KR102626352B1 - Method and device for inspecting defect on substrate - Google Patents

Abstract

The present invention relates to a method and device for inspecting defects on a carrier substrate in the manufacture of a film touch sensor, and specifically relates to (a) a substrate and a laminate including an organic layer or an inorganic layer provided on one side of the substrate. A step of irradiating light on the two long sides; (b) obtaining a surface image by photographing two opposing long sides of the laminate using a line scan method; and (c) detecting defects from the surface image, wherein the long side of the surface image captured by the line scan method is on the substrate forming an angle in the range of 30° to 60° with respect to the long side direction of the laminate. It relates to defect inspection methods.

Description

Method and apparatus for inspecting defects on a substrate {METHOD AND DEVICE FOR INSPECTING DEFECT ON SUBSTRATE}

The present invention relates to a method and apparatus for inspecting defects on a substrate, such as a method and apparatus for inspecting defects on a carrier substrate in the manufacture of film touch sensors.

As the touch input method receives attention as a next-generation input method, attempts are being made to introduce the touch input method to a wider variety of electronic devices. Accordingly, research and development on touch sensors that can be applied to a variety of environments and enable accurate touch recognition is also being actively conducted. I'm losing.

Recently, on the carrier substrate 1a, it can function as a coating layer that covers the electrode pattern layer 4a after being separated from the carrier substrate 1a, or as a protective layer to protect the electrode pattern layer from external contact. A separation layer (3a) forming step of forming a separation layer (3a); An electrode pattern layer (4a) forming step of forming an electrode pattern layer (4a) including a sensing electrode and a pad electrode on the separation layer (3a); An insulating layer forming step of forming an insulating layer on the electrode pattern layer (4a); A base film attachment step of attaching a base film on the insulating layer; and a carrier substrate (1a) removal step of separating the separation layer (3a) from the carrier substrate (1a). A method of manufacturing a film touch sensor has been proposed.

Referring to FIGS. 1A to 1D, since it may be difficult to protect the electrode pattern against contact or impact from the outside with only the separation layer 3a, the separation layer 3a was formed on the carrier substrate 1a. Afterwards, a protective layer (2a) is formed on the upper part of the separation layer (3a), which can play a role in suppressing the occurrence of cracks due to differences in stress relieving ability, and then the area corresponding to the portion where the pad electrode is to be formed is formed. By removing part of the protective layer (2a), an electrode pattern layer (4a) is formed on the protective layer (2a) and the exposed separation layer (3a). At this time, the peeling of substrates such as wiring and the protective layer is smooth. If this does not proceed, a problem may occur where part of the metal wiring and the substrate remain on the surface of the substrate, and a problem may occur where the organic material used as a peeling material bleeds onto the surface of the wiring and substrate, so that the upper part of the carrier substrate 1a There is a need for an inspection method and device capable of inspecting the long-side boundary of the protective film of the separation layer 3a.

Republic of Korea Patent Publication No. 2013-0086801 relates to “multi-layer display panel inspection device and method”. Specifically, surface images are obtained by photographing a display panel with a multi-layer structure, and the camera focal length of the inspection imaging unit is determined based on the basic base distance. Using , the second to nth layers of the display panel are distinguished, the surface image of each layer is obtained, and each surface image is analyzed to determine whether defects or foreign substances are located on the X and Y axes and in which layer. Discloses information regarding a multi-layer display panel inspection device for discrimination.

However, the inspection device and method of the above document are insufficient to solve the problem that the long-side protective layer boundary is not detected due to scattering of light emitted from the light source.

Republic of Korea Patent Publication No. 2013-0086801 (2013.08.05.)

The present invention is intended to solve the above problems, and its purpose is to provide a method and device for inspecting defects on the long-side organic layer or inorganic layer interface of a laminate, specifically, a carrier substrate in the manufacture of a film touch sensor.

The present invention includes the steps of (a) irradiating light to two opposing long sides of a laminate including a substrate and an organic layer or an inorganic layer provided on one side of the substrate; (b) obtaining a surface image by photographing two opposing long sides of the laminate using a line scan method; and (c) detecting defects from the surface image, wherein the long side of the surface image captured by the line scan method is on the substrate forming an angle in the range of 30° to 60° with respect to the long side direction of the laminate. The purpose is to provide a defect inspection method.

