TWM585676U - Light-heating curing apparatus - Google Patents

Light-heating curing apparatus Download PDF

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Publication number
TWM585676U
TWM585676U TW108208751U TW108208751U TWM585676U TW M585676 U TWM585676 U TW M585676U TW 108208751 U TW108208751 U TW 108208751U TW 108208751 U TW108208751 U TW 108208751U TW M585676 U TWM585676 U TW M585676U
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Taiwan
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light
coating
light source
source module
curing
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TW108208751U
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Chinese (zh)
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許俊榮
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新代科技股份有限公司
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Publication of TWM585676U publication Critical patent/TWM585676U/en

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Abstract

A light-heating curing apparatus includes a coating device, a light source module and a supporting platform. Heat-curing glue is coated along a coating path by the coating device, wherein the coating path is located on a coating surface. The light source module emits a light ray to the heat-curing glue. The coating device is connected to the supporting platform, wherein the light source module is mounted on the supporting platform. When the light-heating curing apparatus is working, the coating device and the light source module are carried by the supporting platform to move along the coating path, and the light source module further emits the light ray back and forth along a scanning direction. The light-heating curing apparatus of the utility model can decrease switching time between the light source module and the coating device, and curing process can be controlled precisely.

Description

光加熱固化裝置Light heating curing device

本創作是有關於一種光加熱固化裝置,尤其是有關於一種減少切換光源模組與塗布裝置的時間的光加熱固化裝置。The present invention relates to a light heating and curing device, and more particularly to a light heating and curing device that reduces the time for switching between a light source module and a coating device.

光加熱固化裝置在工業上的應用相當廣泛,舉凡IC封裝、LCD框膠、LED封裝、LED灌膠、電腦手機外殼封裝、筆記型電腦膠合、印刷電路板的組裝或是各種元件之間的膠合等,而隨著電子產業的日益進展,業界對於這種光加熱固化裝置的精確度要求也日益提升。Light heating curing devices are widely used in industry, such as IC packaging, LCD frame adhesive, LED packaging, LED potting, computer mobile phone casing packaging, notebook computer gluing, printed circuit board assembly or gluing between various components. With the increasing progress of the electronics industry, the industry's requirements for the accuracy of such light heating and curing devices have also increased.

現有的光加熱固化裝置主要可分為塗膠與固化兩道程序,這兩道程序必須分別透過塗布裝置與光源模組實施,因此在整個工作過程中這兩道程序必須分別進行,也就是說當塗膠程序進行後,需要經過裝置的切換才可繼續進行固化程序,如此將會大幅拉長光加熱固化工作的時間。The existing light heating curing device can be mainly divided into two procedures: gluing and curing. These two procedures must be implemented through the coating device and the light source module respectively. Therefore, these two procedures must be performed separately during the entire work process, that is, After the gluing process is performed, the device needs to be switched before the curing process can be continued, which will greatly lengthen the time of light heating and curing work.

而現有的固化程序又可分為兩種形式,第一種是控制光源裝置沿著熱固化膠的塗布路徑照射熱固化膠使其固化,然而當熱固化膠的塗布路徑較為複雜時,此種固化方法也會大幅拉長光加熱固化工作的時間;另一種則是採用大型的固化裝置(例如面狀或線狀光源)同時照射一區域中塗布的所有熱固化膠,然而此種方法容易造成光能量的分散與浪費,且由於光能量無法集中,極有可能需要重複照射熱固化膠才能完成固化程序,因此工作時間也會大幅拉長。The existing curing process can be divided into two forms. The first is to control the light source device to irradiate the thermosetting glue along the coating path of the thermosetting glue to cure it. However, when the coating path of the thermosetting glue is more complicated, this kind of The curing method will also greatly lengthen the working time of light heating curing; the other is to use a large curing device (such as a planar or linear light source) to irradiate all the thermosetting glue applied in an area at the same time, but this method is easy to cause Dispersion and waste of light energy, and because the light energy cannot be concentrated, it is very likely that the curing process needs to be repeated by irradiating the heat curing glue, so the working time will also be significantly lengthened.

針對現有技術的缺點,目前有一種光加熱固化裝置是將光源裝置固設於塗布裝置旁,以達到塗膠後即時固化的效果。然而此種光加熱固化裝置受限於光源裝置與塗布裝置之間的間距固定,僅能運用於直線等特定的塗布路徑上,造成工作彈性不佳。因此,仍有必要提供一種光加熱固化裝置解決現有技術的問題。In view of the shortcomings of the prior art, there is currently a light heating and curing device in which a light source device is fixed beside a coating device, so as to achieve the effect of immediate curing after coating. However, such a light heating curing device is limited by a fixed distance between the light source device and the coating device, and can only be applied to a specific coating path such as a straight line, resulting in poor working flexibility. Therefore, it is still necessary to provide a light heating curing device to solve the problems of the prior art.

先前技術段落只是用來幫助了解本創作內容,因此在先前技術段落所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。在先前技術段落所揭露的內容,不代表所述內容或者本創作一個或多個實施例所要解決的問題,在本創作申請前已被所屬技術領域中具有通常知識者所知曉或認知。The prior art paragraphs are only used to help understand the content of the creation, so the content disclosed in the prior art paragraphs may contain some conventional technologies that do not constitute the knowledge of those skilled in the art. The content disclosed in the previous technical paragraphs does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field to which this invention belongs before the application for this creation.

