TWM586360U - Optical module - Google Patents

Abstract

The present invention discloses an optical module including plural optical channels, a filter substrate arranged below the optical channels, and a sensing element arranged below the filter substrate. Each optical channel includes at least one optical lens formed by an imprinting process. The sensing element includes plural sensing units corresponding to the optical channels. After the light beam passes through one of the optical channel, the light beam is sensed by the corresponding optical unit.

Description

Optical module

This creation relates to the field of optics, especially to an optical module.

In recent years, with the evolution of the electronics industry and the vigorous development of industrial technology, the design and development of various electronic devices has gradually been developed towards lightness and portability, so that users can use it in mobile commerce, entertainment or leisure, anytime, anywhere. . For example, various image capture modules are being widely used in various fields, such as portable electronic devices such as smart phones and wearable electronic devices. They have the advantages of small size and easy portability, and people can When you need it, you can take it out at any time for image capture and storage, or upload it to the Internet through the mobile network, which not only has important business value, but also adds color to the daily life of the general public.

Please refer to FIG. 1, which is a structural diagram of a conventional image capture module. The conventional image capturing module 1 includes an optical lens group 11, a sensing element 12, a fixing bar 13 for fixing the optical lens group 11, and a housing for carrying each component. 14; among them, the optical lens group 11 includes a plurality of optical lenses 111 stacked along the optical axis 15, and the sensing element 12 is used to sense a light beam from outside the image capturing device 1 and passed through the optical lens group 11, and further Outputs the sensing signal used to obtain the image. However, the image capture module 1 shown in FIG. 1 can only capture a single image during a one-time imaging process. In order to overcome this defect, the current technology mainly gathers and arranges a plurality of optical lens groups 11 so that Capture multiple images at the same time interval.

For details, please refer to FIG. 2, which is a structural diagram of a conventional image capture module implemented in an array form. FIG. 2 illustrates that the image capturing module 2 includes a plurality of optical lens groups 11 arranged in an array, a plurality of sensing elements (not shown) corresponding to the optical lens groups 11, and fixing the optical lenses. The group 11 and the frame 21 of the sensing elements. During the imaging process of the image capture module 2, each sensing element generates a sensing signal after individually sensing the light beam passing through the corresponding optical lens group 11, and the sensing signals generated by the sensing elements It can be sent to a back-end processor (not shown) for integration processing, and then complete various application requirements, such as synthesizing 3D stereoscopic images.

In particular, in the manufacturing process of the image capturing modules 1 and 2 shown in FIG. 1 or FIG. 2, each optical lens 111 is limited to being manufactured through injection molding, which results in a manufacturing tolerance of several tens of microns ( μm), plus the process of stacking and assembling multiple optical lenses 111 into an optical lens group 11, unavoidable changes and uncertainties will inevitably occur, so the focal plane of the assembled optical lens group 11 is likely to deviate from the sensing element 12 sensing planes, which in turn leads to poor image quality. In view of this, various focal length adjustments and compensation methods have been proposed, for example, disclosed in US Patents Nos. US9595553 and US9880391. However, the adjustment and compensation methods of these focal lengths All need to be implemented through micro-machining technology. This has limited effects on reducing manufacturing tolerances and improving yield, which means that production lines need additional processing machines for micro-machining. This not only increases the manufacturing cost of the image capture modules 1 and 2, but also lengthens the manufacturing time.

Furthermore, as mentioned above, since the conventional optical lens 111 is made by injection molding, its material is less selective and the heat resistance of the available materials is low. Generally speaking, if it is an image capture module 1 and 2 are in an environment greater than 80 degrees Celsius, the optical lens 111 will deform to cause a non-linear change in imaging, and this non-linear change cannot be easily compensated and corrected. On the other hand, if the image capture modules 1 and 2 are to be assembled into an electronic device (such as a portable electronic device), the image capture modules 1 and 2 cannot be connected with other electronic components (such as resistors, capacitors, and chips). Etc.) are commonly set on the circuit board of the electronic device through the same process, because the process of soldering other electronic components (such as resistors, capacitors, chips, etc.) to the circuit board needs to go through a high temperature environment greater than 80 degrees Celsius. Therefore, the image capturing modules 1 and 2 need to be mounted on the circuit board after other electronic components (such as resistors, capacitors, chips, etc.) are soldered to the circuit board and then subjected to another post-processing process. It can be seen that the process of assembling the conventional image capture modules 1 and 2 to the electronic device is extremely complicated.