In addition, the present invention provides a first image acquisition unit and a second image acquisition unit for obtaining a surface image by photographing the two long sides of a laminate including a substrate and an organic layer or an inorganic layer provided on one side of the substrate using a line scan method. An image acquisition unit including a unit; And a first light source and a second light source for irradiating light to two opposing long sides of the laminate; wherein the first image acquisition unit and the second image acquisition unit are respectively disposed on two opposing long sides of the laminate. However, the object is to provide a defect inspection device on a substrate arranged so that the long side of the surface image captured by the line scan method forms an angle in the range of 30° to 60° with respect to the long side direction of the laminate.

The method for inspecting defects on a substrate according to the present invention has the advantage of being able to inspect the long side of a laminate, specifically, the long side of a defect on a carrier substrate in the manufacture of a film touch sensor.

In addition, the defect inspection device on the substrate according to the present invention is capable of inspecting defects on the long side of the laminate, specifically the carrier substrate in the manufacture of the film touch sensor, so it is easy to transmit process defect information after monitoring the defective product, and the carrier There is an advantage in reducing inspection time because continuous inspection is possible without the need to stop the inspection device or rotate the carrier substrate to inspect the long side of the substrate.

1A to 1D are diagrams showing an example of a conventional film touch sensor manufacturing process.
Figure 2 is a perspective view of a defect inspection device on a substrate according to an embodiment of the present invention.
3 is a plan view of a defect inspection device on a substrate according to an embodiment of the present invention.
4 is a side view of an inspection device on a substrate according to one embodiment of the present invention.
Figures 5a and 5b are diagrams illustrating a case where the image acquisition unit and the light source according to an embodiment of the present invention are arranged with respect to the long side of the laminate.
Figure 6 is a diagram illustrating a light emitting unit of a light source according to an embodiment of the present invention.
Figure 7 is a diagram illustrating the boundary between the protective layer and a glass substrate from which part of the protective layer has been peeled off.
Figure 8 is a diagram showing a surface image.

Hereinafter, the present invention will be described in more detail.

In the present invention, when a member is said to be located “on” another member, this includes not only the case where a member is in contact with another member, but also the case where another member exists between the two members.

In the present invention, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components, unless specifically stated to the contrary.

In the present invention, the image acquisition unit may refer to the first image acquisition unit 10 and the second image acquisition unit 20, and may further include the third image acquisition unit 50. In addition, in the present invention, the light source may refer to the first light source 30 and the second light source 40, and may further include the third light source 60.

The present invention includes the steps of (a) irradiating light to two opposing long sides of a laminate including a substrate (1) and an organic or inorganic layer (2) provided on one side of the substrate (1); (b) obtaining a surface image by photographing two opposing long sides of the laminate using a line scan method; And (c) detecting defects from the surface image, wherein the long side of the surface image captured by the line scan method is a substrate ( 1) It relates to a method of inspecting defects on an image.

The laminate according to the present invention includes a substrate (1) and an organic or inorganic layer (2) provided on one side of the substrate (1), and functional layers commonly applied in the industry depending on the purpose of the laminate are used. More may be included. For example, when the laminate is included in a film touch sensor, the substrate 1 may be a base film, and the organic layer or inorganic layer 2 implements the film touch sensor, such as a separation layer or an electrode pattern layer. It may be any one configuration, but is not limited to this.

In one embodiment of the present invention, the substrate 1 may be a carrier substrate. When the substrate 1 is a carrier substrate, the organic layer or inorganic layer 2 may be a protective layer, and a separation layer to facilitate peeling between the substrate 1 and the organic layer or inorganic layer 2 is provided. Additional information may be included, but is not limited thereto.

In short, the defect inspection method and inspection device on the substrate 1 according to the present invention can inspect the long side of the display panel, such as a film touch sensor, and inspect defects before bonding components such as the protective layer required to manufacture the display panel. , specifically, defects on the carrier substrate in the manufacture of the film touch sensor may be inspected.

Hereinafter, the defect inspection method and device on the substrate 1 of the present invention will be described in more detail with reference to the drawings.

