TWM572076U - Package structure - Google Patents

Abstract

The present invention discloses a package structure comprising: a first substrate having a power supply end on one side; a second substrate; a metal extension layer extending from the power supply end in a length direction of the side to the both ends; And an encapsulation layer covering the metal extension layer and for fixing the first substrate and the second substrate. Thereby, the extension filling of the metal is utilized, which contributes to the conduction of thermal energy and improves the breakage of the signal line.

Description

Package structure

This creation belongs to the field of display technology, and specifically relates to a package structure.

The flat display device has many advantages such as thin body, power saving, no radiation, and the like, and thus has been widely used. The existing flat display devices mainly include a liquid crystal display (LCD) and an Organic Light-Emitting Diode (OLED) display device.

The fabrication process of the OLED display device includes a packaging process, such as a frit package. However, in the packaging process, due to the influence of thermal energy during the laser sealing process, when the temperature gradient and the stress distribution are not uniform and do not match the thermal expansion coefficient of the material, it is easy to generate cracks on the film under the glass paste, resulting in a signal. The line is broken, resulting in an abnormal display.

The purpose of this creation is to provide a package structure that improves the problem of signal line breakage.

In order to solve the above technical problem, the present invention provides a package structure, including: a first substrate having a power supply end on one side of the first substrate; a second substrate; a metal extension layer extending from the power supply end to a length of the side of the side; and an encapsulation layer disposed between the first substrate and the second substrate, the encapsulation layer covering the metal extension And a layer for fixing the first substrate and the second substrate.

Optionally, the second substrate is a package cover.

Optionally, for the package structure, the metal extension layer has a plurality of through holes.

Optionally, for the package structure, the through holes are evenly arranged.

Optionally, the power terminal is also provided with a through hole.

Optionally, the through hole is square.

Optionally, for the package structure, the width of the metal extension layer is the same as the width of the package layer.

Optionally, for the package structure, the width of the metal extension layer is 1/4 to 1/3 of the width of the package layer.

Optionally, the metal extension layer is located at an intermediate position of the encapsulation layer.

Optionally, for the package structure, the power terminal includes an operating voltage terminal and a common ground terminal.

Optionally, for the package structure, the metal extension layer extends from the working voltage end and the common ground end to the two ends of the side, and the opposite ends of the working voltage terminal and the common ground end do not contact.

Optionally, for the package structure, the first substrate has a polygonal shape, and the power end is located at one side of the polygon.

Optionally, for the package structure, a first metal layer is further disposed at other sides of the polygon, and the encapsulation layer is located on the first metal layer.

Optionally, for the package structure, the first metal layer has a plurality of through holes therein.

Optionally, the metal extension layer has a fold line shape.

As another aspect of the present invention, the present invention also provides an OLED display device employing the package structure as described above.

The package structure provided by the present invention includes: a first substrate having a power supply end on one side; a second substrate; a metal extension layer extending from the power supply end to a length of the side of the side; And an encapsulation layer covering the metal extension layer and for fixing the first substrate and the second substrate. Thereby, the extension filling of the metal is utilized, which contributes to the conduction of thermal energy and improves the breakage of the signal line.

Further, the design of the same width of the metal extension layer and the encapsulation layer can serve to improve the uniformity of the thickness of the film layer.

Further, the through hole design of the metal extension layer can effectively eliminate stress and reduce the risk of signal line breakage.

Further, the metal extension layer is located at the middle of the encapsulation layer, which can eliminate the crack initiation point of stress concentration and reduce the risk of signal line breakage.

1‧‧‧Base

2‧‧‧Encapsulation layer

3‧‧‧metal layer

4‧‧‧Power terminal

10‧‧‧First substrate

20‧‧‧Encapsulation layer

30‧‧‧First metal layer

41‧‧‧ VDD end

411‧‧‧Metal extension layer

42‧‧‧VSS side

421‧‧‧Metal extension layer

50‧‧‧through hole

60‧‧‧second base

W1‧‧‧ width of the encapsulation layer

W2‧‧‧ width of metal extension layer

W3‧‧‧Width of metal extension layer

1 is a schematic view of a package structure; 2 is a schematic view of a package structure in an embodiment of the present invention; FIG. 3 is a schematic cross-sectional view taken along line A-A' of FIG. 2; FIG. 4 is a schematic view of a metal extension layer in one embodiment of the present invention; A schematic representation of a metal extension layer in one embodiment.

