TWM590701U - Panel structure - Google Patents

Abstract

A panel structure is provided. The panel structure includes a circuit substrate, a light-emitting assembly, and a sensor assembly. The circuit substrate includes a plurality of control circuits. The light-emitting assembly includes a plurality of light-emitting elements electrically connected with the circuit substrate. The sensor assembly includes a plurality of sensor elements electrically connected with the circuit substrate. The plurality of light-emitting elements respectively electrically connected with the plurality of control circuits. A part of or all of the plurality of light-emitting elements and the sensor element staggeringly disposed on the circuit substrate.

Description

Panel structure

This creation relates to a panel structure, in particular to a panel structure containing a light emitting diode.

At present, light-emitting diodes (Light-Emitting Diode, LED) are widely used due to their characteristics of good light quality and high luminous efficiency. Generally speaking, in order to make the display device adopting the light-emitting diode as the light-emitting element have better color performance, the prior art uses the combination of the three-color light-emitting diode chips of red, green and blue to form a complete Color light-emitting diode display device, the full-color light-emitting diode display device can emit red, green, and blue colors of light emitted by red, green, and blue light-emitting diode chips respectively, and then pass through the mixed light Afterwards, a full-color light is formed to display related information. However, the LED display in the prior art still has room for improvement in its function.

The technical problem to be solved in this creation is to provide a panel structure to address the deficiencies of the existing technology.

In order to solve the above technical problems, one of the technical solutions adopted in this creation is to provide a panel structure, which includes a circuit substrate, a light emitting component, and a sensing component. The circuit board includes a plurality of control circuits. The light-emitting assembly includes a plurality of light-emitting elements electrically connected to the circuit substrate. The sensing component includes a plurality of sensing elements electrically connected to the circuit substrate. Wherein, the plurality of light-emitting elements are electrically connected to the plurality of control circuits, and a part or all of the plurality of light-emitting elements are interlaced with the plurality of sensing elements on the circuit substrate.

In order to solve the above technical problems, another technical solution adopted in this creation is to provide a panel structure, which includes a circuit substrate, a light emitting component, and a sensing component. The light-emitting component includes a plurality of light-emitting elements electrically connected to the circuit substrate, and serves as an image display. The sensing component includes one or more sensing elements electrically connected to the circuit substrate to serve as an image sensor. Wherein part or all of the light-emitting elements are interlaced with the sensing element on the circuit substrate.

One of the beneficial effects of this creation is that the panel structure provided by this creation can provide a multi-functional use through the technical solution of "some or all of the multiple light-emitting elements are interlaced with the sensing element on the circuit substrate" Panel structure. It can also be used in instruments such as fingerprint readers or endoscopes through the combination of light-emitting elements and sensing elements.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the drawings provided are for reference and explanation only, and are not intended to limit this creation.

The following are specific specific examples to illustrate the implementation of the "panel structure" disclosed in this creation. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments. The details in this specification can also be based on different views and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings in this creation are only a schematic illustration, not based on actual size, and are declared in advance. The following embodiments will further describe the relevant technical content of the creation, but the disclosed content is not intended to limit the protection scope of the creation.

It should be understood that although terms such as “first” and “second” may be used herein to describe various elements or signals, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation.

[First embodiment]

Please refer to FIGS. 1 to 4. The first embodiment of the present invention provides a panel structure including: a circuit substrate 1, a light-emitting component 2 and a sensing component 3.

First, as shown in FIGS. 1 and 2, the circuit board 1 includes a plurality of control circuits 11 embedded in the circuit board 1. The control circuit 11 may be a CMOS (Complementary Metal-Oxide-Semiconductor) control circuit. The CMOS control circuit has Source, Drain and Gate. However, this creation is not limited to the examples given above. The light emitting element 2 is electrically connected to the circuit board 1. The light-emitting assembly 2 includes a plurality of light-emitting elements 21 electrically connected to the circuit board 1. The plurality of light-emitting elements 21 are electrically connected to the plurality of control circuits 11 respectively. Specifically, each of the light-emitting elements 21 is respectively disposed above the control circuit 11 corresponding to the electrical connection. The sensing element 3 is electrically connected to the circuit board 1. The sensing component 3 includes a plurality of sensing elements 31 electrically connected to the circuit substrate 1. The sensing elements 31 and a part or all of the light emitting elements 21 are alternately arranged on the circuit substrate 1, specifically, except for the sensing element 31 In addition, each light-emitting element 21 is provided above the corresponding electrically connected control circuit 11.