FIG. 2 is a perspective view of a defect inspection device on a substrate 1 according to an embodiment of the present invention, and FIG. 3 is a top view of the device for inspecting defects on the substrate 1. 2 and 3, the defect inspection device on the substrate 1 has the first image acquisition unit 10 and the second image acquisition unit 20 each photographing two opposing long sides of the laminate to be inspected using a line scan method. A surface image is obtained, and the long side of the surface image taken by the line scan method has an angle in the range of 30° to 60°, preferably an angle in the range of 40° to 50°, more preferably, with respect to the long side direction of the laminate. It is arranged to form an angle of 45°. In short, the first image acquisition unit 10 and the second image acquisition unit 20 are arranged to form an angle in the range of 30° to 60° with respect to the two opposing long sides of the laminate. Specifically, the laminate allows inspection of the long side of the organic layer or inorganic layer 2 constituting the laminate, and the organic layer or inorganic layer 2 is preferably a protective layer. In this case, the substrate 1 is It is preferable that it is a carrier substrate. Referring to Figure 2, the laminate may be supplied in the form of a protective layer laminated on a carrier substrate. In this case, the carrier substrate is preferably a glass substrate, but is not limited to this and other substrates can also be used as the carrier substrate. This is possible. However, a material with heat resistance that is not deformed even at high temperatures, that is, can maintain flatness, is desirable so as to withstand the process temperature during electrode formation.

More specifically, the defect inspection method on the substrate 1 according to the present invention includes the steps of irradiating light to two opposing long sides of the laminate; Obtaining a surface image by photographing two opposing long sides of the laminate using a line scan method; It is possible to detect defects by performing a step of detecting defects using the surface image.

In the present invention, the surface image includes the long side of the entire laminate; Long sides of the organic layer or inorganic layer (2), the base material, etc., such as the protective layer, which constitute the laminate; Alternatively, it may be a surface image of the long side of another configuration that is laminated on the laminate and is parallel to the long side of the laminate. For example, referring to FIG. 7, the surface image may be a surface image of the boundary portion of the organic layer or inorganic layer 2 of the laminate, and more specifically, the protective layer formed on the carrier substrate. The inside of the protective layer may contain wiring, and the protective layer may have a portion of the area in contact with the carrier substrate peeled off, and the remaining protective layer may be peeled off from the carrier substrate in a later process to form another layer. Can be bonded to a substrate.

The boundary portion may refer to the dotted line portion of FIG. 7 .

The method and device for inspecting defects on the substrate 1 according to the present invention has the advantage of being able to inspect the long sides of components such as the protective layer necessary for manufacturing a display panel, and thus enabling delivery of process defect information after monitoring defective products before bonding. .

The defect inspection method on the substrate 1 according to the present invention includes the step of irradiating light to two opposing long sides of the laminate.

Figure 5a shows an example in which the first light source 30 or the second light source 40 according to some embodiments of the present invention is disposed on the laminate, and Figure 5b shows the first image acquisition unit 10 or the second light source 40. An example in which the image acquisition unit 20 is disposed with respect to the laminate is shown. Specifically, when an arbitrary axis parallel to the long side and an arbitrary axis parallel to the short side of the laminate to be inspected are positioned on the same plane, the first light source 30 or the second light source 30 is applied to an arbitrary axis in the long side direction. 2 The light source 40, the first image acquisition unit 10 or the second image acquisition unit 20 may be rotated and arranged in the range of 30° to 60°.

The first light source 30 or the second light source 40, the first image acquisition unit 10 or the second light source 30 so that the long side of the surface image according to the present invention forms an angle within the range with respect to the long side direction of the laminate. By arranging the image acquisition unit 20, the defect inspection device on the substrate 1 according to the present invention can inspect defects near the long side of the laminate, specifically defects at the border of the protective layer.

Conventionally, since the image acquisition unit was located on the short side of the object to be inspected, the object to be inspected had to be rotated in order to inspect the long side of the object to be inspected. To this end, the step of stopping the inspection device or rotating the object to be inspected was performed. Because it was additionally included, there was a problem of increased inspection time.

However, the defect inspection device on the substrate 1 according to the present invention has the advantage of significantly reducing inspection time because there is no need to rotate the laminate or stop the inspection device. In addition, before applying to a display panel such as a film touch sensor, it is possible to easily inspect the border of the protective layer for damage such as protruding or tearing, so it is possible to transmit information about defects to the post-process. , this has the advantage of being able to predict film yield and defective products in advance.

Light according to the present invention is irradiated to two opposing long sides of the laminate through the first light source 30 and the second light source 40, respectively. Referring to FIG. 6, the first light source 30 and the second light source 40 include a light emitting unit with a long side of 30 mm to 50 mm and a short side of 3 mm to 7 mm, and emits a band-shaped light through the light emitting unit. Light may be irradiated from the bottom of the laminate toward the top. At this time, the lower part of the laminate may refer to the side closer to the substrate 1 on which the organic layer or the inorganic layer 2 is not formed. In the case of Figure 6, the length of the long side of the light emitting part is 40 mm and the length of the short side is 5 mm, but it is not limited to this as long as it satisfies the above range.

