CN112394426A

CN112394426A - Optical module, manufacturing method thereof and method for welding optical module on circuit board

Info

Publication number: CN112394426A
Application number: CN201910745944.4A
Authority: CN
Inventors: 程章金
Original assignee: Barzini Capital Pte Ltd
Current assignee: Chaoying Optical Technology Pte. Ltd.
Priority date: 2019-08-13
Filing date: 2019-08-13
Publication date: 2021-02-23

Abstract

The invention provides an optical module, a manufacturing method thereof and a method for welding the optical module on a circuit board. The optical module comprises a plurality of optical channels, a filter substrate arranged below the optical channels and a sensing element arranged below the filter substrate, wherein each optical channel is provided with at least one optical lens formed by an imprinting process, the sensing element is provided with a plurality of sensing units respectively corresponding to the optical channels, and each sensing unit is used for sensing light beams passing through the corresponding optical channel. In addition, the invention also provides a manufacturing method and a welding method of the optical module. The invention can effectively control the manufacturing tolerance of the optical lens, thereby effectively simplifying the manufacturing process and reducing the manufacturing time and cost.

Description

Optical module, manufacturing method thereof and method for welding optical module on circuit board

Technical Field

The present invention relates to the field of optics, and more particularly, to an optical module, a method for manufacturing the optical module, and a method for soldering the optical module to a circuit board.

Background

In recent years, with the evolution of the electronic industry and the vigorous development of industrial technologies, the trend of designing and developing various electronic devices is gradually developing in a direction of being portable and easy to carry, so that users can apply to mobile commerce, entertainment, leisure and other purposes anytime and anywhere. For example, various image capturing modules are widely used in various fields, such as portable electronic devices, such as smart phones and wearable electronic devices, which have the advantages of small size and portability, so that people can capture and store images at any time when they have a need, or upload the images to the internet through a mobile network, which not only has important commercial value, but also adds color to the daily life of the general public.

Please refer to fig. 1, which is a schematic structural diagram of a conventional image capturing module. The conventional image capturing module 1 includes an optical lens assembly 11, a sensing device 12, a fixing base (barrel)13 for fixing the optical lens assembly 11, and a housing 14 for carrying each device; the optical lens assembly 11 includes a plurality of optical lenses 111 stacked along the optical axis 15, and the sensing element 12 is used for sensing light beams from outside the image capturing device 1 and passing through the optical lens assembly 11, and further outputting a sensing signal for obtaining an image. However, the image capturing module 1 shown in fig. 1 can capture only a single image in a one-time capturing process, and in order to overcome this drawback, the conventional technology mainly focuses and arranges a plurality of optical lens assemblies 11 so as to capture a plurality of images in a same time interval.

In detail, please refer to fig. 2, which is a schematic structural diagram of a conventional image capturing module implemented in an array format. Fig. 2 illustrates that the image capturing module 2 includes a plurality of optical lens assemblies 11 arranged in an array, a plurality of sensing elements (not shown) respectively corresponding to the plurality of optical lens assemblies 11, and a frame 21 for fixing the plurality of optical lens assemblies 11 and the plurality of sensing elements. In the process of capturing images by the image capturing module 2, each sensing device generates a sensing signal after sensing the light beam passing through the corresponding optical lens assembly 11, and the sensing signals generated by the sensing devices can be respectively transmitted to a back-end processor (not shown) for integration, thereby fulfilling various application requirements, such as synthesizing 3D stereoscopic images.

It should be noted that, in the process of manufacturing the image capturing

module

1 or 2 shown in fig. 1 or 2, each optical lens 111 is limited to be manufactured by injection molding, which results in a manufacturing tolerance of more than several tens of micrometers (μm), and inevitable changes and uncertainties occur in the process of assembling the optical lens assembly 11 by stacking a plurality of optical lenses 111, so that the focal plane of the assembled optical lens assembly 11 is easily deviated from the sensing plane of the sensing element 12, which results in poor image quality. In view of the above, various methods for adjusting and compensating the focal length are proposed, such as those disclosed in U.S. Pat. nos. US9595553 and US 9880391. However, the focus adjustment and compensation methods are performed by micromachining technology, which still has limited effects for reducing the manufacturing tolerance and increasing the yield, and means that an additional machining tool for micromachining needs to be added to the production line, thereby increasing the manufacturing cost of the

image capturing modules

1 and 2 and also prolonging the manufacturing time.

