TWM595562U - Diamond arranging device of diamond conditioner - Google Patents

Abstract

This creation is a diamond arrangement and arrangement device of a diamond arrangement, which includes a arrangement plate, which is provided with a plurality of diamond accommodation grooves. The diamond accommodation groove may be a round diamond accommodation groove or an oval diamond accommodation groove And, the opening size of each diamond containing groove is smaller than the diameter of the diamond. When the diamond falls into the diamond containing groove, the sharp end of the diamond can face outward. This creation uses a special diamond receiving slot design, which can effectively organize diamonds, so that when the diamond is set in the diamond organizer, the sharp surface can be exposed outside the diamond organizer, which can prevent the plane of the diamond from being exposed to the diamond organizer and affecting the diamond. The cutting rate of the finisher.

Description

Diamond arrangement and arrangement device of diamond arrangement

This creation relates to a technique for making diamond sorters, especially a diamond sorting and sorting device that can sort diamonds arranged on the diamond sorter.

Chemical-Mechanical Planarization (CMP) is a technique commonly used in semiconductor manufacturing processes. Chemical-mechanical planarization uses mechanical force and chemical etching to planarize the surface of wafers or other semiconductor devices during processing deal with.

In the chemical mechanical planarization process of semiconductors, a common technique is to use a pad to contact the surface of the wafer or other semiconductor devices to polish the wafer or other semiconductor devices by mechanical force. It is also used with chemical etching slurry (Slurry) to remove impurities or uneven structures on the surface of wafers or other semiconductor devices through chemical reactions and physical mechanical forces.

The cutting rate of the diamond sorter will change with the angle and density of the diamond arrangement. Therefore, in order to improve the cutting rate of the diamond sorter, the angle and density of the diamond arrangement on the diamond sorter are very important, but In the past, when making a diamond sorter, there was no effective way to make the exposed surface of the diamond on the diamond sorter. As a result, the finished product of the diamond sorter may have the risk of most diamonds facing out. This way of setting the diamond not only affects the diamond finishing The cutting rate of the tool, and the diamond is also easy to fall off from the diamond sorter. When the quality of the diamond finisher is poor, it also affects the quality of subsequent polished wafers or other semiconductors. Therefore, whether the quality of the diamond finisher is good has a profound impact on the yield of wafers or other semiconductors. It is also a very important part for the semiconductor industry.

In view of this, this creation proposes a diamond arrangement and arrangement device for a diamond organizer in order to effectively overcome the aforementioned problems in view of the lack of the above-mentioned conventional technology.

The main purpose of this creation is to provide a diamond arrangement and arrangement device for a diamond organizer, which uses a special diamond accommodating groove design to effectively arrange the diamond's arrangement angle. When the diamond is set in the diamond organizer, the sharp surfaces of all diamonds are It can be exposed to the diamond finisher to improve the cutting rate of the diamond finisher.

Another purpose of this creation is to provide a diamond arrangement and arrangement device for a diamond organizer, which can effectively arrange the arrangement angle of the diamonds, to avoid the diamond plane being exposed outside the diamond arrangement when the diamond is arranged in the diamond arrangement, and to reduce the diamond arrangement The cutting rate of the device.

In order to achieve the above purpose, the present invention provides a diamond arrangement and arrangement device for a diamond arrangement, which includes a arrangement plate, which is provided with a plurality of diamond accommodation slots, each diamond accommodation slot can accommodate one diamond separately, and The opening size of each diamond containing groove must be smaller than the diameter of the diamond.

The plural diamond accommodating grooves may be round diamond accommodating grooves or oval diamond accommodating grooves.

The finishing board is a steel finishing board.

In order to make your reviewer have a better understanding and understanding of the structural characteristics and the achieved effect of this creation, I would like to use the preferred embodiment drawings and detailed explanations as follows.

This creation is a diamond arrangement and arrangement device of a diamond organizer, which can be used to arrange the installation angle of diamonds, so that when the diamond is set in the diamond organizer, all the sharp surfaces of the diamonds can face outwards to enhance the cutting of the diamond organizer The rate is relatively helpful to improve the yield of subsequent wafer or other semiconductor production.

Please refer to the first figure to explain in detail the structure of the diamond arrangement and arrangement device 1 of the diamond organizer. As shown in the figure, the structure of the diamond arrangement and arrangement device 1 of the diamond arrangement includes a arrangement plate 10, which may be steel arrangement Plate, the finishing plate 10 is provided with a plurality of diamond accommodating grooves 12 for accommodating diamonds (not shown), the opening size of each diamond accommodating groove 12 is smaller than the diameter of the diamond, and the plurality of diamond accommodating The groove 12 is a round diamond accommodating groove or an oval diamond accommodating groove. The edges of the diamond accommodating groove 12 are all rounded, without any right-angled diamond accommodating groove 12.