When inspecting the laminate with a conventional inspection device, especially the boundary between the substrate 1 from which part of the organic layer or inorganic layer 2 has been peeled as shown in FIG. 7 and the organic layer or inorganic layer 2 from which a part of the organic layer or inorganic layer 2 has not been peeled, the light source When photographing the boundary between the substrate 1 and the organic layer or inorganic layer 2 to be inspected using an image acquisition unit due to scattering of light, there was a problem in that the boundary was covered by light in the captured image.

However, since the light according to the present invention is in the form of a band with a long side of 30 mm to 50 mm and a short side of 3 mm to 7 mm, it blocks light coming from the surroundings and prevents scattering of light from the light source, creating a surface image. When obtained, it is possible to prevent the conventional problem, especially the phenomenon of the boundary between the substrate 1 from which part of the organic layer or inorganic layer 2 has been peeled off and the organic layer or inorganic layer 2 being obscured by light.

The long side of the light may form an angle in the range of 30° to 60°, preferably an angle in the range of 40° to 50°, and more preferably an angle of 45° with respect to the long side direction of the laminate, and the light is irradiated The first light source 30 and the second light source 40 may be positioned to face the first image acquisition unit 10 and the second image acquisition unit 20, respectively, with the laminate interposed therebetween. For example, when the light source is located at the top of the laminate, the image acquisition unit may be located at the bottom of the laminate, and when the light source is located at the bottom of the laminate, the image acquisition unit may be located at the top of the laminate. can be located

However, in the case of inspection before bonding of the laminate, for example, to inspect the long side of the boundary portion of the partially peeled protective layer formed on the carrier substrate, the light source is located below the protective layer to be inspected, as shown in FIG. 4, The image acquisition unit is located on top of the protective layer to be inspected. Figure 4 shows a side view of a defect inspection device on a substrate 1 according to an embodiment of the present invention, wherein the light source is located below the protective layer to be inspected, and the image acquisition unit observes the boundary surface of the protective layer. It must be located on top of the protective layer so that the boundary portion of the protective layer can be observed by the image acquisition unit.

In the case where the laminate according to the present invention includes a protective layer formed on the carrier substrate, in other words, the object to be inspected with the defect inspection device on the substrate 1 according to the present invention is the organic layer or inorganic layer 2 formed on the carrier substrate. In the case of a boundary portion, a step of removing part of the organic layer or inorganic layer 2 to expose the substrate 1 by partially removing the organic layer or inorganic layer 2 may be further included.

Specifically, the organic layer or the inorganic layer 2 may be a protective layer, and more specifically, the protective layer may include at least one of an organic insulating film and an inorganic insulating film. The protective layer may be formed through coating and curing methods or deposition, but is not limited thereto.

The protective layer may be formed by partially removing the portion where the pad electrode will be formed by a method such as patterning, or by applying the layer excluding the portion where the pad electrode will be formed. When a separation layer is formed between the protective layer and the carrier substrate, the protective layer may preferably be formed so that the separation layer is exposed.

The area in contact between the organic layer or inorganic layer (2) and the substrate (1) according to the present invention may be less than 100% of the total area of the substrate (1), but is not limited to this, but the organic layer or inorganic layer (2) The protective layer formed on the carrier substrate has the advantage that the circuit board and the pad electrode can be smoothly connected when connecting the circuit board.

The long side of the light may refer to the long side of the light emitting part. In short, the first light source 30 and the second light source 40 of the present invention are configured so that the long side of the light emitting part forms an angle in the above range with respect to the long side direction of the laminate. can be placed.

The first light source 30 and the second light source 40 have the same range as the first image acquisition unit 10 and the second image acquisition unit 20, which are positioned oppositely with respect to the laminate. Arrangement to form an angle is most desirable for detecting a surface image, but is not limited thereto as long as it satisfies the above range.

For example, when the first image acquisition unit 10 is arranged so that the long side of the surface image captured by the line scan method forms an angle of 45° with respect to the long side direction of the laminate, the first image acquisition unit 10 The long side of the light emitting part of the first light source 30 opposite to may be arranged to form an angle of 45° with respect to the long side direction of the laminate.

The line scan method refers to running a strip-shaped body, such as a laminate, display panel, film, or other sheet-shaped material according to the present invention in one direction, and continuously taking images one line at a time from above the strip-shaped body. It refers to the method of obtaining.

