TWM571045U - Bare crystal test system - Google Patents

Abstract

A bare die test system is used to test the electrical characteristics of a die containing a substrate and a pad. The bare crystal test system includes a feed zone and a feed tray transfer station connected to the feed zone, a first image capture device, a test transfer platform, a first transfer device, a test machine, and a second image capture device. Controller. The feed zone includes a linearly displaced and rotating feed tray transfer station and a feed carrier disposed thereon. The first image capturing device is used to take an image of the substrate. The test transfer stage can be linearly displaced and rotated. The first transfer device is displaceably disposed between the loading zone and the test transfer station for accommodating the bare crystal. The test machine has a probe card and is fixed to the displacement path of the test transfer stage. The second image capturing device is used to take an image of the solder pad.

Description

Bare crystal test system

This case is related to the test system of electronic components, especially regarding a bare crystal test system.

According to the continuous advancement of IC manufacturing technology, IC process technology based on gate length (line width) size specifications has been reduced by several micrometer (μm) process technology, sub-micron process technology (<1μm), deep sub-micron process Technology (<0.25 μm) has even evolved into nanometer (nm) process technology. This can be seen in the small and fine IC products.

In the IC process, the front-end process includes a wafer processing process (Wafer Fab) and a chip probing (Chip Probing), and the latter process includes a packaging process and a final test (Final Test). In the bare crystal needle measurement process, after the complete wafer is cut into bare crystals and the package is not completed, each bare crystal is subjected to acceptance test through the probe card, and the probe card is formed through the probe and the bare crystal. Conductive connections to test their electrical characteristics, in order to eliminate defective products into subsequent packaging processes, reducing packaging costs.

In the bare crystal needle test, the probe of the probe card is directly in contact with the pad (Pad) on the bare die for needle measurement. Due to the increasing demand for solder pads on the bare crystals and the increasing density, the size of the pads on the bare crystals is getting smaller and smaller. That is to say, the alignment between the probe tip of the probe card and the pad also increases, and the probe and the pad occur when the offset between the probe tip and the pad exceeds the expected value. It is impossible to align and the condition of the failure is measured. For example, the current die pad size on the bare die can be as small as 40μm, while the probe tip size can be as small as 15~20μm. It can be seen that as long as the tip offset of the probe exceeds 1/2 of the length of the pad, the bare die cannot be touched and the needle test cannot be completed. Accordingly, the present application provides a bare crystal test system that ensures the accuracy of bare crystal needles.

The present invention provides a bare crystal test system for testing bare crystals, bare crystals comprising substrates and pads, and pads on the substrate. The bare die test system includes a feed zone, a first image capture device, a test transfer station, a first transfer device, a test machine, a second image capture device, and a controller. The feeding area includes a loading tray transfer station and a loading tray. The feed tray transfer stage has a feed linear adjustment unit and a feed angle adjustment unit. The feeding linear adjustment unit can be displaced along the mutually perpendicular X direction and the Y direction, and the feeding angle adjusting unit can be rotated. The feed carrier is disposed on the loading tray transfer platform for carrying the bare crystal. The first image capturing device is disposed adjacent to the loading tray to image the substrate of the bare crystal. The test transfer table is set adjacent to the feeding zone, the test transfer stage has a test base, a test linear adjustment unit, a test angle adjustment unit and a carrier, the test base can be displaced in the Y direction, and the test linear adjustment unit is set on the test base. The seat can be displaced in the X direction and the Z direction, and the X direction, the Y direction and the Z direction are perpendicular to each other. The test angle adjusting unit is connected to the test linear adjusting unit, and the carrier can be displaced along the Z direction to the test linear adjusting unit. The first transfer device is displaceably disposed between the loading zone and the test transfer station for accommodating the bare crystal. The test machine has a probe card that is fixed to the displacement path of the test transfer table. The second image capturing device is displaceably disposed between the test transfer station and the testing machine to image the bare pad. The controller signal is connected to the loading tray transfer stage, the first image taking device, the test transfer station, the first transfer device, the test machine, and the second image capturing device.

In this way, the bare crystal test system can ensure that the needle position of the probe card is aligned with the position of the pad through two image taking operations to ensure the needle test work.

Please refer to FIG. 1 together. FIG. 1 is a structural block diagram of an embodiment of a new bare die test system. It is used to test the electrical characteristics of the bare crystal with the test machine 50 having the probe card, and achieve sorting of good or defective products.

Referring to FIG. 2 and FIG. 3, the bare die D (Bare die) is divided into one by one after the wafer stage (Wafer) process, and is not in the state before the package process. Each die D includes a substrate D1 and a pad D2, and the pad D2 is located on the substrate D1 for electrical connection with an external device. Here, the substrate D1 has a first outer contour D11, and the pad D2 has a second outer contour D21, and the area of the second outer contour D21 is smaller than the area of the first outer contour D11. More specifically, the first outer contour D11 of the substrate D1 may be a square contour with a side length of 10 mm, and the second outer contour D21 may be a square contour with a side length of 40 μm, but not limited thereto.