根據現有技術的缺點,本創作的目的是提供一種光加熱固化裝置,能夠縮短固化的時間。According to the shortcomings of the prior art, the purpose of the present invention is to provide a light heating curing device, which can shorten the curing time.

本創作的另一目的是提供一種光加熱固化裝置,能夠精確控制固化位置,達到精準控制的需求。Another purpose of this creation is to provide a light-heating curing device that can precisely control the curing position to meet the needs of precise control.

本創作的其他目的和優點可以從本創作所揭露的技術特徵中得到進一步的了解。Other purposes and advantages of this creation can be further understood from the technical features disclosed in this creation.

為達上述一部分或全部目的或是其他目的,本創作的一實施例揭露一種光加熱固化裝置,包括塗布裝置、光源模組與承載平台,塗布裝置沿塗布路徑塗布熱固化膠,其中塗布路徑位於塗布面上,光源模組提供光線照射熱固化膠,承載平台連接塗布裝置,其中光源模組固設於承載平台,當光加熱固化裝置工作時,承載平台帶動塗布裝置與光源模組沿塗布路徑移動,且光源模組於垂直塗布路徑且位於塗布面的掃描方向上來回提供光線。In order to achieve some or all of the above or other purposes, an embodiment of the present invention discloses a light heating curing device, which includes a coating device, a light source module, and a bearing platform. The coating device applies a thermal curing glue along a coating path, where the coating path is located at On the coating surface, the light source module provides light to irradiate the thermosetting glue, and the bearing platform is connected to the coating device. The light source module is fixed on the bearing platform. When the light heating and curing device works, the bearing platform drives the coating device and the light source module along the coating path. Moving, and the light source module provides light back and forth in the scanning direction of the vertical coating path and located on the coating surface.

在一實施例中,光源模組還包括光源、至少一可旋轉反射鏡以及聚焦透鏡,光源模組透過至少一可旋轉反射鏡改變光線的照射位置,且透過聚焦透鏡聚焦光線。In one embodiment, the light source module further includes a light source, at least one rotatable mirror, and a focusing lens. The light source module changes the irradiation position of the light through the at least one rotatable mirror, and focuses the light through the focusing lens.

在一實施例中,塗布於塗布路徑上的熱固化膠於掃描方向上具有膠寬,透過聚焦透鏡聚焦後的光線於熱固化膠上具有照射區域,且照射區域於掃描方向上的寬度小於膠寬。In one embodiment, the thermosetting glue applied on the coating path has a glue width in the scanning direction, and the light focused through the focusing lens has an irradiation area on the heat curing glue, and the width of the irradiation area in the scanning direction is smaller than that of the glue. width.

在一實施例中,光加熱固化裝置還包括控制單元,控制單元電性連接於承載平台、塗布裝置與光源模組。In one embodiment, the light heating curing device further includes a control unit, and the control unit is electrically connected to the bearing platform, the coating device and the light source module.

在一實施例中,當光加熱固化裝置工作時,控制單元根據至少一設定參數控制光源模組照射光線於熱固化膠的起始時間或位置。In one embodiment, when the light-heating and curing device is operating, the control unit controls the starting time or position of the light source module to irradiate the light with the heat-curing glue according to at least one set parameter.

在一實施例中,控制單元依照塗布路徑控制光源模組以塗布裝置為軸心旋轉。In one embodiment, the control unit controls the light source module to rotate around the coating device according to the coating path.

在一實施例中,塗布裝置透過樞軸機構連接於承載平台。In one embodiment, the coating device is connected to the bearing platform through a pivot mechanism.

在一實施例中,塗布裝置可沿垂直於塗布面的方向移動。In one embodiment, the coating device is movable in a direction perpendicular to the coating surface.

在一實施例中,光源模組可沿垂直於塗布面的方向移動。In one embodiment, the light source module is movable in a direction perpendicular to the coating surface.

基於上述,本創作的實施例至少具有以下其中一個優點或功效。在本創作的實施例中,光加熱固化裝置的光源模組提供光線照射熱固化膠,承載平台連接塗布裝置且光源模組固設於承載平台,當光加熱固化裝置工作時,承載平台帶動塗布裝置與光源模組沿塗布路徑移動,且光源模組於垂直塗布路徑且位於塗布面的掃描方向上來回提供光線以固化熱固化膠,如此一來,相較於現有技術可減少切換光源模組與塗布裝置的時間,並且能夠精確地控制固化程序。Based on the above, the embodiment of the present invention has at least one of the following advantages or effects. In the embodiment of the present invention, the light source module of the light heating curing device provides light to irradiate the heat curing glue, the bearing platform is connected to the coating device and the light source module is fixed to the bearing platform. When the light heating curing device works, the bearing platform drives the coating The device and the light source module move along the coating path, and the light source module provides light to and fro in the scanning direction of the vertical coating path and located on the coating surface to cure the thermosetting glue. In this way, compared with the prior art, the light source module can be reduced. The time with the coating device, and the curing process can be precisely controlled.

為讓本創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of this creation more comprehensible, embodiments are described below in detail with the accompanying drawings as follows.

有關本創作之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本創作。The foregoing and other technical contents, features, and effects of this creation will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the terminology used is used to explain and is not used to limit the creation.