In order to make the purpose, technical means and advantages of the present creation more clear, the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of them.

The package structure of the present invention will be described in more detail below with reference to the schematic drawings, in which a preferred embodiment of the present invention is shown, and it should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as being widely understood by those skilled in the art and not as a limitation of the present invention.

The present creation is more specifically described by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of this creation will be more apparent from the following description and claims. It should be noted that the drawings are in a very simplified form and all use non-precise proportions, and are only for convenience and clarity to assist the purpose of the present embodiment.

In the following description, it will be understood that when a layer (or film), region, pattern or structure is referred to as being "on" a substrate, layer (or film), region, pad and/or pattern, it can be directly An additional layer or substrate, and/or an intervening layer may also be present. In addition, it should be understood that when a layer is referred to as being "under" another layer, it can be directly under another layer, and/or one or more intervening layers may also be present. In addition, it is possible to perform "on" and "down" on each layer based on the drawings. Refers to.

Referring to FIG. 1, the creator studies a package structure including a substrate 1 having a polygonal shape (for example, a rectangular shape), one of which has a power supply terminal 4 and the other side has a metal layer 3, and the package layer 2 (for example, glass glue) surrounds the substrate 1 one week (for example, in a ring shape), and the encapsulation layer 2 is located above the metal layer 3 and the power supply terminal 4, and then another substrate (not shown) is packaged with the substrate 1 through the encapsulation layer 2.

However, in the substrate 1, there are usually some film layers such as signal lines and the like, and as described above, cracks are generated on the film layer under the encapsulation layer 2 (for example, glass paste) due to factors such as high temperature during packaging, resulting in cracks. The signal line is broken, causing an abnormal display. Further research by the creator found that the crack is mainly generated by the encapsulation layer 2 (for example, glass glue) and further extended, so that other film layers are affected.

Therefore, the present invention proposes a package structure comprising: a first substrate having a power supply end on one side of the first substrate; a second substrate; and a metal extension layer extending from the power supply end in a length direction of the side to the both ends And an encapsulation layer disposed between the first substrate and the second substrate, the encapsulation layer covering the metal extension layer and for fixing the first substrate and the second substrate.

The preferred embodiments of the touch screen structure and the manufacturing method thereof are listed below to clearly explain the content of the present creation. It should be clarified that the content of the present creation is not limited to the following embodiments, and other common technologies in the art are used. The improvement of the conventional technical means of personnel is also within the scope of the idea of this creation.

As shown in FIG. 2 to FIG. 5, the package structure of the present embodiment includes: The first substrate 10 has a power supply terminal (VDD terminal 41, VSS terminal 42) on one side of the first substrate 10; a second substrate 60; metal extension layers 411 and 421, from the power supply terminal (VDD terminal 41, VSS terminal 42) a length direction (for example, A-A' direction) extending to the both ends of the side; and an encapsulation layer 20 covering the metal extension layers 411, 421 and for fixing the first substrate 10 and the Second substrate 60.

2 is not shown for convenience of display.

The first substrate 10 may be, for example, a display substrate. A display structure, for example, an OLED structure or the like, is formed on the first substrate 10. For the specific selection of the display structure in the first substrate, the present invention is not particularly limited, and may be designed according to actual needs. For example, a well-known driving circuit may be formed on the first substrate 10. The drain electrode of the driving transistor of the driving circuit is electrically connected to the bottom electrode of the OLED through the via hole. The specific structure and forming method of the driving circuit are technical in the art. Well-known content will not be described in detail here. A passivation layer may also be formed on the first substrate 10 to protect the driving circuit on the substrate. The passivation layer is preferably an inorganic material such as tantalum nitride, hafnium oxide, aluminum oxide, or the like, but it should be understood that the above is merely an example of a passivation layer, but the selection range is not limited to the above examples, and may be disclosed from the prior art. Or choose from a range of commercial materials.

Around the display structure can be a drive region, for example for applying a voltage to the display structure. For example, the first metal layer 30 shown in FIG. 2 is located in the driving region.

In an embodiment of the present invention, the first substrate 10 has a polygonal shape, wherein the power supply end is located on one side of the polygon; for example, the first substrate 10 has a rectangular shape, and the power supply end is located at a rectangular shape. Sides.

