameters, but different machines will cause unstable chip breaking or strong vibration of the machine during chip breaking processing, which will affect processing accuracy or processing quality. In the case of considering the processing conditions, the parameters of chip breaking can be calculated according to the different spindle speed, feed rate, and bar diameter parameters, so as to improve the chip breaking caused by the change of processing conditions, and the chip breaking is wound. The problem on the tool can further improve the problem of machine vibration and excessive swing, which cause the surface finish of the processed object to decrease.
根據上述目的,本發明揭露一種斷屑控制系統,包含:控制模組、驅動器及擺動單元,其中驅動器分別與控制模組及擺動單元連接。控制模組包括:命令接收單元、斷屑單元及路徑規劃單元,命令接收單元用以接收至少一個加工命令、至少一個加工條件及至少一個機台性能,且命令接收單元根據加工命令及加工條件計算移動命令;斷屑單元用以接收由命令接收單元所傳送的加工條件及機台性能,且斷屑單元根據加工條件及機台性能計算擺動振幅及擺動頻率;以及路徑規劃單元用以接收由命令接收單元計算得到的移動命令,及接收由斷屑單元計算得到的擺動振幅及擺動頻率,且路徑規劃單元根據移動命令、擺動振幅及擺動頻率計算擺動移動命令。驅動器用以接收由控制模組的路徑規劃單元所傳送的擺動移動命令。 驅動器根據擺動移動命令來控制擺動單元對工件進行斷屑加工製程。 According to the above objective, the present invention discloses a chip breaking control system, including: a control module, a driver, and a swing unit, wherein the driver is respectively connected to the control module and the swing unit. The control module includes: a command receiving unit, a chip breaking unit, and a path planning unit. The command receiving unit is used to receive at least one processing command, at least one processing condition, and at least one machine performance, and the command receiving unit calculates according to the processing command and processing condition Movement command; the chip breaking unit is used to receive the processing conditions and machine performance transmitted by the command receiving unit, and the chip breaking unit calculates the swing amplitude and frequency according to the processing conditions and machine performance; and the path planning unit is used to receive the command The movement command calculated by the receiving unit and the swing amplitude and the swing frequency calculated by the chip breaking unit are received, and the path planning unit calculates the swing movement command according to the movement command, the swing amplitude and the swing frequency. The driver is used for receiving the swing movement command transmitted by the path planning unit of the control module. The driver controls the swing unit to perform chip breaking processing on the workpiece according to the swing movement command.
在本發明的較佳實施例中,斷屑單元根據機台性能設定擺動頻率參考區間,且斷屑單元將擺動頻率參考區間與擺動頻率進行比較,當擺動 頻率未包含在擺動頻率參考區間內,斷屑單元根據此加工條件及機台性能重新計算以得到另一個擺動頻率。 In a preferred embodiment of the present invention, the chip breaking unit sets the swing frequency reference interval according to the machine performance, and the chip breaking unit compares the swing frequency reference interval with the swing frequency. The frequency is not included in the swing frequency reference interval, and the chip breaking unit recalculates according to the processing conditions and machine performance to obtain another swing frequency.
在本發明的較佳實施例中,斷屑單元根據機台性能設定擺動振幅參考區間,且斷屑單元將擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含在擺動振幅參考區間內,斷屑單元根據此加工條件及機台性能重新計算以得到另一個擺動振幅。 In a preferred embodiment of the present invention, the chip breaking unit sets the swing amplitude reference interval according to the machine performance, and the chip breaking unit compares the swing amplitude with the swing amplitude reference interval. When the swing amplitude is not included in the swing amplitude reference interval, The chip breaking unit recalculates according to the processing conditions and machine performance to obtain another swing amplitude.
在本發明的較佳實施例中,控制模組更包含記憶單元用以接收並儲存由使用者所輸入的加工條件及機台性能。 In a preferred embodiment of the present invention, the control module further includes a memory unit for receiving and storing the processing conditions and machine performance input by the user.
