TWM600028U - Laser module - Google Patents

Abstract

A laser module includes a heat dissipation base, a laser element, a temperature sensor, a kina diode and a first imaging lens. The laser element is fixed in the heat dissipation base and can emit a laser beam, and the light emitting direction of the laser element is perpendicular to the die attach direction of the laser element. The laser beam emitted by the laser element can be emitted outward through the first imaging lens to form a side-emitting type. The temperature sensor can be a temperature coefficient thermistor (NTC), and the temperature sensor can be used to detect the temperature of the laser module to compensate for the optical power. The Kina diode can be used to provide electrostatic protection.

Description

Laser module

This creation relates to a packaging structure, in particular to a laser module.

The traditional can-type (Transistor Outline-Can, TO-CAN) package type laser module has slow processing speed, high processing cost, manual plug-in, large volume, and need to cut feet, which causes inconvenience in use. Furthermore, when the existing laser module is actually used, the optical power is reduced due to the increase in temperature, and it is easily damaged by static electricity.

The technical problem to be solved by this creation is to provide a laser module in view of the shortcomings of the existing technology, which has fast processing speed, low processing cost, SMD type, small size, does not need to cut feet, and is more convenient to use.

The technical problem to be solved by this creation is to provide a laser module in view of the shortcomings of the prior art, which can be used to detect the temperature of the laser module to compensate for the optical power.

The technical problem to be solved by this creation is to provide a laser module for the deficiencies of the prior art, which can be used to provide static electricity protection.

In order to solve the above technical problems, the present invention provides a laser module, including: a heat dissipation base, a accommodating space is formed in the heat dissipation base, one side of the heat dissipation base has an opening, and the opening is connected to the housing. The radiating base is in communication with a fixed surface, the fixed surface is adjacent to the accommodating space, the radiating base has an electrode layer, the electrode layer is located on the other side of the radiating base, the electrode layer is exposed Outside the heat dissipation base, the electrode layer and the opening are located on two adjacent sides of the heat dissipation base; a laser element, the laser element is arranged in the accommodating space of the heat dissipation base, the laser element Is electrically connected to the electrode layer; a first imaging lens, the first imaging lens is arranged opposite to the opening of the heat dissipation base, the laser element can emit an output laser beam and pass through the opening of the heat dissipation base and the first An imaging lens is projected outwards to form a side-emitting type; and a temperature sensor arranged in the accommodating space of the heat dissipation base, and the temperature sensor is fixed on the fixing surface of the heat dissipation base, The temperature sensor is electrically connected to the electrode layer, and the temperature sensor can be used to detect the temperature of the laser module to compensate for the optical power.

In order to solve the above technical problems, the present creation also provides a laser module, including: a heat dissipation base forming an accommodation space in the heat dissipation base, one side of the heat dissipation base has an opening, the opening and the The accommodating space is connected, a fixing surface is formed in the heat dissipation base, and the fixing surface is adjacent to the accommodating space. The heat dissipation base has an electrode layer located on the other side of the heat dissipation base. Exposed to the outside of the heat dissipation base, the electrode layer and the opening are located on the two adjacent sides of the heat dissipation base; a laser element, the laser element is arranged in the accommodating space of the heat dissipation base, the laser The element is electrically connected to the electrode layer; a first imaging lens, the first imaging lens is arranged opposite to the opening of the heat dissipation base, the laser element can emit an output laser beam and pass through the opening of the heat dissipation base and the The first imaging lens is projected outward to form a side-emitting type; and an electrostatic protection element, the electrostatic protection element is arranged in the accommodating space of the heat dissipation base, the electrostatic protection element is electrically connected to the electrode layer, the electrostatic The protective element can be used to provide electrostatic protection.