The structure of the diamond accommodating groove 12 can make the sharp surface of the diamond face outward, except that the size of the opening is smaller than the diameter of the diamond, so that the diamond can be snapped into the opening of the diamond accommodating groove 12, and the diamond accommodating groove 12 is The round diamond accommodating groove or oval diamond accommodating groove has rounded edges and no right angle design. Since the diamonds set in the diamond sorter are usually hexahedral, octahedral or tetrahedral diamonds, the matching diamond receiving groove 12 is a design without corners, which can avoid hexahedral, octahedral or The sharp part of the diamond of the tetrahedron just falls into the corner of the diamond accommodating groove 12, and the flat part is exposed.

After explaining the structure of the diamond arrangement and arrangement device 1 of the created diamond arrangement, please refer to the second figures A to F to explain the use state of the diamond arrangement and arrangement device 1 of the diamond arrangement in detail, first please Referring to the second figure A, a plurality of diamonds 40 are scattered on the finishing plate 10. Since the opening size of the diamond accommodating slot 12 is smaller than the diameter of the diamond 40, and the diamond accommodating slot 12 is a round diamond accommodating slot or an oval diamond accommodating slot, there is no corner design, so the plural diamonds 40 fall into the diamond When the groove 12 is accommodated, the sharp surfaces of all diamonds 40 can face outward.

Next, referring to FIG. 2B, a soft substance 20, such as non-woven fabric or paper, is attached to the finishing board 10, so that the diamond 40 in the diamond accommodating groove 12 can be embedded in the soft substance 20. Next, please refer to the third figure C, remove the finishing board 10, and lay the soft substance 20 inlaid with diamonds 40 on a substrate 22, which can be a glaze substrate or a ceramic substrate, and then 800 ℃ ~ 1000 ℃ After sintering at a high temperature, the soft substance 20 has been deformed or broken after high temperature sintering. At this time, the surface of the substrate 22 can be rinsed with a water column to rinse the soft substance 20 on the substrate 22, as shown in the second D figure, the diamond 40 is set On the substrate 22. Finally, please refer to the second E diagram and the second F diagram, the substrate 22 inlaid with diamonds 40 is mounted on a metal base 24 to complete the diamond organizer 26.

Next, please refer to FIGS. 3A to 3C to illustrate another embodiment of the diamond arrangement and finishing device 1 using the diamond arrangement of this creation, first referring to FIG. 3A, which is the same as the above The steps in the example are the same. Sprinkle a plurality of diamonds on the finishing plate 10 so that when all the diamonds 40 fall into the diamond receiving groove 12, the sharp surfaces of the diamonds 40 can face outwards.

Next, referring to FIG. 3B, a base 30 is provided. The base 30 may be a steel base. The base 30 is coated with a metal layer 32, and the side coated with the metal layer 32 is bonded to the diamond 40. Next, referring to FIG. 3C, the finishing plate 10 is removed and electroplated, so that the diamond 40 can be stably inserted into the metal layer 32, and the diamond finisher 34 can be completed.

In summary, this creation uses a special diamond receiving slot design, which can effectively arrange the diamond's display angle. When the diamond is set in the diamond organizer, all the sharp surfaces of the diamond can be exposed in the diamond organizer to avoid the flat surface of the diamond It is exposed outside the diamond finisher to increase the cutting rate of the diamond finisher.

The above are only preferred embodiments of this creation, and are not intended to limit the scope of this creation. Therefore, any changes or modifications based on the characteristics and spirit described in the scope of this creative application should be included in the scope of the patent application for this creative.

1: Diamond arrangement and arrangement device of diamond arrangement 10: Finishing board 12: Diamond receiving slot 20: Soft substances 22: substrate 24: Metal substrate 26: Diamond Organizer 30: Base 32: Metal layer 34: Diamond Organizer 40: Diamond

The first picture is a three-dimensional schematic drawing of the creation. The second picture A to the second picture F are schematic diagrams of successive steps for making a diamond sorter using this creation. Figures 3A to 3C are schematic diagrams of successive steps of another embodiment of using this creation to make a diamond collator.

1: Diamond arrangement and arrangement device of finishing device

10: Finishing board

12: Diamond receiving slot

Claims (4)

A diamond arrangement and arrangement device for a diamond arrangement includes: A finishing board is provided with a plurality of diamond accommodating grooves for accommodating diamonds respectively, and the opening size of each diamond accommodating groove is smaller than the diameter of the diamond. The diamond arrangement and arrangement device of the diamond organizer according to claim 1, wherein the diamond accommodation grooves may be round diamond accommodation grooves. The diamond arrangement and arrangement device of the diamond organizer according to claim 1, wherein the diamond accommodating grooves may be oval-shaped diamond accommodating grooves. The diamond arrangement and arrangement device of the diamond arrangement as described in claim 1, wherein the arrangement plate is a steel arrangement plate.

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