TWM565397U - Gas filling control device - Google Patents

Abstract

The gas filling control device includes a box body, at least one gas filling control unit, a shunt module, a current collecting module, and a management unit. Each gas filling control unit is removably installed in the box for fluidly connecting the gas source to receive the gas from the gas source, and detecting and processing the gas from the gas source to output the processed gas to the corresponding The gas input terminal of the wafer box loading port receives gas from the gas output terminal of the wafer box loading port for detection and discharge to at least one recovery tank. The shunt module is used to fluidly connect between a gas source and at least one gas-filled control unit. The current collecting module is used to be fluidly connected between at least one recovery tank and at least one gas-filled control unit. The management unit is used to manage each gas filling control unit.

Description

Gas filling control device

This creation relates to a control device, and more particularly to a gas filling control device.

In the semiconductor process, the cleanliness and stability of wafers are very high. In order to ensure that the wafer system is set in the cleanest and most stable environment, a commonly used method is to use an air-tight wafer box as a carrier to store a certain number of wafers in the wafer box for temporary storage.

In addition, a wafer cassette load port is provided at different process equipment of the semiconductor factory. In the semiconductor manufacturing process, wafer cassettes are transported and placed on wafer cassette loading ports via automated transport equipment, and wait for wafers to be processed by corresponding process equipment.

If the accommodating space of the wafer box contains oxygen and moisture, it will easily cause some unpredictable effects on the wafer surface, which may even seriously reduce the final process yield and the failure of semiconductor products. Therefore, the semiconductor industry has gradually developed a gas filling technology to inflate the wafer box, thereby replacing the air inside the wafer box with an inert gas to meet the standards required by the process.

In the conventional technology, the existing wafer cassette loading port must be modified. For example, a plurality of holes are provided in the wafer cassette loading port and a base for carrying the wafer cassette, and additional installation is provided on the wafer cassette loading port. Various gas and electrical components related to individual gas filling. In this way, for the cassette loading port, the cassette loading port has been changed in the organization, which may cause an unexpected situation. Furthermore, for the control of gas filling, it is necessary to carry out the above complex modification to all wafer box loading ports in the factory. In the setting and maintenance, a lot of complexity is added, and the cost of maintenance and management is greatly increased. If the gas filling device on a wafer cassette loading port is abnormal, the wafer cassette loading port may need to be temporarily stopped for maintenance, which may affect the operation of the overall process.

Therefore, the way to realize the gas filling control in the wafer cassette loading port still needs to be improved.

One of the objectives of this creation is to provide a gas filling control device that is independent of the wafer box loading port and performs centralized management to reduce the gas filling gas control of the wafer box loading port during installation, management, and The complexity of maintenance allows managers to manage and dispatch the inflation status of multiple wafer box loading ports in the plant as a whole.

In order to achieve the above-mentioned object and other objects, the present invention proposes a gas filling control device, which includes a cabinet, at least one gas filling control unit, a shunt module, a current collecting module, and a management unit. Each gas filling control unit is removably installed in the box for fluidly connecting the gas source to receive the gas from the gas source, and detecting and processing the gas from the gas source to output the processed gas to the corresponding A gas input terminal of a wafer box load port receives gas from a gas output terminal of the wafer box load port for detection and discharge to at least one recovery tank. The shunt module is used to fluidly connect between a gas source and at least one gas-filled control unit. The current collecting module is used to be fluidly connected between at least one recovery tank and at least one gas-filled control unit. The management unit is electrically coupled to at least one gas-filled control unit for managing each gas-filled control unit.

In one embodiment of the present invention, the shunt module includes a plurality of first switching valves, and each of the first switching valves is used to fluidly connect between the gas source and the corresponding gas filling control unit; the current collecting module includes a plurality of first switching valves. Two on-off valves, each of which is used to be fluidly connected between at least one recovery tank and a corresponding gas-filled control unit.

In an embodiment of the present invention, the gas filling control device further includes a regulator for fluidly connecting between the gas source and the shunt module.