In the first embodiment, a plurality of light-emitting elements 21 are arranged on the circuit substrate 1 in an array layout, and the light sources generated by the light-emitting elements 21 cooperate with each other to form a display image, that is, the light-emitting element 2 can be used as an image display. The multiple sensing elements 31 are arranged on the circuit substrate 1 in an array layout. The multiple sensing elements 31 cooperate with each other to capture image information, that is, the sensing element 3 can be used as an image sensor. Also, a plurality of light emitting elements 21 and a plurality of sensing elements 31 are regularly arranged on the substrate 1 in a staggered manner.

Specifically, the plurality of light emitting elements 21 may be red light emitting elements, green light emitting elements, or blue light emitting elements. Among them, the red light-emitting element, the green light-emitting element and the blue light-emitting element, which are adjacently arranged, can produce three colored lights of red, green and blue or overlap to form a full-color light under the control of the control circuit 11, and can constitute a display image One of the pixels.

In this embodiment, the light-emitting elements 21 may be light-emitting diodes (Light-Emitting Diode, LED), and may be divided into sub-millimeter light-emitting diodes (Mini LED) and miniatures according to their size and whether they have a substrate Light emitting diode (Micro LED), but not limited to this.

Please refer to FIG. 3, the sub-millimeter light-emitting diode includes a substrate B, an n-type semiconductor N, a light-emitting layer M, a p-type semiconductor P, two bonding pads C and an insulating layer S arranged in a stack, The n-type semiconductor N, the light-emitting layer M, and the p-type semiconductor P are disposed on the substrate B, the light-emitting layer M is disposed between the n-type semiconductor N and the p-type semiconductor P, and the two pads C are respectively disposed on the n-type semiconductor N On the p-type semiconductor P, the insulating layer S is provided on the n-type semiconductor N, the light-emitting layer M, the p-type semiconductor P, and the second pad C, and the insulating layer S simultaneously exposes a portion of the second pad C. The substrate B is a sapphire material layer, the n-type semiconductor N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer, and the light-emitting layer M is a multiple quantum well structure layer (Multiple Quantum Well, MQW), p The type semiconductor P may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer, but it is not limited thereto. The substrate B may also be a base layer of quartz, glass, silicon or any material. The materials of the n-type semiconductor N and the p-type semiconductor P can be selected according to the color of the generated light source. However, the example given above is just one of the feasible embodiments and is not intended to limit the creation.

Please refer to FIG. 4, the miniature light-emitting diode includes an n-type semiconductor N, a light-emitting layer M, a p-type semiconductor P, two pads C and an insulating layer S arranged in a stack, wherein the light-emitting layer M It is disposed between the n-type semiconductor N and the p-type semiconductor P, the two pads C are respectively disposed on the n-type semiconductor N and the p-type semiconductor P, and the insulating layer S is disposed on the n-type semiconductor N, the light-emitting layer M, and the p-type semiconductor P And on the second pad C, the insulating layer S simultaneously exposes part of the second pad C. The n-type semiconductor N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer M is a multi-quantum well structure layer, and the p-type semiconductor P may be a p-type gallium nitride material layer or p-type arsenide Gallium material layer, but not limited to this. The materials of the n-type semiconductor N and the p-type semiconductor P can be selected according to the color of the generated light source. However, the example given above is just one of the feasible embodiments and is not intended to limit the creation.

Further, when at least one light emitting element 21 and at least one sensing element 31 cooperate with each other, an object surface identifier can be formed. The light emitting element 21 can generate a projection light source and project it onto an object. After the projection light source is reflected by the object, a reflective light source is formed, and the reflective light source is projected on the sensing element 31 for the sensing element 31 to capture the image information of the object.

