TWM581223U - Housing for electronic device - Google Patents

Abstract

A housing for an electronic device is provided. The housing comprises an operating region, a thermal dissipation region and a plurality of waveform structures. The thermal dissipation region has a first side and a second side opposite to the first side, and the first side is adjacent to the operating region. These waveform structures are located at the thermal dissipation region. Each waveform structure has a rising side, a falling side and a plurality of openings. The openings are located at the falling side.

Description

Housing of electronic device

The present invention relates to a housing, and more particularly to a housing for an electronic device.

With the thinning of electronic devices, such as notebook computers, heat dissipation issues are becoming more and more important. In order to dissipate the internal components of the electronic device, the conventional method is to directly make an opening at a specific position on the surface of the casing of the electronic device as an air inlet and an air outlet. However, this method fails to consider the difference between hot and cold gases. In addition, the opening also affects the integrity of the appearance of the electronic device.

The present invention provides a housing for an electronic device. The housing of the electronic device includes an operating area, a heat dissipating area and a plurality of wave-shaped structures. The heat dissipating region has a first side and a second side opposite the first side, the first side being adjacent to the operating region. A plurality of wave structures are located in the heat dissipation region. Each of the wave-shaped structures has a rising side, a descending side and a plurality of openings, the openings being located on the descending side of the wave-shaped structure.

The housing of the electronic device provided in the present case has a plurality of wave-shaped structures in the heat dissipation area to increase the heat dissipation area, and further, each wave The structure has a plurality of openings on its descending side, in particular below the descending side. In this way, on the one hand, it helps to reduce the temperature at the opening, and on the other hand, it can also prevent the user from directly seeing the opening and affecting the integrity of the appearance of the electronic device.

The specific embodiments used in the present invention will be further illustrated by the following examples and drawings.

10‧‧‧shell

100‧‧‧Host part

20‧‧‧Screen section

120‧‧‧Operating area

140,440‧‧‧heating area

142,242,342,442‧‧‧ Wave structure

142a, 242a‧‧‧ rising side

142b, 242b‧‧‧ descending side

P‧‧‧ pivot position

H‧‧‧

R1‧‧‧ tilt angle

144,244,344,444‧‧‧ openings

140a‧‧‧ first side

140b‧‧‧ second side

160a, 160b‧‧ vents

The first figure is a perspective view of a first embodiment of a housing of an electronic device of the present invention.

The second figure is a schematic cross-sectional view of the heat dissipation area in the first figure.

The second A is an enlarged schematic view of the area A in the second figure.

The third figure is a perspective view of a second embodiment of the housing of the electronic device of the present invention.

The fourth figure is a perspective view of a third embodiment of the housing of the electronic device of the present invention.

The fifth drawing is a perspective view of a fourth embodiment of the housing of the electronic device of the present invention.

The specific embodiment of the present invention will be described in more detail below with reference to the schematic drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are in a very simplified form and all use non-precision proportions, only for convenience, The purpose of the embodiment of the present invention is clearly explained.

The first figure is a perspective view of a first embodiment of a housing 10 of an electronic device of the present invention. In this embodiment, the electronic device is a notebook computer, and the housing 10 includes a main body portion 100 and a screen portion 20. The screen portion 20 is pivotally connected to the main body portion 100. However, it is not limited to this. The electronic device can also be an electronic device such as a desktop computer or a tablet computer that needs to make holes in the casing for heat dissipation.

The housing 10 of the electronic device includes an operating area 120, a heat dissipating area 140, and a plurality of wave-shaped structures 142 (see FIG. 2 for details). The operation area 120 refers to an area where the user directly touches the electronic device, such as a keyboard, a touch pad, or a setting area of the touch panel.

In the present embodiment, the operation area 120 and the heat dissipation area 140 are located in the main body portion 100. In an embodiment, the operating region 120 and the heat dissipating region 140 may be located on the same surface, such as the upper surface of the host portion 100. However, it is not limited to this. Depending on the actual design difference, the operation area 120 and the heat dissipation area 140 need only be located on the same side of the housing 10 of the electronic device (as shown in the upper side of the main body portion 100 in the figure).