Furthermore, since the conventional optical lens 111 is manufactured by injection molding, the material selectivity is low, and the heat resistance of the usable material is low, generally, if the image capturing

module

1, 2 is in an environment with a temperature greater than 80 ℃, the optical lens 111 will deform to cause the image to have nonlinear change, and the nonlinear change is not easily compensated and corrected. On the other hand, if the

image capturing modules

1 and 2 are to be assembled into an electronic device (e.g., a portable electronic device), the

image capturing modules

1 and 2 cannot be disposed on a circuit board of the electronic device together with other electronic components (e.g., resistors, capacitors, chips, etc.) through the same process, because the process of soldering the other electronic components (e.g., resistors, capacitors, chips, etc.) to the circuit board requires a high temperature environment greater than 80 ℃. Therefore, the

image capturing modules

1 and 2 are mounted on the circuit board after other electronic components (such as resistors, capacitors, chips, etc.) are soldered to the circuit board and then subjected to another post-processing process. Therefore, the process of assembling the conventional

image capturing modules

1 and 2 to the electronic device is very complicated.

According to the above description, the conventional image capturing module and the manufacturing method thereof have room for improvement.

Disclosure of Invention

The present invention is directed to an optical module, which is formed by an imprinting process and can effectively control manufacturing tolerance, thereby effectively simplifying the manufacturing process and reducing the manufacturing time and cost.

The present invention provides a method for manufacturing the optical module and a method for soldering to a circuit board, which are directed to the above-mentioned shortcomings of the prior art.

The technical solution adopted to solve the technical problems of the present invention is to provide an optical module, comprising: the optical filter comprises a first light-transmitting base material, a plurality of first optical lenses, a filter substrate and a sensing element, wherein the first optical lenses are formed on the first light-transmitting base material through an imprinting process; the light filtering substrate is arranged below the first light-transmitting base material, and at least one light filtering unit corresponding to at least one first optical lens is formed on the light filtering substrate; the sensing element is arranged below the filtering substrate and is provided with a plurality of sensing units respectively corresponding to the first optical lenses, and each sensing unit is used for sensing at least one light beam passing through the corresponding first optical lens and the filtering substrate.

Preferably, the optical module further includes a second transparent substrate and at least a second optical lens, the second transparent substrate is located between the first transparent substrate and the filter substrate, or the first transparent substrate is located between the second transparent substrate and the filter substrate; the at least one second optical lens is formed on the second transparent substrate through an imprinting process.

Preferably, the optical module further includes a plurality of optical channels, and each of the optical channels has at least one of the first optical lens and the second optical lens therein.

Preferably, the optical module further includes a first spacer vertically connected between the first transparent substrate and the second transparent substrate.

Preferably, the first spacer is formed on the first transparent substrate or the second transparent substrate by the imprinting process.

Preferably, the optical module further includes a second spacer, and the at least one filtering unit includes a first filtering unit and a second filtering unit; the second spacer is vertically connected to the filter substrate and used for separating the first filter unit from the second filter unit.

Preferably, the second spacer is formed on the filter substrate through the imprinting process.

Preferably, the optical module further includes a third spacer disposed between the filter substrate and the sensing device for vertically spacing the filter substrate and the sensing device.

Preferably, the maximum thickness of the optical module is no more than 5 millimeters (mm).

Preferably, any one of the first optical lenses has a high temperature resistant material, and a tolerable temperature of the high temperature resistant material exceeds 90 ℃.

The invention also provides an optical module, which comprises a plurality of optical channels, a filter substrate and a sensing element, wherein each optical channel is provided with at least one optical lens, and the at least one optical lens is formed by an imprinting process; the filtering substrate is arranged below the plurality of optical channels and is used for filtering light beams entering at least one optical channel; the sensing element is arranged below the filtering substrate and is provided with a plurality of sensing units respectively corresponding to the plurality of optical channels, and each sensing unit is used for sensing at least one light beam passing through the corresponding optical channel; the optical module is used for being soldered on a circuit board through a Surface Mount Technology (SMT) process.