The beneficial effect of this creation is that in the laser module provided by this creation, the heat dissipation base has an electrode layer, the electrode layer and the opening are located on the adjacent two sides of the heat dissipation base, and the laser beam emitted by the laser element can pass The opening on one side of the heat dissipation base and the first imaging lens are imaged and then projected out. It has the characteristics of edge-light packaging, and the arrangement of the electrode layer can form an SMD-type laser module with fast processing speed and processing cost. Low, SMD capable, small size, no need to cut feet, more convenient to use. Furthermore, this creation is equipped with a temperature sensor, which can be used to detect the temperature of the laser module to compensate for the optical power. In addition, this creation is equipped with electrostatic protection components, which can be used to provide electrostatic protection functions.

In order to have a better understanding of the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, not to limit this creation.

The following are specific specific examples to illustrate the implementation manners disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following embodiments will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIG. 1, this creation provides a laser module including a heat dissipation base 1, a laser element 2, a temperature sensor 3 and a first imaging lens 4.

The heat dissipation base 1 includes a ceramic substrate, a plastic leaded chip carrier (PLCC) or a circuit board, etc. The type of the heat dissipation base 1 is not limited. An accommodating space 11 is formed in the heat dissipating base 1, and one side (side) of the heat dissipating base 1 has an opening 12 which communicates with the accommodating space 11. A fixing surface 13 is formed in the heat dissipation base 1, the fixing surface 13 is adjacent to the accommodating space 11, and the fixing surface 13 and the opening 12 are located on two adjacent sides of the accommodating space 11. The heat sink base 1 further has an electrode layer 14 which is a conductor and is made of conductive material. The electrode layer 14 is located on the other side (bottom side) of the heat sink base 1, and the electrode layer 14 is exposed to the heat sink. Outside the base 1, the electrode layer 14 and the opening 12 are located on the adjacent two sides of the heat dissipation base 1, that is, the electrode layer 14 and the opening 12 can be located on the two adjacent and perpendicular sides of the heat dissipation base 1. The arrangement of the electrode layer 14 enables the creation of an SMD type laser module.

The laser element (laser diode) 2 may be a side-fired laser element. The laser element 2 is arranged in the accommodating space 11 of the heat dissipation base 1, and the laser element 2 is electrically connected to the electrode layer 14. In this embodiment, a carrier board 5 is fixed on the fixing surface 13 of the heat dissipation base 1, and the laser element 2 is fixed on the carrier board 5 so that the laser element 2 is arranged on the heat dissipation base 1 through the carrier board 5的容空间11。 In the housing space 11. The laser element 2 can emit an output laser beam from one side, and radiate out through the opening 12 of the heat dissipation base 1 to form a side-emitting type. The light-emitting direction A of the laser element 2 is perpendicular to the die-bonding direction B of the laser element 2, and the die-bonding direction B refers to the direction when the laser element 2 is fixed (bonded) to the carrier 5. In the final manufacturing process, gel may also be filled in the accommodating space 11 of the heat dissipation base 1 to cover all the components.

The first imaging lens 4 can be a focusing lens, a wave lens, or a cylindrical lens. The structure and number of the first imaging lens 4 are not limited. In this embodiment, the first imaging lens 4 is a focusing lens. The first imaging lens 4 is disposed opposite to the opening 12 of the heat dissipation base 1, and the first imaging lens 4 can be fixed in the accommodation space 11 of the heat dissipation base 1.

Therefore, when the laser beam is emitted outward through the opening 12 of the heat dissipation base 1, the laser beam can be imaged (focused) by the first imaging lens 4 to form a predetermined shape of light. For example, after the laser beam passes through the first imaging lens 4, the laser beam can be focused or formed into a linear shape, so as to emit horizontal or vertical linear light.

The temperature sensor 3 can be a temperature coefficient thermistor (Negative Temperature Coefficient; NTC), the temperature sensor 3 is disposed in the accommodating space 11 of the heat dissipation base 1, and the temperature sensor 3 can be fixed on the heat dissipation base 1 The temperature sensor 3 is electrically connected to the electrode layer 14 on the fixing surface 13 or other positions. The temperature sensor 3 can be used to detect the temperature of the laser module, and adjust the temperature and current of the laser element 2 according to the information of the temperature sensor 3 to compensate the optical power to achieve a stable optical power output.

