TWM573082U - Compression head - Google Patents

Abstract

A pressing head for pressing two electronic components (such as a chip and a circuit substrate), the pressing head has a pressing base and a conductive voltage piece, and the voltage guiding piece is coupled to the pressing base. The conductive voltage splicing sheet has a conductive effect, and the conductive voltage splicing sheet is used to touch an electronic component, and the conductive voltage splicing sheet is used to conduct static electricity to prevent static electricity from affecting the electronic performance of the electronic component.

Description

Pressing head

The present invention relates to a press-fit head capable of conducting static electricity when the press head contacts or touches an electronic component to prevent static electricity from affecting the electronic properties of the electronic component, especially when used in a semiconductor touch-pressure bonding process. It can avoid the influence of static electricity on the electronic performance of the integrated circuit.

During the manufacture, production, assembly, testing, storage, handling of electronic components, etc., static electricity accumulates in the device, and even the electronic components themselves accumulate static electricity. When the device and the electronic components come into contact with each other, A discharge path causes the electronic component or device to be damaged by electrostatic discharge.

A conventional pressure bonding head is used for pressing a wafer on a circuit substrate. However, when the bonding head contacts the wafer or presses the wafer and the circuit substrate, electrostatic discharge (ESD) occurs. The wafer is damaged, thus affecting the electronic properties of the wafer.

A compression head of the present invention whose main purpose is to avoid electrostatic discharge (ESD) and cause damage to electronic components, thereby affecting the electronic properties of the electronic components.

A compression head of the present invention comprises a press-fit base and a voltage-conducting splicing plate, the voltage-conducting splicing plate is coupled to the embossing pedestal, and the voltage-conducting splicing plate is selectively detachable from the pressing The susceptor is electrically conductive, and the galvanic sheet is made of a non-single metal material. The galvanic sheet comprises a bonding surface and a pressing surface, and the bonding surface faces the nip. A bearing surface of the seat, and the pressing surface is exposed.

When the voltage guiding tab contacts the electronic component (such as a wafer) or the two electronic components (such as a wafer and a circuit substrate) with the pressing surface, the voltage guiding sheet can conduct static electricity to the outside of the electronic component. To avoid electrostatic damage to the electronic component and affect the electronic performance of the electronic component.

Please refer to Figures 1 to 3, which is a compression head 100 of the present invention, which can be mounted on an automatic crimping machine or a hand held grip (not shown). The head 100 is used for crimping two electronic components (such as a chip and a circuit substrate). The shape of the press head 100 disclosed in FIGS. 1 to 3 is an embodiment of the creation. The pressure head 100 of the present invention is not The shape disclosed in Figures 1 to 3 is a limitation.

Referring to FIGS. 1 to 3 , the pressure bonding head 100 includes a pressing base 110 and a voltage guiding tab 120. The voltage guiding tab 120 is coupled to the pressing base 110, and the voltage guiding tab 120 is coupled. The pressure-conducting susceptor 120 can be detached from the pedestal pedestal 110 and the other voltage-conducting susceptor 120 can be replaced. The pressing head 100 is disposed on the automatic crimping machine or the hand held gripper (not shown) for contacting the electronic component (such as a wafer). The voltage splicing plate 120 is electrically conductive, and the conductive voltage splicing plate 120 is made of a non-single metal material. In the embodiment, the conductive voltage splicing chip 120 includes a plurality of conductive particles (not shown) and a substrate. (not shown), the conductive particles are connected to each other to form a conductive path, and the conductive particles are embedded in the substrate, and the conductive particles are selected from titanium carbide (TiC), the substrate The material is selected from cubic boron nitride (CBN), and the conductive voltage plate 120 has plasticity, so that the voltage-conducting plate 120 can be prevented from being pressed. Electronic components (e.g., wafer), causing the electronic component (e.g., wafer) is damaged.

Referring to FIGS. 1 to 4 , the voltage guiding tab 120 includes a bonding surface 121 and a pressing surface 122 . The pressing base 110 has a bearing surface 111 for contacting the electronic component ( For example, the bonding surface 121 faces the bearing surface 111 of the pressing base 110. In this embodiment, the bonding surface 121 of the voltage guiding tab 120 contacts the bearing surface 111 and reveals the pressure. The pressure-receiving base 110 has a retaining wall 112. The retaining wall 112 is disposed around the bearing surface 111. The voltage-conducting plate 120 is limited to the retaining wall 112 to avoid the The voltage guiding tab 120 is offset from the bearing surface 111 or is detached from the pressing base 110.

Referring to FIGS. 1 to 4, in the embodiment, a portion of the conductive particles are exposed on the pressing surface 122, and the conductive particles exposed on the pressing surface 122 are used to contact the electronic component (such as a wafer). The conductive path formed by the interconnected conductive particles is used to direct static electricity out of the electronic component (such as a wafer).

Referring to FIGS. 1 to 4 , in the embodiment, a portion of the conductive particles are exposed on the bonding surface 121 , and the conductive particles exposed on the bonding surface 121 contact the bearing surface 111 of the pressing base 110 . And the pressing base 110 is a conductive base, so that the voltage guiding tab 120 is electrically connected to the pressing base 110, and the conductive path formed by interconnecting the conductive particles is electrically connected to the pressing The base 110 is combined.