Preferably, the optical module further includes a first transparent substrate disposed above the filter substrate; wherein each optical channel has a first optical lens, and the first optical lenses in any two optical channels are formed on the same first transparent substrate by the imprinting process.

Preferably, the optical module further includes a second transparent substrate located between the first transparent substrate and the filter substrate, or the first transparent substrate is located between the second transparent substrate and the filter substrate; wherein at least one of the plurality of optical channels has a second optical lens formed on the second transparent substrate by the imprinting process.

Preferably, the optical module further includes a second spacer, and the filter substrate includes at least a first filter unit and a second filter unit respectively corresponding to the two optical channels; the second spacer is vertically connected to the filter substrate and is used for separating the first filter unit from the second filter unit.

Preferably, the at least one optical lens is made of a high temperature resistant material, and a tolerable temperature of the high temperature resistant material exceeds 90 ℃.

Preferably, the circuit board is disposed in a portable electronic device.

The invention also provides a manufacturing method of the optical module, which comprises the following steps:

(A) forming at least one optical lens on at least one transparent substrate by using an imprinting process;

(B) arranging the at least one light-transmitting base material above a light-filtering substrate and connecting the at least one light-transmitting base material and the light-filtering substrate; and

(C) the filter substrate is arranged above a sensing element and connected with the filter substrate and the sensing element.

Preferably, the step (a) includes:

(A1) a plurality of first optical lenses are formed on a first transparent substrate by the imprinting process, and at least one second optical lens corresponding to at least one first optical lens is formed on a second transparent substrate by the imprinting process.

Preferably, the method for manufacturing an optical module further comprises, between the step (a) and the step (B):

connecting the first transparent substrate and the second transparent substrate by using a first spacer; the first spacer is vertically connected between the first transparent substrate and the second transparent substrate.

Preferably, the step (a1) further includes:

the first spacer is formed on the first transparent substrate or the second transparent substrate by the imprinting process.

Preferably, the method for manufacturing an optical module further comprises:

a blocking member for blocking the light beam is formed outside the first spacer.

Preferably, the method for manufacturing an optical module further comprises, before the step (B):

disposing a second spacer on the filter substrate; the second spacer is used for separating two adjacent filtering units of the filtering substrate.

Preferably, the method for manufacturing an optical module further comprises:

the second spacer is formed on the filter substrate by an imprint process.

Preferably, the step (B) includes:

before connecting the at least one light-transmitting substrate and the filter substrate, aligning the at least one optical lens to the at least one filter unit of the filter substrate by using an Active Alignment process; wherein, each filtering unit and the corresponding at least one optical lens form an optical channel.

Preferably, the method for manufacturing an optical module further comprises, between the step (B) and the step (C):

a Front Focal Length (Front Focal Length) and/or a Modulation Transfer Function (MTF) corresponding to each optical channel is detected.

the filter substrate is cut to obtain a plurality of lens assemblies, and each lens assembly is provided with a plurality of optical channels.

Preferably, the step (C) includes:

the filter substrate and the sensing element are vertically spaced by a third spacer.

Preferably, the method for manufacturing an optical module further comprises:

a blocking member for blocking the light beam is formed outside the third spacer.

Preferably, the step (C) includes:

before connecting the filtering substrate and the sensing element, an Active Alignment (Active Alignment) process is used to align at least one filtering unit of the filtering substrate with at least one sensing unit of the sensing element.

The invention also provides a method for welding the optical module on the circuit board, which comprises the following steps:

providing a circuit board;

respectively arranging the optical module and a plurality of electronic elements on a plurality of solder pastes of the circuit board; and

the optical module and the electronic components are thermally processed at a temperature higher than 90 ℃ to be soldered on the circuit board.

Preferably, the temperature is between 90 degrees celsius and 300 degrees celsius.

Preferably, the plurality of electronic components include an arithmetic processing chip electrically connected to the optical module for performing arithmetic processing on an electronic signal output by the sensing component.

The optical lens of the optical module of the present invention is formed by imprinting and the optical module has a plurality of optical channels to provide a plurality of optical functions. Because the optical lens of the optical module is formed by the coining process, the invention can effectively control the manufacturing tolerance of the optical lens, thereby effectively simplifying the manufacturing process and reducing the manufacturing time and cost; the optical module can miniaturize the whole volume under the condition of simultaneously having a plurality of optical channels; moreover, the optical module of the present invention can be formed by a high temperature resistant material and has a high temperature resistant characteristic, so that the optical module can be soldered on a circuit board together with other electronic components through a Surface Mount Technology (SMT) process, thereby effectively improving the defect that the image capturing module in the prior art needs to be disposed on the circuit board through an additional post-processing process, and simplifying the process of assembling the optical module to the electronic device.