在本發明的較佳實施例中,在記憶單元中更包含儲存有至少一個共振頻率區間,當擺動頻率包含此共振頻率區間內,斷屑單元根據加工條件及機台性能重新計算擺動頻率以得到另一個擺動頻率。 In a preferred embodiment of the present invention, the memory unit further includes storing at least one resonance frequency interval. When the oscillation frequency includes the resonance frequency interval, the chip breaking unit recalculates the oscillation frequency according to the processing conditions and machine performance to obtain Another swing frequency.
在本發明的較佳實施例中,斷屑控制系統中的擺動單元與至少一個擺動軸連接,擺動單元包括主軸或是進給軸,且加工條件包括主軸的轉速、進給軸的進給速度與工件的至少一個工件特徵,其中工件特徵包括工件的形狀、尺寸及/或材料特性以及機台性能包括速度回路增益、速度回路積分時間常數及/或位置回路增益。 In a preferred embodiment of the present invention, the swing unit in the chip breaking control system is connected to at least one swing axis, the swing unit includes a spindle or a feed axis, and the processing conditions include the rotation speed of the spindle and the feed speed of the feed axis. At least one feature of the workpiece with the workpiece, where the feature of the workpiece includes the shape, size, and/or material characteristics of the workpiece, and the machine performance includes the speed loop gain, the speed loop integral time constant, and/or the position loop gain.
在本發明的較佳實施例中,斷屑單元根據轉速、進給速度、速度回路增益與速度回路積分時間常數計算擺動振幅,且斷屑單元根據轉速、進給速度、工件特徵、速度回路增益與速度回路積分時間常數計算得到擺動頻率。 In a preferred embodiment of the present invention, the chip breaking unit calculates the swing amplitude according to the speed, feed speed, speed loop gain, and speed loop integral time constant, and the chip breaking unit calculates the swing amplitude according to the speed, feed speed, workpiece characteristics, and speed loop gain. Calculate the swing frequency with the integral time constant of the speed loop.
在本發明的較佳實施例中,斷屑單元更根據轉速、進給速度、速度回路增益、速度回路積分時間常數與位置回路增益計算第一擺動振幅,且斷屑單元更根據轉速、進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動頻率。 In a preferred embodiment of the present invention, the chip breaking unit further calculates the first swing amplitude according to the speed, feed speed, speed loop gain, speed loop integral time constant, and position loop gain, and the chip breaking unit further calculates the first swing amplitude according to the speed and feed speed. Speed, workpiece characteristics, speed loop gain, speed loop integral time constant and position loop gain are calculated to obtain the first swing frequency.
在本發明的較佳實施例中,工件在斷屑加工製程中的第一時間會產生第一斷屑量,在第二時間會產生第二斷屑量,且第一斷屑量與第二斷屑量皆包含在公差區間內。 In a preferred embodiment of the present invention, the workpiece will have a first chip breaking amount at the first time in the chip breaking processing process, and a second chip breaking amount will be generated at the second time, and the first chip breaking amount and the second chip breaking amount The amount of chip breaking is included in the tolerance interval.
在本發明的較佳實施例中,工件在斷屑加工製程中的第三時間根據第三擺動振幅與第三擺動頻率進行斷屑加工製程,且工件在斷屑加工製程中的第四時間根據第四擺動振幅與第四擺動頻率進行斷屑加工製程,且第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,其中擺動單元在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。 In a preferred embodiment of the present invention, the third time of the workpiece in the chip breaking process is performed according to the third oscillation amplitude and the third oscillation frequency, and the fourth time of the workpiece in the chip breaking process is according to The fourth oscillating amplitude and the fourth oscillating frequency are subjected to a chip-breaking processing process, and the third oscillating amplitude is greater than the fourth oscillating amplitude, and the third oscillating frequency is lower than the fourth oscillating frequency. The third processing that the oscillating unit moves at the third time The distance is smaller than the fourth machining distance moved at the fourth time.