The bare crystal test system described herein may be an action of manually loading and discharging, or a fully automated operation of feeding and discharging through an automated machine.

The die test system illustrated in FIG. 1 is an embodiment of a bare die test system that can achieve fully automated control of the incoming and outgoing actions. 1 shows a bare crystal test system comprising a controller C, a feed zone 10, a first image capture device 20, a test transfer platform 30, a first transfer device 40, a test machine 50, a second image capture device 60, The second transfer device 70 and the discharge tray sorting area 80.

Referring to Figure 1, controller C can be an industrial computer. The controller C signal is connected to the first image capturing device 20, the test transfer station 30, the first transfer device 40, the testing machine 50, the second image capturing device 60, and the second transfer device 70 to control the first image capturing device. The operation of the device 20, the test transfer station 30, the first transfer device 40, the test machine 50, the second image capture device 60, and the second transfer device 70. Referring to FIG. 1 and referring to FIG. 2 to FIG. 4, the feeding area 10 includes a loading tray transfer stage 11 and a loading tray 12, and the loading tray transfer stage 11 is connected with the controller C signal. The tray transfer stage 11 carries the loading tray 12, and the loading tray 12 carries the die D. In the feeding zone 10, the first image capturing device 20 is configured to capture an image of the substrate D1 of the die D in the loading tray 12 on the loading tray transfer table 11, and the loading tray The transfer stage 11 accordingly corrects the appearance position of the substrate D1 of the bare crystal D. The position of the substrate D1 of the die D is corrected and transferred by the first transfer device 40 to the test transfer station 30. The test transfer table 30 feeds the die D into the test machine 50 and drives the die D to make the pad D2. The probe card 51 is contacted for testing. Before the test transfer station 30 sends the die D to the test machine 50 for testing, the second image capture device 60 captures the image of the pad D2 of the die D on the test transfer station 30. Here, the test transfer is performed. The stage 30 corrects the position of the die D accordingly, so that the pad D2 of the die D is located at a position suitable for testing.

Thereby, the bare crystal D is corrected by the outer contour position of the substrate D1 before the test, and then the position correction of the solder pad D2 is performed to ensure that the probe card 51 can contact the correct test position of the bare crystal D, thereby ensuring that the test work is smoothly performed. get on. And the position correction of the bare crystal D is achieved by the displacement of the loading tray transfer stage 11 and the test transfer stage 30 equipped with the bare crystal D, and the calibration work before the test of the bare crystal D does not directly contact the bare crystal D, It can avoid the damage of the bare crystal D and improve the product yield.

Please refer to FIG. 5 in conjunction with FIG. 6. FIG. 5 is a configuration diagram of an embodiment of a bare die test system. The positional configuration of the bare die test system of FIG. 5 is only a schematic illustration of one of the embodiments, and the overall configuration is not limited thereto. In one embodiment, the feed tray transfer stage 11 has a feed base 111, a feed linear adjustment unit 112, a feed angle adjustment unit 113, and a coupling unit 114. Here, the feed linear adjustment unit 112 is disposed on the feed base 111, the feed angle adjustment unit 113 is disposed in the feed linear adjustment unit 112, the joint unit 114 is disposed in the feed angle adjustment unit 113, and the feed tray 12 The binding unit 114 is coupled to the loading tray 12 to be fixed to the loading tray transfer stage 11. Further, the feeding linearity adjusting unit 112 is displaceable in mutually perpendicular X and Y directions, and the feeding angle adjusting unit 113 is rotatable on a plane formed by the X direction and the Y direction, and the combining unit 114 is detachably engaged The material carrier tray 12 is combined. Specifically, the feed linear adjustment unit 112 may be guided by a combination of a linear slide and a linear slider, but is not limited thereto. The feeding angle adjusting unit 113 can be driven by a rotation motor or a combination of a belt and a pulley, but is not limited thereto. The bonding unit 114 can be a jaw, but is not limited thereto.

In this way, when the feed linear adjustment unit 112 of the feed tray transfer stage 11 is displaced in the X direction or the Y direction, or the feed angle adjustment unit 113 is rotated, it is coupled to the feed tray transfer stage 11. The feed tray 12 changes the linear position or angle simultaneously, and the die D located in the feed carrier 12 also changes position or angle.

In one embodiment, the loading tray 12 may be used to accommodate a die D that has been separated or a die D that is still adhered to a soft film commonly known as Blue Tape after being cut. When the loading tray 12 accommodates a separated die D, the loading carrier 12 is a disk having a plurality of grooves, and the grooves are arranged in a matrix, and the inner circumference contour of each groove corresponds to each A first outer contour D11 of a die D, whereby each of the grooves corresponds to a die D. The bare crystal D adhered to the blue film can be placed on a steel frame to support the blue film through the steel frame to avoid collision between the bare crystals D. It can be seen that the loading carrier 12 can be applied to the bare die D of various feed types, and has a higher die D suitability.