[Second Embodiment]

Please refer to FIG. 2. In this embodiment, the laser module further includes an electrostatic protection element 6. The electrostatic protection element 6 may be a Zener Diode, and the electrostatic protection element 6 is disposed on a heat dissipation base. In the accommodating space 11 of the base 1, the static electricity protection element 6 can be fixed on the fixing surface 13 of the heat dissipation base 1 or other positions, the static electricity protection element 6 is electrically connected to the electrode layer 14, and the static electricity protection element 6 can Used to provide electrostatic protection. Furthermore, in another embodiment, the temperature sensor 3 can also be omitted, and only the electrostatic protection element 6 is provided, that is, the temperature sensor 3 and the electrostatic protection element 6 can be installed separately or together.

[Third and Fourth Embodiments]

Please refer to FIGS. 3 and 4, the laser module of this embodiment, which is roughly the same as the above embodiment, includes a heat dissipation base 1, a laser element 2, a temperature sensor 3, and a first imaging lens 4. The only difference is that the laser module of this embodiment also includes a second imaging lens 7, which can be a wave lens, and the second imaging lens 7 is arranged opposite to the opening 12 of the heat dissipation base 1. Therefore, when the laser element 2 emits an output laser beam, the laser beam can be emitted through the first imaging lens 4 and the second imaging lens 7 in sequence, and the laser beam can be emitted horizontally or vertically through the second imaging lens 7 Linear light. The structure and number of the creative imaging lenses are not limited, and can be increased or decreased as needed.

In this embodiment (as shown in FIGS. 3 and 4), the temperature sensor 3 is disposed in the accommodating space 11 of the heat dissipation base 1, and the temperature sensor 3 can be fixed on the fixing surface 13 of the heat dissipation base 1. The temperature sensor 3 is electrically connected to the electrode layer 14 at upper or other locations. The temperature sensor 3 can be used to detect the temperature of the laser module, and adjust the temperature and current of the laser element 2 according to the information of the temperature sensor 3 to compensate the optical power to achieve a stable optical power output.

In this embodiment (as shown in FIG. 4), the static electricity protection element 6 is disposed in the accommodating space 11 of the heat dissipation base 1, and the static electricity protection element 6 can be fixed on the fixing surface 13 of the heat dissipation base 1 or other The electrostatic protection element 6 is electrically connected to the electrode layer 14 at the position of, and the electrostatic protection element 6 can be used to provide an electrostatic protection function. The temperature sensor 3 and the electrostatic protection element 6 can be arranged separately or together.

[Beneficial effects of the embodiment]

The beneficial effect of this creation is that in the laser module provided by this creation, the heat dissipation base has an electrode layer, the electrode layer and the opening are located on the two adjacent sides of the heat dissipation base, and the light emitting direction of the laser element is consistent with that of the laser element. The die attaching direction of the laser element is vertical, and the laser beam emitted by the laser element can pass through the opening on the side of the heat dissipation base and the first and second imaging lenses to be imaged. It has the characteristics of edge-light packaging and the electrode layer The setting of SMD type laser module can be formed with fast processing speed, low processing cost, SMD printing, small size, no need to cut feet, and more convenient use. Furthermore, this creation is equipped with a temperature sensor, which can be used to detect the temperature of the laser module to compensate for the optical power. In addition, this creation is equipped with electrostatic protection components, which can be used to provide electrostatic protection functions.

The content disclosed above is only a preferred and feasible embodiment of the creation, and does not limit the scope of the patent application for this creation. Therefore, all equivalent technical changes made using the creation specification and schematic content are included in the application for this creation. Within the scope of the patent.

1: cooling base 11: Housing space 12: opening 13: fixed surface 14: Electrode layer 2: Laser component 3: Temperature sensor 4: The first imaging lens 5: Carrier board 6: Electrostatic protection components 7: The second imaging lens A: Light emitting direction B: Bonding direction

Fig. 1 is a schematic diagram of the laser module of the first embodiment of creation.

Figure 2 is a schematic diagram of the laser module according to the second embodiment of the creation.

FIG. 3 is a schematic diagram of the laser module according to the third embodiment of the creation.