在本發明的較佳實施例中,在斷屑控制系統中,路徑規劃單元更包含:接收擺動單元對工件進行斷屑加工製程的回授值;比較回授值與擺動移動命令以產生回授移動命令;根據回授移動命令、第二移動命令、第二擺動振幅與第二擺動頻率計算擺動回授移動命令;以及根據擺動回授移動命令控制擺動單元以對工件進行斷屑加工製程補償,其中移動命令的發生時間點早於第二移動命令的發生時間點。 In a preferred embodiment of the present invention, in the chip breaking control system, the path planning unit further includes: receiving the feedback value of the swing unit for chip breaking processing of the workpiece; comparing the feedback value with the swing movement command to generate feedback Movement command; calculate the swing feedback movement command according to the feedback movement command, the second movement command, the second swing amplitude and the second swing frequency; and control the swing unit according to the swing feedback movement command to compensate the workpiece for chip breaking processing, The occurrence time of the movement command is earlier than the occurrence time of the second movement command.
另外,本發明更揭露一種斷屑控制方法,其步驟包括:在加工區間開啟斷屑加工製程;接收加工命令、至少一個加工條件及至少一個機台性能;根據加工命令與加工條件計算移動命令;根據加工條件及機台性能計算擺動振幅與擺動頻率;根據移動命令、擺動振幅與擺動頻率計算擺動移動命令;以及根據擺動移動命令驅動擺動單元以對工件進行斷屑加工製程。 In addition, the present invention further discloses a chip-breaking control method, the steps of which include: starting a chip-breaking processing process in a processing interval; receiving processing commands, at least one processing condition, and at least one machine performance; calculating a movement command according to the processing commands and processing conditions; Calculate the swing amplitude and swing frequency according to the processing conditions and machine performance; calculate the swing movement command according to the movement command, swing amplitude and swing frequency; and drive the swing unit according to the swing movement command to perform chip breaking processing on the workpiece.
在本發明的較佳實施例中,斷屑控制方法更包括根據機台性能設定擺動頻率參考區間,並將擺動頻率與擺動頻率參考區間進行比較,當擺 動頻率未包含在擺動頻率參考區間內,根據加工條件及機台性能重新計算另一個擺動頻率。 In a preferred embodiment of the present invention, the chip breaking control method further includes setting a swing frequency reference interval according to the performance of the machine, and comparing the swing frequency with the swing frequency reference interval. The dynamic frequency is not included in the reference range of the swing frequency. Recalculate another swing frequency according to the processing conditions and machine performance.
在本發明的較佳實施例中,斷屑控制方法更包括根據機台性能設定擺動振幅參考區間,並將擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含在擺動振幅參考區間內,根據加工條件及機台性能重新計算以得到另一個擺動振幅。 In a preferred embodiment of the present invention, the chip breaking control method further includes setting the swing amplitude reference interval according to the machine performance, and comparing the swing amplitude with the swing amplitude reference interval. When the swing amplitude is not included in the swing amplitude reference interval, Recalculate according to the processing conditions and machine performance to obtain another swing amplitude.
在本發明的較佳實施例中,加工條件與機台性能可由使用者自行輸入或儲存於記憶單元中。 In a preferred embodiment of the present invention, the processing conditions and machine performance can be input by the user or stored in the memory unit.
在本發明的較佳實施例中,斷屑控制方法更包括將至少一個共振頻率區間儲存於記憶單元中,當擺動頻率包含在共振頻率區間內,根據加工條件及機台性能重新計算擺動頻率以得到另一個擺動頻率。 In a preferred embodiment of the present invention, the chip breaking control method further includes storing at least one resonance frequency interval in the memory unit. When the oscillation frequency is included in the resonance frequency interval, the oscillation frequency is recalculated according to the processing conditions and the performance of the machine. Get another swing frequency.
在本發明的較佳實施例中,擺動單元包括主軸或進給軸,且加工條件包括主軸的轉速、進給軸的進給速度與工件的工件特徵,其中工件特徵包括工件的形狀、尺寸及/或至少一個材料特性,擺動單元與擺動軸連接及機台性能包括速度回路增益、速度回路積分時間常數及/或位置回路增益。 In a preferred embodiment of the present invention, the swing unit includes a main shaft or a feed shaft, and the processing conditions include the rotation speed of the main shaft, the feed speed of the feed shaft, and the workpiece features of the workpiece. The workpiece features include the shape, size, and / Or at least one material characteristic, the swing unit is connected with the swing axis and the machine performance includes speed loop gain, speed loop integral time constant and/or position loop gain.