In an embodiment, the first image capturing device 20 may be a CCD (Charge Coupled Device) lens, but is not limited thereto. The first image capturing device 20 is disposed at any position before the bare crystal D can be photographed for testing. In this embodiment, the first image capturing device 20 is disposed at a position adjacent to the loading tray transfer stage 11 for capturing the bare crystal D. More specifically, the first image capturing device 20 is disposed at the image capturing load. The position of the first outer contour D11 of the bare metal D in the feed carrier 12 on the disk transfer stage 11 is transferred.

In an embodiment, the initial positioning base image can be pre-stored in the controller C. The first image capturing device 20 captures an image of the first outer contour D11 of one of the bare crystals D in the loading tray 12 (the image of the first outer contour D11 of the bare crystal D is referred to as a first outer contour image), and the controller The C coordinates the initial positioning of the base image and controls the loading tray transfer stage 11 to perform position compensation so that the first outer contour image of the bare crystal D on the loading tray transfer stage 11 matches the initial positioning base image. Specifically, the loading tray transfer stage 11 adjusts the position of the loading tray 12 through the material feeding linear adjustment unit 112 and the feeding angle adjusting unit 113, so that the bare crystal D in the loading carrier 12 is the first one. The position of the contour D11 is identical to the initial positioning base image.

It is worth noting that the initial positioning base image is the appearance standard image that the preset bare crystal D should conform to before the second image capturing, that is, the first outer contour D11 of the bare crystal D in the initial positioning basic image is located. The image capturing range of the second image capturing device 60 is within the image capturing range.

Continuing to refer to FIG. 5 and in conjunction with FIG. 7, in an embodiment, the test transfer stage 30 is displaceably disposed on one side of the loading zone 10 for receiving the die D of the material zone 10 and capable of squeezing the die D. It is sent to the test machine 50 for testing. Further, the test transfer stage 30 has a test base 31, a test linear adjustment unit 32, a test angle adjustment unit 33, and a carrier 34. Here, the test base 31 can be displaced in the Y direction, the test linear adjustment unit 32 is disposed on the test base 31, the test angle adjustment unit 33 is connected to the test linear adjustment unit 32 and can drive the test linear adjustment unit 32 to rotate, and the carrier 34 is set. The linear adjustment unit 32 is tested and used to carry the die D. Further, the test linear adjustment unit 32 is displaceable in mutually perpendicular X and Z directions, and the test angle adjustment unit 33 is rotatable on a plane formed by the X direction and the Y direction. The carrier 34 may include a suction device having an ejection function, and the die D is positioned in a vacuum suction manner, and the die D can be ejected by the ejection mechanism, but not limited thereto.

In an embodiment, please refer to FIG. 8 and FIG. 9. FIG. 8 is a partial perspective structural view of an embodiment of a single set of test transfer table 30 and test machine 50. The test transfer stage 30 can be displaced into and out of the test machine 50 in the Y direction. 9 is a cross-sectional view of the structure of one embodiment of a single set of test transfer stations 30.

Here, the test linear adjustment unit 32 includes a carrier plate 321, a swivel 322, and a Z-direction displacement assembly 323. The carrier 321 is movably disposed on the test pedestal 31 in the X direction. The swivel 322 is rotatably coupled to the carrier 321 . The Z-direction displacement assembly 323 is disposed within the swivel 322. The test angle adjusting unit 33 is connected to the rotating base 322 to drive the rotating base 322 to rotate.

Further, in an embodiment, referring to FIG. 9 , the Z-direction displacement assembly 323 includes a first guiding member 3231 and a second guiding member 3232 . The first guiding member 3231 and the second guiding member 3232 are all trapezoidal blocks, and the first guiding member 3231 is displaceably disposed in the rotating base 322 in the X direction, and the first guiding member 3231 is in two parallel planes. One of the planes abuts against the swivel 322 and can slide in the X direction. The second guiding member 3232 abuts against the carrier 34 in a plane with respect to the inclined surface, and the inclined surface of the second guiding member 3232 is relatively movable with respect to the inclined surface of the first guiding member 3231. Further, between the first guiding member 3231 and the rotating base 322, the linear sliding rail and the slider may be disposed, but the inclined surface of the second guiding member 3232 and the inclined surface of the first guiding member 3231 may also be disposed. Linear slides and sliders.

In addition, referring further to FIG. 10 and with reference to FIG. 11, the carrier 34 is movably coupled to the second guide member 3232 in the Z direction. Specifically, in an embodiment, the rotating base 322 is fixedly coupled with the sliding rail, and the carrier 34 can be coupled to the sliding rail of the rotating base 322 through the side plate B, thereby limiting the carrier 34. Displace in the Z direction.

Based on this, when the first guiding member 3231 is displaced in the X direction, the second guiding member 3232 will be driven to change its position relative to the first guiding member 3231. Here, since the second guiding member 3232 is coupled to the carrier 34, and the carrier 34 is limited to be displaced in the Z direction, the second guiding member 3232 can drive the carrier 34 to change in the Z direction. position. Specifically, in the embodiment, the displacement of the first guiding member 3231 in the X direction can be driven by the air/hydraulic cylinder. It should be noted that, in this embodiment, based on the arrangement of the first guiding member 3231 and the second guiding member 3232, the driving source (such as a gas/hydraulic cylinder) extending along the X direction can be used to drive the carrier. Seat 34 changes position in the Z direction. The driving source for driving the carrier 34 to change the position in the Z direction is not limited to being extended or arranged in the Z direction, and the space occupation of the entire system in the Z direction can be reduced, achieving miniaturization.