Drawings

FIG. 1: is a structural schematic diagram of the conventional image capturing module.

FIG. 2: is a structural schematic diagram of an image capturing module implemented in an array form.

FIG. 3: the optical module of the present invention is schematically illustrated in an appearance structure of a preferred embodiment.

FIG. 4: is a conceptual sectional view of a portion of the optical module along the line L-L in FIG. 3.

FIG. 5: is a conceptual diagram of the sensing plane of the sensing element shown in fig. 4.

FIG. 6: is a block flow diagram of the manufacturing method of the optical module of the present invention.

FIG. 7A: is a conceptual diagram illustrating the implementation of step P1 shown in fig. 6.

FIG. 7B: is a conceptual diagram illustrating the implementation of step P2 shown in fig. 6.

FIG. 7C: is a conceptual diagram illustrating the implementation of step P3 shown in fig. 6.

FIG. 7D: is a conceptual diagram illustrating the implementation of step P4 shown in fig. 6.

FIG. 8: is a preferred block flow diagram of the soldering method of the optical module of the present invention.

FIG. 9A: is a conceptual diagram illustrating the implementation of step Q2 shown in fig. 8.

FIG. 9B: is a conceptual diagram illustrating the implementation of step Q3 shown in fig. 8.

Detailed Description

Embodiments of the present invention will be further explained by the following description in conjunction with the related drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and thickness may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are in a form known to those of ordinary skill in the art. Various changes and modifications may be suggested to one skilled in the art based on the teachings herein.

Referring to fig. 3-5, fig. 3 is an external structural view of an optical module according to a preferred embodiment of the invention, fig. 4 is a schematic partial structural cross-sectional view of the optical module shown in fig. 3 along a sectional line L-L, and fig. 5 is a schematic view of a sensing plane of the sensing element shown in fig. 4. The optical module 3 includes a first transparent substrate 31, a second transparent substrate 32, a filter substrate 33 and a sensor 34 in sequence from top to bottom, wherein the first transparent substrate 31 has a plurality of first optical lenses 35 formed on an upper surface and/or a lower surface of the first transparent substrate 31 by an imprinting process, and the second transparent substrate 32 has a plurality of second optical lenses 36 formed on an upper surface and/or a lower surface of the second transparent substrate 32 by an imprinting process.

Further, the optical module 3 includes a plurality of optical channels 30, and each of the optical channels 30 has a first optical lens 35 and a second optical lens 36 stacked on each other. Preferably, but not limited thereto, the optical channels 30 of the optical module 3 are arranged in a matrix, such as a 2 × 2 array shown in fig. 3, and thus the optical module 3 of the preferred embodiment is an optical module with a multi-lens array (multi-lens array). In addition, although each optical channel 30 in the preferred embodiment has the first optical lens 35 and the second optical lens 36, one of ordinary skill in the art can modify the design to have only the first optical lens 35 or only the second optical lens 36 according to the actual application requirement. Furthermore, if only the first optical lens 35 is required to be disposed in each optical channel 30 according to practical application requirements, the second transparent substrate 32 is not required to be disposed in the optical module 3.

Furthermore, the filter substrate 33 has a plurality of filter units 331 respectively corresponding to the plurality of optical channels 30, and the sensing element 34 has a plurality of sensing units 341 respectively corresponding to the plurality of optical channels 30. After the light beam enters any optical channel 30, the light beam sequentially passes through the corresponding first optical lens 35, the corresponding second optical lens 36 and the corresponding filtering unit 331 and then is projected to the corresponding sensing unit 341, and the corresponding sensing unit 341 senses the light beam projected thereon and outputs a corresponding sensing signal accordingly. Preferably, but not limited thereto, each sensing unit 341 can have a resolution of more than 1.3 mega pixels (mega pixels), and in the preferred embodiment, the sensing element 34 can have a resolution of more than 5.2 mega pixels (mega pixels) because the sensing element 34 has 4 sensing units 341.

