CN210550375U - Pressure dividing pad - Google Patents
Pressure dividing pad Download PDFInfo
- Publication number
- CN210550375U CN210550375U CN201921567611.9U CN201921567611U CN210550375U CN 210550375 U CN210550375 U CN 210550375U CN 201921567611 U CN201921567611 U CN 201921567611U CN 210550375 U CN210550375 U CN 210550375U
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- CN
- China
- Prior art keywords
- gasket
- pressure
- groove
- hole
- pressure plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 34
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 24
- 238000005498 polishing Methods 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007517 polishing process Methods 0.000 abstract description 2
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a pressure-dividing pad, which is arranged between a pressure plate and a ceramic plate, and comprises a gasket, wherein the central position of the gasket is provided with a circular through hole, one side of the gasket is fixedly bonded with the pressure plate, the other side of the gasket is provided with a plurality of transverse grooves and a longitudinal groove, the gasket is also provided with a vacuum-removing groove and an air vent, the vacuum-removing groove passes through the circular through hole, two air vents are positioned in two end groove bodies of the true-hole-removing groove, a hole is drawn at the central position of the gasket, so that the wafers at two sides of the bottom of the pressure plate are stressed intensively in the polishing process, the polishing precision and the polishing effect of the wafers are improved, the gasket is bonded and fixed on the pressure plate, the transverse grooves and the longitudinal groove are arranged on the gasket, the friction force between the gasket and the ceramic plate and the wafers is increased, the gasket is prevented from generating, outside air can enter the vacuum removal groove through the vent hole, so that the ceramic disc is prevented from being lifted when the pressure disc is lifted.
Description
Technical Field
The utility model relates to a polishing equipment technical field specifically is a pressure-dividing pad for on sapphire burnishing machine.
Background
The function of sapphire single-side polishing (copper polishing) is mainly to remove the damage layer on the wafer surface generated by the upper stage of the process (double-side polishing). Under the action of the superfine diamond abrasive, the wafer and the resin copper disk which are subjected to certain pressure do mutual high-speed rotation motion, and grinding is carried out by means of the mechanical action of the abrasive. When the prior copper polishing machine equipment is used for polishing the sapphire substrate, the following two problems exist: first, in the conventional general polishing apparatus, impurities such as diamond abrasives are easily mixed between the pressure plate and the ceramic plate during normal operation, and after long-term wear and accumulation, the surfaces of the pressure plate and the ceramic plate may be irregularly deformed due to large local stress during operation. After the contact surface of the ceramic disc and the pressure disc is deformed, the downward stress applied by the polishing head can not be uniformly applied to the sapphire substrate, so that stress concentration exists in the sapphire wafer. Since the sapphire surface is subjected to non-uniform forces, wafer removal thickness varies from wafer to wafer during processing. Meanwhile, the pressure disc and the ceramic disc which are seriously deformed need to be periodically maintained and even replaced, which increases the processing cost; second, in prior art polishing processes, the pressure disk and ceramic disk are often "hard contacted" by contact points. After long-term processing and use, the contact area between the two is increased, the sliding friction coefficient is reduced, and the ceramic disc at the bottom is likely to generate transverse displacement during high-speed polishing. The lateral displacement of the ceramic disk causes abnormal variation in the polishing track of the processed wafer, resulting in abnormal loss of TTV and thickness of the wafer.
Chinese patent application No. CN201721867447.4 discloses a pad and a wafer polishing device, the core of which is to open a plurality of through holes uniformly distributed on the surface of the pad, so as to prevent the pressure plate from making hard contact with the ceramic plate, and simultaneously release the air inside the pressure-dividing pad in time, thereby achieving good effects of pressure-reducing buffering and auxiliary polishing. However, the design of the invention has two disadvantages in practical use, one of which is that in the above patent, the pad is placed between the pressure plate and the ceramic plate, and the position of the pad is not relatively fixed, so that the pad is easy to displace laterally when rotating at high speed, which easily affects the polishing precision and polishing effect of the wafer; secondly, the pressure disk lower surface is a cambered surface of which the center is slightly upwards concave, so that wafers are polished by two sides of the pressure disk which is preferentially stressed under normal conditions.