In addition, FIG. 10 illustrates a specific embodiment of the test angle adjusting unit 33 in the test transfer stage 30. The test angle adjusting unit 33 includes a linear driving device 331, a first belt 332, a second belt 333, and a guiding arc 334. The linear driving device 331 is displaced in the X direction and drives the guiding arc 334 to rotate through the first belt 332 and the second belt 333.

Here, the linear driving device 331 can be reciprocally displaced between the first end and the second end along the X direction. The guiding arc 334 has a curved surface 3341 and a flat surface 3342. The curved surface 3341 is opposite to the flat surface 3342. The first belt 332 and the second belt 333 are abutted against the curved surface 3341, and the plane 3342 of the guiding arc 334 is combined. In the transposition 322.

Referring to FIG. 10, the two ends of the first belt 332 are respectively adjacent to the first end and the second end opposite to each other in the X direction, and are respectively connected to the linear driving device 331 and the guiding arc block 334. That is, when one end of the first belt 332 is connected to the linear driving device 331 near the first end, the other end of the first belt 332 is connected to the guiding arc 334 near the second end.

Similarly, the two ends of the second belt 333 are respectively adjacent to the first end and the second end opposite to each other in the X direction, and are respectively connected to the linear driving device 331 and the guiding arc 334. That is, when one end of the second belt 333 is connected to the position where the linear driving device 331 is close to the first end, the other end of the second belt 333 is connected to the position where the guiding arc 334 is close to the second end.

Here, the two ends of the first belt 332 and the second belt 333 are respectively connected to the two ends of the linear belt driving device 333, and the two ends of the guiding arc block 334 are also connected to the other ends of the first belt 332 and the second belt 333, respectively. The first belt 332 intersects the second belt 333 and passes through the sleeve at the overlapping position to ensure that the first belt 332 and the second belt 333 are relatively displaceable.

Based on this, when the linear driving device 333 reciprocates between the first end and the second end in the X direction, the first belt 332 and the second belt 333 cooperate with the guiding arc 334 to drive the rotating base 322 to rotate. When the swivel 322 is rotated, the carrier 34 can also be driven to change the angular position. Here, the linear driving device 331 can be, but is not limited to, a gas/hydraulic cylinder.

It should be noted that, in this embodiment, the guiding arc block 334 abuts against the rotating seat 322 through the plane 3342, and the curved surface 3341 abuts against the first belt 332 and the second belt 333. The plane 3342 abuts against the swivel 322 to abut against the swivel 322 over a large area to reliably drive the swivel 322 to rotate. When the first belt 332 and the second belt 333 abut against the curved surface 3341, the first belt 332 and the second belt 333 can be reliably pressed against the rotating motion of the guiding arc 334 when the guiding arc 334 rotates. On the guiding arc block 334, the subsequent driving stability is ensured.

Referring to FIG. 5, in an embodiment, the first transfer device 40 is displaceably disposed between the loading zone 10 and the test transfer platform 30 for taking the die D of the feed zone 10 to test. Transfer station 30. In this case, the first transfer device 40 includes a base and a pick-and-place head. The pick-and-place head is rotatably disposed on the base, and the pick-up head sucks the die D through vacuum suction, and when the positioning is reached, The ejector mechanism ejects the die D. However, the structural configuration of the first transfer device 40 is merely illustrative and is not limited to this structure.

In one embodiment, the probe card 51 on the test machine 50 has a plurality of contacts corresponding to the position of the pads D2 of the die D. The contact member may be a cantilever probe, a pogo pin, a wire bonding point disposed on the film, or a contact member made by using a MEMS technology. The contact member in this embodiment is a probe, but is not limited thereto. Here, the test machine 50 is fixedly disposed on the displacement path of the test transfer stage 30, and the test transfer stage 30 can be displaced into the test machine 50, and the test transfer stage 30 is further pushed to the carrier 34 by the Z-direction displacement assembly 323. The probe that contacts the probe card 51 is electrically tested after the probe contacts the pad D2 to form an electrical connection.

With continued reference to FIG. 5, in an embodiment, the second image capture device 60 is disposed between the test machine 50 and the test transfer station 30. Further, the second image capturing device 60 may be a CCD (Charge Coupled Device) lens, but is not limited thereto. More specifically, the second image capturing device 60 is disposed at a position where the second outer contour D21 of the bare crystal D on the test transfer stage 30 can be photographed. Here, since the area of the first outer contour D11 is larger than the area of the second outer contour D21, and the first image capturing device 20 is an image capturing the first outer contour D11 of the substrate D1 of the bare crystal D, and the second image capturing The device 60 is an image of the second outer contour D21 of the pad D2 on the substrate D1 of the die D. Therefore, the magnification of the second image capturing device 60 is greater than the magnification of the first image capturing device 20. Here, the second image capturing device 60 can image the second outer contour D21 of the bare crystal D on the test transfer stage 30 before the test transfer stage 30 transfers the die D into the test machine 50.

