TWM574353U - Connector structure - Google Patents

Abstract

The present invention relates to a connector structure, which is a connector structure for transmitting a high frequency signal. The present invention includes at least an insulating body, a plurality of first conductive terminals, and a plurality of second conductive terminals; The connector structure of the present invention is mainly designed by the hardware design of the two adjacent first differential signal terminals and the second differential signal terminals, so that the high-frequency signals can be directly transmitted without being blocked between the two. It does achieve the main advantages of reducing energy consumption during high-frequency signal transmission and improving the quality of high-frequency signal transmission.

Description

Connector structure

The present invention relates to a connector structure, and more particularly to a connector structure for transmitting high frequency signals.

According to the general connector structure, it is designed as a connecting component of electronic signal and power supply and its accessory parts. Its main function is to provide connections between various electronic devices or devices to ensure that signals can be accurately transmitted. Connector structure In addition to the miniaturization design, the requirements for transmission speed and bandwidth are getting higher and higher, and the problems caused by high-frequency signal transmission are endless; with the miniaturization of the connector structure and the large transmission efficiency. The number and distribution of the terminal groups are also increased and dense. However, if the distance between adjacent terminals is too close, the interference between electromagnetic waves and crosstalk during high-frequency signal transmission is likely to occur, and the structure of the connector will be miniaturized in the future. Will shrink at a faster rate, which will make the signal interference problem of the connector structure itself more serious; for high-frequency connectors, in many signal integrity problems, especially cross-talk interference is the most serious problem, and A conventional high frequency connector includes an insulative housing and a plurality of grounding terminals mounted in the lower row of terminals above the insulating body And a grounding piece for connecting the grounding terminals in series, but the grounding piece has a complicated structure and must be assembled with a clamping member made of an insulating material before being further mounted inside the insulating body through the engaging member. At the same time, the elastic arms of the grounding piece are respectively in contact with the grounding terminal to be connected in series to form a common ground.

The above-mentioned feature is disclosed in the "Mounting Structure of Electrical Connector" of the Republic of China, No. M565427, which is provided with a docking portion having a docking space at the base side of the insulating base, and The receiving portion of the mounting portion is disposed at two sides of the positioning body, and the terminal group disposed in the plurality of terminal slots at the side wall surfaces of the plugging space includes a plurality of conductive terminals, and the conductive terminals are at the base portion The terminal blocks respectively mounted in the accommodating slots are embedded and exposed, and the grounding strips on the two sides of the positioning body of the mounting portion respectively comprise a grounding surface having two bodies, and both are outwardly on the two bodies The grounding elastic piece with the lap joint is bent and extended. The grounding piece can be grounded and contacted with the grounding conductive terminal of the terminal group at the same time without changing the spacing and appearance of the connector of the electrical connector. Connected to form a common ground, and enhance the path and density of ground conduction, and the effect of shielding and isolation through the grounding strip to achieve signal transmission stability; however, the plurality of conductive terminals are open to each other The signals transmitted by the plurality of conductive terminals will be prone to interference; therefore, how to effectively reduce the energy consumption and improve the quality of the high-frequency signal transmission by the innovative hardware-related design is still a high-frequency signal. Developers and related researchers in related industries such as connector structures need to continuously strive to overcome and solve problems.

In view of this, the creators have improved and created a connector structure by providing their expertise and years of practical experience to provide a connector structure for transmitting high frequency signals. Mainly by the hardware design of the two adjacent first differential signal terminals and the second differential signal terminals, the high-frequency signals can be directly transmitted without being blocked, and the high-frequency signal is actually reduced. The main advantages of energy loss during transmission and improvement of the quality of high-frequency signal transmission.