In addition, each filtering unit 331 is used for filtering and screening the light beams passing through it, so that the light beams incident to the sensing unit 341 are all available light beams; for example, each of the filter units 331 may be designed to block at least one of visible light beams, infrared light beams, near-infrared light beams and far-infrared light beams from passing therethrough according to practical application requirements, and any two of the filter units 331 may also be designed to block the same kind of light beams from passing therethrough or block different kinds of light beams from passing therethrough respectively according to specific requirements. Furthermore, although each optical channel 30 in the preferred embodiment corresponds to one filter unit 331, the above embodiments are only examples, and the number of the filter units 331 on the filter substrate 33 is not limited to be the same as the number of the optical channels 30, that is, in a specific embodiment, the filter substrate 33 does not have the filter units 331 corresponding to a certain optical channel 30, so that the light beam incident to the certain optical channel 30 passes through the filter substrate 33 but is not filtered and screened and is directly projected to the corresponding sensing unit 341.

It should be noted that, in the optical module 3 of the present invention, different optical processing can be performed on the light beams incident to different optical channels 30, that is, the first optical lens 35, the second optical lens 36, the corresponding filter unit 331 and the corresponding sensor unit 341 in each optical channel 30 can be configured and designed according to practical application requirements to provide specific optical functions, such as a wide-angle camera function, a non-wide-angle camera function, a long-distance camera function, a short-distance camera function, a visible light camera function, an invisible light camera function, or a distance measurement function. Therefore, the optical module 3 of the present invention can only perform a one-time shooting operation on the shooting environment to obtain a plurality of optical information from different optical channels 30, and the optical information can be used for performing various intelligent applications, such as 3D stereoscopic image application, people flow monitoring and/or passenger flow counting application, hand gesture recognition application, and the like.

Furthermore, the optical module 3 of the present invention further includes a first spacer 37, a second spacer 38 and a third spacer 39, wherein the first spacer 37 is vertically connected between the first transparent base material 31 and the second transparent base material 32, and can vertically space the first transparent base material 31 and the second transparent base material 32, and can also space any two adjacent optical channels 30, and the second spacer 38 is located between the second transparent base material 32 and the filter substrate 33 and vertically connected to the filter substrate 33, and is mainly used for separating any two adjacent filter units 331, so as to prevent any filter unit 331 from receiving the light beam of the optical channel 30 adjacent thereto. In addition, a third spacer 39 is disposed between the filter substrate 33 and the sensing element 34 for vertically spacing the filter substrate 33 and the sensing element 34.

Preferably, but not limited thereto, a blocking member 40 is further formed outside the first spacer 37, the second spacer 38 and/or the third spacer 39 for blocking external stray light or foreign matter from entering the optical module 3, the first spacer 37 may also be directly formed on the first transparent base material 31 or the second transparent substrate 32 through an imprinting process, and the second spacer 38 may also be directly formed on the filter substrate 33 through an imprinting process. Next, the optical module 3 of the present invention further includes a baffle (42) disposed on the first transparent substrate 31, and the baffle 42 can also be formed on the first transparent substrate 31 by an imprint process, and is mainly used to separate any two adjacent optical channels 30, so as to prevent light beams from being incident from one optical channel 30 to another adjacent optical channel 30. However, the above is merely an example, and the formation method of the first spacer 37, the second spacer 38, the third spacer 39, and the baffle 42 is not limited to the above.

In summary, the present invention provides a method for manufacturing an optical module. Referring to fig. 6 and fig. 7A to 7D, fig. 6 is a schematic block flow diagram illustrating a method for manufacturing an optical module 3 according to the present invention, and fig. 7A to 7D are schematic diagrams illustrating the implementation concepts of step P1 to step P4 shown in fig. 6, respectively. The manufacturing method of the optical module of the present invention is as follows. First, step P1 is executed to form a plurality of first optical lenses 35 on the first transparent substrate 31 by an imprint process, and form a plurality of second optical lenses 36 corresponding to the plurality of first optical lenses 35 on the second transparent substrate 32 by an imprint process, as shown in fig. 7A; step P2 is performed again, the first transparent substrate 31 and the second transparent substrate 32 are connected by the first spacer 37, and the first spacer 37 is vertically connected between the first transparent substrate 31 and the second transparent substrate 32, as shown in fig. 7B; alternatively, the first spacer 37 is formed on the first transparent substrate 31 together with the first optical lens 35 by the imprinting process in step P1 and then connected to the second transparent substrate 32, or is formed on the second transparent substrate 32 together with the second optical lens 36 by the imprinting process in step P1 and then connected to the first transparent substrate 31.

