TWM598019U - Infrared thermal imaging device for detecting processing error of printed circuit board - Google Patents

Abstract

An infrared thermal image detection printed circuit board manufacturing process error device includes an infrared camera, an infrared window (IR Window), a flat plate and a heater. The infrared window is arranged above the infrared camera. The flat panel is arranged above the infrared window. The heater is arranged above the plate. A test sample can be placed between the infrared window and the flat panel. The heater generates heat energy, which is absorbed by the plate and test sample to increase the temperature. An infrared camera can capture infrared light images, and the infrared light image can be processed to convert the infrared light image of each pixel into the corresponding temperature of each pixel.

Description

Infrared thermal image detection printed circuit board manufacturing process error device

This creation is related to an infrared thermal image detection device for printed circuit board manufacturing process errors.

Flexible Printed Circuit Board (FPCB), also known as FPCB, has the characteristics of lightness, thinness, bending resistance, low voltage, and low power consumption. It is currently widely used in consumer electronics, communication products, computer equipment, Automobile, military and other fields.

Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional structure diagram of a flexible printed circuit board. The flexible printed circuit board 100 includes a flexible substrate 10 and a cover layer 20. The flexible substrate 10 is a flexible copper clad laminate (FCCL) 13 and a flexible insulating base material 11 that are first attached via an adhesive 12 and then pressed together, and then subjected to processing processes such as etching, and finally the required copper circuit is left As an electronic signal transmission medium. The cover film 20 is composed of a flexible insulating substrate 22 and an adhesive 21, and its main function is to prevent oxidation of the copper circuit and protect the copper circuit from environmental temperature and humidity.

The cover film is usually automatically attached by a machine. Sometimes more than one layer of the cover film may be attached to the surface of the flexible substrate, causing the flexible printed circuit board to be unable to bend or the circuit to be blocked, making the flexible printed circuit board to be reworked or scrapped, which increases production costs . The traditional contact scanning method to detect the number of cover film layers often takes a lot of time and is not economical.

In view of this, the main purpose of this creation is to provide an infrared thermal imaging device for detecting printed circuit board manufacturing process errors, which can detect the number of cover film layers of flexible printed circuit boards in a non-contact manner, which can greatly reduce the inspection time and reduce production costs.

The infrared thermal image detection device for printed circuit board manufacturing process error of this creation includes an infrared camera, an infrared window (IR Window), a flat plate and a heater. The infrared window is arranged above the infrared camera. The flat panel is arranged above the infrared window. The heater is arranged above the plate. A test sample can be placed between the infrared window and the flat panel. The heater generates heat energy, which is absorbed by the plate and test sample to increase the temperature. An infrared camera can capture infrared light images, and the infrared light image can be processed to convert the infrared light image of each pixel into the corresponding temperature of each pixel.

The IR Window only allows Mid-wavelength Infrared (MWIR) to pass through.

Among them, the heater can heat the plate and the test sample up to about 100°C.

The material of the plate can be stainless steel, copper or silicon carbide (SiC).

The material of the infrared window can be zinc sulfide (ZnSe), germanium (Ge) or silicon (Si).

The infrared camera can be moved to adjust the vertical distance between the infrared camera and the test sample or the flat panel to capture clear infrared light images.

The infrared window can be moved, the plate can be moved, or the infrared window and the plate can be moved simultaneously to adjust the vertical distance between the infrared window and the plate, so that the test sample is pressed by the infrared window and the plate.

The resolution of the infrared camera is 1024x1024 pixels or 2048x2048 pixels Prime.

The test sample may be a flexible printed circuit board (FPCB, Flexible Printed Circuit Board).

In order to make the above-mentioned purpose, features, and advantages of this creation more obvious and understandable, the following will specifically describe the preferred embodiments in conjunction with the accompanying drawings.

100: Flexible printed circuit board

10: Flexible substrate

11: Flexible insulating substrate

12: Adhesive

13: Flexible copper foil substrate

20: Cover film

21: Adhesive

22: Flexible insulating substrate

200: Infrared thermal image detection printed circuit board process error device

110: Infrared camera

120: infrared window

130: tablet

140: heater

150: flexible printed circuit board

Figure 1 is a schematic cross-sectional structure diagram of a flexible printed circuit board.

FIG. 2 is a schematic diagram of an embodiment of an apparatus for detecting PCB manufacturing process errors based on the infrared thermal image of the present invention.

Figure 3 is a schematic diagram of the infrared thermal image detection printed circuit board manufacturing process error device of this creation to detect flexible printed circuit boards.