According to the purpose of the present invention, a connector structure is provided, which comprises at least an insulating base, a plurality of first conductive terminals, and a plurality of second conductive terminals; the insulating base system includes a first terminal slot, and a corresponding one is disposed on the a second terminal slot on one side of the first terminal slot, and a card slot, the first terminal slot includes a plurality of first slots, a plurality of first spacers, a plurality of first truncation regions, and a plurality of a first partition wall, wherein the first slot and the first cut-off zone are separated by the first partition, and the first partition wall is connected to an inner side of the first cut-off zone, the first The two-terminal slot system includes a plurality of second slots, a plurality of second spacers, a plurality of second cut-off regions, and a plurality of second partition walls, wherein the second slot and the second cut-off area are The second spacer is isolated, and the second partition wall is connected to the other inner side of the second cut-off area corresponding to the first terminal slot, and the card slot is opened in the first terminal slot and the Between the second terminal slots; a plurality of the first conductive terminals are inserted in the Each of the first conductive terminals is a first differential signal terminal or a first ground terminal, and the first differential signal terminal is adjacently inserted in the first cut-off region. And the first ground terminal is correspondingly inserted in the first slot, wherein the two first two pairs of the first ground terminals are arranged between the adjacent two of the first differential signal terminals; The second conductive terminal is inserted into the second terminal slot, and each of the second conductive terminals is a conductive terminal of the second differential signal terminal or a second ground terminal, and the second differential signal The terminal is correspondingly inserted in the second cut-off area, and the second grounding terminal is correspondingly inserted in the second slot, wherein the two grounding terminals disposed in pairs are arranged in two adjacent pairs Between the second differential signal terminals.

In an embodiment of the present invention, a first carrier is further disposed between the first terminal slot and the card slot.

In an embodiment of the present invention, a second carrier may be further disposed between the second terminal slot and the card slot.

In one embodiment of the present creation, the card slot can be further inserted with a card.

In one embodiment of the present creation, the card is an electronic card.

In an embodiment of the present invention, each of the first conductive terminals includes a first top portion, a first contact portion, a first solder portion, and a first body portion.

In an embodiment of the present invention, the first top portion abuts the first terminal slot and abuts the first carrier.

In an embodiment of the present invention, the first soldering portion extends out of the insulating base, and the first soldering portion is fixed to a circuit board in a fixed manner.

In an embodiment of the present invention, the first soldering portion is fixed to the circuit board in the fixing manner, and the fixing manner is one of a surface adhesion or a dual in-line package.

In an embodiment of the present invention, the two ends of the first body portion are respectively connected to the first contact portion and the first solder portion.

In an embodiment of the present invention, each of the second conductive terminals includes a second top portion, a second contact portion, a second solder portion, and a second body portion.

In an embodiment of the present invention, the second top portion abuts the second terminal slot and abuts the second carrier.

In an embodiment of the present invention, the second soldering portion extends out of the insulating base, and the second soldering portion is fixed to a circuit board in a fixed manner.

In an embodiment of the present invention, the two ends of the second body portion are respectively connected to the second contact portion and the second welded portion.

Therefore, the connector structure of the present invention is mainly designed by the hardware design of the two adjacent first differential signal terminals and the second differential signal terminals, so that the high frequency signals can be blocked without being blocked between the two. Direct transmission does have the main advantages of reducing energy consumption during high-frequency signal transmission and improving the quality of high-frequency signal transmission.

In order to understand the technical characteristics, content and advantages of the creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the original creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope. First described.

First, please refer to FIGS. 1 to 5, which are a front view of the overall structure, a rear view of the overall structure, an overall structural exploded view, a schematic view of the overall structure, and a terminal of a preferred embodiment of the present invention. Schematic diagram of the arrangement of the slot and the conductive terminal, the connector structure (1) of the present invention includes at least:

An insulating base (11) includes a first terminal slot (111), a second terminal slot (112) corresponding to one side of the first terminal slot (111), and a card slot (113) The first terminal slot (111) includes a plurality of first slots (1111), a plurality of first spacers (1112), a plurality of first intercepting regions (1113), and a plurality of first partition walls (1114), wherein the first slots (1111) and the first cut-off regions (1113) are isolated by the first spacers (1112), and the first partition walls (1114) are connected The second terminal slot (112) includes a plurality of second slots (1121), a plurality of second spacers (1122), and a plurality of the first slots (1113). a second cut-off area (1123), and a plurality of second partition walls (1124), wherein the second slots (1121) and the second cut-off areas (1123) are provided by the second spacers (1122) Isolated, and the second partition wall (1124) is connected to the other inner side of the second cut-off area (1123) corresponding to the first terminal slot (111), and the card slot (113) is Opening between the first terminal slot (111) and the second terminal slot (112); A first carrier (1115) may be further disposed between the first terminal slot (111) and the card slot (113); further, the second terminal slot (112) and the card slot (113) Further, a second carrier (1125) may be further disposed; further, the card slot (113) is further inserted with a card (2); in a preferred embodiment of the present invention, the insulating base ( 11) The first terminal slot (111), the second terminal slot (112) and the card slot (113) are combined, wherein the first terminal slot (111) is formed by the first insertion slot a slot (1111), the first spacers (1112), the first cutouts (1113), and the first partitions (1114), the first slots (1111) and the The first cut-off area (1113) is isolated by the first partitions (1112), and the first partition walls (1114) are connected to one of the first cut-off areas (1113). The second terminal slot (112) is formed by the second slot (1121), the second spacer (1122), the second intercepting area (1123), and the second partition wall (1124). Combined, the second slot (1121) and the second truncation zone (1123) are The spacers (1122) are isolated, and the second partition walls (1124) are corresponding to the first terminal slots (111) and are connected to the other inner side of the second cut-off regions (1123), and the card a slot (113) is defined between the first terminal slot (111) and the second terminal slot (112) to provide the card (2) insertion; in addition, the first carrier (1115) is provided Between the first terminal slot (111) and the card slot (113), and the second carrier (1125) is disposed between the second terminal slot (112) and the card slot (113) ;