圖1是根據本創作所揭露的一實施例,表示光加熱固化裝置的結構示意圖,圖2是根據圖1的實施例,表示光加熱固化裝置塗布熱固化膠的俯視示意圖。請參考圖1與圖2,光加熱固化裝置10包括塗布裝置12、光源模組14與承載平台16,塗布裝置12沿塗布路徑22塗布熱固化膠18,其中塗布路徑22位於塗布面21上,塗布面21例如是工件20的其中一表面,但不以此為限。光源模組14提供光線141照射熱固化膠18,使熱固化膠18受熱產生交聯反應而凝固形成熱固化膠181。此外,承載平台16連接塗布裝置12,光源模組14固設於承載平台16上。因此,當光加熱固化裝置10工作時,承載平台16會同時帶動塗布裝置12與光源模組14移動。FIG. 1 is a schematic diagram showing a structure of a light heating and curing device according to an embodiment disclosed in the present invention, and FIG. 2 is a schematic plan view showing a light curing device applying a heat curing glue according to the embodiment of FIG. 1. Please refer to FIGS. 1 and 2. The light heating curing device 10 includes a coating device 12, a light source module 14, and a supporting platform 16. The coating device 12 applies a thermal curing glue 18 along a coating path 22, where the coating path 22 is located on the coating surface 21. The coating surface 21 is, for example, one surface of the workpiece 20, but is not limited thereto. The light source module 14 provides light 141 to irradiate the heat-curing glue 18, so that the heat-curing glue 18 undergoes a cross-linking reaction and solidifies to form a heat-curing glue 181. In addition, the bearing platform 16 is connected to the coating device 12, and the light source module 14 is fixed on the bearing platform 16. Therefore, when the light heating and curing device 10 works, the supporting platform 16 will simultaneously move the coating device 12 and the light source module 14.

圖3是根據圖1的實施例,表示光源模組的結構示意圖。請參考圖2與圖3,光源模組14於掃描方向23上來回提供光線141,其中掃描方向23例如是垂直塗布路徑22且位於塗布面21上。詳細而言,本實施例中,光源模組14包括光源142、至少一可旋轉反射鏡(圖3中繪示第一可旋轉反射鏡143與第二可旋轉反射鏡144,但不以此為限)以及聚焦透鏡145,其中光源142發出的光線141透過第一可旋轉反射鏡143與第二可旋轉反射鏡144改變光線141的行進方向,並透過聚焦透鏡145聚焦後形成光線141以照射熱固化膠18。本實施例中,光源142例如是雷射光源,然而,光源142也可以採用其他功率充足的光源並搭配準直透鏡等光學元件,本創作並不以此為限。FIG. 3 is a schematic structural diagram of a light source module according to the embodiment of FIG. 1. Please refer to FIG. 2 and FIG. 3, the light source module 14 provides light 141 back and forth in a scanning direction 23. The scanning direction 23 is, for example, a vertical coating path 22 and is located on the coating surface 21. In detail, in this embodiment, the light source module 14 includes a light source 142 and at least one rotatable mirror (the first rotatable mirror 143 and the second rotatable mirror 144 are shown in FIG. 3, but this is not the case. Limit) and focusing lens 145, in which the light 141 emitted from the light source 142 passes through the first rotatable mirror 143 and the second rotatable mirror 144 to change the direction of travel of the light 141, and is focused through the focusing lens 145 to form the light 141 to radiate heat固 胶 18。 Cured glue 18. In this embodiment, the light source 142 is, for example, a laser light source. However, the light source 142 may also use other light sources with sufficient power and match optical elements such as a collimating lens, which is not limited in this creation.

請繼續參考圖1、圖2與圖3,光線141經由聚焦透鏡145聚焦後,在熱固化膠18上形成照射區域182,其中熱固化膠18於掃描方向23上具有膠寬,且照射區域182於掃描方向23上的寬度小於熱固化膠18的膠寬。詳細而言,照射區域182例如是點狀但不限於此,照射區域182於掃描方向23上具有寬度y,熱固化膠18於掃描方向23上具有膠寬x,其中寬度y小於熱固化膠18的膠寬x,光線141的能量因而能夠集中以大幅提高固化效率。本實施例中,光源模組14於掃描方向23上來回提供光線141以使熱固化膠18凝固形成熱固化膠181,且承載平台16會同時帶動塗布裝置12與光源模組14沿著塗布路徑22移動。舉例而言,熱固化膠18上具有多個照射位置例如A、B、C與D,當照射區域182位於位置A時,光源模組14可控制照射區域182由位置A沿掃描方向23移動至位置B,接著承載平台16帶動光源模組14使照射區域182由位置B沿塗布路徑22移動至位置C,光源模組14再控制照射區域182由位置C沿掃描方向23移動至位置D。如此一來,光加熱固化裝置10透過控制光源模組14與承載平台16,相較於現有技術,可減少切換光源模組14與塗布裝置12的時間,並能夠精確地控制整體固化程序,有效縮短熱固化膠18的固化時間。Please continue to refer to FIG. 1, FIG. 2 and FIG. 3. After the light 141 is focused by the focusing lens 145, an irradiation area 182 is formed on the thermosetting glue 18. The thermosetting glue 18 has a glue width in the scanning direction 23 and the irradiation area 182. The width in the scanning direction 23 is smaller than the adhesive width of the thermosetting adhesive 18. In detail, the irradiation area 182 is, for example, dot-shaped, but is not limited thereto. The irradiation area 182 has a width y in the scanning direction 23, and the thermosetting adhesive 18 has a glue width x in the scanning direction 23, where the width y is smaller than the thermosetting adhesive 18 As the glue width x, the energy of the light 141 can be concentrated to greatly improve the curing efficiency. In this embodiment, the light source module 14 provides light 141 back and forth in the scanning direction 23 to solidify the thermosetting adhesive 18 to form a thermosetting adhesive 181, and the supporting platform 16 will simultaneously drive the coating device 12 and the light source module 14 along the coating path. 22 to move. For example, the heat curing adhesive 18 has multiple irradiation positions such as A, B, C, and D. When the irradiation area 182 is located at the position A, the light source module 14 can control the irradiation area 182 to move from the position A in the scanning direction 23 to At the position B, the carrying platform 16 drives the light source module 14 to move the irradiation area 182 from the position B along the coating path 22 to the position C. The light source module 14 then controls the irradiation area 182 from the position C to the position D along the scanning direction 23. In this way, the light heating curing device 10 can control the light source module 14 and the supporting platform 16 by controlling the light source module 14 and the carrying platform 16. Compared with the prior art, the time for switching between the light source module 14 and the coating device 12 can be reduced, and the overall curing process can be accurately controlled. Shorten the curing time of the thermosetting glue 18.