According to the above description, the conventional image capturing module has room for improvement.

The main purpose of this creation is to provide an optical lens whose optical lens is formed through an embossing process and has a plurality of optical channels to provide a plurality of optical functions. group.

In a preferred embodiment, the present invention provides an optical module including: a first transparent substrate; a plurality of first optical lenses, and the plurality of first optical lenses are formed on the first through an imprinting process. A light-transmitting substrate; a filter substrate disposed below the first light-transmitting substrate; and at least one filter unit corresponding to at least one of the first optical lenses is formed on the filter substrate; and A sensing element is disposed below the filter substrate, and has a plurality of sensing units respectively corresponding to the plurality of first optical lenses, and each of the sensing units is configured to sense passage through the corresponding first optical lens. And at least one light beam of the filter substrate.

In a preferred embodiment, the optical module further includes: a second transparent substrate, and the second transparent substrate is located between the first transparent substrate and the filter substrate, or is the first transparent substrate A transparent substrate is located between the second transparent substrate and the filter substrate; and at least one second optical lens, and the at least one second optical lens is formed on the second transparent substrate through an imprinting process. Wood.

In a preferred embodiment, the optical module further includes a plurality of optical channels, and each of the optical channels has at least one of the first optical lens and the second optical lens.

In a preferred embodiment, the optical module further includes a first spacer, and the first spacer is vertically connected between the first transparent substrate and the second transparent substrate.

In a preferred embodiment, the first spacer is formed on the first transparent substrate or the second transparent substrate through the embossing process.

In a preferred embodiment, the optical module further includes a second spacer, and the at least one filter unit includes a first filter unit and a second filter unit; wherein the second spacer is vertical Connected to the filter substrate to separate the first filter unit and the second filter unit.

In a preferred embodiment, the second spacer is formed on the filter substrate through the embossing process.

In a preferred embodiment, the optical module further includes a third spacer, and the third spacer is disposed between the filter substrate and the sensing element to vertically space the filter substrate and the sensor.测 装置。 Test components.

In a preferred embodiment, the maximum thickness of one of the optical modules does not exceed 5 mm.

In a preferred embodiment, any one of the first optical lenses has a high temperature resistant material, and one of the high temperature resistant materials can withstand a temperature exceeding 90 degrees Celsius.

In a preferred embodiment, the present invention also provides an optical module, including: a plurality of optical channels, each of which has at least one optical lens, and the at least one optical lens is formed by an imprinting process A filter substrate disposed below the plurality of optical channels for filtering the light beam incident on at least one of the optical channels; and a sensing element disposed below the filter substrate and having corresponding correspondences A plurality of sensing units in the plurality of optical channels, and each of the sensing units is configured to sense at least one light beam passing through the corresponding optical channel; The optical module is used for soldering to a circuit board through a Surface Mount Technology (SMT) process.

In a preferred embodiment, the optical module further includes a first light-transmitting substrate disposed above the filter substrate; wherein each of the optical channels has a first optical lens, and any two of the optical channels The first optical lens in the channel is formed on the same first transparent substrate through the embossing process.

In a preferred embodiment, the optical module further includes a second light-transmitting substrate located between the first light-transmitting substrate and the filter substrate, or the first light-transmitting substrate is located in the first Between two transparent substrates and the filter substrate; wherein at least one optical channel of the plurality of optical channels has a second optical lens, and the second optical lens is formed on the second optical lens through the imprinting process On a light-transmitting substrate.

In a preferred embodiment, the optical module further includes a first spacer, and the first spacer is vertically connected between the first transparent substrate and the second transparent substrate.

In a preferred embodiment, the first spacer is formed on the first transparent substrate or the second transparent substrate through the embossing process.

In a preferred embodiment, the optical module further includes a second spacer, and the filter substrate includes at least a first filter unit and a second filter unit respectively corresponding to the two optical channels; wherein, The second spacer is vertically connected to the filter substrate and is used to separate the first filter unit and the second filter unit.

In a preferred embodiment, the second spacer is formed on the filter substrate through the embossing process.