In an embodiment, the controller C further stores a needle position coordinate value, and the tip position coordinate value is a coordinate value corresponding to the probe position of the probe card in the testing machine. The second image capturing device 60 captures the image of the second outer contour D21 of the bare crystal D on the test transfer station 30 (the image of the second outer contour D21 of the bare crystal is referred to as a second outer contour image), and the second image capturing device The second outer contour image captured by 60 is transmitted to the controller C, and the controller C defines the coordinate value corresponding to the second outer contour image according to the coordinate system and the coordinate origin which are the same as the coordinate value of the needle tip position.

Then, the controller C compares the coordinate value of the needle tip position coordinate with the coordinate value of the second outer contour image, and controls the test transfer table 30 to perform position compensation, so as to test the second outer contour image of the bare crystal D on the transfer table 30. The coordinate value matches the coordinate value of the tip position. When the coordinate value of the second outer contour image conforms to the coordinate value of the needle tip position, the position of the pad D2 of the bare crystal D can accurately correspond to the position of the needle tip. Specifically, the test transfer station 30 adjusts the position of the test transfer stage 30 through the test linear adjustment unit 32 and the test angle adjustment unit 33, so that the second outer contour D21 of the bare crystal D on the test transfer stage 30 is positioned and accurately The alignment base image is consistent.

In one embodiment, the second transfer device 70 is displaceably disposed between the test transfer station 30 and the test machine 50 for taking out the die D in the test machine 50 for testing. In this case, the second transfer device 70 includes a base and a pick-and-place head. The pick-and-place head is rotatably disposed on the base, and the pick-up head sucks the die D through vacuum suction, and when the positioning is reached, The ejector mechanism ejects the die D. However, the structural configuration of the second transfer device 70 is merely illustrative and not limited to this structure.

In one embodiment, the discharge tray sorting area 80 includes a plurality of discharge trays 81. Each of the discharge trays 81 is connected to the controller C and is used to carry different bare crystals D (for example, good products) classified according to the test results. Or defective products). Here, the second transfer device 70 is also located between the test machine 50 and the discharge tray sorting area 80. Specifically, the discharge tray sorting area 80 is located on the displacement path of the second transfer unit 70, whereby The second transfer device 70 can place the tested bare crystals D on different discharge trays 81 according to the test results.

The operation of the bare crystal test system will be described below. First, the die D to be tested is placed on the feed carrier 12 on the feed tray transfer stage 11 of the feed zone 10. A plurality of die D to be tested may be placed in the loading tray 12 at the same time. After the die D is placed in the loading tray 12, the first image capturing device 20 pairs one of the loading trays 12 The first outer contour D11 of the bare crystal D is imaged. After the first image capturing device 20 captures and obtains the first outer contour image, the controller C compares the first outer contour image with the first outer contour image, and when the first outer contour image does not match the initial positioning base image, the feed linearity is adopted. The adjusting unit 112 and the feeding angle adjusting unit 113 adjust the position of the loading tray 12 so that the position of the bare crystal D is changed to coincide with the initial positioning base image.

Here, after the bare crystal D is adjusted based on the initial positioning base image, the appearance position of the substrate D1 of the bare crystal D can be ensured to be within the image capturing range of the second image capturing device 60, so as to facilitate subsequent position correction. jobs. After the controller C controls the loading tray transfer stage 11 to perform the position correction correction, the first transfer device 40 takes out and transfers the corrected bare crystal D to the test transfer stage 30.

While the first transfer device 40 transfers the die D to the test transfer station 30, the first image capture device 20 and the feed carrier transfer table 11 can continue to other die in the feed carrier 12. D performs the operations of image acquisition, comparison, and position compensation. Here, the number of test transfer stations 30 and test machines 50 may be a plurality of continuous feeds suitable for the bare die D.

Then, after the die D is transferred to the test transfer stage 30, the second image capturing device 60 takes a second outer contour image on the bare crystal D on the test transfer stage 30, and after capturing the second outer contour image, The second outer contour image defines the coordinate value (this is the coordinate value of the pad position), and then compares the coordinate value of the second outer contour image with the coordinate value of the tip position. When the coordinate value of the second outer contour image does not match the needle position coordinate value, the test transfer table 30 adjusts the angle or linear displacement through the test linear adjustment unit 32 and the test angle adjusting unit 33 to make the second outer contour image of the bare crystal D The coordinate value corresponds to the coordinate value of the tip position. After the coordinate value of the second outer contour image of the bare crystal D on the test transfer table 30 conforms to the coordinate value of the needle tip position, the test transfer station 30 transfers the die D to the test machine. Within 50, and through the Z-direction displacement assembly 323, the carrier 34 and the die D thereon are pushed up in the Z direction to the probe contacting the probe card 51 for needle testing. Here, the number of the second image capturing devices 60 may be singular or corresponding to the number of test transfer stations 30.