The defect inspection method on the substrate 1 according to the present invention includes a third image acquisition unit 50 that acquires a surface image by photographing the short side of the laminate using a line scan method; and a third light source 60 that irradiates light to a short side of the laminate.

The defect inspection method on the substrate 1 according to the present invention may include obtaining a surface image by photographing two opposing long sides of the laminate using a line scan method, and the third light source is provided on the short side of the laminate. (60) irradiates light from the top or bottom of the third image acquisition unit 50, and the third image acquisition unit 50 photographs the short side direction of the laminate using a line scan method to obtain a surface image. By doing so, inspection of both the short side and the long side of the laminate is possible.

In short, the long side of the laminate is inspected using the first image acquisition unit 10 and the second image acquisition unit 20, and the short side of the laminate is inspected using the third image acquisition unit 50. By inspecting, it is possible to continuously inspect the laminate to be inspected without rotating the laminate or stopping the inspection device.

The light source according to the present invention, that is, the first light source 30, the second light source 40, and the third light source 60, inspects defects on a display panel or carrier substrate such as a film touch sensor to be inspected in the art. There is no limitation on the type of light source used for this purpose, but for example, white condensed lighting with a light quantity of about 200,000 Lux is preferable for detecting surface images. However, the white light of the first light source 30 and the second light source 40 must have a band shape as described above.

The image acquisition unit is preferably capable of acquiring a surface image of a color image, and may be a CCD camera or another two-dimensional camera, but is not limited thereto.

The laminate is photographed while being transported to a point where the surface image of the image acquisition unit is detected. By continuously performing imaging as the laminate is transported, it is possible to inspect the entire area of the laminate. Figures 3 and 4 illustrate the direction in which the laminate is introduced.

A defect inspection device on a substrate (1) according to the present invention includes an encoder that generates an imaging period signal of the image acquisition unit from the moving speed of the laminate; And it may further include a control unit that receives a shooting cycle signal from the encoder and detects defects in the captured image.

Specifically, the encoder generates a shooting cycle signal of the image acquisition unit according to the transfer speed of the laminate. Since the shooting time of the image acquisition unit is determined according to the shooting cycle signal of the encoder, the signal generation time of the encoder can be set according to the desired shooting interval. Preferably, the surface image can be obtained by generating a photographing period signal so that there are no overlapping parts of the laminate.

More preferably, the imaging cycle signal generated from the encoder is generated so that there are no overlapping or missing parts with respect to the laminate, so that a surface image of the entire area of the laminate can be obtained.

The control unit transmits the shooting cycle signal generated by the encoder to the image acquisition unit to capture a surface image, and detects defects in the laminate through the surface image acquired by the image acquisition unit, such as the protective layer on the carrier substrate. Detect defects at the boundaries of . In particular, the defect inspection device on the substrate 1 according to the present invention is a surface image of the long side of the laminate obtained by the first image acquisition unit 10 and the second image acquisition unit 20, for example, the protective layer. Defects at the interface between a partially peeled glass substrate and the protective layer can be detected.

Detection of the defect can be performed in the same manner as a conventional detection method using a computer program. The surface image of the inspection device on the substrate 1 obtained according to the present invention shows the long side of the laminate, especially the boundary surface of the glass substrate from which the protective layer has been peeled, more clearly, so the detection accuracy of defects can be greatly increased. there is.

Hereinafter, examples will be given in detail to explain the present specification in detail. However, the embodiments according to the present specification may be modified into various other forms, and the scope of the present specification is not to be construed as being limited to the embodiments described in detail below. The embodiments of this specification are provided to more completely explain the present specification to those with average knowledge in the art. In addition, "%" and "part" indicating content below are based on weight, unless otherwise specified.

Test example

The image acquisition unit and light source of the inspection device on the substrate were arranged so that the long side of the surface image captured by line scanning formed the angle shown in Table 1 below with respect to the long side of the protective layer formed on the carrier substrate to be inspected. The surface image of the glass substrate and the protective layer from which part of the edge protective layer was peeled off was obtained using an inspection device on the substrate, and the surface image acquired through the first image acquisition unit is shown in Table 1 below.

Comparative Example 1 Example 1 Example 2 Example 3 Video acquisition department 0° 30° 45° 60° light source 0° 30° 45° 60° surface image Figure 8 a) Figure 8 b) Figure 8 c) Figure 8 d)

As can be seen in Table 1 above, when the image acquisition unit and the light source form an angle in the range of 30° to 60° with respect to the long side of the protective layer formed on the carrier substrate, the glass substrate and the protective layer from which part of the edge protective layer has been peeled off It was found that the boundary was clearly detected.