Please refer to Figure 2. Figure 2 is a schematic diagram of an embodiment of the device for detecting printed circuit board manufacturing process errors with infrared thermal images of this invention. The infrared thermal image detection printed circuit board process error device 200 includes an infrared camera 110, an infrared window 120, a flat plate 130 and a heater 140. The infrared window 120 is disposed above the infrared camera 110. The flat plate 130 is disposed above the infrared window 120. The heater 140 is disposed above the plate 130. A test sample (not shown) can be placed between the infrared window 120 and the flat plate 130, and the test sample can be a flexible printed circuit board (FPCB, Flexible Printed Circuit Board). The heater 140 can generate heat energy and be absorbed by the flat plate 130 and the test sample, so that the flat plate 130 and the test sample are heated up to about 100°C. IR Window only allows mid-wavelength infrared (Mid-wavelength Infrared, MWIR) passed. The infrared camera 110 can move to adjust the vertical distance between the infrared camera 110 and the test sample or the flat plate 130 to capture a clear infrared light image. After the infrared light image is processed, the infrared light image of each pixel can be converted into each The corresponding temperature of the pixel.

The process of measuring the flexible printed circuit board by the infrared thermal image detection printed circuit board manufacturing process error device will be explained in further detail below.

Please refer to Figure 2 again. First, turn on the power switch (not shown) of the heater 140 for heating, so that the temperature of the plate 130 rises to about 100°C, and then use the infrared camera 110 to take an infrared image of the plate 130. After the image is analyzed, the starting temperature T ₀ of each pixel can be obtained, and the starting temperature of each pixel can correspond to the starting temperature of each area on the surface of the flat plate 130.

Please refer to Figure 3. Next, a flexible printed circuit board 150 is placed between the infrared window 120 and the flat plate 130 so that the cover film (not shown) of the flexible printed circuit board 150 faces the infrared camera 110, and the infrared camera 110 photographs the cover film (not shown) An infrared image. After the infrared image is analyzed, the final temperature T ₁ of each pixel can be obtained. The final temperature of each pixel can correspond to the final temperature of each area on the surface of the cover film (not shown). Finally, analyze and process the temperature difference △T (△T=T ₁ -T ₀ ) to determine the number of layers of the cover film.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the scope of the attached patent application.

200: Infrared thermal image detection printed circuit board process error device

110: Infrared camera

120: infrared window

130: tablet

140: heater

Claims (9)

An infrared thermal image detection device for printed circuit board manufacturing process errors, including: An infrared camera An infrared window (IR Window), the infrared window is arranged above the infrared camera; A flat plate which is arranged above the infrared window; and A heater, the heater is arranged above the plate; A test sample can be placed between the infrared window and the plate; The heater can generate heat energy, which is absorbed by the plate and the test sample to increase the temperature; The infrared camera can capture an infrared light image, and the infrared light image can be processed to convert the infrared light image of each pixel into the corresponding temperature of each pixel. As described in the first item of the scope of the patent application, the infrared thermal image detection printed circuit board process error device, wherein the infrared window (IR Window) only allows mid-wavelength infrared (Mid-wavelength Infrared, MWIR) to pass. As described in the first item of the scope of patent application, the infrared thermal image detection printed circuit board manufacturing process error device, wherein the heater can heat the plate and the test sample up to about 100°C. As described in the first item of the scope of the patent application, the infrared thermal image detection printed circuit board manufacturing process error device, wherein the material of the flat plate can be stainless steel, copper or silicon carbide (SiC). In the infrared thermal image detection printed circuit board process error device described in the first item of the patent application, the material of the infrared window can be zinc sulfide (ZnSe), germanium (Ge) or silicon (Si). As described in the first item of the scope of patent application, the infrared thermal image detection printed circuit board process error device, wherein the infrared camera can be moved to adjust the vertical distance between the infrared camera and the test sample or the flat plate to capture the clear infrared Light image. For example, the infrared thermal image detection printed circuit board process error device described in the first item of the patent application, wherein the infrared window can be moved, the plate can be moved, or the infrared window and the plate can be moved at the same time to adjust the infrared window to the A vertical distance of the flat plate enables the test sample to be pressed together by the infrared window and the flat plate. As described in the first item of the scope of patent application, the infrared thermal image detection printed circuit board process error device, wherein the infrared camera has a resolution of 1024x1024 pixels or 2048x2048 pixels. As described in the first item of the scope of patent application, the infrared thermal image detection printed circuit board manufacturing process error device, wherein the test sample can be a flexible printed circuit board (FPCB, Flexible Printed Circuit Board).

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