In a further embodiment, the other side of the polygon further has a first metal layer 30, and the encapsulation layer 20 is located on the first metal layer 30.

In a further embodiment, the first metal layer 30 is provided with a plurality of through holes, which can effectively eliminate stress and reduce the risk of signal line breakage.

In one embodiment, the second substrate 60 can be, for example, a package substrate.

In an embodiment of the present invention, the power terminal (VDD terminal 41, VSS terminal 42) is not limited to one, and may include, for example, an operating voltage (VDD) terminal and a common ground (VSS) terminal. As shown in FIG. 2, the power supply terminal includes two VDD terminals 41 and two VSS terminals 42, two VDD terminals 41 are located in the middle, and two VSS terminals 42 are located on both sides of the two VDD terminals 41.

It can be understood that the VDD terminal 41 and the VSS terminal 42 are inconvenient to make contact. Therefore, the metal extension layers 411 and 421 extending from the VDD terminal and the VSS terminal are also not in contact, that is, the metal extension layers 411 and 421 are respectively The VDD terminal 41 and the VSS terminal 42 extend toward the both ends, and the opposite ends from the VDD terminal 41 and the VSS terminal 42 do not contact.

The metal extension layers 411 and 421 extending toward the VDD end 41 and the VSS end 42 in FIG. 2 may be opposite to each other. Of course, the VDD end 41 and the VSS end 42 may be opposite to each other. The metal extension layers 411, 421 may have a common overlap portion, and of course, it is also desirable to not contact.

In a further embodiment, the metal extension layers 411, 421 may be made of one of lithium, magnesium, barium, aluminum, indium, copper, gold, and silver.

In still another embodiment, as shown in FIG. 2, the metal extension layers 411, 421 extend from the power supply end (VDD end 41, VSS end 42) to both sides, specifically, in a rectangular shape. The first substrate 10 is taken as an example. The power supply terminals (the VDD terminal 41 and the VSS terminal 42) are located on the first substrate 10 side. The metal extension layers 411 and 421 are from the power supply terminal (the VDD terminal 41 and the VSS terminal 42). The opposite sides of the two sides extend and can extend to the position just below the encapsulation layer 20.

Thus, when the encapsulation layer 20 is heated for packaging, the generated heat can be better transferred by the metal extension layers 411, 421, contribute to the conduction of thermal energy, prevent the local temperature difference from being excessive, and improve the breakage of the signal line.

In an embodiment of the present creation, the metal extension layers 411, 421 have through holes 50.

Referring to FIG. 4 , a part of the metal extension layer 421 is taken as an example. The metal extension layer 421 extends from the power supply end (specifically, the VSS end 42 ), and the through hole 50 can be arranged on the metal extension layer 421 . It is also possible to arrange in the power supply terminal (VSS terminal 42), and the through hole 50 in the power supply terminal (VSS terminal 42) may have the same position (for example, a horizontal position) as the through hole 50 in the metal extension layer 421. It is also possible to completely fill the power supply terminal (VSS terminal 42).

In a further embodiment, the through holes 50 may be evenly arranged or non-uniformly arranged, such as at a position where the through holes 50 are relatively more at a position where the breakage is more likely to occur, and the position where the breakage is not likely to occur is not Has a through hole or has fewer through holes.

In still another embodiment, the through hole 50 is, for example, square and has a size (for example, a side length) of between 50 μm and 100 μm.

In the present embodiment, by providing a through hole 50 in the metal extending layers 411 and 421, the through hole 50 can effectively eliminate stress and reduce the risk of signal line breakage.

In an embodiment of the present invention, the width W2 of the metal extension layer 421 is the same as the width W1 of the encapsulation layer 20. This will not only improve the temperature difference, but also improve The effect of film thickness uniformity.

Of course, the metal extension layers 411 and 421 may not have the through holes 50. For example, as shown in FIG. 5, a part of the metal extension layer 421 is taken as an example, and a whole metal may be extended. The width of the metal extension layer 421 can be appropriately reduced without the stress problem at the time of the through hole. For example, the width W3 of the metal extension layer 421 is 1/4 to 1/3 of the width W1 of the package layer 20. Further, since the crack occurs generally from the intermediate position of the encapsulation layer 20, that is, it can be considered as a stress concentration portion, the metal extension layer 421 can be located at the middle of the encapsulation layer 20, thereby The role of good dispersion stress.