1: substrate
2: Organic layer or inorganic layer
1a: carrier substrate
2a: protective layer
3a: separation layer
4a: electrode pattern layer
10: First image acquisition unit
20: Second image acquisition unit
30: first light source
40: second light source
50: Third image acquisition unit
60: Third light source

Claims (17)

(a) irradiating light through a light source to two opposing long sides of a laminate including a substrate and a protective layer including an organic layer or an inorganic layer provided on one side of the substrate;
(b) acquiring a surface image by photographing two opposing long sides of the laminate using a line scan method through an image acquisition unit disposed on the laminate;
(c) detecting defects from the surface image; and
(d) removing a portion of the organic layer or inorganic layer to expose the substrate,
The light source and the image acquisition unit are arranged to face each other in a planar direction with a boundary between the substrate and the protective layer of the laminate, and the image acquisition unit overlaps the boundary in the planar direction,
The planar direction is defined as a direction perpendicular to the long and short sides of the laminate,
A defect inspection method on a substrate, wherein the long side of the surface image captured by the line scan method forms an angle in the range of 30° to 60° with respect to the long side direction of the laminate. According to paragraph 1,
A defect inspection method on a substrate, wherein the long side of the surface image captured by the line scan method forms an angle in the range of 40° to 50° with respect to the long side direction of the laminate. According to paragraph 1,
A method for inspecting defects on a substrate, wherein the light is in the form of a band with a long side of 30 mm to 50 mm and a short side of 3 mm to 7 mm. According to paragraph 3,
A defect inspection method on a substrate, wherein the long side of the light forms an angle in the range of 30° to 60° with respect to the long side direction of the laminate. delete According to paragraph 1,
A defect inspection method on a substrate, wherein the light is irradiated from the bottom of the laminate toward the top. According to paragraph 1,
Irradiating light to a short side of the laminate; and
A defect inspection method on a substrate further comprising: acquiring a surface image by photographing a short side of the laminate using a line scan method. According to paragraph 1,
A method of inspecting defects on a substrate, wherein the substrate is a carrier substrate. A first image acquisition unit and a second image acquisition unit that acquire a surface image by photographing two long sides of a laminate including a substrate and a protective layer including an organic layer or an inorganic layer provided on one side of the substrate using a line scan method. An image acquisition unit including a unit; and
A light source including a first light source and a second light source that irradiates light to two opposing long sides of the laminate,
A portion of the organic layer or inorganic layer is removed to expose the substrate on the one side,
The light source and the image acquisition unit are arranged to face each other in a planar direction with a boundary between the substrate and the protective layer of the laminate, and the image acquisition unit overlaps the boundary in the planar direction,
The planar direction is defined as a direction perpendicular to the long and short sides of the laminate,
The first image acquisition unit and the second image acquisition unit are respectively disposed on two opposing long sides of the laminate, and the long side of the surface image captured by the line scan method is 30° to 60 degrees with respect to the long side direction of the laminate. A defect inspection device on a substrate positioned at an angle in the range of °. According to clause 9,
The first image acquisition unit and the second image acquisition unit are each disposed on two opposing long sides of the laminate, and the long side of the surface image captured by the line scan method is 40° to 50 degrees with respect to the long side direction of the laminate. A defect inspection device on a substrate arranged to form an angle in the range of °. According to clause 9,
The first light source and the second light source include a light emitting unit having a long side of 30 mm to 50 mm and a short side of 3 mm to 7 mm. According to clause 11,
The first light source and the second light source are arranged so that the long side of the light emitting part forms an angle in the range of 30° to 60° with respect to the long side direction of the laminate. According to clause 9,
a third image acquisition unit that acquires a surface image by photographing a short side of the laminate using a line scan method; and
A defect inspection device on a substrate further comprising a third light source that irradiates light to a short side of the laminate. According to clause 9,
An encoder that generates a shooting cycle signal of the image acquisition unit from the moving speed of the laminate; and
A control unit that receives a shooting cycle signal from the encoder, transmits a shooting signal to the image acquisition unit, and detects defects in the surface image received from the image acquisition unit. According to clause 9,
A defect inspection device on a substrate, wherein the area in contact between the organic layer or the inorganic layer and the substrate is less than 100% of the total area of the substrate. According to clause 9,
A defect inspection device on a substrate, wherein the substrate is a carrier substrate. According to clause 9,
A defect inspection device on a substrate, wherein the organic layer or the inorganic layer is a protective layer.

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