A plurality of first conductive terminals (12) are inserted into the first terminal slot (111), and each of the first conductive terminals (12) is a first differential signal terminal (121) or a first ground terminal. (122) one of the conductive terminals, the first differential signal terminal (121) is adjacently inserted in the first cut-off area (1113), and the first ground terminal (122) is correspondingly inserted in the first a slot (1111), wherein the first ground terminals (122) disposed in pairs are arranged between the adjacent two of the first differential signal terminals (121); further, the first conductive terminal (12) comprising a first top portion (123), a first contact portion (124), a first soldering portion (125), and a first body portion (126); further, the first top portion (123) ) abutting the first terminal slot (111) and abutting against the first carrier plate (1115); further, the first soldering portion (125) extends out of the insulating seat body (11) and is fixed in a fixed manner The first soldering portion (125) is fixed to the circuit board in any fixed manner, and the fixing manner may be a surface adhesive or a dual in-line package, etc., in a circuit board (not shown). Among them Further, the two ends of the first body portion (126) are respectively connected to the first contact portion (124) and the first solder portion (125); please refer to FIG. 6 and FIG. 7 together. The figure shows a schematic diagram of a terminal slot of a preferred embodiment of the present invention, and a partial schematic view of the conductive terminal, wherein the first conductive terminals (12) are inserted into the insulating base (11). The first terminal slot (111), and the first conductive terminal (12) is one of the first differential signal terminal (121) or the first ground terminal (122), wherein the first difference is The signal terminals (121) are adjacently inserted in the first cut-off area (1113), and the first ground terminal (122) is correspondingly inserted in the first slot (1111), and the two pairs are arranged in pairs. The first grounding terminal (122) is arranged between the two adjacent first differential signal terminals (121), that is, the two adjacent first grounding terminals (122) are respectively inserted in two Adjacent to the first slot (1111), and separated by the first spacer (1112) disposed between the two adjacent first slots (1111) for positioning, and two adjacent The first differential signal terminal (121) is simultaneously disposed in the first cut-off area (1113). Since the first cut-off area (1113) is not isolated by the first spacer (1112), the first differential signal terminal (121) The transmitted signals can be directly transmitted, and the first ground terminals (122) can absorb and block the noise and interference generated by the first differential signal terminals (121) when transmitting high frequency signals. This is because the amplitudes of the high-frequency signals transmitted by the same pair of first differential signal terminals (121) are the same, but the phase is opposite, so there is a problem of high-frequency interference between the two sets of first differential signal terminals (121). Providing the first ground terminal (122) between the two sets of first differential signal terminals (121) can effectively absorb noise and interference generated by the first differential signal terminals (121); The first conductive terminal (12) is composed of the first top portion (123), the first contact portion (124), the first solder portion (125) and the first body portion (126), wherein The first top portion (123) abuts the first terminal slot (111) and abuts against the first carrier plate (1115), and the first soldering portion (1) 25) extending the insulating base (11) and fixing to the circuit board in a fixed manner in a dual in-line package, and the two ends of the first body portion (126) are respectively connected to the first contact portion (124) and the first welded portion (125);