Fig. 4 is a schematic diagram of the laser module according to the fourth embodiment of the creation.

1: cooling base

11: Housing space

12: opening

13: fixed surface

14: Electrode layer

2: Laser component

3: Temperature sensor

4: The first imaging lens

5: Carrier board

A: Light emitting direction

B: Bonding direction

Claims (10)

A laser module includes: A heat dissipation base forming an accommodating space in the heat dissipation base, an opening on one side of the heat dissipation base, the opening communicating with the accommodating space, a fixing surface formed in the heat dissipation base, and the fixing surface Adjacent to the accommodating space, the heat dissipation base has an electrode layer, the electrode layer is located on the other side of the heat dissipation base, the electrode layer is exposed outside the heat dissipation base, and the electrode layer and the opening are located on the heat dissipation base Adjacent sides; A laser element, the laser element is arranged in the accommodating space of the heat dissipation base, and the laser element is electrically connected to the electrode layer; A first imaging lens, the first imaging lens is arranged opposite to the opening of the heat dissipation base, and the laser element can emit an output laser beam and exit through the opening of the heat dissipation base and the first imaging lens to Form a side-emitting type; and A temperature sensor, the temperature sensor is arranged in the accommodating space of the heat dissipation base, the temperature sensor is fixed on the fixing surface of the heat dissipation base, the temperature sensor is electrically connected to the electrode layer, and the temperature The sensor can be used to detect the temperature of the laser module to compensate for the optical power. The laser module according to claim 1, wherein the electrode layer and the opening are located on two adjacent and perpendicular sides of the heat dissipation base. The laser module according to claim 1, wherein the laser element is a side-fired laser element, a carrier plate is fixed on the fixing surface of the heat dissipation base, the laser element is fixed on the carrier plate, and the The light-emitting direction of the laser element is perpendicular to the die-bonding direction of the laser element, and the die-bonding direction refers to the direction when the laser element is fixed to the carrier. The laser module according to claim 1, wherein the temperature sensor is a temperature coefficient thermistor. The laser module according to claim 1, which further includes a second imaging lens, the second imaging lens is arranged opposite to the opening of the heat dissipation base, and when the laser element emits an output laser beam, it can be The sequence is emitted outward through the first imaging lens and the second imaging lens. A laser module includes: A heat dissipation base forming an accommodating space in the heat dissipation base, an opening on one side of the heat dissipation base, the opening communicating with the accommodating space, a fixing surface formed in the heat dissipation base, and the fixing surface Adjacent to the accommodating space, the heat dissipation base has an electrode layer, the electrode layer is located on the other side of the heat dissipation base, the electrode layer is exposed outside the heat dissipation base, the electrode layer and the opening are located on the heat dissipation base Adjacent sides; A laser element, the laser element is arranged in the accommodating space of the heat dissipation base, and the laser element is electrically connected to the electrode layer; A first imaging lens, the first imaging lens is arranged opposite to the opening of the heat dissipation base, and the laser element can emit an output laser beam and emits outward through the opening of the heat dissipation base and the first imaging lens to Form a side-emitting type; and An electrostatic protection element, the electrostatic protection element is arranged in the accommodating space of the heat dissipation base, the electrostatic protection element is electrically connected to the electrode layer, and the electrostatic protection element can be used to provide an electrostatic protection function. The laser module according to claim 6, wherein the electrode layer and the opening are located on two adjacent and perpendicular sides of the heat dissipation base. The laser module according to claim 6, wherein the laser element is a side-fired laser element, a carrier plate is fixed on the fixing surface of the heat dissipation base, the laser element is fixed on the carrier plate, and the The light-emitting direction of the laser element is perpendicular to the die-bonding direction of the laser element, and the die-bonding direction refers to the direction when the laser element is fixed to the carrier. The laser module according to claim 6, wherein the electrostatic protection element is a Kina diode. The laser module according to claim 6, which further includes a second imaging lens, the second imaging lens is arranged opposite to the opening of the heat dissipation base, and when the laser element emits an output laser beam, it can The sequence is emitted outward through the first imaging lens and the second imaging lens.

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