SUMMERY OF THE UTILITY MODEL
Therefore, an object of the present invention is to provide a pressure-dividing pad capable of improving polishing accuracy and polishing effect of a wafer.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a pressure divider pad disposed between a pressure plate and a ceramic plate, comprising:
the center of the gasket is provided with a circular through hole, one surface of the gasket is fixedly bonded with the pressure disc, and the other surface of the gasket is provided with a plurality of transverse grooves and longitudinal grooves;
one surface of the gasket, which is provided with the transverse groove and the longitudinal groove, is also provided with a vacuum removal groove and a vent hole;
wherein the transverse grooves and the longitudinal grooves are vertically crossed;
the vacuum removing groove penetrates through the circular through hole, and the two vent holes are respectively located in groove bodies at two ends of the true hole removing groove.
As a preferred scheme of partial pressure pad, wherein, the gasket is made by polyurethane material, and its one side of being connected with the pressure disk has evenly paintd the adhesive, the gasket passes through with the pressure disk the adhesive bonds fixedly.
As an optimal selection scheme of partial pressure pad, wherein, horizontal slot with the groove width of vertical slot is 1 ~ 2mm, the groove depth is 0.5 ~ 1 mm.
As a preferred scheme of partial pressure pad, wherein, horizontal slot with the groove width of vertical slot is 2mm, the groove depth is 0.8 mm.
As an optimal solution of the pressure dividing pad of the present invention, wherein the difference between the inner diameter and the outer diameter of the pad is 1.1 to 1.2 times the diameter of the processed wafer.
Compared with the prior art: the utility model discloses a central point at the gasket puts and draws the hole, the wafer that makes pressure plate bottom both sides is concentrated at polishing in-process atress, improve the polishing precision and the effect of wafer, bond the gasket simultaneously and fix on the pressure plate, and set up horizontal slot and vertical slot on the gasket, increase the friction dynamics of gasket and ceramic dish and wafer, avoid the gasket to take place the displacement when the high-speed rotation of work, improve the polishing precision and the effect of crystal, and when finishing raising the pressure plate, outside air accessible air vent enters into and removes the vacuum chamber in, avoid the pressure plate to take the ceramic dish up when rising.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic structural view of the pressure-dividing pad of the present invention;
fig. 2 is a schematic view of the installation structure of the pressure dividing pad, the pressure plate and the ceramic plate of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
The utility model provides a pressure-dividing pad can improve the polishing precision and the polishing effect of wafer.
Fig. 1-2 show the structure diagram of an embodiment of the pressure dividing pad of the present invention and the installation diagram of the pressure plate and the ceramic plate, please refer to fig. 1-2, the pressure dividing pad of the present embodiment includes a gasket 100, which is disposed between the pressure plate 200 and the ceramic plate 300, the gasket 100 is driven by the pressure plate 200 to extrude downwards, the wafers on two sides of the bottom of the gasket 100 are pressed on the ceramic plate 300, and the gasket 100 is attached to the ceramic plate 300, and when the ceramic plate 300 rotates at a high speed, the wafers are polished.
The gasket 100 is made of a polyurethane material, and the specification of the polyurethane material simultaneously meets the requirements of 70-85 degrees of hardness, 1.2-1.5 mm of thickness, 2.5-6 percent of compression ratio and 0.3-0.5 g/cm of density3The polyurethane partial pressure pad has certain hardness, friction coefficient and compression modulus, the compressible property of the polyurethane partial pressure pad can ensure that the polyurethane partial pressure pad plays a role of buffering tip stress when hard particles enter the pressure disc 200 or the ceramic disc 300, and the microscopic abrasion of the pressure disc 200 and the ceramic disc 300 is effectively relieved, preferably, the selected polyurethane material has the hardness of 80 degrees, the thickness of 1.28mm, the compression rate of 3 percent and the density of 0.35g/cm3。
The center of the spacer 100 is provided with a circular through hole 110, and the surface of the pressure disc 200 is bent inward into an arc shape, so the circular through hole 110 can raise the plane of the acting force of the pressure disc 200 and the ceramic disc 300, and reduce the ineffective contact between the center of the pressure disc 200 and the center of the ceramic disc 300, thereby transmitting the force from both sides of the pressure disc 200 to the bottom wafer and the ceramic disc 300 more intensively, and therefore, the wafer grinding efficiency is higher during the rotary grinding.