在本發明的較佳實施例中,斷屑控制方法中的擺動振幅是根據轉速、進給速度、速度回路增益與速度回路積分時間常數計算得到及擺動頻率是根據轉速、進給速度、工件特徵、速度回路增益與速度回路積分時間常數計算得到。 In the preferred embodiment of the present invention, the swing amplitude in the chip breaking control method is calculated based on the speed, feed speed, speed loop gain and speed loop integral time constant, and the swing frequency is based on the speed, feed speed, and workpiece characteristics. , Speed loop gain and speed loop integral time constant are calculated.
在本發明的較佳實施例中,斷屑控制方法更包括根據轉速、進給速度、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動振幅,以及根據轉速、進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算得到第一擺動頻率。 In a preferred embodiment of the present invention, the chip breaking control method further includes calculating the first swing amplitude according to the rotation speed, the feed speed, the speed loop gain, the speed loop integral time constant and the position loop gain, and according to the rotation speed and the feed speed. , Workpiece characteristics, speed loop gain, speed loop integral time constant and position loop gain are calculated to get the first swing frequency.
在本發明的較佳實施例中,工件在斷屑加工製程中的第一時間會產生第一斷屑量,以及在第二時間會產生第二斷屑量,且第一斷屑量與第二斷屑量皆包含在公差區間內。 In a preferred embodiment of the present invention, the workpiece will have a first chip breaking amount at the first time in the chip breaking processing process, and a second chip breaking amount will be generated at the second time, and the first chip breaking amount and the second chip breaking amount Both chip breaking amounts are included in the tolerance interval.
在本發明的較佳實施例中,工件在斷屑加工製程中的第三時間根據第三擺動振幅與第三擺動頻率進行斷屑加工製程,且工件在斷屑加工製程中的第四時間根據第四擺動振幅與第四擺動頻率進行斷屑加工製程,且第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,其中擺動單元在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。 In a preferred embodiment of the present invention, the third time of the workpiece in the chip breaking process is performed according to the third oscillation amplitude and the third oscillation frequency, and the fourth time of the workpiece in the chip breaking process is according to The fourth oscillating amplitude and the fourth oscillating frequency are subjected to a chip-breaking processing process, and the third oscillating amplitude is greater than the fourth oscillating amplitude, and the third oscillating frequency is lower than the fourth oscillating frequency. The third processing that the oscillating unit moves at the third time The distance is smaller than the fourth machining distance moved at the fourth time.
在本發明的較佳實施例中,斷屑控制方法更包括以下步驟:接收擺動單元對工件進行斷屑加工製程的回授值;比較回授值與擺動移動命令以產生回授移動命令;根據回授移動命令、第二移動命令、第二擺動振幅與第二擺動頻率計算擺動回授移動命令;以及根據擺動回授移動命令控制擺動單元以對工件進行斷屑加工製程補償,其中移動命令的發生時間點早於第二移動命令的發生時間點。 In a preferred embodiment of the present invention, the chip breaking control method further includes the following steps: receiving the feedback value of the chip breaking processing process performed by the swing unit on the workpiece; comparing the feedback value with the swing movement command to generate the feedback movement command; The feedback movement command, the second movement command, the second oscillation amplitude and the second oscillation frequency are used to calculate the oscillation feedback movement command; and the oscillation unit is controlled according to the oscillation feedback movement command to compensate the workpiece for chip-breaking processing. The occurrence time point is earlier than the occurrence time point of the second movement command.
步驟S10-S20:斷屑控制方法的步驟流程圖 Steps S10-S20: Step-by-step flow chart of chip breaking control method
1:斷屑控制系統 1: Chip breaking control system
2:上位機 2: Host computer
3:控制模組 3: Control module
30:命令接收單元 30: Command receiving unit
32:斷屑單元 32: Chip breaking unit
34:路徑規劃單元 34: Path Planning Unit
36:記憶單元 36: memory unit
4:驅動器 4: drive
5:擺動單元 5: Swing unit
圖1是根據本發明所揭露的技術,表示斷屑控制方法的步驟流程示意圖。 FIG. 1 is a schematic diagram showing the steps of the chip breaking control method according to the technology disclosed in the present invention.