圖4是根據圖1的實施例,表示光加熱固化裝置的系統架構示意圖。請參考圖1與圖4,光加熱固化裝置10還包括控制單元30,控制單元30耦接於塗布裝置12、光源模組14與承載平台16,控制單元30例如是有單核心或多核心的中央處理單元(Central Processing Unit,CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor,DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuit,ASIC)或其他類似元件或上述元件的組合搭配,也可以搭配遠端電腦、平板等電子裝置,本創作對此並不加以限制。本實施例中,控制單元30例如是具有輸入介面(未繪示於圖4),操作者可透過此輸入介面輸入至少一設定參數,當光加熱固化裝置10工作時,控制單元30可根據設定參數控制光源模組14照射光線141於熱固化膠18的起始時間或位置,其中設定參數例如是固化延遲時間或距離等。因此,操作者僅需要根據不同成分的熱固化膠輸入適當的設定參數,控制單元30即可依據這些設定參數同時控制塗布裝置12、光源模組14與承載平台16,例如是控制光源模組14照射光線141於熱固化膠18的起始時間或位置,如此一來可大幅提高光加熱固化裝置10的效能。FIG. 4 is a schematic diagram showing a system architecture of a light heating and curing device according to the embodiment of FIG. 1. Please refer to FIG. 1 and FIG. 4. The light heating curing device 10 further includes a control unit 30. The control unit 30 is coupled to the coating device 12, the light source module 14, and the bearing platform 16. The control unit 30 is, for example, a single core or a multi-core. Central Processing Unit (CPU), or other programmable general purpose or special purpose microprocessor (Microprocessor), digital signal processor (Digital Signal Processor, DSP), programmable controller, special Application Specific Integrated Circuit (ASIC) or other similar components or combinations of the above components can also be used with electronic devices such as remote computers and tablets. This creation does not limit this. In this embodiment, the control unit 30 has, for example, an input interface (not shown in FIG. 4), and an operator can input at least one setting parameter through the input interface. When the light heating and curing device 10 works, the control unit 30 can The parameter controls the starting time or position of the light source module 14 to irradiate the light 141 on the thermosetting glue 18, and the setting parameter is, for example, a curing delay time or a distance. Therefore, the operator only needs to input appropriate setting parameters according to the thermosetting glue of different components, and the control unit 30 can simultaneously control the coating device 12, the light source module 14, and the carrying platform 16 according to these setting parameters, for example, the light source module 14 is controlled. The irradiation time of the light 141 at the starting time or position of the heat curing glue 18 can greatly improve the performance of the light heating curing device 10.

圖5是根據圖1的實施例,表示光加熱固化裝置中旋轉光源模組的示意圖。請參考圖2、圖4與圖5,當塗布路徑22不為直線時,控制單元30可依照塗布路徑22控制光源模組14,以塗布裝置12為軸心進行旋轉。詳細而言,控制單元30例如是控制承載平台16帶動光源模組14,令光源模組14以塗布裝置12為軸心進行旋轉(圖5示意性地繪示光源模組14由圖5左側實線位置旋轉180度至圖5右側的虛線位置,但並不以此為限),承載平台16樞接於塗布裝置12,其中光源模組14的旋轉面平行於塗布面21,如此一來即可對應各種不同形態的塗布路徑進行光加熱固化工作。FIG. 5 is a schematic diagram illustrating a rotating light source module in a light heating and curing device according to the embodiment of FIG. 1. Please refer to FIG. 2, FIG. 4 and FIG. 5, when the coating path 22 is not straight, the control unit 30 can control the light source module 14 according to the coating path 22 and rotate the coating device 12 as an axis. In detail, the control unit 30 controls, for example, the carrying platform 16 to drive the light source module 14 so that the light source module 14 rotates around the coating device 12 (FIG. 5 schematically illustrates that the light source module 14 is implemented by the left side of FIG. 5. The line position is rotated 180 degrees to the dotted line position on the right side of FIG. 5, but it is not limited thereto.) The bearing platform 16 is pivotally connected to the coating device 12. The rotation surface of the light source module 14 is parallel to the coating surface 21. It can carry out light heating and curing according to various coating paths.