In a preferred embodiment, the optical module further includes a third spacer, and the third spacer is disposed between the filter substrate and the sensing element. The filter substrate and the sensing element are spaced at a vertical interval.

In a preferred embodiment, the maximum thickness of one of the optical modules does not exceed 5 mm.

In a preferred embodiment, the at least one optical lens has a high temperature resistant material, and one of the high temperature resistant materials can withstand a temperature exceeding 90 degrees Celsius.

In a preferred embodiment, the circuit board is disposed in a portable electronic device.

1‧‧‧Image capture module

2‧‧‧Image capture module

3‧‧‧ Optical Module

11‧‧‧Optical lens group

12‧‧‧ sensing element

13‧‧‧Fixed

14‧‧‧shell

15‧‧‧ Optical axis

21‧‧‧Frame

30‧‧‧optical channel

31‧‧‧The first transparent substrate

32‧‧‧Second transparent substrate

33‧‧‧ Filter substrate

34‧‧‧sensing element

35‧‧‧first optical lens

36‧‧‧Second Optical Lens

37‧‧‧First spacer

38‧‧‧Second spacer

39‧‧‧ third spacer

40‧‧‧block

41‧‧‧ lens assembly

42‧‧‧baffle

91‧‧‧Circuit Board

92‧‧‧ resistance

93‧‧‧Capacitor

94‧‧‧ Operation Processing Chip

95‧‧‧ solder paste

111‧‧‧optical lens

331‧‧‧Filter Unit

341‧‧‧Sensing unit

L‧‧‧ hatch

P1‧‧‧step

P2‧‧‧step

P3‧‧‧step

P4‧‧‧step

P5‧‧‧step

Q1‧‧‧step

Q2‧‧‧step

Figure 1: Schematic diagram of a conventional image capture module.

Figure 2: Schematic diagram of a conventional image capture module implemented as an array.

FIG. 3 is a schematic diagram of the appearance structure of a creative optical module in a preferred embodiment.

FIG. 4 is a schematic conceptual cross-sectional view of a part of the structure of the optical module shown in FIG. 3 based on a section line L as a reference.

FIG. 5 is a conceptual diagram of a sensing plane of the sensing element shown in FIG. 4.

FIG. 6 is a schematic diagram of a manufacturing process of the optical module shown in FIG. 3.

FIG. 7A is a conceptual diagram of the execution of step P1 shown in FIG. 6.

FIG. 7B is a conceptual diagram of execution of step P2 shown in FIG. 6.

FIG. 7C is a conceptual diagram of execution of step P3 shown in FIG. 6.

FIG. 7D is a conceptual diagram of execution of step P4 shown in FIG. 6.

FIG. 8 is a schematic diagram of a process of soldering the optical module shown in FIG. 3 to a circuit board.

FIG. 9A is a conceptual diagram of execution of step Q1 shown in FIG. 8.

FIG. 9B is a conceptual diagram of execution of step Q2 shown in FIG. 8.

The embodiment of this creation will be further explained by cooperating with related drawings below. Wherever possible, in the drawings and the description, the same reference numerals represent the same or similar components. In the drawings, shapes and thicknesses may be exaggerated based on simplification and convenient labeling. It can be understood that elements not specifically shown in the drawings or described in the description have the forms known to those skilled in the art in the art. A person skilled in the art can make various changes and modifications according to the content of this creation.

Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of an appearance structure of a creative optical module in a preferred embodiment. FIG. 4 is a conceptual schematic view of a partial structure of the optical module shown in FIG. FIG. 5 is a conceptual diagram of a sensing plane of the sensing element shown in FIG. 4. The optical module 3 includes a first light-transmitting substrate 31, a second light-transmitting substrate 32, a filter substrate 33, and a sensing element 34 in this order from top to bottom. A plurality of first optical lenses 35 are formed on the upper surface and / or the lower surface of the first light-transmitting substrate 31 during the manufacturing process, and the second light-transmitting substrate 32 has a second light-transmitting substrate formed on the second light-transmitting substrate through an imprinting process. A plurality of second optical lenses 36 on the upper surface and / or the lower surface of the material 32.