For example, the object surface identifier may be a fingerprint identifier. Referring to FIG. 5, a projection light source generated by the light-emitting element 21 is projected on the fingerprint of the finger. After the projection light source is reflected by the finger, a reflection light source is generated, and the reflective light source is projected on the sensing element 31. At this time, the sensing element 31 can obtain the fingerprint image information of the finger to achieve the effect of identifying the fingerprint. Since the panel structure of the first embodiment is evenly distributed with the sensing elements 31, the entire panel structure can be fingerprinted. However, the example given above is just one of the feasible embodiments and is not intended to limit the creation.

[Second Embodiment]

Please refer to FIG. 6 and FIG. 7, the second embodiment of this creation provides a panel structure, but this creation is not limited to this example. The second embodiment of the present invention provides a panel structure, which includes: a circuit substrate 1, a light emitting component 2, and a sensing component 3.

The circuit board 1 includes a plurality of control circuits 11 embedded in the circuit board 1. The light-emitting assembly 2 includes a plurality of light-emitting elements 21 electrically connected to the circuit board 1. The sensing component 3 includes a sensing element 31 electrically connected to the circuit substrate 1 (of course, a plurality of sensing elements 31 may also be used). In the panel structure of the second embodiment, the structures of the circuit board 1, the light-emitting assembly 2, and the sensing assembly 3 are similar to the first embodiment, and the difference is that the sensing assembly 3 in the second embodiment has only one sensing element 31 .

In the second embodiment, a plurality of light-emitting elements 21 are arranged on the circuit substrate 1 in an array layout, and the light sources generated by the light-emitting elements 21 cooperate with each other to form a display image, that is, the light-emitting element 2 can be used as an image display. The sensing element 31 is centrally disposed on the edge of the circuit substrate 1 and surrounded by a plurality of light-emitting elements 21. The sensing element 31 has a function of capturing image information, that is, the sensing element 3 can serve as an image sensor.

When the plurality of light emitting elements 21 and the sensing element 31 cooperate with each other, an object surface recognizer, such as a fingerprint recognizer, can be formed. That is to say, the portion of the circuit board 1 of the second embodiment provided with the sensing element 31 may also have the function of fingerprint recognition.

In addition, regardless of the panel structure of the first embodiment or the second embodiment, when at least one light emitting element 21 and at least one sensing element 31 cooperate with each other, it can also be applied to an endoscope assembly. Referring to FIG. 8, the light-emitting element 21 can generate a projection light source and project it onto an object (organ to be observed). After the projection light source is reflected by the object, a reflection light source is formed. The reflection light source passes through a camera module L and then The receiving of the sensing element 31 achieves the effect of capturing image information. However, the example given above is just one of the feasible embodiments and is not intended to limit the creation.

[Beneficial effect of embodiment]

One of the beneficial effects of this creation is that the panel structure provided by this creation can provide a panel with multi-functional uses through the technical solution of "a part or all of the light emitting elements are interlaced with the sensing elements on the circuit substrate" structure. It can also be used in instruments such as fingerprint readers or endoscopes through the combination of light-emitting elements and sensing elements.

Furthermore, by arranging the light-emitting elements in an array layout, the light sources generated by the light-emitting elements can be matched with each other to form a display image. Then, the sensing elements are arranged in an array layout manner, so that the sensing elements can cooperate with each other to capture image information.

The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of the patent application for this creation, so any equivalent technical changes made by using this creation specification and graphic content are included in this creation application Within the scope of the patent.

1‧‧‧ circuit board 11‧‧‧Control circuit 2‧‧‧Lighting components 21‧‧‧Lighting element 3‧‧‧sensing components 31‧‧‧sensing element B‧‧‧Substrate N‧‧‧n-type semiconductor M‧‧‧luminous layer P‧‧‧p-type semiconductor L‧‧‧Camera module C‧‧‧solder pad S‧‧‧Insulation

FIG. 1 is a schematic top view of a first embodiment of a creative panel structure.

FIG. 2 is an enlarged schematic view of part II of FIG. 1.

Fig. 3 is a schematic side sectional view of a sub-millimeter light-emitting diode.