圖6A至圖6C是根據圖1的實施例,表示光加熱固化裝置工作過程的示意圖。請先參考圖4、圖5與圖6A,塗布面21上的塗布路徑22具有路徑向量221,光加熱固化裝置10具有塗布方向向量101。塗布方向向量101代表光加熱固化裝置10實施光加熱固化工作的工作方向,其中塗布方向向量101的兩端例如是光源模組14與塗布裝置12分別投影至塗布面21上的點。當塗布方向向量101平行於路徑向量221且兩者方向相同時(如圖6A所示),光加熱固化裝置10可直接對塗布路徑22進行光加熱固化工作。接著請參考圖4、圖5、圖6B與圖6C,當塗布方向向量101不平行於路徑向量221時(如圖6B所示),控制單元30控制光源模組14以塗布裝置12為軸心進行旋轉,令光加熱固化裝置10的塗布方向向量101大致平行於路徑向量221後(如圖6C所示),再對塗布路徑22進行光加熱固化工作。如此一來,光加熱固化裝置10能夠靈活應對各種塗布路徑22的變化,以避免光源模組14發出的光線照射到塗布裝置12形成機構上的干涉。此外,本實施例中,操作者也可以手動控制光源模組14的旋轉,使光源模組14能夠在塗布路徑22上避開上述的機構干涉,而控制模組30也能夠依據塗布裝置12的塗膠頭的尺寸等參數計算上述機構干涉的位置與距離,並根據計算出的機構干涉位置與距離對光源模組14發出的光線進行補償,本創作對此並不加以限制。6A to 6C are schematic diagrams showing the working process of the light heating curing device according to the embodiment of FIG. 1. Please refer to FIG. 4, FIG. 5 and FIG. 6A first, the coating path 22 on the coating surface 21 has a path vector 221, and the light heating curing device 10 has a coating direction vector 101. The coating direction vector 101 represents a working direction in which the light heating and curing device 10 performs the light heating and curing work. The two ends of the coating direction vector 101 are, for example, points where the light source module 14 and the coating device 12 are respectively projected onto the coating surface 21. When the coating direction vector 101 is parallel to the path vector 221 and both directions are the same (as shown in FIG. 6A), the light heating and curing device 10 can directly perform light heating and curing on the coating path 22. Please refer to FIGS. 4, 5, 6B, and 6C. When the coating direction vector 101 is not parallel to the path vector 221 (as shown in FIG. 6B), the control unit 30 controls the light source module 14 with the coating device 12 as the axis. After the rotation is performed, the coating direction vector 101 of the light heating curing device 10 is substantially parallel to the path vector 221 (as shown in FIG. 6C), and then the light heating curing operation is performed on the coating path 22. In this way, the light heating and curing device 10 can flexibly respond to changes in various coating paths 22 to avoid interference from the light emitted from the light source module 14 on the forming mechanism of the coating device 12. In addition, in this embodiment, the operator can also manually control the rotation of the light source module 14, so that the light source module 14 can avoid the above-mentioned mechanism interference on the coating path 22, and the control module 30 can also be based on the coating device 12 The parameters such as the size of the glue head calculate the position and distance of the interference of the mechanism, and compensate the light emitted by the light source module 14 based on the calculated position and distance of the mechanism interference. This creation does not limit this.

圖7A與圖7B是根據本創作所揭露的另一實施例,分別表示光加熱固化裝置的結構示意圖。請同時參考圖7A與圖7B,光加熱固化裝置10A與圖1至圖6C實施例的光加熱固化裝置10類似且能夠達成相同的功效,相同的元件以相同的標號表示,在此不再贅述。光加熱固化裝置10A與光加熱固化裝置10的差異在於,塗布裝置12透過樞軸機構16A連接於承載平台16,使塗布裝置12能夠相對承載平台16進行旋轉,以調整塗布裝置12塗布熱固化膠的位置。本實施例中,樞軸機構16A例如是萬向接頭(universal joint,或稱為萬向節),圖7A與圖7B分別示意性地繪示塗布裝置12分別往不同方向旋轉以調整出膠頭12A與光源模組14的相對位置與間距,以配合各種不同的塗布路徑22,或是配合熱固化膠18所需要的塗布間距。本實施例中,樞軸機構16A並不限定萬向接頭的種類與結構,也可以採用其他合適的機構實施,例如具有多個自由度的機械臂等,本創作並不以此為限。FIG. 7A and FIG. 7B are schematic structural diagrams of a light heating and curing device according to another embodiment disclosed by the present invention. Please refer to FIG. 7A and FIG. 7B at the same time. The light heating and curing device 10A is similar to the light heating and curing device 10 in the embodiments of FIGS. 1 to 6C and can achieve the same effect. . The difference between the light heating curing device 10A and the light heating curing device 10 is that the coating device 12 is connected to the bearing platform 16 through a pivot mechanism 16A, so that the coating device 12 can rotate relative to the bearing platform 16 to adjust the coating device 12 to apply the thermosetting glue. s position. In this embodiment, the pivot mechanism 16A is, for example, a universal joint (also referred to as a universal joint). FIG. 7A and FIG. 7B each schematically illustrate that the coating device 12 is rotated in different directions to adjust the glue head. The relative positions and distances between 12A and the light source module 14 can be matched with various coating paths 22 or the coating distances required by the thermosetting glue 18. In this embodiment, the pivot mechanism 16A is not limited to the type and structure of the universal joint, and may also be implemented by other suitable mechanisms, such as a robotic arm having multiple degrees of freedom, etc., and this creation is not limited thereto.