Please refer to the second and second A drawings together. The second figure is a schematic cross-sectional view of the heat dissipation area in the first figure, and the second A is an enlarged view of the area A in the second figure. The heat dissipation region 140 has a first side 140a and a second side 140b opposite the first side 140a. The first side 140a is adjacent to the operating area 120. In the present embodiment, the heat dissipation area 140 is located behind the operation area 120, that is, the operation area 120 is away from one side of the user. In an embodiment, as shown in the figure, the heat dissipation area 140 is located behind the pivotal position P of the screen portion 20 and the main body portion 100, and the operation area The field 120 is located in front of this pivotal position P. The operation area 120 and the heat dissipation area 140 have a difference H to match the thickness of the screen portion 20. The heat dissipation area 140 and the operation area 120 have an inclination angle R1. The height of the first side 140a of the heat dissipation region 140 is higher than the height of the second side 140b of the heat dissipation region 140.

As shown in the figures, a plurality of wave structures 142 are located within the heat dissipation region 140. In the present embodiment, a total of five wave structures 142 are arranged in the heat dissipation region 140 to increase the heat dissipation area of the heat dissipation region 140. Only one of them is shown as an illustration. These wave structures 142 extend in the lateral direction. The term "lateral" as used herein refers to the direction parallel to the first side 140a of the heat dissipating region 140. In this embodiment, the wave structures 142 located in the heat dissipation region 140 are connected to each other to form a continuous wave pattern extending to the rear edge of the casing 10 of the electronic device, and the amplitudes of the wave structures 142 are The first side 140a of the heat dissipation region 140 gradually decreases toward the second side 140b.

The configuration of the foregoing wave structure 142 is only one embodiment of the present invention, and is not intended to limit the scope of the present invention. Depending on the actual situation, such as the size of the electronic device, the size of the heat dissipation region 140, and the heat dissipation requirements, a different number of wave structures 142 may be disposed, and the respective wave structures 142 may be separated from each other.

Each of the wave structures 142 has a rising side 142a, a falling side 142b, and a plurality of openings 144. These openings 144 are located on the descending side 142b of the wave structure 142, in this embodiment, that is, the wave structure 142 is remote from one side of the user. In this way, in addition to guiding the heat dissipation airflow of the electronic device to the rear of the electronic device, it is possible to avoid affecting the user's operation. another On the one hand, the openings 144 can also be hidden outside the line of sight of the user to prevent the openings 144 from affecting the integrity of the appearance of the electronic device housing 10.

The opening 144 in the figure is square. However, it is not limited to this. According to actual needs, the openings 144 may also have other shapes, such as a circular shape, and the sizes and shapes of the respective openings 144 need not be completely identical. Next, in the present embodiment, the openings 144 are arranged substantially evenly on the wave structure 142. However, it is not limited thereto, and the arrangement of the openings 144 on the wave structure 142, such as the number and spacing distance, may be adjusted according to actual needs. For example, for the concentrated airflow concentration, a dense opening 144 may be provided, and the number of the openings 144 may be reduced for a higher structural strength requirement.

In the present embodiment, the openings 144 serve as air inlets for heat dissipation of the electronic device. The first side 140a of the heat dissipation area 140 may be provided with an air inlet to increase the heat dissipation efficiency of the electronic device. The rear and side faces of the main body portion 100 are provided with air outlets 160a, 160b. However, it is not limited to this. These openings 144 can also be used as the air outlet of the electronic device depending on the design of the internal airflow of the electronic device.

Secondly, in the present embodiment, the openings 144 are substantially the same size. For some of the larger angled structures 142, the openings 144 are disposed below the falling side 142b of the wave structure 142. It is the position near the trough to ensure that the opening 144 can be hidden from the user's line of sight. In addition, since the gas has the characteristic of hot rise and cold drop, if the opening 144 is used as the air inlet, the opening 144 is disposed below the falling side 142b of the wave structure 142 to help reduce the gas flowing in the opening 144. temperature.