It is to be understood that the metal extending layer 421 is not limited to the above, and may be, for example, a broken line or the like, and can be adjusted as needed by those skilled in the art.

Obviously, the metal extension layer 411 can be substantially identical to the metal extension layer 421, except that the extension direction and the extension length can be slightly different. The encapsulation layer 20 is used for fixing (for example, using a bonding form) the first substrate 10 and the first The two substrates 60 and form a package strip, typically a frit, which includes fine glass particles. The glass particles include one or more of the following materials: magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide (K) ₂ O), boron oxide (B ₂ O ₃ ), vanadium oxide (V ₂ O ₅ ), zinc oxide (ZnO), cerium oxide (TeO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (SiO _{2 )} ), lead oxide (PbO), tin oxide (SnO), phosphorus oxide (P ₂ O ₅ ), ruthenium oxide (Ru ₂ O), ruthenium oxide (Rb ₂ O), ruthenium oxide (Rh ₂ O), iron oxide ( Fe ₂ O ₃ ), copper oxide (CuO), titanium oxide (TiO ₂ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), bismuth oxide (Sb ₂ O ₃ ), lead-borate glass, Tin-phosphate glass, vanadate glass and borosilicate.

In order to ensure the reliability of the sealing, the glass glue wraps around the first substrate 10, and the position covered by the glass glue is generally referred to as a package area.

Moreover, by means of the design of the metal extension layer (for example, the metal extension layer has a through hole or the metal extension layer has a small width), the encapsulation layer 20 is facilitated to contact the dielectric layer under the metal extension layer, thereby improving the encapsulation effect. .

In summary, the package structure provided by the present embodiment includes: a first substrate having a power supply end on one side of the first substrate; a second substrate; a metal extension layer from a length direction of the power supply end on the side Extending to both ends of the side; and an encapsulation layer covering the metal extension layer and for fixing the first substrate and the second substrate. Thereby, the extension filling of the metal is utilized, which contributes to the conduction of thermal energy and improves the breakage of the signal line.

Further, the design of the same width of the metal extension layer and the encapsulation layer can serve to improve the uniformity of the thickness of the film layer.

Further, the through hole design of the metal extension layer can effectively eliminate stress and reduce the risk of signal line breakage.

Further, the metal extension layer is located at the middle of the encapsulation layer, which can eliminate the crack initiation point of stress concentration and reduce the risk of signal line breakage.

The present creative embodiment also proposes an OLED display device employing the package structure as described above.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention are within the scope of the present invention and the scope of the equivalents, the present invention is intended to include such modifications and variations.

Claims (16)

A package structure comprising: a first substrate having a power supply end on one side; a second substrate; a metal extension layer extending from a length of the power supply end to a length of the side; and an encapsulation layer Provided between the first substrate and the second substrate, the encapsulation layer covers the metal extension layer and is used to fix the first substrate and the second substrate. The package structure of claim 1, wherein the second substrate is a package cover. The package structure of claim 1, wherein the metal extension layer has a plurality of through holes therein. The package structure of claim 3, wherein the through holes are evenly arranged. The package structure of claim 3, wherein the power terminal is also provided with a through hole. The package structure according to any one of claims 3 to 5, wherein the through hole has a square shape. The package structure of any one of claims 1 to 3, wherein the width of the metal extension layer is the same as the width of the encapsulation layer. The package structure of claim 1, wherein the width of the metal extension layer is 1/4 to 1/3 of the width of the package layer. The package structure of claim 8, wherein the metal extension layer is located at an intermediate position of the encapsulation layer. The package structure of claim 1, wherein the power terminal includes an operating voltage terminal and a common ground terminal. The package structure of claim 10, wherein the metal extension layer extends from the working voltage terminal and the common ground terminal to the two ends of the side, and the working voltage terminal and the common ground end are not in contact with each other. . The package structure of claim 1, wherein the first substrate is polygonal and the power end is located on one side of the polygon. The package structure of claim 12, wherein the other metal layer further has a first metal layer on the other side of the polygon, and the encapsulation layer is on the first metal layer. The package structure of claim 13, wherein the first metal layer has a plurality of through holes therein. The package structure of claim 1, wherein the metal extension layer has a fold line shape. An OLED display device using the package structure according to any one of claims 1 to 15.