Further, the bare crystal test system of the present invention can be tested with different batches of bare crystal or different probe cards. In this embodiment, the third image capturing device 90 is further included, and the third image capturing device 90 is connected to the controller C signal. Before the user replaces the different probe card 51 for the initial test, the third image capturing device 90 captures an image of the needle tip of the probe card 51, and after the third image capturing device 90 captures the image of the needle tip position, the third image capturing device 90 The tip image is transmitted to controller C, which defines the tip image as the corresponding coordinate value. In this way, in the test work of the same probe card 51, the controller C can control the test transfer table 30 to transfer the position of the die D to the coordinate value of the position of the pad D2 corresponding to the coordinate value of the tip position. This ensures that the position of the pad D2 of each die D can be located at the test position.

In an embodiment, with reference to FIG. 8 and FIG. 11 , the third image capturing device 90 is fixedly disposed on the test transfer station 30 and connected to the controller C signal. Specifically, the third image capturing device 90 is fixed on the carrier 34 of the test transfer station 30, thereby enabling the third image capturing device 90 to be synchronously displaced with the test transfer station 30, thereby being used on the test transfer station 30. The bare crystals have the same positional basis.

With continued reference to FIG. 11, in an embodiment, the third image capturing device 90 has an observation end 91 and an image capturing end 92. The observation end 91 is for human observation, and the image pickup end 92 is provided for taking the image of the probe tip. For the convenience of personnel observation, the direction of the observation end 91 and the image capturing end 92 is 90 degrees perpendicular to each other. Specifically, the observation end 91 of the third image taking device 90 is open in the Y direction and can be observed by the person in the Y direction. The image capturing end 92 of the third image capturing device 90 is opened in the Z direction to capture an image in the Z direction.

Further, in order to enable the observation end 91 of the third image capturing device 90 to capture an image perpendicular to the observation end by 90 degrees, a first mirror is further disposed between the observation end 91 of the third image capturing device 90 and the image capturing end 92. 93 and the second mirror 94. The first mirror 93 can reflect the light incident in the Y direction to be emitted in the X direction. The second mirror 94 receives the light emitted by the first mirror 93, and the second mirror 94 reflects the light incident in the X direction to emit in the Z direction, thereby causing the observation end 92 to be observed perpendicular to the observation end 90. Image of the position.

Based on this, the third image capturing device 90 can provide a person to observe the image at an angular position of 90 degrees perpendicular to the observation end through the arrangement of the first mirror 93 and the second mirror 94. The third image capturing device 90 does not need to be disposed upright in the Z direction, and does not cause a height expansion of the test transfer stage 30 in the Z direction, thereby reducing the space requirement required for testing the transfer stage 30. It should be noted that the specific configuration of the third image capturing device 90 is only one of the embodiments for illustration, and the present invention is not limited thereto.

More specifically, in this embodiment, the coordinate origin origin of the coordinate value corresponding to the second outer contour image of the bare crystal D is the same as the coordinate origin of the needle position coordinate value. Thereby, the test transfer stage 30 can configure the position information and the tip position coordinate value as the basis of the correction position through the matching pad D2. In this way, the human operation error when installing the probe card will not cause the variation of the subsequent position, and the subsequent bare crystal D position correction work can be based on the actual needle position of the probe card 51, thereby being able to surely exclude The error factor of the personnel operation can reduce the difficulty and time consuming of the installation of the probe card 51, and improve the smoothness of the operation. In addition, in an embodiment, the probe card 51 is mounted on the testing machine 50 to maintain its fixed position, and is also changed in the Z direction by the test transfer station to test the probe card 51 when testing. Accordingly, the positional parameter variation of the probe card 51 after installation may be eliminated as much as possible, and the accuracy of the subsequent compensation adjustment can be ensured.

Further, since the test machine 50 is subjected to needle measurement through the vertical force contact of the die D with the probe card 51, the die D must be subjected to stress every time the probe is touched. In addition, after the probe is in contact with the bare crystal D, it is necessary to further apply pressure so that the probe generates an appropriate vertical displacement in the direction of the vertical die D (needle stroke, Overdrive), allowing the probe A suitable stylus pressure is generated relative to the pad D2 of the die D to allow the probe to scratch the oxide layer on the pad D2 to form a conductive connection.

Therefore, the stress experienced by the probe on each needle measurement will cause wear and affect its life. Therefore, if you can grasp the stress of each probe of the probe, you can grasp the life of the probe. For this reason, when the probe card 51 is kept in the same Z-direction position after installation, the bare-crystal contact probe can receive the same contact pin pressure when performing the needle test, and the contact pin pressure is related to the contact resistance at the time of the needle test. In this way, under the condition that the contact needle pressure of the probe is the same at each needle measurement, the accuracy of the needle measurement can be further improved, and the wear and life of the probe can be further grasped.

Referring to FIG. 5, in a more specific embodiment, the first guiding module G1, the second guiding module G2, the third guiding module G3, the fourth guiding module G4, and the Five guiding modules G5. The first guiding module G1 extends in the Y direction, and the loading tray transfer stage 11 is movably disposed in the Y direction on the first guiding module G1.