A plurality of second conductive terminals (13) are inserted into the second terminal slot (112), and each of the second conductive terminals (13) is a second differential signal terminal (131) or a second ground terminal. (132) one of the conductive terminals, the second differential signal terminal (131) is correspondingly inserted in the second cut-off area (1123), and the second ground terminal (132) is correspondingly inserted in the second a slot (1121), wherein the two second ground terminals (132) are disposed in pairs between the adjacent two of the second differential signal terminals (131); in addition, the second conductive terminal ( 13) comprising a second top portion (133), a second contact portion (134), a second solder portion (135), and a second body portion (136); further, the second top portion (133) Abutting the second terminal slot (112) and abutting against the second carrier plate (1125); further, the second soldering portion (135) extends out of the insulating base body (11) and is fixed in a fixed manner Further, the two ends of the second body portion (136) are respectively connected to the second contact portion (134) and the second solder portion (135); please refer to FIG. 5 to FIG. As shown in the figure, wherein the second conductive ends The sub-terminal (13) is inserted into the second terminal slot (112) of the insulating base (11), and the second conductive terminal (13) is the second differential signal terminal (131) or the second ground terminal (132) One of the conductive terminals, wherein the second differential signal terminal (131) is adjacently inserted in the second cut-off region (1123), and the second ground terminal (132) is correspondingly inserted in The second slot (1121) is disposed between the two adjacent second differential signal terminals (131), that is, two adjacent terminals. The second grounding terminal (132) is respectively disposed in the two adjacent second slots (1121), and is disposed by the second between the two adjacent second slots (1121) The spacer (1122) is isolated for positioning, and the two adjacent second differential signal terminals (131) are simultaneously disposed in the second cutoff region (1123), since the second cutoff region (1123) is not the first The two spacers (1122) are isolated, so that the signals transmitted by the second differential signal terminal (131) can be directly transmitted, and the second ground terminals (132) can absorb and shield the second differential signal terminals ( 131) Yu The noise and interference generated when the high frequency signal is transmitted, because the amplitude of the high frequency signal transmitted to the second differential signal terminal (131) is the same, but the phase is opposite, so the two sets of the second differential signal There is a problem of high frequency interference between the terminals (131). If the second ground terminal (132) is disposed between the two sets of the second differential signal terminals (131), the second differential signals can be effectively absorbed. The noise and interference generated by the terminal (131); further, each of the second conductive terminals (13) is composed of the second top portion (133), the second contact portion (134), and the second solder portion (135) And the second body portion (136) is combined, wherein the second top portion (133) abuts the second terminal slot (112) and abuts the second carrier plate (1125), and the second portion The soldering portion (135) extends from the insulating base (11) and is fixed to the circuit board in a fixed manner in a dual in-line package, and the two ends of the second body portion (136) are respectively connected to the first portion Two contact portions (134) and the second solder portion (135).

In addition, the card (2) inserted in the card slot (113) is an electronic card that abuts against the first conductive terminal (12) and the second conductive terminal (13), and is The first contact portion (124) and the second contact portion (134) are clamped against each other.

It can be seen from the above description that the present invention has the following advantages compared with the prior art and the product:

1. The connector structure of the present invention is mainly designed by the hardware design of the two adjacent first differential signal terminals and the second differential signal terminals, so that the high frequency signals can be directly blocked without being blocked between the two. Transmission, indeed, achieves the main advantages of reducing energy consumption during high-frequency signal transmission and improving the quality of high-frequency signal transmission.

In summary, the connector structure of the present invention can achieve the intended use effect by the above disclosed embodiments, and the creation has not been disclosed before the application, and has fully complied with the requirements and requirements of the patent law. . If you apply for a new type of patent in accordance with the law, you are welcome to review it and grant a patent.

However, the illustrations and descriptions disclosed above are only preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention; those who are familiar with the skill are otherwise characterized by the scope of the creation. Equivalent changes or modifications shall be considered as not departing from the design of this creation.