圖8A與圖8B是根據本創作所揭露的再一實施例,分別表示光加熱固化裝置的結構示意圖。請同時參考圖8A與圖8B,光加熱固化裝置10B與前述實施例的光加熱固化裝置10、10A類似且能夠達成相同的功效,相同的元件以相同的標號表示,在此不再贅述。光加熱固化裝置10B與光加熱固化裝置10、10A的差異在於,光加熱固化裝置10B的塗布裝置12與光源模組14可選擇性地沿移動方向24改變與塗布面21之間的相對位置,其中移動方向24垂直於塗布面21。本實施例中,塗布裝置12例如是以滑軌或氣動機構等方式連接於承載平台16,本創作並不以此為限。FIG. 8A and FIG. 8B are schematic structural diagrams of a light heating and curing device according to still another embodiment disclosed in the present invention. Please refer to FIG. 8A and FIG. 8B at the same time. The light heating and curing device 10B is similar to the light heating and curing devices 10 and 10A of the foregoing embodiment and can achieve the same effect. The same components are denoted by the same reference numerals, and details are not described herein again. The difference between the light heating curing device 10B and the light heating curing devices 10 and 10A is that the coating device 12 and the light source module 14 of the light heating curing device 10B can selectively change the relative position with the coating surface 21 along the moving direction 24. The moving direction 24 is perpendicular to the coating surface 21. In this embodiment, the coating device 12 is, for example, connected to the bearing platform 16 by means of a slide rail or a pneumatic mechanism, and the creation is not limited thereto.

詳細而言,本實施例中,工件20的塗布面21例如是具有多個凸起或凹陷(圖8A與圖8B中示意性地繪示1個凸起20’,但不以此為限)。請先參考圖8A,當光加熱固化裝置10B於工作過程中遇到塗布面21上的凸起20’時,控制單元30(未繪示於圖8A)例如是先控制塗布單元12沿移動方向24遠離塗布面21,以配合塗布面21上的凸起20’塗布熱固化膠18。接著請參考圖8B,隨著光加熱固化裝置10B移動,控制單元30(未繪示於圖8B)控制光源模組14沿移動方向24遠離塗布面21,例如是透過移動承載平台16帶動光源模組14進行移動,以發出光線141照射位於凸起20’的熱固化膠18。如此一來,光加熱固化裝置10B能夠對應工作過程中所遇到工件20上的各種凸起或凹陷,避免塗布裝置12或光源模組14直接撞擊工件20。值得注意的是,本創作並不限定必須在光加熱固化工作中遇到塗布面21上具有凸起或凹陷時才可移動塗布單元12或光源模組14。In detail, in this embodiment, the coating surface 21 of the workpiece 20 has, for example, a plurality of protrusions or depressions (a protrusion 20 'is schematically shown in FIGS. 8A and 8B, but is not limited thereto) . Please refer to FIG. 8A first. When the light heating and curing device 10B encounters the protrusion 20 'on the coating surface 21 during operation, the control unit 30 (not shown in FIG. 8A) first controls the coating unit 12 along the moving direction, for example. 24 is away from the coating surface 21 to coat the heat curing glue 18 in cooperation with the protrusion 20 ′ on the coating surface 21. Referring to FIG. 8B, as the light heating and curing device 10B moves, the control unit 30 (not shown in FIG. 8B) controls the light source module 14 away from the coating surface 21 in the moving direction 24. For example, the light source module is driven by the moving bearing platform 16 The group 14 is moved to emit light 141 to irradiate the thermosetting glue 18 located on the protrusion 20 '. In this way, the light heating curing device 10B can correspond to various protrusions or depressions on the workpiece 20 encountered during the working process, and avoid the coating device 12 or the light source module 14 from directly hitting the workpiece 20. It is worth noting that this creation is not limited to the fact that the coating unit 12 or the light source module 14 must be moved only when there are protrusions or depressions on the coating surface 21 during light heating curing work.

圖9是根據本創作所揭露的再一實施例,表示光加熱固化裝置工作過程的示意圖。請參考圖9,本實施例中,塗布路徑22例如是具有起點P與終點S,包含PQ段、QR段與RS段,PQ段、QR段與RS段的箭頭代表光加熱固化裝置10的移動方向。舉例而言,光加熱固化裝置10由P點向Q點移動進行PQ段的光加熱固化工作,再由Q點向R點移動以進行QR段的光加熱固化工作。當光加熱固化裝置10準備進行RS段的熱固化工作時,控制單元30可控制整個光加熱固化裝置10由S點向R點移動,而不是由R點向S點移動以進行光加熱固化工作。因此,控制單元30不需旋轉光源模組14,即可靈活應對塗布路徑22的各種變化,以避免機構上的干涉。FIG. 9 is a schematic diagram showing a working process of a light heating and curing device according to still another embodiment disclosed in the present invention. Please refer to FIG. 9. In this embodiment, the coating path 22 has, for example, a start point P and an end point S, including a PQ segment, a QR segment, and an RS segment. The arrows of the PQ segment, the QR segment, and the RS segment represent the movement of the light heating curing device 10. direction. For example, the light heating and curing device 10 moves from point P to point Q to perform light heating and curing of the PQ section, and then moves from point Q to point R to perform light heating and curing of the QR section. When the light heating and curing device 10 is ready to perform the thermal curing work of the RS segment, the control unit 30 can control the entire light heating and curing device 10 to move from the S point to the R point, instead of moving from the R point to the S point for the light heating and curing work . Therefore, the control unit 30 can flexibly respond to various changes in the coating path 22 without rotating the light source module 14 to avoid interference on the mechanism.