Further, the optical module 3 includes a plurality of optical channels 30, each An optical channel 30 has a first optical lens 35 and a second optical lens 36 stacked on each other. The better, but not limited to this, the optical channels 30 of the optical module 3 are arranged in a matrix, as shown in FIG. 3 is a 2x2 array. Therefore, the optical module 3 of the preferred embodiment is Optical module with multi-lens array. In addition, although each optical channel 30 in the preferred embodiment has a first optical lens 35 and a second optical lens 36, those skilled in the art can design and change it to have only the first optical lens according to actual application requirements. An optical lens 35 may have only the second optical lens 36. Furthermore, if each optical channel 30 only needs to be configured with the first optical lens 35 according to the actual application requirements, the optical module 3 does not need to be provided with the second transparent substrate 32.

Furthermore, the filter substrate 33 has a plurality of filtering units 331 corresponding to the plurality of optical channels 30, and the sensing element 34 has a plurality of sensing units 341 corresponding to the plurality of optical channels 30, respectively. When the light beam enters any optical channel 30, the light beam is sequentially passed through the corresponding first optical lens 35, the corresponding second optical lens 36, and the corresponding filter unit 331 and then projected to the corresponding sensing unit 341. The corresponding sensing unit 341 then senses the light beam projected onto it and outputs a corresponding sensing signal accordingly. Preferably, but not limited to this, each sensing unit 341 may have a resolution of 1.3 mega pixels or more. In the preferred embodiment, since the sensing element 34 has four The sensing unit 341, so the sensing element 34 can have a resolution of 5.2 mega pixels or more.

In addition, each filter unit 331 is used for filtering and filtering the light beams passing through it, so that the light beams incident on the sensing unit 341 are all available light beams. For example, each filter unit 331 may be based on actual applications. Designed to block visible, infrared, near-infrared, and far-infrared light beams At least one of them passes through, and any of the two filter units 331 can also be designed to prevent the same kind of light beams from passing through it or to prevent different types of light beams from passing through it according to specific needs. Secondly, although each optical channel 30 in the preferred embodiment corresponds to a filter unit 331, the above is only an embodiment, and the number of the filter units 331 on the filter substrate 33 is not limited to that of the optical channel 30. The number is the same, that is, in a specific embodiment, the filter substrate 33 does not have a filter unit 331 corresponding to a certain optical channel 30, so the light beam incident on the certain optical channel 30 will then pass through the filter. The substrate 33 is not directly filtered and projected to the corresponding sensing unit 341.

In particular, in the optical module 3 of the present case, different optical treatments can be performed on the light beams incident on different optical channels 30, that is, the first optical lens 35 and the second optical lens in each optical channel 30 36 and the corresponding filter unit 331 and the corresponding sensing unit 341 can be jointly designed to provide a specific optical function according to actual application requirements, and the specific optical function can be, for example, a wide-view camera function and a non-wide-view camera. Camera function, long-distance camera function, close-range camera function, visible light camera function, invisible light camera function or ranging function ... etc. Therefore, the optical module 3 in this case can only perform a one-time shooting operation on the shooting environment, and obtain a variety of optical information from different optical channels 30, and the optical information can be used for subsequent intelligent applications, such as 3D stereo Video applications, pedestrian flow monitoring and / or passenger counting applications, hand gesture recognition applications, etc.

Furthermore, the optical module 3 in this case further includes a first spacer 37, a second spacer 38, and a third spacer 39, and the first spacer 37 is vertically connected to the first transparent substrate 31 and the second transparent In addition to the first light-transmitting substrate 31 and the second light-transmitting substrate 32, the substrates 32 can be vertically spaced apart, and any two adjacent optical channels can be separated. 30, and the second spacer 38 is located between the second light-transmitting substrate 32 and the filter substrate 33 and is vertically connected to the filter substrate 33, which is mainly used to separate any two adjacent filter units 331 to avoid any A filter unit 331 receives the light beam from the optical channel 30 adjacent to it. In addition, the third spacer 39 is disposed between the filter substrate 33 and the sensing element 34 to vertically space the filter substrate 33 and the sensing element 34.