圖2是根據本發明所揭露的技術,表示斷屑控制系統的方塊示意圖。 FIG. 2 is a block diagram of the chip breaking control system according to the technology disclosed in the present invention.
首先請參考圖1。在說明圖1的同時也一併配合圖2來說明,其中圖1是根據本發明所揭露的技術,表示斷屑控制方法的步驟流程圖以及圖2是
表示斷屑控制系統的示意圖。斷屑控制方法其步驟包含:步驟S10:在加工區間開啟斷屑加工製程。於此步驟中,使用者依照實際加工製程需求於上位機2開啟斷屑加工功能。步驟S12:接收加工命令、至少一個加工條件及至少一個機台性能。於此步驟中,控制模組3中的命令接收單元30接收由上位機2傳來的加工命令、至少一個加工條件及至少一個機台性能,而加工命令、加工條件及機台性能的定義將在以下詳細說明。值得注意的是,機台性能可由上位機2獲得,也可以內建於控制模組3的記憶單元36中。
Please refer to Figure 1 first. While describing FIG. 1, it is also explained in conjunction with FIG. 2. Among them, FIG. 1 is a flow chart showing the steps of the chip breaking control method according to the technology disclosed in the present invention, and FIG. 2 is
Represents the schematic diagram of the chip breaking control system. The chip breaking control method includes the following steps: Step S10: Start the chip breaking processing process in the processing interval. In this step, the user turns on the chip breaking processing function on the
接著,步驟S14:根據加工命令與加工條件計算移動命令。於此步驟中,命令接收單元30根據上位所傳來的加工命令與加工條件計算出移動命令。加工機台對工件(未在圖中表示)執行加工製程前,需經由上位機2的加工命令得知工件的加工態樣,例如:切削孔徑大小或是深度等等。步驟S16:根據至少一個加工條件及至少一個機台性能計算擺動振幅與擺動頻率。於此步驟中,由斷屑單元32依據上位機2所傳來的加工條件及機台性能計算出擺動振幅與擺動頻率。在本發明中,機台性能可視為加工機台剛性,主要包括速度回路增益、速度回路積分時間常數及/或位置回路增益等資訊。步驟S18:根據移動命令、擺動振幅與擺動頻率計算擺動移動命令。於此步驟是利用命令接收單元30將移動命令傳送至路徑規劃單元34,擺動振幅與擺動頻率是由斷屑單元32傳送至路徑規劃單元34,再由路徑規劃單元34根據移動命令、擺動振幅與擺動頻率來計算出擺動移動命令。
Next, step S14: Calculate the movement command according to the machining command and the machining condition. In this step, the
最後於步驟S20:根據擺動移動命令驅動擺動單元以對工件進行斷屑加工製程。於此步驟中,控制模組3可以依據步驟S18中,由路徑規劃單元34所計算得到的擺動移動命令來驅動驅動器4來控制擺動單元5對工件(未在圖中表示)進行斷屑加工製程。針對上述的上位機2、驅動器3、命令接收單元30、斷屑單元32及路徑規劃單元34的功能於後詳細說明。
Finally, in step S20: drive the swing unit according to the swing movement command to perform chip breaking processing on the workpiece. In this step, the