Next, step P3 is executed, the plurality of connected first transparent substrates 31 and second transparent substrates 32 are disposed above the filter substrate 33, as shown in fig. 7C, and the plurality of second transparent substrates 32 are connected to the filter substrate 33; preferably, but not limited to this, before the connecting operation is performed, an Active Alignment (Active Alignment) process may be used to align each first optical lens 35 and the corresponding second optical lens 36 with the corresponding filter unit 331, so that each first optical lens 35 and the corresponding second optical lens 36 and filter unit 331 form an optical channel 30, and the Active Alignment process of the embodiment includes six-axis automatic Alignment: fore-aft pitch (sweep), side-to-side yaw (sway), heave (heave), roll (roll), pitch (pitch), and yaw (yaw). In addition, before the active alignment process is performed, a second spacer 38 for separating any two adjacent filter cells 331 is disposed on the filter substrate 33, wherein the second spacer 38 may be formed on the filter substrate 33 by an imprint process.

Next, step P4 is executed to cut the filter substrate 33 to obtain a plurality of lens assemblies 41 respectively having a plurality of optical channels 30, as shown in fig. 7D. Preferably, but not limited thereto, before the cutting operation, it is detected whether the Front Focal Length (Front Focal Length) and/or the Modulation Transfer Function (MTF) corresponding to each optical channel 30 meets a detection criterion.

Finally, step P5 is executed to dispose each lens assembly 41 above the sensing element 34, and connect each lens assembly 41 and the corresponding sensing element 34 to form the optical module 3 shown in fig. 4; preferably, but not limited thereto, in step P5, the filter substrate 33 and the sensing elements 34 may be vertically spaced by the third spacers 39, and before the connection operation, each filter unit 331 may be aligned to the corresponding sensing unit 341 by an Active Alignment (Active Alignment) process, where the Active Alignment process of the embodiment includes six-axis auto-Alignment: fore-aft pitch (sweep), side-to-side yaw (sway), heave (heave), roll (roll), pitch (pitch), and yaw (yaw). In addition, in order to block the stray light or the foreign matter from entering the optical module 3, the method for manufacturing the optical module 3 according to the present invention may further include forming a blocking member 40 outside the first spacer 37, the second spacer 38 and/or the third spacer 39, and the operation of forming the blocking member 40 may be performed between the step P1 and the step P5 according to actual manufacturing conditions.

In addition, in order to block the light beam from entering from one optical channel 30 to another adjacent optical channel 30, the method for manufacturing the optical module 3 of the present invention further includes: a baffle (buffer) 42 for separating any two adjacent optical channels 30 is disposed on the first transparent substrate 31, and the operation of disposing the baffle 42 is also performed between the step P1 and the step P5 according to the actual manufacturing situation. Preferably, but not limited thereto, the baffle 42 is formed on the first transparent substrate 31 together with the first optical lens 35 through an imprinting process in step P1.

Specifically, since the first optical lenses 35 on the first transparent substrate 31 and the second optical lenses 36 on the second transparent substrate 32 are formed by the imprinting process, the manufacturing tolerance can be controlled below 5 micrometers (μm), and any one of the first optical lenses 35 and any one of the second optical lenses 36 can have curved surfaces with various radii of curvature. Since the manufacturing tolerance can be controlled below 1 micrometer (μm), the focus adjustment or compensation of each optical channel 30 is not required in the manufacturing process as in the prior art, thereby effectively simplifying the manufacturing process and reducing the manufacturing time and cost. In addition, based on the above advantages, the optical module 3 of the present invention can have the effect of miniaturizing the overall volume under the condition of having a plurality of optical channels 30, and preferably, but not limited thereto, the maximum thickness of the optical module 3 of the present invention is not more than 5 millimeters (mm).