Referring to Figures 1 to 3, an electrostatic guiding device (e.g., a conductive wire) is selectively mountable to the press-fit base 110 and the voltage-conducting tab 120. In various embodiments, when the press-fit is performed When the susceptor 110 is a non-conductive pedestal, the electrostatic guiding device (such as a conductive wire) is mounted on the voltage guiding tab 120 and electrically connected to the conductive path formed by interconnecting the conductive particles.

Referring to FIGS. 1 to 5, the voltage guiding tab 120 has at least one first through hole 123 having a first opening 123a and a second opening 123b. The first opening 123a is located at the pressure. The first through hole 123 is a gas passage of a gas supply device (not shown), and the first opening 123a is for sucking the electronic component (such as a wafer). In this embodiment, the second through hole The opening 123b is located at the bonding surface 121. Preferably, the pressing base 110 has at least one second through hole 113. A third opening 113a of the second through hole 113 communicates with the second opening of the first through hole 123. An opening 123b, the second through hole 113 is configured to connect to the air supply device, and the air supply device absorbs the electronic component (such as a wafer) by the first through hole 123 and the second through hole 113 to avoid pressing During the manufacturing process, the electronic component (such as a wafer) is offset and cannot be pressed against another electronic component such as a circuit substrate.

Please refer to the first to fifth embodiments. Preferably, the pressing base 110 has at least one receiving hole 114 for receiving a heating rod (not shown). The press head 100 is heated to perform a thermocompression bonding process on the two electronic components (such as a wafer and a circuit substrate).

Referring to FIGS. 1, 4 and 5, the crimping head 100 contacts the electronic component (such as a wafer) with the conductive voltage tab 120 or presses the two electronic components with the bonding head 100 when performing a pressing process. (such as a wafer and a circuit substrate), the static electricity is guided to the outside of the electronic component (such as a wafer) by the voltage guiding tab 120 to prevent static electricity from affecting the electronic performance of the electronic component.

The scope of protection of this creation is subject to the definition of the scope of the patent application, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation are within the scope of protection of this creation. .

100‧‧‧ Pressing head

110‧‧‧Pressing base

111‧‧‧ bearing surface

112‧‧‧Retaining wall

113‧‧‧Second through hole

113a‧‧‧ third opening

114‧‧‧ accommodating holes

120‧‧‧Guide voltage splicing

121‧‧‧ joint surface

122‧‧‧ Pressing surface

123‧‧‧First through hole

123a‧‧‧first opening

123b‧‧‧ second opening

Figure 1: A perspective view of the original compression head. Figure 2: An exploded perspective view of the original compression head. Fig. 3: An exploded perspective view of another perspective of the creation of the compression head. Figure 4: A cross-sectional view of the original compression head. Figure 5: A cross-sectional view of another perspective of the present compression head.

Claims (15)

A press-fit head comprising: a press-fit base; and a voltage-conducting tab coupled to the press-fit base, and the voltage-conducting tab is selectively detachable from the press-fit base, the pilot voltage The bonding piece is electrically conductive, and the conductive voltage piece is made of a non-single metal material, and the voltage guiding piece comprises a bonding surface and a pressing surface, and the bonding surface faces a bearing surface of the pressing base. And exposing the pressing surface for contacting an electronic component. The bonding head of claim 1, wherein the bonding surface of the voltage guiding tab contacts the bearing surface. The pressure-bonding head according to claim 1 or 2, wherein the conductive voltage-conducting sheet comprises a plurality of conductive particles which are connected to each other to form a conductive path. The pressure-bonding head according to claim 3, wherein the material of the conductive particles is selected from titanium carbide (TiC). The pressure-sensitive adhesive head according to claim 3, wherein the conductive voltage-conducting sheet comprises a substrate, the conductive particles are embedded in the substrate, and a part of the conductive particles are exposed on the pressing surface. . The press-fit head of claim 5, wherein the material of the substrate is selected from cubic boron nitride (CBN). The pressure-sensitive adhesive head according to claim 5, wherein a part of the conductive particles are exposed on the bonding surface. The press-fit head of claim 7, wherein the conductive particles exposed on the bonding surface contact the bearing surface of the press-fit base. The pressure bonding head of claim 1, wherein the voltage guiding tab is electrically connected to the pressing base. The press-fit head of claim 9, wherein the press-fit base is a conductive base. The pressure-bonding head of claim 1, wherein the pressing base has a retaining wall, the retaining wall is wound around the periphery of the bearing surface, and the bonding surface of the voltage-conducting splicing plate contacts the bearing surface And is limited to the retaining wall. The pressure-bonding head of claim 1, wherein the voltage-conducting tab has at least one first through-hole, a first opening of the first through-hole is located at the pressing surface, and the first through-hole is A gas passage for a gas supply unit. The press-fit head of claim 12, wherein a second opening of the first through hole is located at the joint surface. The press-fit head of claim 13 , wherein the press-fit base has at least one second through hole, and a third opening of the second through hole communicates with the second opening of the first through hole, The second through hole is used to connect the air supply device. The press-fit head according to claim 1, wherein the press-fit base has at least one receiving hole for receiving a heating rod.