The second guiding module G2 is displaced in the X direction, and the second guiding module G2 is disposed across the first guiding module G1, and the first image capturing device 20 is movable in the X direction to the second guiding module. On G2. Thereby, the first image capturing device 20 can move in the X direction when capturing the image of the bare crystal D on the loading tray transfer stage 11 so as to completely capture all the bare on the loading tray transfer stage 11. Image of crystal D.

The third guiding module G3 is parallel to the first guiding module G1 and spaced apart from the first guiding module G1, and the test transfer table 30 is displaceably disposed on the third guiding module G3 in the Y direction.

Here, referring to FIG. 8, the third guiding module G3 may include a motor, a screw, a nut, two sliding rails and two sliding blocks. The motor is connected to the screw to drive the screw to rotate, the screw extends in the Y direction, and the nut and the screw The sliding rails extend in the Y direction and are respectively fixed to the two sides of the screw, and the slider is slidably sleeved on the sliding rail. In addition, the test base 31 is fixedly coupled to the nut and the slider to be linearly displaced in the Y direction.

The number of the test transfer station 30 and the number of the third guide module G3 are both plural, and the third guide modules G3 are arranged in parallel, and the corresponding setting test is performed on each third guide module G3. In this way, each test transfer station 30 can be displaced along each of the third guide modules G3 to transfer the die D into the test machine 50. Of course, the number of test transfer stations 30 and third guide modules G3 may also be only a single.

The fourth guiding module G4 extends in the X direction. The fourth guiding module G4 traverses the third guiding module G3, and the second imaging device 60 is movable in the X direction to the fourth guiding. On the index module G4. The extension range of the fourth guiding module G4 covers the configuration range of each third guiding module G3, so that the second imaging device 60 can be displaced in the X direction to the bare crystal on each test transfer station 30. D takes the image. Of course, when the bare crystal test system only sets a single group of test transfer stations 30, the setting of the fourth guide module G4 can be omitted, and the second image capture device 60 can be disposed at a fixed position.

The fifth guiding module G5 extends in the X direction, and the fifth guiding module G5 straddles the first guiding module G1 and the third guiding module G3. Here, the first transfer device 40 and the second transfer device 70 are respectively displaceably disposed on the fifth guiding module G5 in the X direction. Accordingly, the first transfer device 40 can transfer the die D from the loading zone 10 to the test transfer station 30 through the fifth guiding module G5, and the second transfer device 70 can pass through the fifth guiding module. G5 transfers the die D from the test transfer station 30 to the discharge tray sorting area 80.

It can be seen from the above that the bare crystal D is subjected to the needle measurement after the position correction twice, so that the needle test can be ensured smoothly, and the second position correction is based on the position of the pad D2 and the position of the needle tip. The alignment reference, therefore, even if the first outer contour D11 of the die D is differentiated due to the wafer cutting, the bare die D can be positioned at the correct needle measurement position during the second position correction, thereby improving the needle measurement work. Smoothness.

Referring to FIG. 12 again, FIG. 12 illustrates an embodiment in which the first image capturing device 20 is disposed at a position adjacent to the test transfer station 30. Here, the door post can be disposed between the test transfer table 30 and the test machine 50, and the first image taking device 20 and the second image capturing device 60 are respectively disposed on both sides of the door post. The first image capturing device 20 is adjacent to the test transfer station 30, and the second image capturing device 60 is adjacent to the test machine 50. Accordingly, the present embodiment can be applied to a manual test mode in which a person manually places a bare die directly on the test transfer stage 30.

In addition, in an embodiment, when the system is configured with multiple sets of test transfer stations 30 at the same time, the test transfer stations 30 are parallel and juxtaposed, and the gate posts can span the range distributed by the test transfer stations 30. The second guiding module G2 and the fourth guiding module G4 can be disposed on the door post, thereby being suitable for the operation of the plurality of sets of test transfer stations 30.

Although the present invention is disclosed above in the foregoing embodiments, it is not intended to limit the present invention. Any one skilled in the art can make some modifications and retouchings without departing from the spirit and scope of the present invention. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

