TWI800053B - Method of manufacturing a display module and related full screen image display device - Google Patents

Method of manufacturing a display module and related full screen image display device Download PDF

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Publication number
TWI800053B
TWI800053B TW110139605A TW110139605A TWI800053B TW I800053 B TWI800053 B TW I800053B TW 110139605 A TW110139605 A TW 110139605A TW 110139605 A TW110139605 A TW 110139605A TW I800053 B TWI800053 B TW I800053B
Authority
TW
Taiwan
Prior art keywords
manufacturing
screen image
full screen
display device
image display
Prior art date
Application number
TW110139605A
Other languages
Chinese (zh)
Other versions
TW202223856A (en
Inventor
廖建碩
黃紹瑋
黃育民
Original Assignee
台灣愛司帝科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 台灣愛司帝科技股份有限公司 filed Critical 台灣愛司帝科技股份有限公司
Priority to CN202111327252.1A priority Critical patent/CN114596790A/en
Priority to US17/523,888 priority patent/US20220173088A1/en
Publication of TW202223856A publication Critical patent/TW202223856A/en
Application granted granted Critical
Publication of TWI800053B publication Critical patent/TWI800053B/en

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/40Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light specially adapted for use with infrared light
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW110139605A 2020-12-02 2021-10-26 Method of manufacturing a display module and related full screen image display device TWI800053B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111327252.1A CN114596790A (en) 2020-12-02 2021-11-10 Method for manufacturing display module and related full-screen image display
US17/523,888 US20220173088A1 (en) 2020-12-02 2021-11-10 Method of manufacturing a display module and full screen image display device including a display module prepared in accordance with the aforementioned method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063120221P 2020-12-02 2020-12-02
US63/120,221 2020-12-02

Publications (2)

Publication Number Publication Date
TW202223856A TW202223856A (en) 2022-06-16
TWI800053B true TWI800053B (en) 2023-04-21

Family

ID=81768519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110139605A TWI800053B (en) 2020-12-02 2021-10-26 Method of manufacturing a display module and related full screen image display device

Country Status (2)

Country Link
CN (1) CN114582256A (en)
TW (1) TWI800053B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201836137A (en) * 2017-03-20 2018-10-01 台灣愛司帝科技股份有限公司 Image display module and method of manufacturing the same, and display device
WO2020008801A1 (en) * 2018-07-03 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 Image capture element and solid-state image capture device
US20200035729A1 (en) * 2018-07-25 2020-01-30 Samsung Electronics Co., Ltd. Image sensor with selective light-shielding for reference pixels
TWM590701U (en) * 2018-11-30 2020-02-11 台灣愛司帝科技股份有限公司 Panel structure
US20200327300A1 (en) * 2019-04-10 2020-10-15 Shenzhen GOODIX Technology Co., Ltd. Optical id sensing using illumination light sources positioned at a periphery of a display screen
TWM603199U (en) * 2020-04-08 2020-10-21 台灣愛司帝科技股份有限公司 Led chip structure and chip transferring system
TWI708981B (en) * 2013-08-28 2020-11-01 日商半導體能源研究所股份有限公司 Display device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7079146B2 (en) * 2018-05-18 2022-06-01 シャープ株式会社 3D display device
CN111027513A (en) * 2019-12-25 2020-04-17 业成科技(成都)有限公司 Display integrating optical identification function
CN111952349A (en) * 2020-04-06 2020-11-17 神盾股份有限公司 In-screen optical biological characteristic sensing device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708981B (en) * 2013-08-28 2020-11-01 日商半導體能源研究所股份有限公司 Display device
TW201836137A (en) * 2017-03-20 2018-10-01 台灣愛司帝科技股份有限公司 Image display module and method of manufacturing the same, and display device
WO2020008801A1 (en) * 2018-07-03 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 Image capture element and solid-state image capture device
US20200035729A1 (en) * 2018-07-25 2020-01-30 Samsung Electronics Co., Ltd. Image sensor with selective light-shielding for reference pixels
TWM590701U (en) * 2018-11-30 2020-02-11 台灣愛司帝科技股份有限公司 Panel structure
US20200327300A1 (en) * 2019-04-10 2020-10-15 Shenzhen GOODIX Technology Co., Ltd. Optical id sensing using illumination light sources positioned at a periphery of a display screen
TWM603199U (en) * 2020-04-08 2020-10-21 台灣愛司帝科技股份有限公司 Led chip structure and chip transferring system

Also Published As

Publication number Publication date
CN114582256A (en) 2022-06-03
TW202223856A (en) 2022-06-16

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