接著請參考圖2。圖2是表示斷屑控制系統的示意圖。斷屑控制系統1至少包含:上位機2、控制模組3、驅動器4及擺動單元5,其中控制模組3分別與上位機2及驅動器4連接,驅動器4與擺動單元5連接,並由驅動器4來驅動擺動單元5。在本發明的實施例中,上位機2可以是加工機台(未在圖中表示)控制器、桌上型電腦、筆記型電腦、智慧型手機或遠端伺服器等裝置,且上位機2與控制模組3透過有線或是無線方式連接。
Then please refer to Figure 2. Fig. 2 is a schematic diagram showing a chip breaking control system. The chip
控制模組3至少包括命令接收單元30、斷屑單元32、路徑規劃單元34及記憶單元36,其中命令接收單元30接收由上位機2所傳來的加工命令、加工條件及機台性能,命令接收單元30根據加工命令與加工條件計算移動命令,其中加工條件包括主軸的轉速及進給軸的進給速度,並且將計算得到的移動命令傳送至路徑規劃單元34。另外,命令接收單元30將加工條件中的主軸的轉速、進給軸的進給速度、工件的至少一個工件特徵及機台性能傳送至斷屑單元32。在本發明中,加工命令指的是工件的加工態樣,也就是使用者要將工件加工成什麼形態。工件的工件特徵包括工件的形狀、尺寸及/或材料特性;機台性能包括速度回路增益、速度回路積分時間常數及/或位置回路增益。
The
斷屑單元32,接收由命令接收單元30所傳送的加工條件中的主軸的轉速、進給軸的進給速度、工件的至少一個工件特徵及機台性能來計算擺動單元5的擺動振幅及擺動頻率。其中,擺動振幅是由斷屑單元32依據主軸的轉速、進給軸的進給速度、機台性能中的速度回路增益以及速度回路積分常數計算得到。另外,擺動頻率是斷屑單元32根據主軸的轉速、進給軸的進給速度、工件特徵及機台性能中的速度回路增益與速度回路積分時間常數計算得到。值得注意的是,加工條件中的工件特徵為工件在斷屑加工製程中每一階段的工件特徵。
The
於本發明的另一實施例中,斷屑單元32可以根據主軸的轉速、進給軸的進給速度、速度回路增益、速度回路增益、速度回路積分時間常數與位置回路增益來計算第一擺動振幅;另外,斷屑單元32根據主軸的轉速、進給軸的進給速度、工件特徵、速度回路增益、速度回路積分時間常數與位置回路增益計算以得到第一擺動頻率。值得注意的是,在本發明的實施例中,斷屑單元32將機台性能中的位置回路增益也納入考量用以計算第一擺動振幅與第一擺動頻率實為一種優化方式,可提升斷屑加工製程的穩定性與精準度。
In another embodiment of the present invention, the
接著,斷屑單元32將上述計算所得到的擺動振幅及擺動頻率傳送至路徑規劃單元34,路徑規劃單元34根據由命令傳送單元30所傳送的移動命令及由斷屑單元所傳送的擺動振幅及擺動頻率來計算出擺動移動命令。
於另一實施例中,斷屑單元32將第一擺動振幅及第一擺動頻率傳送至路徑規劃單元34,同樣的,路徑規劃單元34根據由命令傳送單元30所傳送的移動命令及由斷屑單元所傳送的第一擺動振幅及第一擺動頻率來計算得到第一擺動移動命令,使得驅動器4接收由控制模組3中的路徑規劃單元34所傳送的擺動移動命令(或第一擺動移動命令),並且依據此擺動移動命令(或第一擺動移動命令)來控制擺動單元5對工件(未在圖中表示)進行斷屑加工製程。
Then, the
於本發明的實施例中,斷屑單元32主要根據機台性能來設定擺動頻率參考區間,於另一實施例中亦可以由使用者來設定擺動頻率參考區間。接著,斷屑單元32將擺動頻率參考區間與先前計算得到的擺動頻率來進行比較,當擺動頻率未包含在擺動頻率參考區間內,斷屑單元32會重新計算另一個包含在擺動頻率參考區間內的擺動頻率。舉例來說,當斷屑單元32計算出的擺動頻率(以擺動頻率f1稱之)小於擺動頻率參考區間的最小
值(以擺動頻率fA稱之)或大於擺動頻率參考區間的最大值(以擺動頻率fB稱之)時,即擺動頻率f1未落入擺動頻率參考區間,則斷屑單元32不會直接將計算出的擺動頻率f1輸出至路徑規劃單元34,而是根據擺動頻率fA與擺動頻率fB計算出包含在擺動頻率參考區間內的另一個擺動頻率(以擺動頻率f2稱之),後續斷屑單元32會將擺動頻率f2輸出至路徑規劃單元34。
In the embodiment of the present invention, the