D‧‧‧ bare crystal

D1‧‧‧Substrate

D2‧‧‧ solder pads

D11‧‧‧ first outline

D21‧‧‧ second outline

10‧‧‧Incoming area

11‧‧‧Loading tray transfer station

111‧‧‧Feeding base

112‧‧‧Feed linear adjustment unit

113‧‧‧Feed angle adjustment unit

114‧‧‧ combination unit

12‧‧‧Feeding tray

20‧‧‧First image capture device

30‧‧‧Test transfer station

31‧‧‧Test base

32‧‧‧Test linear adjustment unit

321‧‧‧ carrier board

322‧‧‧transposition

323‧‧‧Z direction displacement assembly

3231‧‧‧First Guide Module

3232‧‧‧Second guiding module

33‧‧‧Test angle adjustment unit

331‧‧‧Linear drive

332‧‧‧First belt

333‧‧‧Second belt

334‧‧‧Guided arc

3341‧‧‧ curved surface

3342‧‧‧ Plane

34‧‧‧Hosting

40‧‧‧First transfer device

50‧‧‧Testing machine

51‧‧‧ Probe Card

60‧‧‧second image capture device

70‧‧‧Second transfer device

80‧‧‧Measured disk classification area

81‧‧‧distribution tray

90‧‧‧ Third image capture device

91‧‧‧ Observatory

92‧‧‧Image terminal

93‧‧‧First mirror

94‧‧‧second mirror

G1‧‧‧First Guide Module

G2‧‧‧Second guiding module

G3‧‧‧ Third Guide Module

G4‧‧‧4th guidance module

G5‧‧‧ fifth guiding module

C‧‧‧ controller

1 is a block diagram of an architecture of an embodiment of a new bare die test system. 2 is a schematic view of a bare die tested by the new bare die test system. Figure 3 is a partially enlarged plan view of the bare crystal of Figure 2. 4 is a block diagram of an embodiment of a test machine in the present bare die test system. FIG. 5 is a configuration diagram of an embodiment of a new bare die test system. Figure 6 is a block diagram of one embodiment of a feed zone in a prior art bare die test system. 7 is a block diagram of an embodiment of a test transfer station in the present bare die test system. FIG. 8 is a structural diagram of an embodiment of a test transfer station in the present bare die test system. Figure 9 is a cross-sectional view of one embodiment of a test transfer station in the present bare die test system. Figure 10 is a top plan view of one embodiment of a test transfer station in the present bare die test system. 11 is a schematic diagram of an embodiment of a third image capturing device in the bare die test system of the present invention. FIG. 12 is a structural diagram of still another embodiment of a test transfer stage in the bare die test system of the present invention.

Claims (10)

A bare crystal test system for testing a die, the die includes a substrate and a pad, the pad is located on the substrate, and includes: a feed zone, comprising: a feed tray transfer station, The utility model has a feeding linear adjusting unit and a feeding angle adjusting unit, wherein the feeding linear adjusting unit is displaceable along an X direction and a Y direction perpendicular to each other, the feeding angle adjusting unit is rotatable; and a feeding tray Provided on the loading tray transfer stage for carrying the bare crystal; a first image capturing device disposed adjacent to the loading carrier to image the substrate of the bare crystal; Positioned adjacent to the feeding zone, the test transfer station has a test base, a test linear adjustment unit, a test angle adjustment unit and a carrier, the test base can be displaced along the Y direction, the test The linear adjustment unit is disposed on the test base and is displaceable along the X direction and the Z direction. The X direction, the Y direction and the Z direction are perpendicular to each other, and the test angle adjusting unit is connected to the test linear adjustment unit. The seat can be displaced along the Z direction On the test linear adjustment unit; a first transfer device is displaceably disposed between the input region and the test transfer station for accommodating the bare crystal; a test machine having a probe card, The test machine is fixed on the displacement path of the test transfer table, the probe card is fixed on the test machine; a second image capture device is disposed between the test transfer station and the test machine to the bare crystal And the controller, the signal is connected to the loading tray transfer station, the first image capturing device, the test transfer station, the first transfer device, the testing machine, and the first Two image capture devices. The bare crystal test system of claim 1, wherein the image resolution of the second image capturing device is higher than the image resolution of the first image capturing device. The bare crystal test system of claim 1, wherein the test linear adjustment unit comprises a carrier plate, a rotary base and a Z-direction displacement assembly, and the carrier plate is displaceably disposed on the test base along the X direction. The rotating seat is rotatably coupled to the carrier, the Z-direction displacement component is disposed on the rotating seat, and the test angle adjusting unit is coupled to the rotating base. The die test system of claim 3, wherein the Z-direction displacement component comprises a first guiding member and a second guiding member, the first guiding member and the second guiding member are both trapezoidal blocks a first guiding member opposite to the inclined surface of the second guiding member and capable of sliding relative to each other, the first guiding member abutting against the rotating seat and capable of sliding along the X direction, the second guiding The piece is connected to the carrier. The bare crystal test system of claim 3, wherein the test angle adjusting unit comprises a linear driving device, a first belt, a second belt and a guiding arc block, and the linear driving device and the first belt respectively And connecting the second belt, the first belt and the second belt are respectively connected to the guiding arc block, and the guiding arc block is connected to the rotating seat. The bare crystal testing system of claim 5, wherein the guiding arc has a curved surface and a plane, and the first belt and the second belt abut the arc surface, the plane abuts against the plane Transposition. The die test system of claim 1, further comprising a third image capturing device disposed on the test transfer station, wherein the third image capture device is coupled to the controller signal. The bare crystal testing system of claim 7, wherein the third image capturing device has an observation end and an image capturing end, and the viewing end is open in a direction perpendicular to a direction in which the image capturing end is open. The bare crystal test system of claim 8, wherein the observation end is open in the Y direction, and the image pickup end is open in the Z direction. The bare die test system of claim 1, further comprising a second transfer device and a discharge tray classification area, wherein the discharge tray classification area is disposed on the displacement path of the second transfer device.