One side of the gasket 100 is fixedly bonded with the pressure plate, specifically, an adhesive is coated on the side of the gasket 100, the gasket 100 is fixed on the pressure plate 200 through the adhesive, a plurality of transverse grooves 120 and longitudinal grooves 130 are formed in the other side of the gasket, the transverse grooves 120 are perpendicularly crossed with the longitudinal grooves 130, the groove widths of the transverse grooves 120 and the longitudinal grooves can be 1-2 mm, the groove depths can be 0.5-1 mm, the groove widths are preferably 2mm, and the groove depths are preferably 0.8 mm.
The side of the gasket 100 provided with the transverse groove 120 and the longitudinal groove 130 is further provided with a vacuum removing groove 140 and a vent hole 150, the vacuum removing groove 140 penetrates through the circular through hole 110, the two vent holes 150 are respectively located in grooves at two ends of the true hole removing groove 140, when the gasket 100 is pressed on the ceramic disc 300 by the pressure disc 200, the gasket 100 is compressed, at this time, air between the gasket 100 and the ceramic disc 300 is exhausted through the vacuum removing groove 140 and the vent hole 150, so that the gasket 100 is tightly attached to the ceramic disc 300, when the pressure disc 200 is lifted after processing, at this time, external air enters between the gasket 100 and the ceramic disc 300 through the vent hole 150 and the vacuum removing groove 140 again, so that air is filled between the gasket 100 and the ceramic disc 300, and the pressure disc 200 can be separated from the ceramic disc 300 in the process of lifting the gasket 100, and the gasket 100 is prevented from lifting the ceramic disc 300.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. A pressure divider pad disposed between a pressure plate and a ceramic plate, comprising:
the gasket (100) is provided with a circular through hole (110) at the center, one surface of the gasket is fixedly bonded with the pressure disc, and the other surface of the gasket is provided with a plurality of transverse grooves (120) and longitudinal grooves (130);
one surface of the gasket (100) provided with the transverse groove (120) and the longitudinal groove (130) is also provided with a vacuum removing groove (140) and a vent hole (150);
wherein the transverse grooves (120) and the longitudinal grooves (130) intersect perpendicularly;
the de-vacuum groove (140) penetrates through the circular through hole (110), and the two vent holes (150) are respectively located in groove bodies at two ends of the de-vacuum groove (140).
2. The partial pressure pad according to claim 1, characterized in that the gasket (100) is made of polyurethane material, and the surface of the gasket connected with the pressure plate is evenly coated with adhesive, and the gasket (100) and the pressure plate are fixed by the adhesive.
3. The partial pressure pad according to claim 1, wherein the width of the transverse grooves (120) and the longitudinal grooves is 1-2 mm, and the depth of the grooves is 0.5-1 mm.
4. A partial pressure pad according to claim 3, characterised in that the transverse grooves (120) and the longitudinal grooves have a groove width of 2mm and a groove depth of 0.8 mm.
5. The pressure divider pad of claim 1, wherein the difference between the inner and outer diameters of the gasket (100) is 1.1 to 1.2 times the diameter of a processed wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921567611.9U CN210550375U (en) | 2019-09-20 | 2019-09-20 | Pressure dividing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921567611.9U CN210550375U (en) | 2019-09-20 | 2019-09-20 | Pressure dividing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210550375U true CN210550375U (en) | 2020-05-19 |
Family
ID=70671376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921567611.9U Expired - Fee Related CN210550375U (en) | 2019-09-20 | 2019-09-20 | Pressure dividing pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210550375U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290426A (en) * | 2021-04-15 | 2021-08-24 | 金华博蓝特电子材料有限公司 | Method for improving polishing thickness uniformity of wafer |
-
2019
- 2019-09-20 CN CN201921567611.9U patent/CN210550375U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290426A (en) * | 2021-04-15 | 2021-08-24 | 金华博蓝特电子材料有限公司 | Method for improving polishing thickness uniformity of wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 |