4 is a schematic side cross-sectional view of a miniature light-emitting diode.

FIG. 5 is a schematic view of a fingerprint reader composed of a light-emitting element and a sensing element.

FIG. 6 is a schematic top view of a second embodiment of a creative panel structure.

7 is an enlarged schematic view of part VII of FIG. 6.

FIG. 8 is a schematic view of the use state of an endoscope assembly composed of a light-emitting element and a sensing element.

1‧‧‧ circuit board

2‧‧‧Lighting components

3‧‧‧sensing components

11‧‧‧Control circuit

21‧‧‧Lighting element

31‧‧‧sensing element

Claims (10)

A panel structure, including: A circuit substrate, which includes a plurality of control circuits; A light-emitting assembly including a plurality of light-emitting elements electrically connected to the circuit substrate; and A sensing component, which includes a plurality of sensing elements electrically connected to the circuit substrate; Wherein, the light-emitting elements are respectively electrically connected to the control circuits, and part or all of the light-emitting elements are interlaced with the sensing elements on the circuit substrate. The panel structure as described in item 1 of the patent application scope, wherein the light-emitting elements are arranged on the circuit substrate in an array layout, and the light sources generated by the light-emitting elements cooperate to form a display image; wherein, these The light-emitting element includes a plurality of red light-emitting elements, a plurality of green light-emitting elements, and a plurality of blue light-emitting elements. The red light-emitting element, the green light-emitting element, and the blue light-emitting element constitute one of the pixels of the displayed image; wherein, the The sensing elements are arranged on the circuit substrate in an array layout, and the sensing elements cooperate with each other to capture image information. The panel structure as described in item 1 of the patent application range, wherein the light-emitting element is a micro LED without a substrate, which includes an n-type semiconductor, a light-emitting layer, and a p-type semiconductor arranged in a stack. The panel structure as described in item 1 of the patent application range, wherein the light-emitting element is a mini LED, which includes a substrate, an n-type semiconductor, a light-emitting layer, and a p-type semiconductor arranged in a stack. The panel structure as described in item 1 of the patent application scope, wherein at least one of the light-emitting elements and at least one of the sensing elements cooperate with each other to form an object surface recognizer; wherein, at least one of the light-emitting elements generates a projection light source Projected onto an object, the projected light source forms a reflected light source through the reflection of the object, and the reflected light source is projected on at least one of the sensing elements to capture image information of the object. A panel structure, including: A circuit board; A light-emitting component, which includes a plurality of light-emitting elements electrically connected to the circuit substrate, as an image display; and A sensing component, which includes one or more sensing elements electrically connected to the circuit substrate, as an image sensor; Wherein part or all of the light-emitting elements are interlaced with the sensing element on the circuit substrate. The panel structure as described in item 6 of the patent application scope, wherein the light-emitting elements are arranged on the circuit substrate in an array layout, and the light sources generated by the light-emitting elements cooperate to form a display image; wherein, these The light-emitting element includes a plurality of red light-emitting elements, a plurality of green light-emitting elements, and a plurality of blue light-emitting elements. The red light-emitting element, the green light-emitting element, and the blue light-emitting element constitute one of the pixels of the displayed image; wherein, the The sensing elements are arranged on the circuit substrate in an array layout, and the sensing elements cooperate with each other to capture image information. The panel structure as described in item 6 of the patent application range, wherein the light-emitting element is a micro LED without a substrate, which includes an n-type semiconductor, a light-emitting layer, and a p-type semiconductor arranged in a stack. The panel structure as described in Item 6 of the patent application range, wherein the light-emitting element is a mini LED, which includes a substrate, an n-type semiconductor, a light-emitting layer, and a p-type semiconductor arranged in a stack. The panel structure as described in item 6 of the patent application scope, wherein at least one of the light emitting elements and at least one of the sensing elements cooperate with each other to form an object surface recognizer; wherein, at least one of the light emitting elements generates a projection light source Projected onto an object, the projected light source forms a reflected light source through the reflection of the object, and the reflected light source is projected on at least one of the sensing elements to capture image information of the object.

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