In an embodiment of the present invention, the gas filling control device further includes a power supply unit, and the power supply unit is configured to output a power signal for internal use of the gas filling control device.

In one embodiment of the present invention, the gas filling control unit includes a gas filling module and a gas recovery module. The gas filling module is used to fluidly connect the gas source to receive the gas from the gas source, and to detect, control and filter the gas from the gas source to output the processed gas to the gas input of the corresponding wafer box loading port. End, wherein the gas filling module has a first input connection end and a first output connection end, the first input connection end is used to receive the gas of the gas source, and the first output connection end is used to output the processed gas to the corresponding crystal Gas input terminal of round box loading port. The gas recovery module is used to receive the gas at the gas output terminal of the wafer box loading port for detection and discharge to at least one recovery tank. The gas recovery module has a second input connection terminal and a second output connection terminal, and the second input The connection end is used to receive the gas at the gas output end of the wafer box loading port, and the second output connection end is used to discharge the gas at the gas output end of the wafer box loading port to at least one recovery tank.

In one embodiment of the present invention, the gas recovery module is used to detect the humidity of the gas from the second input connection terminal and output a humidity sensing signal. The management unit controls the gas filling module based on the humidity sensing signal to change the processed gas. The velocity of the gas.

In one embodiment of the present invention, if the humidity sensing signal indicates that the humidity of the gas from the second input connection terminal is greater than the humidity threshold, the management unit controls the gas filling module to increase the flow rate of the processed gas.

In one embodiment of the present invention, the gas filling module includes: an air flow regulator, a first pressure sensor, a gas flu detector, and a filter. The input end of the air conditioner is fluidly connected to the first input connection end. The first pressure sensor is fluidly connected to the airflow regulator, and is configured to sense the pressure of the gas output by the airflow regulator and output a first pressure sensing signal. The gas flu detector is fluidly connected to the airflow regulator, and is used to sense the gas flow velocity of the gas output by the airflow regulator and output a gas flu signal. The filter is fluidly connected between the first input connection end and the first output connection end.

In one embodiment of the present invention, the gas recovery module includes: an exhaust valve, a second pressure sensor, and a humidity sensor. The exhaust valve is fluidly connected between the second input connection end and the second output connection end. The second pressure sensor is fluidly connected between the second input connection end and the second output connection end, and is used for sensing the pressure of the gas from the second input connection end and outputting a second pressure sensing signal. The humidity sensor is fluidly connected between the second input connection end and the second output connection end, and is used to sense the humidity of the gas from the second input connection end and output a humidity sensing signal.

In one embodiment of the present invention, the management unit includes a control module and a display module. The display module is electrically coupled to the control module for displaying the use interface, wherein the control module is used to control the display module to display the status of each gas-filled control unit on the use interface.

Thereby, a plurality of gas filling control units can be removably installed in the box of the gas filling control device for centralized management, so as to reduce the gas filling gas control of the wafer box loading port in installation, management and maintenance. Complexity, and can enable managers to manage and schedule the inflation status of multiple wafer box loading ports in the plant as a whole. When necessary, the manager can perform maintenance or condition removal by replacing the gas with the control unit. In this way, the complexity of the setting of the gas filling control is greatly reduced, the maintenance and the setting are more convenient, and the cost of the setting and the maintenance can be reduced.

In order to fully understand the purpose, features, and effects of this creation, we will use the following specific examples and the accompanying drawings to explain this creation in detail, as described below:

Please refer to FIG. 1A, FIG. 1B, and FIG. 2. FIG. 1A is a schematic diagram of an appearance of a gas filling control device in an embodiment of the creation, FIG. 1B is an appearance diagram of an embodiment of a box of the gas filling control device, and FIG. 2 is A block diagram of a gas filling control device in an embodiment of the present invention. As shown in FIG. 1A, the gas filling control device 1 includes a cabinet 10, at least one gas filling control unit 20, and a management unit 30. Each of the gas filling control units 20 is removably installed in the cabinet 10 to manage The unit 30 can be installed inside or outside the cabinet 10. As shown in FIG. 1B, the cabinet 10 may be implemented with a front door 11 and a side door 12. After the front door 11 is opened, the gas filling control unit 20 is removably installed in the accommodation space of the box 10. The side door 12 has a heat sink for heat dissipation, and the user can open the side door 12 to perform maintenance work on the gas filling control unit 20. In addition, the management unit 30 can be configured to have a display module and can be installed on the cabinet 10 so that the display screen of the display module faces outward, so that a technician can know the status of the gas filling control unit 20 or make settings from the display screen. . However, the realization of this creation is not limited by the above examples. For example, the cabinet 10 can also be implemented with multiple side doors or without side doors, or any configuration that can provide a space for accommodation.

As shown in FIG. 2, the gas filling control device 1 is independent of the wafer box loading port LP and performs centralized management, so the gas filling control device 1 can be fluidly connected to a plurality of wafer box loading ports LP at the same time. Each gas filling control unit 20 is for fluidly connecting the gas source GS to receive the gas from the gas source GS, and detecting and processing the gas from the gas source GS to output the processed gas to the corresponding wafer box loading port LP (load port) gas input terminal LI, and receives the gas at the gas output terminal LO of the wafer cassette loading port LP for detection and discharge to at least one recovery tank SK. For example, the wafer cassette loading port LP is used to carry a wafer cassette FP, such as a Front Open Unified Pod (FOUP); the wafer cassette FP also has a gas input and output terminal for communicating with the gas input terminal. LI is in fluid connection with the gas output LO. The gas filling control unit 20 can fill the inside of the wafer cassette FP with an inert gas (such as nitrogen, helium, or other inert gas), clean dry air (CDA), and the like through the cassette loading port LP. Ultra Clean Dry Air (XCDA) or other gases to achieve the purpose of excluding oxygen and water vapor, so as to meet the standards required by the process.

The management unit 30 is electrically coupled to at least one gas-filled control unit 20 and is configured to receive a corresponding detection signal from each gas-filled control unit 20 and control each gas-filled control unit 20.

Thereby, a plurality of gas filling control units 20 can be removably installed in the casing 10 of the gas filling control device 1 for centralized management. In addition, semiconductor manufacturers no longer need to modify the wafer cassette loading port in order to provide the gas cassette with a gas filling control function, which greatly reduces the complexity of the setup. In addition, with the centralized management of the management unit 30, managers can more efficiently manage and dispatch the inflation status of multiple wafer box loading ports LP in the plant as a whole; if necessary, they can be replaced by replacement The control unit 20 is filled with gas for maintenance or condition elimination. Furthermore, the management unit 30 can also be configured to provide management functions required by a manager, such as tracking status events of the gas filling control unit 20. In this way, the complexity of the setting of the gas filling control is greatly reduced, the maintenance and the setting are more convenient, and the cost of the setting and the maintenance can be reduced.

Please refer to FIG. 3, which is a block diagram of an embodiment of the gas filling control device 1. In this embodiment, the gas filling control device 1 further includes a shunt module 40 for fluidly connecting between the gas source GS and at least one gas filling control unit 20. For example, the shunt module 40 may include a plurality of on-off valves 41, each of which is used to fluidly connect between the gas source GS and the corresponding gas-filled control unit 20, such as the on-off valve 41 through a connected pipeline fluid Connected to gas source GS. In addition, the gas filling control device 1 may further include a regulator 45, such as a gas flow stabilization device, for fluidly connecting between the gas source GS and the shunt module 40 to make the flow of the gas from the gas source GS more stable. In addition, the gas filling control device 1 further includes a current collecting module 50 for fluidly connecting between at least one recovery tank SK and at least one gas filling control unit 20. For example, the current collecting module 50 may include a plurality of on-off valves 51. Each on-off valve 51 is used to fluidly connect between at least one recovery tank SK and the corresponding gas filling control unit 20, for example, the on-off valve 51 is connected by The pipeline is fluidly connected to at least one recovery tank SK. However, the implementation method of the gas filling control device of this creation is not limited by the above examples; for example, the regulator can also be regarded as an external device of the gas filling control device 1; the on-off valve can be a solenoid valve or a manual valve.