In addition, since the first optical lens 35 and the second optical lens 36 in the optical module 3 of the present invention are not formed by an injection molding process, the material selectivity is high. In the preferred embodiment, the first optical lens 35 and the second optical lens 36 are formed by a high temperature resistant material disposed on the first transparent substrate 31 and the second transparent substrate 32 respectively through a stamping process, and the high temperature resistant material can withstand a temperature exceeding 90 ℃. Preferably, but not limited thereto, the refractory material is epoxy resin and can withstand a temperature of 260 ℃. Therefore, when the optical module 3 is in a high temperature environment, the first optical lens 35 and the second optical lens 36 can withstand a higher temperature without deformation, so that the imaging quality of the optical module 3 is not affected, and further, the assembly process of the optical module 3 to other electronic devices is simplified.

In detail, please refer to fig. 8 and fig. 9A-9B, wherein fig. 8 is a schematic block flow diagram illustrating a method for soldering an optical module to a circuit board according to the present invention, and fig. 9A-9B are schematic diagrams illustrating the implementation concept of step Q2-step Q3 shown in fig. 8, respectively. When the optical module 3 is to be assembled into an electronic device (not shown), the present invention provides a method for soldering the optical module to a circuit board as follows; the electronic device may be, for example, a portable electronic device, but not limited to the foregoing. First, step Q1 is executed to provide a circuit board 91, where the circuit board 91 is a component of an electronic device for processing electronic signals of the electronic device. Next, step Q2 is executed to dispose the optical module 3 and a plurality of electronic components (such as the resistor 92, the capacitor 93 or the processor chip 94 for processing electronic signals) on a plurality of solder pastes 95 of the circuit board 91, as shown in fig. 9A. Finally, step Q3 is executed to perform a heat treatment on the optical module 3 and the electronic components at a temperature greater than 90 degrees celsius to solder the optical module 3 and the electronic components onto the circuit board 91, as shown in fig. 9B; preferably, but not limited thereto, the temperature for performing the heat treatment is between 90 ℃ and 300 ℃, such as 260 ℃.

As can be seen from the above description, the optical module of the present invention can be formed of a high temperature resistant material and has a high temperature resistant characteristic, so that the optical module can be soldered to a circuit board together with various electronic components (such as resistors, capacitors, or an operation processing chip for performing operation processing on electronic signals) through a Surface Mount Technology (SMT) process, thereby effectively improving the defect that the image capturing module in the prior art needs to be disposed on the circuit board through an additional post-processing process, and simplifying the process of assembling the optical module to an electronic device.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the claims, therefore, all equivalent changes and modifications without departing from the spirit of the present invention should be included in the scope of the present invention.

Claims

1. An optical module, comprising:

a first light-transmitting substrate;

a plurality of first optical lenses formed on the first transparent substrate through an imprinting process;

a light filtering substrate arranged below the first light-transmitting base material, and at least one light filtering unit corresponding to at least one first optical lens is formed on the light filtering substrate; and

the sensing element is arranged below the filtering substrate and is provided with a plurality of sensing units respectively corresponding to the first optical lenses, and each sensing unit is used for sensing at least one light beam passing through the corresponding first optical lens and the filtering substrate.

2. The optical module of claim 1 further comprising:

the second light-transmitting base material is positioned between the first light-transmitting base material and the light-filtering substrate, or the first light-transmitting base material is positioned between the second light-transmitting base material and the light-filtering substrate; and

at least one second optical lens formed on the second transparent substrate by the imprinting process.

3. The optical module of claim 2 further comprising a plurality of optical channels, each of the optical channels having at least one of a first optical lens and a second optical lens therein.

4. The optical module of claim 2 further comprising a first spacer, wherein the first spacer is vertically connected between the first transparent substrate and the second transparent substrate.

5. The optical module of claim 4 wherein the first spacer is formed on the first transparent substrate or the second transparent substrate by the imprinting process.

6. The optical module of claim 1 further comprising a second spacer, and the at least one filter cell comprises a first filter cell and a second filter cell; the second spacer is vertically connected to the filter substrate and used for separating the first filter unit from the second filter unit.

7. The optical module of claim 6 wherein the second spacers are formed on the filter substrate by the imprinting process.

8. The optical module of claim 1 further comprising a third spacer disposed between the filter substrate and the sensing device for vertically spacing the filter substrate and the sensing device.