另一方面,斷屑單元32主要根據機台性能來設定擺動振幅參考區間,於另一實施例中亦可以由使用者來設定。斷屑單元32將先前所計算所得到的擺動振幅與擺動振幅參考區間進行比較,當擺動振幅未包含在擺動振幅參考區間內(即擺動振幅未落入擺動振幅參考區間),斷屑單元32會重新計算另一個包含在擺動振幅參考區間內的擺動振幅。舉例來說,當斷屑單元32計算出的擺動振幅(以擺動振幅h1稱之)小於擺動振幅參考區間的最小值(以擺動振幅hA稱之)或大於擺動振幅參考區間的最大值(以擺動振幅hB稱之)時,即擺動振幅h1未落入擺動振幅參考區間內,則斷屑單元32不會直接將計算出的擺動振幅h1輸出至路徑規劃單元34,而是根據擺動振幅hA與擺動振幅hB計算出包含在擺動振幅參考區間內的另一個擺動振幅(以擺動振幅h2稱之),後續斷屑單元32會將擺動振幅h2輸出至路徑規劃單元34。
On the other hand, the
路徑規劃單元34根據接命令接收單元30傳來的移動命令與斷屑單元32傳來的擺動頻率與擺動振幅計算出擺動移動命令。驅動器3根據路徑規劃單元34計算出的擺動移動命令以控制擺動單元5進行斷屑加工製程。
The
擺動單元5包括主軸(未在圖中表示)或進給軸(未在圖中表示),當擺動單元為進給軸(依照實際加工流程對應於刀具或是工件)時,進給軸可於x、y或z軸中的任一軸進行擺動。其中,進給軸可依照實際加工流程於x、y或z軸中的任一軸進行擺動而在加工過程中進行斷屑。舉例來說,當加工流程為直線斷屑時,進給軸可於x、y或z軸的其中任一軸擺動用以斷屑。於另
一實施例中,同樣的,當加工流程為斜線或圓弧時,進給軸可於x、y或z軸中的任一軸擺動進行斷屑加工製程。
The
在另一實施例中,當擺動單元5為主軸(依照實際加工流程對應刀具或工件)時,主軸可於a、b或c軸中的任一軸進行擺動,其中,主軸可依照實際加工流程於a、b或c軸中的任一軸擺動用以斷屑。於一實施例中,當加工流程為直線斷屑時,主軸可於a、b或c軸中的任一軸擺動用以斷屑;於又一實施例中,當加工流程為斜線或圓弧時,主軸同樣可於a、b或c軸中的任一軸擺動進行斷屑加工製程。
In another embodiment, when the
在本發明的實施例中,控制模組3更包含記憶單元36,用以儲存由使用者或是由上位機2所輸入的加工條件及機台性能,以及斷屑單元32根據機台性能所設定的擺動頻率參考區間、擺動振幅參考區間以及公差區間。
此外,記憶單元36中還儲存有共振頻率區間,當斷屑單元32計算出的擺動頻率(以擺動頻率f3稱之)包含在預設的共振頻率區間時(即擺動頻率f3落入共振頻率區間),則表示擺動單元5在進行斷屑加工製程的過程所產生的振動頻率會與機台(未在圖中表示)產生共振,這會造成斷屑加工製程無法順利進行,也容易讓機台(未在圖中表示)以及相關零件因共振而造成損壞。此時,斷屑單元32不會直接將計算出的擺動頻率f3輸出至路徑規劃單元34,而是避開共振頻率區間中的所有頻率重新計算出擺動頻率f4,後續斷屑單元32會將擺動頻率f4輸出至路徑規劃單元34。
In the embodiment of the present invention, the
在本發明的一實施例中,在對工件進行斷屑加工製程的過程中會產生斷屑量。當驅動器4依據擺動移動命令驅動擺動單元5來對工件進行斷屑加工製程時,所產生的斷屑量若包含在公差區間內,則表示斷屑單元32計算出的擺動頻率與擺動振幅可穩定斷屑。若是斷屑量沒有包含在公差區間內,使用者可依照實際加工情況來決定斷屑單元32是否需重新計算擺動
頻率與擺動振幅,使得在不同的單位時間進行的斷屑加工製程所產生的斷屑量都需應該包含在公差區間內。在本發明的實施例中,斷屑量可以是重量或是體積。舉例來說,工件在斷屑加工製程中的第一時間會產生第一斷屑量,在第二時間會產生第二斷屑量,當第一斷屑量與第二斷屑量的重量或體積皆包含在公差區間內時,代表目前機台(未在圖中表示)的斷屑效果穩定。
In an embodiment of the present invention, the amount of chip breakage is generated during the chip breaking process of the workpiece. When the
在一實施例中,隨著工件的加工時間不同,擺動頻率與擺動振幅也會隨之調整。以工件為安裝於主軸的棒材,且擺動單元為安裝於進給軸的刀具為例,在斷屑加工製程中,刀具會由棒材的外徑表面往棒材圓心的方向進行加工。刀具在第三時間(例如棒材直徑50mm)時,會根據第三擺動振幅與第三擺動頻率對棒材進行斷屑加工製程;刀具在第四時間(例如棒材直徑40mm)時,會根據第四擺動振幅與第四擺動頻率對棒材進行斷屑加工製程。其中第三擺動振幅大於第四擺動振幅,第三擺動頻率小於第四擺動頻率,且刀具在第三時間時所移動的第三加工距離小於在第四時間時所移動的第四加工距離。 