Preferably, but not limited to this, a blocking member 40 is also formed on the outside of the first spacer 37, the second spacer 38, and / or the third spacer 39 to block outside light or foreign objects from entering Optical module 3, and the first spacer 37 can also be directly formed on the first transparent substrate 31 or the second transparent substrate through an embossing process, and the second spacer 38 can also be directly formed through an embossing process. It is formed on the filter substrate 33. Secondly, the optical module 3 in this case further includes a baffle 42 disposed on the first transparent substrate 31, and the baffle 42 can also be formed on the first transparent substrate 31 through an embossing process, mainly It is used to separate any two adjacent optical channels 30 to prevent the light beam from entering from one optical channel 30 to the other adjacent optical channel 30. However, the above is only an embodiment, and the formation methods of the first spacer 37, the second spacer 38, the third spacer 39, and the baffle 42 are not limited to the above.

Please refer to FIG. 6, FIG. 7A to FIG. 7D, FIG. 6 is a schematic diagram of a manufacturing process of the optical module shown in FIG. 3, and FIG. 7A to FIG. 7D are schematic diagrams of execution concepts of steps P1 to P4 shown in FIG. 6, respectively. The manufacturing process of the optical module 3 is as follows. First, step P1 is performed to form a plurality of first optical lenses 35 on the first light-transmitting substrate 31 by an embossing process, and to form a plurality of first optical lenses on the second light-transmitting substrate 32 by an embossing process. A plurality of second optical lenses 36 corresponding to 35 are shown in FIG. 7A; and then step P2 is performed to connect the first transparent substrate 31 and the second transparent substrate 32 with the first spacer 37, and the first interval The member 37 is vertically connected to the first light-transmitting substrate 31 to 7B; and optionally, the first spacer 37 is formed on the first through the embossing process together with the first optical lenses 35 in step P1. The light-transmitting substrate 31 is further connected to the second light-transmitting substrate 32, or is formed on the second light-transmitting substrate 32 through the embossing process together with the second optical lenses 36 in step P1. And further connected to the first transparent substrate 31.

Next, step P3 is performed, and a plurality of connected first light-transmitting substrates 31 and second light-transmitting substrates 32 are disposed above the filter substrate 33, as shown in FIG. 7C, and a plurality of second The light-transmitting substrate 32 is connected to the filter substrate 33; preferably, but not limited to this, before performing the above-mentioned connection operation, each of the first optical lenses may be firstly processed by an Active Alignment process. The second optical lens 36 corresponding to 35 is aligned with the corresponding filter unit 331, so that each first optical lens 35 and its corresponding second optical lens 36 and filter unit 331 form an optical channel 30. The active alignment process of the embodiment includes six-axis automatic alignment: forward and backward movement, sway, heave, roll, pitch, and pan. Pendulum deflection (yaw). In addition, before the above-mentioned active alignment process is performed, a second spacer 38 for separating any two adjacent filter units 331 is first provided on the filter substrate 33, wherein the second spacer 38 can be passed through the embossing process. It is formed on the filter substrate 33.

Next, step P4 is performed to cut the filter substrate 33 to obtain a plurality of lens assemblies 41 each having a plurality of optical channels 30, as shown in FIG. 7D. Preferably, but not limited to this, before performing the above-mentioned cutting action, the front focal length (Front Focal Length) and / or Modulation Transfer Function (MTF) corresponding to each optical channel 30 may be detected first. ) Whether it meets a test standard.

Finally, step P5 is performed to set each lens assembly 41 to the sensor. Above the element 34, each lens assembly 41 is connected to a corresponding sensing element 34 to form an optical module 3 as shown in FIG. 4; preferably, but not limited to, in step P5 The third spacer 39 can be used to vertically space the filter substrate 33 and the sensing element 34, and before performing the above-mentioned connection operation, an active alignment process can be used to align each filter unit 331 with the corresponding one. Sensing unit 341, and the active alignment process of this embodiment includes six-axis automatic alignment: forward and backward movements, sway, lifts, rolls, rolls, Pitch pitch and yaw. In addition, in order to prevent external light or foreign objects from entering the optical module 3, the manufacturing process of the optical module 3 may also be formed outside the first spacer 37, the second spacer 38, and / or the third spacer 39. The blocking member 40, and the above-mentioned action of forming the blocking member 40 may be performed between steps P1 to P5 according to actual manufacturing conditions.

In addition, in order to block the light beam from entering from one optical channel 30 to another adjacent optical channel 30, the manufacturing process of the optical module 3 further includes: providing a first light-transmitting substrate 31 to separate any two adjacent optical channels 30; The buffle 42 of the optical channel 30, and the operation of setting the baffle 42 described above is also performed between steps P1 to P5 according to actual manufacturing conditions. Preferably, but not limited to this, the baffle plate 42 is formed on the first light-transmitting substrate 31 together with the first optical lenses 35 in the step P1 through an embossing process.