9. The optical module of claim 1 wherein the maximum thickness of the optical module is no more than 5 mm.

10. The optical module of claim 1 wherein any of the first optical lenses comprises a refractory material, and a tolerable temperature of the refractory material exceeds 90 ℃.

11. An optical module, comprising:

a plurality of optical channels, each of the optical channels having at least one optical lens formed by an imprint process;

the filtering substrate is arranged below the plurality of optical channels and is used for filtering light beams entering at least one optical channel; and

a sensing element disposed below the filter substrate and having a plurality of sensing units respectively corresponding to the plurality of optical channels, each sensing unit being configured to sense at least one light beam passing through the corresponding optical channel;

the optical module is used for being welded on a circuit board through a surface-mount technology process.

12. The optical module of claim 11 further comprising:

a first light-transmitting substrate arranged above the light-filtering substrate; wherein each optical channel has a first optical lens, and the first optical lenses in any two optical channels are formed on the same first transparent substrate by the imprinting process.

13. The optical module of claim 12 further comprising:

the second light-transmitting base material is positioned between the first light-transmitting base material and the light-filtering substrate, or the first light-transmitting base material is positioned between the second light-transmitting base material and the light-filtering substrate; wherein at least one of the plurality of optical channels has a second optical lens formed on the second transparent substrate by the imprinting process.

14. The optical module of claim 13 further comprising a first spacer, wherein the first spacer is vertically connected between the first transparent substrate and the second transparent substrate.

15. The optical module of claim 14 wherein the first spacer is formed on the first transparent substrate or the second transparent substrate by the imprinting process.

16. The optical module of claim 11 further comprising a second spacer, wherein the filter substrate comprises a first filter unit and a second filter unit corresponding to two of the optical channels, respectively; the second spacer is vertically connected to the filter substrate and is used for separating the first filter unit from the second filter unit.

17. The optical module of claim 16 wherein the second spacers are formed on the filter substrate by the imprinting process.

18. The optical module of claim 11 further comprising a third spacer disposed between the filter substrate and the sensing device for vertically spacing the filter substrate and the sensing device.

19. The optical module of claim 11 wherein the maximum thickness of the optical module is no more than 5 mm.

20. The optical module of claim 11 wherein the at least one optical lens comprises a refractory material and a sustainable temperature of the refractory material exceeds 90 ℃.

21. The optical module of claim 11, wherein the circuit board is disposed in a portable electronic device.

22. A method of manufacturing an optical module, comprising:

23. The method of manufacturing an optical module according to claim 22, wherein the step (a) comprises:

24. The method of claim 23, further comprising, between step (a) and step (B):

25. The method of manufacturing an optical module according to claim 24, wherein the step (a1) further comprises:

26. The method of manufacturing an optical module according to claim 24, further comprising:

27. The method of claim 22, further comprising, before the step (B):

28. The method of manufacturing an optical module according to claim 27, further comprising:

the second spacer is formed on the filter substrate by an imprint process.

29. The method of manufacturing an optical module according to claim 22, wherein the step (B) comprises:

before connecting the at least one light-transmitting base material and the light-filtering substrate, utilizing an active alignment process to align the at least one optical lens to at least one light-filtering unit of the light-filtering substrate; wherein, each filtering unit and the corresponding at least one optical lens form an optical channel.

30. The method of claim 29, further comprising, between step (B) and step (C):

a front focal length and/or a modulation transfer function corresponding to each optical channel is detected.

31. The method of claim 29, further comprising, between step (B) and step (C):

32. The method of manufacturing an optical module according to claim 22, wherein the step (C) comprises:

33. The method of manufacturing an optical module according to claim 32, further comprising:

34. The method of manufacturing an optical module according to claim 22, wherein the step (C) comprises:

before connecting the filtering substrate and the sensing element, at least one filtering unit of the filtering substrate is aligned to at least one sensing unit of the sensing element by using an active alignment process.

35. A method of soldering an optical module according to claim 11 to a circuit board, comprising:

providing a circuit board;

36. The method of claim 35, wherein the temperature is between 90 degrees celsius and 300 degrees celsius.

37. The method of claim 35, wherein the plurality of electronic components includes an arithmetic processing chip electrically connected to the optical module for processing the electronic signals outputted from the sensing element.