值得注意的是,圖7A、7B實施例所揭露的光加熱固化裝置10A,與圖8A、8B實施例所揭露的光加熱固化裝置10B也可以應用於圖1至圖6C實施例與圖9實施例中的光加熱固化裝置10,本創作對此並不加以限制。It is worth noting that the light heating and curing device 10A disclosed in the embodiment of FIGS. 7A and 7B and the light heating and curing device 10B disclosed in the embodiment of FIGS. 8A and 8B can also be applied to the embodiment of FIGS. 1 to 6C and FIG. 9. The light heating and curing device 10 in the example is not limited in this work.

綜上所述,在本創作的實施例中,光加熱固化裝置中的塗布裝置沿塗布路徑塗布熱固化膠,光源模組提供光線照射熱固化膠,承載平台連接塗布裝置且光源模組固設於承載平台,當光加熱固化裝置工作時,承載平台帶動塗布裝置與光源模組沿塗布路徑移動,且光源模組於垂直塗布路徑且位於塗布面的掃描方向上來回提供光線以固化熱固化膠,如此一來,相較於現有技術可減少切換光源模組與塗布裝置的時間,並且能夠精確地控制固化程序。In summary, in the embodiment of the present invention, the coating device in the light heating curing device applies the thermal curing glue along the coating path, the light source module provides light to irradiate the thermal curing glue, the bearing platform is connected to the coating device, and the light source module is fixed On the supporting platform, when the light heating curing device works, the supporting platform drives the coating device and the light source module to move along the coating path, and the light source module provides light to and fro in the scanning direction of the vertical coating path and located on the coating surface to cure the heat curing adhesive. In this way, compared with the prior art, the time for switching the light source module and the coating device can be reduced, and the curing process can be accurately controlled.

惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍,即大凡依本創作申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。另外本創作的任一實施例或申請專利範圍不須達成本創作所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本創作之權利範圍。此外,本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。However, the above are only the preferred embodiments of this creation. When the scope of implementation of this creation cannot be limited in this way, that is, the simple equivalent changes and modifications made according to the scope of the patent application for this creation and the description of the new type, All are still covered by the new patent. In addition, any embodiment of this creation or the scope of patent application need not achieve all the purposes or advantages or features disclosed in the creation. In addition, the abstract section and title are only used to assist the search of patent documents and are not intended to limit the scope of rights of this creation. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the element or to distinguish between different embodiments or ranges, not to limit the number of elements. Upper or lower limit.