In particular, since the plurality of first optical lenses 35 on the first light-transmitting substrate 31 and the plurality of second optical lenses 36 on the second light-transmitting substrate 32 are formed through an embossing process, The manufacturing tolerance can be controlled below 5 micrometers (μm), and any of the first optical lens 35 and any of the second optical lens 36 can have a curved surface composed of multiple radii of curvature. Because manufacturing tolerances can be controlled to 1 micron (μm) Hereinafter, the manufacturing process does not need to perform additional adjustment or compensation of the focal length of each optical channel 30 as in the prior art, which can effectively reduce the manufacturing process and reduce manufacturing time and costs. In addition, based on the advantages described above, the optical module 3 of the present case can also have the effect of minimizing the overall volume when it has multiple optical channels 30 at the same time. The better, but not limited to this, the optical module of the present case The maximum thickness of Group 3 does not exceed 5 mm (mm).

In addition, since the first optical lens 35 and the second optical lens 36 in the optical module 3 of this case are not formed through an injection molding process, the material selectivity thereof is large. In this preferred embodiment, the first optical lens 35 and the second optical lens 36 are formed by a high-temperature-resistant material disposed on the first transparent substrate 31 and the second transparent substrate 32 through an embossing process, And the high temperature resistant material can withstand temperatures exceeding 90 degrees Celsius. The better, but not limited to this, the high temperature resistant material is epoxy resin, and the temperature it can withstand is 260 degrees Celsius. Based on this, when the optical module 3 is in a high-temperature environment, since the first optical lens 35 and the second optical lens 36 can withstand a large temperature without deformation, the imaging quality of the optical module 3 is not affected. Influence, further simplifies the assembling process of assembling the optical module 3 to other electronic devices.

For details, please refer to FIG. 8, FIG. 9A to FIG. 9B, FIG. 8 is a schematic flow chart of soldering the optical module shown in FIG. 3 to the circuit board, and FIGS. 9A to 9B are steps Q2 to Q3 shown in FIG. 8, respectively. Executive concept illustration. When the optical module 3 in this case is to be assembled into an electronic device (not shown), the process of soldering the optical module 2 to the circuit board of the electronic device is as follows; wherein the electronic device may be a portable electronic device, but Not limited to the above. First, step Q1 is performed to provide a circuit board 91, and the circuit board 91 is a component of an electronic device, and is used to process electronic signals of the electronic device. Next, step Q2 is performed to place the optical module 3 and a plurality of electronic components (such as a resistor 92 and a capacitor). 93 or an arithmetic processing chip 94 for performing arithmetic processing on electronic signals is disposed on the plurality of solder pastes 95 of the circuit board 91, as shown in FIG. 9A. Finally, step Q3 is performed, and the optical module 3 and the electronic components are heat-treated with a temperature greater than 90 degrees Celsius to solder the optical module 3 and the electronic components to the circuit board 91, as shown in FIG. 9B; Preferably, but not limited to this, the above-mentioned heat treatment temperature is between 90 ° C and 300 ° C, such as 260 ° C.

According to the above description, it can be known that, because the optical module of this case has the characteristics of high temperature resistance, it can be used with a variety of electronic components (such as resistors, capacitors or arithmetic processing chips used for arithmetic processing of electronic signals) through surface mount soldering technology Surface Mount Technology (SMT) process and soldering to the circuit board, which effectively improves the defects in the prior art that the image capture module needs to be placed on the circuit board through an additional post-processing process, so that the optical module is assembled to the electronic device. The process is simplified.

The above is only a preferred embodiment of this creation and is not intended to limit the scope of patent application for this creation. Therefore, all other equivalent changes or modifications made without departing from the spirit disclosed by this creation should be included in this case. Within the scope of patent application.