If there is an abnormality in a certain gas filling control unit 20, only the corresponding on-off valves in the shunt module 40 and the current collecting module 50 need to be closed to remove the abnormal gas filling control unit 20 from the gas filling control device. Other than 1, in order to replace the normal gas filling control unit, so that the corresponding wafer cassette loading port needs to be stopped for a long time, so it can greatly reduce the impact on the overall process operation and improve the efficiency of maintenance.

As shown in FIG. 3, for example, the management unit 30 may include a control module 31 and a display module 32. The display module 32 is electrically coupled to the control module 31 to display the use interface. The control module 31 is used to control the display module 32 to display the status of each gas-filled control unit 20 on the use interface. For example, the gas filling control unit 20 detects and processes the gas of the gas source GS, and detects the gas from the gas output terminal LO of the wafer box loading port LP, and the relevant data of the detection signal generated therein (Such as pressure, air velocity, or humidity) will be displayed through the user interface. In addition, the control module 31 can control each gas filling control unit 20 according to the detection signal. For example, the control module 31 outputs a plurality of control signals to each gas filling control unit 20. The control module 31 is, for example, a microprocessor or a microcontroller. In addition, the management unit 30 may further include a network module for communicating with the central control system in a wired or wireless manner for various management purposes. The central control system is, for example, a Manufacturing Execution System (MES) or a machine. Automation (Equipment Automation Program, EAP) system. However, the implementation of the gas filling control device of this creation is not limited by the above examples; for example, the management unit can also be implemented to include at least a control module.

Furthermore, the gas filling control device 1 may further include a power supply unit for outputting a power signal for use by a unit or module inside the gas filling control device 1.

Please refer to FIG. 4, which is a block diagram of an embodiment of the gas filling control unit 20. In this embodiment, the gas filling control unit 20 includes: a gas filling module 21 and a gas recovery module 22, wherein the management unit 30 is electrically coupled to the gas filling module 21 and the gas recovery module 22.

In addition, in FIG. 4, for example, the power supply unit 60 may be used to output a power signal for use by the gas filling control unit 20. For example, the power supply unit may include a transformer, a voltage regulator, a UPS, or other suitable power supply circuits or a combination thereof. However, the implementation of the gas filling control device of this creation is not limited by the above examples. For example, the power supply unit may be implemented in each gas filling control unit 20; or the gas filling control device 1 may be implemented to include at least one power supply unit to supply power for internal use. As another example, the gas filling control device 1 may have a plurality of power supply units, and may switch to another power supply unit when a power supply unit fails. In addition, the gas filling control device 1 can also be realized as a device that regards the power supply unit as an external component.

Please refer to FIG. 4 again, the gas filling module 21 is used to fluidly connect the gas source GS to receive the gas from the gas source GS, and to detect, control and filter the gas from the gas source GS to output the processed gas to Gas input terminal LI of the corresponding cassette loading port LP. As shown in FIG. 4, the gas filling module 21 has a first input connection terminal IN1 and a first output connection terminal OUT1. The first input connection terminal IN1 is used to receive the gas of the gas source GS, and the first output connection terminal OUT1 is used to connect The processed gas is output to the gas input terminal LI of the corresponding wafer cassette loading port LP.

The gas recovery module 22 is used to receive the gas at the gas output terminal LO of the wafer box loading port LP for detection and discharge to at least one recovery tank SK. As shown in FIG. 4, the gas recovery module 22 has a second input connection terminal IN2 and a second output connection terminal OUT2. The second input connection terminal IN2 is used to receive a gas (such as the gas output terminal LO of the wafer box loading port LP). The second output connection terminal OUT2 is used to discharge the received gas (such as the gas at the gas output terminal LO of the wafer cassette loading port LP) to at least one recovery tank SK.