In one embodiment, as the processing time of the workpiece is different, the swing frequency and swing amplitude are also adjusted accordingly. Taking the workpiece as a bar mounted on the spindle and the swing unit as a tool mounted on the feed axis as an example, in the chip breaking process, the tool will be processed from the outer diameter surface of the bar to the center of the bar. When the tool is at the third time (for example, the bar diameter is 50mm), it will perform chip breaking processing on the bar according to the third oscillation amplitude and the third oscillation frequency; when the tool is at the fourth time (for example, the bar diameter is 40mm), it will be processed according to The fourth oscillating amplitude and the fourth oscillating frequency perform a chip breaking processing process on the bar. The third swing amplitude is greater than the fourth swing amplitude, the third swing frequency is less than the fourth swing frequency, and the third machining distance moved by the tool at the third time is smaller than the fourth machining distance moved at the fourth time.
另外,本發明對於擺動單元5在對工件進行斷屑加工製程進行補償。主要是利用路徑規劃單元34來接收擺動單元5對工件(未在圖中表示)進行斷屑加工製程時的回授值,其中此回授值是由馬達編碼器(未在圖中表示)所產生。接著,路徑規劃單元34根據此回授值與先前由斷屑單元32依據擺動振幅及擺動頻率所計算得到的擺動移動命令進行比較,以得到回授移動命令;緊接著,路徑規劃單元34依據此回授移動命令、在下一個單位時間,依據加工命令、加工條件及機台性能所計算得到的移動命令(第二移動命令)、擺動振幅(第二擺動振幅)及擺動頻率(第二擺動頻率)來計算出擺動回授移動命令,要說明的是,在下一個單位時間所得到的移動命令所產生的時
間點晚於先前所述的使用者透過上位機2於控制模組3的命令接收單元30所輸入的加工命令、加工條件及機台性能,命令接收單元30根據加工命令計算出的移動命令的時間點。最後,控制模組3依據此擺動回授移動命令來控制擺動單元5來對工件(未在圖中表示)進行斷屑加工製程補償。
In addition, the present invention compensates for the chip breaking processing process performed on the workpiece by the
1:斷屑控制系統 1: Chip breaking control system
2:上位機 2: Host computer
3:控制模組 3: Control module
30:命令接收單元 30: Command receiving unit
32:斷屑單元 32: Chip breaking unit
34:路徑規劃單元 34: Path Planning Unit
36:記憶單元 36: memory unit
4:驅動器 4: drive
5:擺動單元 5: Swing unit
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