Claims (21)

An optical module includes: a first light-transmitting substrate; a plurality of first optical lenses, and the plurality of first optical lenses are formed on the first light-transmitting substrate through an embossing process; a filter substrate, It is disposed below the first light-transmitting substrate, and at least one filter unit corresponding to at least one of the first optical lenses is formed on the filter substrate; and a sensing element is disposed on the filter substrate. A plurality of sensing units corresponding to the plurality of first optical lenses are provided below, and each of the sensing units is configured to sense at least one light beam passing through the corresponding first optical lens and the filter substrate. The optical module according to item 1 of the scope of patent application, further comprising: a second transparent substrate, and the second transparent substrate is located between the first transparent substrate and the filter substrate, or The first transparent substrate is located between the second transparent substrate and the filter substrate; and at least one second optical lens, and the at least one second optical lens is formed on the second through an embossing process. On a light-transmitting substrate. The optical module according to item 2 of the patent application scope further includes a plurality of optical channels, and each of the optical channels has at least one of the first optical lens and the second optical lens. The optical module according to item 2 of the patent application scope further includes a first spacer, and the first spacer is vertically connected between the first transparent substrate and the second transparent substrate. The optical module according to item 4 of the scope of patent application, wherein the first spacer is formed on the first transparent substrate or the second transparent substrate through the embossing process. The optical module according to item 1 of the patent application scope further includes a second spacer, and the at least one filter unit includes a first filter unit and a second filter unit; wherein the second interval The element is vertically connected to the filter substrate, and is used for separating the first filter unit and the second filter unit. The optical module according to item 6 of the patent application scope, wherein the second spacer is formed on the filter substrate through the imprinting process. The optical module according to item 1 of the patent application scope further includes a third spacer, and the third spacer is disposed between the filter substrate and the sensing element to vertically space the filter substrate. And the sensing element. The optical module according to item 1 of the scope of patent application, wherein the maximum thickness of one of the optical modules does not exceed 5 mm (mm). According to the optical module described in the first item of the patent application scope, any one of the first optical lenses has a high temperature resistant material, and one of the high temperature resistant materials can withstand a temperature exceeding 90 degrees Celsius. An optical module includes: a plurality of optical channels, each of which has at least one optical lens, and the at least one optical lens is formed by an imprinting process; a filter substrate is disposed on the plurality of optical channels Below, for filtering the light beam incident on at least one of the optical channels; and a sensing element, which is disposed below the filter substrate and has a plurality of sensing units respectively corresponding to the plurality of optical channels, and Each of the sensing units is configured to sense at least one light beam passing through the corresponding optical channel; wherein the optical module is used to be soldered to a circuit through a Surface Mount Technology (SMT) process On the board. The optical module according to item 11 of the scope of patent application, further comprising: a first light-transmitting substrate disposed above the filter substrate; wherein each of the optical channels has a first optical lens, and The first optical lens in any two of the optical channels is formed on the same first transparent substrate through the imprinting process. The optical module according to item 12 of the scope of patent application, further comprising: a second transparent substrate, which is located between the first transparent substrate and the filter substrate, or is the first transparent substrate The material is located between the second light-transmitting substrate and the filter substrate; wherein at least one optical channel of the plurality of optical channels has a second optical lens, and the second optical lens is formed through the imprinting process. On the second transparent substrate. The optical module according to item 12 of the patent application scope further includes a first spacer, and the first spacer is vertically connected between the first transparent substrate and the second transparent substrate. The optical module according to item 14 of the scope of patent application, wherein the first spacer is formed on the first transparent substrate or the second transparent substrate through the embossing process. The optical module according to item 11 of the patent application scope further includes a second spacer, and the filter substrate includes at least a first filter unit and a second filter unit respectively corresponding to the two optical channels. Wherein, the second spacer is vertically connected to the filter substrate, and is used for separating the first filter unit and the second filter unit. The optical module according to item 16 of the patent application scope, wherein the second spacer is formed on the filter substrate through the imprinting process. The optical module according to item 11 of the patent application scope further includes a third spacer, and the third spacer is disposed between the filter substrate and the sensing element to vertically space the filter substrate. And the sensing element. The optical module according to item 11 of the scope of patent application, wherein the maximum thickness of one of the optical modules does not exceed 5 mm (mm). The optical module according to item 11 of the scope of patent application, wherein the at least one optical lens has a high temperature resistant material, and one of the high temperature resistant materials can withstand a temperature exceeding 90 degrees Celsius. The optical module according to item 11 of the scope of patent application, wherein the circuit board is disposed in a portable electronic device.