The third figure is a perspective view of a second embodiment of the housing of the electronic device of the present invention. Compared to the embodiment of the second A diagram, the waveform structure 142 exhibits a triangular wave appearance. The wave-shaped structure 242 of the present embodiment is a square wave outer shape, and the opening 244 is located on the falling side of the wave-shaped structure 242, that is, the wave-shaped structure 242 is located away from one side of the user, and the opening 244 is avoided. Enter the user's line of sight. However, this case is not limited to this. In an embodiment, the wave-shaped structure may also exhibit a sine wave appearance.

The fourth figure is a perspective view of a third embodiment of the housing of the electronic device of the present invention. Compared with the embodiment of FIG. 2A, the amplitudes of the mutually connected wave-shaped structures 142 are gradually decreased from the first side 140a of the heat dissipation region 140 toward the second side 140b to match the inclination angle R1 of the heat dissipation region 140, The plurality of waveform structures 342 of this embodiment maintain a uniform amplitude. Each of the wave structures 342 has a plurality of openings 344.

The fifth drawing is a perspective view of a fourth embodiment of the housing of the electronic device of the present invention. Compared with the embodiment of FIG. 2A, the heat dissipation region 140 and the operation region 120 have an inclination angle R1. The heat dissipation region 440 of the embodiment is parallel to the operation region 120, and the plurality of wave structures 442 are arranged in the heat dissipation region. Within 440, and each of the wave structures 442 has a plurality of openings 444. Moreover, compared with the embodiment of the first figure, there is a difference H between the heat dissipation region 140 and the operation region 120, and the heat dissipation region 440 and the operation region 120 of the embodiment are substantially on the same plane.

The housing 10 of the electronic device provided in the present invention has a plurality of wave-shaped structures 142, 242, 342, 442 in the heat dissipation regions 140, 440 to increase the heat dissipation area, and further, the respective wave structures 142, 242, 342, 442 And having a plurality of openings 144, 244, 344, 444 on its descending sides 142b, 242b, especially below the descending side. Thus, on the one hand, it helps to lower the temperature at the openings 144, 244, 344, 444, and on the other hand, it can also prevent the openings 144, 244, 344, 444 from entering the user's line of sight and affecting the integrity of the appearance of the electronic device.

The above is only a preferred embodiment of the present invention, and does not impose any limitation on the present case. Any person skilled in the art can make any form of equivalent replacement or modification to the technical means and technical contents disclosed in the present invention without departing from the technical means of the present invention. Still within the scope of protection of this case.

Claims (10)

A housing of an electronic device, comprising: an operation area; a heat dissipation area having a first side and a second side opposite to the first side, the first side system being adjacent to the operation area; and a plurality of waves The structure is located in the heat dissipation region, and each of the wave structures has a rising side, a falling side and a plurality of openings, and the openings are located on the falling side of each of the wave structures. The casing of the electronic device of claim 1, wherein the wave-shaped structures extend in the heat dissipation region. The casing of the electronic device of claim 1, wherein the openings are located below the descending side of the wave-shaped structure. The casing of the electronic device of claim 1, wherein the openings are a plurality of air inlets. The casing of the electronic device of claim 1, wherein the height of the first side is higher than the height of the second side. The casing of the electronic device of claim 1, wherein the operation area and the heat dissipation area are on the same surface. The casing of the electronic device of claim 1, wherein the electronic device comprises a main body portion and a screen portion, the screen portion is pivotally connected to the main body portion, and the operation area and the heat dissipation area are located at the host One of the upper surfaces, and the heat dissipation area and the operation area are located on both sides of the pivotal position of the main body portion and the screen portion. For example, the housing of the electronic device of claim 7 is Further comprising at least one air outlet located on one side of the main body portion. The casing of the electronic device of claim 1, wherein the wave-shaped structures are connected to each other. The casing of the electronic device of claim 9, wherein the amplitude of the wave-shaped structure gradually decreases from the first side toward the second side.