10、10A、10B‧‧‧光加熱固化裝置10, 10A, 10B ‧‧‧ Light heating curing device

101‧‧‧塗布方向向量 101‧‧‧coating direction vector

12‧‧‧塗布裝置 12‧‧‧ coating device

14‧‧‧光源模組 14‧‧‧light source module

141‧‧‧光線 141‧‧‧light

16‧‧‧承載平台 16‧‧‧bearing platform

16A‧‧‧樞軸機構 16A‧‧‧ Pivot mechanism

18‧‧‧熱固化膠 18‧‧‧Heat Curing Adhesive

181‧‧‧凝固後的熱固化膠 181‧‧‧Heat-curing adhesive after solidification

182‧‧‧照射區域 182‧‧‧ Irradiated area

20‧‧‧工件 20‧‧‧ Workpiece

20’‧‧‧凸起 20’‧‧‧ raised

21‧‧‧塗布面 21‧‧‧ coated surface

22‧‧‧塗布路徑 22‧‧‧ Coating Path

221‧‧‧路徑向量 221‧‧‧path vector

23‧‧‧掃描方向 23‧‧‧Scanning direction

24‧‧‧移動方向 24‧‧‧ Direction of movement

A、B、C、D‧‧‧光線照射熱固化膠的照射位置 A, B, C, D‧‧‧‧ Irradiation position of heat curing glue

P、Q、R、S‧‧‧塗布路徑上的點 P, Q, R, S‧‧‧ points on the coating path

x‧‧‧膠寬 x‧‧‧plastic width

y‧‧‧照射區域於掃描方向上的寬度 y‧‧‧width of the irradiation area in the scanning direction

圖1是根據本創作所揭露的一實施例,表示光加熱固化裝置的結構示意圖;
圖2是根據圖1的實施例,表示光加熱固化裝置塗布熱固化膠的俯視示意圖;
圖3是根據圖1的實施例,表示光源模組的結構示意圖;
圖4是根據圖1的實施例,表示光加熱固化裝置的系統架構示意圖;
圖5是根據圖1的實施例,表示光加熱固化裝置中旋轉光源模組的示意圖;
圖6A至圖6C是根據圖1的實施例,表示光加熱固化裝置工作過程的示意圖;
圖7A與圖7B是根據本創作所揭露的另一實施例,分別表示光加熱固化裝置的結構示意圖;
圖8A與圖8B是根據本創作所揭露的再一實施例,分別表示光加熱固化裝置的結構示意圖;以及
圖9是根據本創作所揭露的再一實施例,表示光加熱固化裝置工作過程的示意圖。
FIG. 1 is a schematic diagram showing a structure of a light heating and curing device according to an embodiment disclosed in the present invention; FIG.
FIG. 2 is a schematic top view illustrating the application of a thermal curing adhesive by a light heating curing device according to the embodiment of FIG. 1; FIG.
3 is a schematic structural diagram of a light source module according to the embodiment of FIG. 1;
4 is a schematic diagram showing a system architecture of a light heating curing device according to the embodiment of FIG. 1;
5 is a schematic diagram showing a rotating light source module in a light heating curing device according to the embodiment of FIG. 1;
6A to 6C are schematic diagrams showing a working process of a light heating curing device according to the embodiment of FIG. 1;
FIG. 7A and FIG. 7B are schematic diagrams showing the structure of a light heating and curing device according to another embodiment disclosed in the present invention; FIG.
FIG. 8A and FIG. 8B are schematic diagrams showing the structure of a light heating and curing device according to still another embodiment disclosed in this work; and FIG. 9 is a diagram showing the working process of the light and heating and curing device according to another embodiment disclosed in this work schematic diagram.

Claims (9)

一種光加熱固化裝置,包括:
一塗布裝置,沿一塗布路徑塗布一熱固化膠,其中該塗布路徑位於一塗布面上;
一光源模組,提供一光線照射該熱固化膠;以及
一承載平台連接該塗布裝置,其中該光源模組固設於該承載平台;
其中該光加熱固化裝置工作時,該承載平台帶動該塗布裝置與該光源模組沿該塗布路徑移動,且該光源模組於垂直該塗布路徑且位於該塗布面的一掃描方向上來回提供該光線以固化該熱固化膠。
A light heating curing device includes:
A coating device for coating a thermosetting glue along a coating path, wherein the coating path is located on a coating surface;
A light source module providing a light to illuminate the heat-curing glue; and a bearing platform connected to the coating device, wherein the light source module is fixed on the bearing platform;
Wherein, when the light heating curing device is working, the bearing platform drives the coating device and the light source module to move along the coating path, and the light source module provides the back and forth in a scanning direction perpendicular to the coating path and located on the coating surface. Light to cure the heat-curing glue.
如申請專利範圍第1項所述之光加熱固化裝置,其中該光源模組還包括一光源、至少一可旋轉反射鏡以及一聚焦透鏡,該光源模組透過該至少一可旋轉反射鏡改變該光線的行進方向,且透過該聚焦透鏡聚焦該光線。The light heating and curing device according to item 1 of the scope of patent application, wherein the light source module further includes a light source, at least one rotatable mirror, and a focusing lens, and the light source module changes the light source through the at least one rotatable mirror. The traveling direction of the light, and the light is focused through the focusing lens. 如申請專利範圍第2項所述之光加熱固化裝置,其中塗布於該塗布路徑上的該熱固化膠於該掃描方向上具有一膠寬,透過該聚焦透鏡聚焦後的該光線於該熱固化膠上具有一照射區域,且該照射區域於該掃描方向上的寬度小於該膠寬。The light heating curing device according to item 2 of the scope of the patent application, wherein the heat curing glue applied on the coating path has a glue width in the scanning direction, and the light focused through the focusing lens is cured by the heat. The glue has an irradiation area, and the width of the irradiation area in the scanning direction is smaller than the glue width. 如申請專利範圍第1項所述之光加熱固化裝置,還包括一控制單元,其中該控制單元電性連接於該承載平台、該塗布裝置與該光源模組。According to the light heating curing device described in the first item of the patent application scope, it further includes a control unit, wherein the control unit is electrically connected to the bearing platform, the coating device and the light source module. 如申請專利範圍第4項所述之光加熱固化裝置,其中當該光加熱固化裝置工作時,該控制單元根據至少一設定參數控制該光源模組照射該光線於該熱固化膠的一起始時間或一位置。The light heating curing device according to item 4 of the scope of patent application, wherein when the light heating curing device is in operation, the control unit controls the light source module to irradiate the light with a starting time of the heat curing glue according to at least one setting parameter. Or a position. 如申請專利範圍第4項所述之光加熱固化裝置,其中該控制單元依照該塗布路徑控制該光源模組以該塗布裝置為軸心旋轉。The light heating and curing device according to item 4 of the scope of the patent application, wherein the control unit controls the light source module to rotate around the coating device according to the coating path. 如申請專利範圍第1項所述之光加熱固化裝置,其中該塗布裝置可透過一樞軸機構連接於該承載平台。The light heating curing device according to item 1 of the scope of patent application, wherein the coating device can be connected to the bearing platform through a pivot mechanism. 如申請專利範圍第1項所述之光加熱固化裝置,其中該塗布裝置可沿一垂直於該塗布面的方向移動。According to the light heating and curing device described in the first item of the patent application scope, wherein the coating device is movable in a direction perpendicular to the coating surface. 如申請專利範圍第1項所述之光加熱固化裝置,其中該光源模組可沿一垂直於該塗布面的方向移動。According to the light heating and curing device described in the first item of the patent application scope, wherein the light source module is movable in a direction perpendicular to the coating surface.
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