(1)‧‧‧Connector structure

(11)‧‧‧Insulated body

(111)‧‧‧First terminal slot

(1111)‧‧‧First slot

(1112)‧‧‧First septum

(1113) ‧‧‧The first truncation area

(1114)‧‧‧First partition

(1115) ‧‧‧First Board

(112)‧‧‧Second terminal slot

(1121)‧‧‧Second slot

(1122) ‧‧‧Separate septum

(1123) ‧‧‧second truncation zone

(1124) ‧‧‧Second partition

(1125) ‧‧‧Second Board

(113)‧‧‧ card slots

(12)‧‧‧First conductive terminal

(121)‧‧‧First differential signal terminal

(122)‧‧‧First ground terminal

(123)‧‧‧ first top

(124) ‧‧‧First contact

(125)‧‧‧First Welding Department

(126) ‧‧‧First Main Body

(13)‧‧‧Second conductive terminal

(131)‧‧‧Second differential signal terminal

(132)‧‧‧Second ground terminal

(133)‧‧‧second top

(134)‧‧‧Second contact

(135)‧‧‧Second Welding Department

(136) ‧‧‧Second Main Body

(2)‧‧‧ cards

Figure 1 is a front elevational view of the overall structure of a preferred embodiment of the present invention. Figure 2: Rear view of the overall structure of a preferred embodiment of the present invention. Fig. 3 is a schematic exploded view showing the overall structure of a preferred embodiment of the present invention. Fig. 4 is a plan view showing the overall structure of a preferred embodiment of the present invention. Fig. 5 is a schematic view showing the arrangement of the terminal slot and the conductive terminal of a preferred embodiment of the present invention. Fig. 6 is a schematic view showing the arrangement of terminal slots of a preferred embodiment of the present invention. Figure 7 is a partial schematic view of a conductive terminal of a preferred embodiment of the present invention.

Claims (14)

A connector structure includes at least: an insulating base (11) including a first terminal slot (111) and a second terminal slot corresponding to one side of the first terminal slot (111) ( 112), and a card slot (113), the first terminal slot (111) includes a plurality of first slots (1111), a plurality of first spacers (1112), and a plurality of first truncation regions ( 1113), and a plurality of first partition walls (1114), wherein the first slot (1111) and the first cut-off area (1113) are isolated by the first spacer (1112), and the first partition The wall (1114) is connected to one of the first cut-off areas (1113), and the second terminal slot (112) includes a plurality of second slots (1121) and a plurality of second spacers (1122). a plurality of second truncation regions (1123), and a plurality of second partition walls (1124), wherein the second slot (1121) and the second truncation region (1123) are separated by the second spacer (1122) Is isolated, and the second partition wall (1124) is corresponding to the first terminal slot (111) and is connected to the other inner side of the second cut-off area (1123), and the card slot (113) is Opening in the first terminal slot (111) and the second terminal A plurality of first conductive terminals (12) are inserted into the first terminal slot (111), and each of the first conductive terminals (12) is a first differential signal terminal (121). Or one of the first grounding terminals (122), and the first differential signal terminal (121) is adjacently inserted in the first blocking region (1113), and the first grounding terminal (122) is Correspondingly inserted in the first slot (1111), wherein the two first two pairs of the first ground terminals (122) are arranged between the two adjacent first differential signal terminals (121); A plurality of second conductive terminals (13) are inserted into the second terminal slot (112), and each of the second conductive terminals (13) is a second differential signal terminal (131) or a second ground terminal. (132) one of the conductive terminals, the second differential signal terminal (131) is correspondingly inserted in the second cut-off area (1123), and the second ground terminal (132) is correspondingly inserted in the second The slot (1121), wherein the two second ground terminals (132) are disposed in pairs between the adjacent two of the second differential signal terminals (131). The connector structure of claim 1, wherein a first carrier (1115) is further disposed between the first terminal slot (111) and the card slot (113). The connector structure of claim 1, wherein a second carrier (1125) is further disposed between the second terminal slot (112) and the card slot (113). The connector structure of claim 1, wherein the card slot (113) is further inserted with a card (2). The connector structure of claim 4, wherein the card (2) is an electronic card. The connector structure of claim 2, wherein the first conductive terminal (12) comprises a first top portion (123), a first contact portion (124), and a first solder portion (125). And a first body portion (126). The connector structure of claim 6, wherein the first top portion (123) abuts the first terminal slot (111) and abuts the first carrier plate (1115). The connector structure of claim 6, wherein the first soldering portion (125) extends from the insulating base (11) and is fixed to a circuit board in a fixed manner. The connector structure of claim 8, wherein the first soldering portion (125) is fixed to the circuit board in the fixing manner, and the fixing manner is a surface adhesion or a dual in-line package. One. The connector structure of claim 6, wherein the two ends of the first body portion (126) are respectively connected to the first contact portion (124) and the first solder portion (125). The connector structure of claim 3, wherein the second conductive terminal (13) comprises a second top portion (133), a second contact portion (134), and a second solder portion (135). And a second body portion (136). The connector structure of claim 11, wherein the second top portion (133) abuts the second terminal slot (112) and abuts the second carrier plate (1125). The connector structure of claim 11, wherein the second soldering portion (135) extends out of the insulating base (11), and the second soldering portion (135) is fixed to the second soldering portion (135) in a fixed manner. On the board. The connector structure of claim 11, wherein the two ends of the second body portion (136) are respectively connected to the second contact portion (134) and the second solder portion (135).