In one embodiment, the gas recovery module 22 is used to detect the humidity of the gas from the second input connection terminal IN2 (such as the gas at the gas output terminal LO of the wafer box loading port LP) and output a humidity sensing signal for management. The unit 30 controls the gas filling module 21 based on the humidity sensing signal to change the flow rate of the processed gas.

For example, if the humidity sensing signal indicates that the humidity of the gas from the second input connection terminal IN2 (such as the gas at the gas output terminal LO of the wafer box loading port LP) is greater than or equal to the humidity threshold, the management unit 30 controls the gas filling module 21 to increase the flow rate of the treated gas. If the humidity sensing signal indicates that the humidity of the received gas (such as the gas at the gas output terminal LO of the wafer box loading port LP) is less than the humidity threshold, the management unit 30 may control the gas filling module 21 to reduce or maintain the The current flow rate of the processed gas.

Please refer to FIG. 5, which is a block diagram of an embodiment of the gas filling module 21 of the gas filling control unit 20. In one embodiment of the present invention, the gas filling module 21 includes: an airflow regulator 110, a first pressure sensor 120, a gas flu detector 130, and a filter 140. An input terminal of the airflow regulator 110 is fluidly connected to the first input connection terminal IN1. The first pressure sensor 120 is fluidly connected to the airflow regulator 110 and is configured to sense the pressure of the gas output by the airflow regulator 110 and output a first pressure sensing signal. The gas flu detector 130 is fluidly connected to the airflow regulator 110, and is used to sense the gas flow velocity of the gas output from the gas flow regulator 110 and output a gas flu signal. The filter 140 is fluidly connected between the first input connection terminal IN1 and the first output connection terminal OUT1. For example, in addition to the configuration relationship shown in FIG. 5, the gas filling module 21 may also be arranged in any other suitable arrangement manner or add other components. For example, the filter 140 may be disposed between the airflow regulator 110 and the first pressure sensor 120; the gas flu sensor 130 may be disposed between the airflow regulator 110 and the first pressure sensor 120. The implementation of this creation is not limited by the above examples.

For example, the airflow regulator 110 may include a plurality of control valves 111 and 112, each of which can generate a corresponding flow when opened, and the airflow can be adjusted by various combinations of the opening and closing of the control valves 111 and 112. The gas at the output of the generator 110 produces different flow rates. The above-mentioned first pressure sensing signal and gas flu testing signal may be transmitted to the management unit 130, and the management unit 130 may process, analyze, record, or display the information so as to facilitate the management personnel to manage the gas filling control matters.

Please refer to FIG. 6, which is a schematic block diagram of an embodiment of the gas recovery module 22 of the gas filling control unit 20. In one embodiment of the present invention, the gas recovery module 22 includes: an exhaust valve 210, a second pressure sensor 220, and a humidity sensor 230. The exhaust valve 210 is fluidly connected between the second input connection terminal IN2 and the second output connection terminal OUT2. The second pressure sensor 220 is fluidly connected between the second input connection terminal IN2 and the second output connection terminal OUT2 to sense the pressure of the gas at the gas output terminal LO of the wafer box loading port LP and output the second Pressure sensing signal. The humidity sensor 230 is fluidly connected between the second input connection terminal IN2 and the second output connection terminal OUT2, and is used to sense the humidity of the gas at the gas output terminal LO of the wafer box loading port LP and output a humidity sensing signal. . As in the foregoing embodiment, the management unit 30 can control the gas filling module 21 to change the flow rate of the processed gas based on the humidity sensing signal. For example, the management unit 30 outputs a control signal to the airflow regulator 110 to control the opening of the regulating valves 111 and 112. Or close to change the flow rate of the gas. For example, in addition to the configuration relationship as shown in FIG. 6, the gas recovery module 22 may be arranged in any other suitable arrangement manner or add other components. For example, the humidity sensor 230 may also be disposed between the exhaust valve 210 and the second input connection terminal IN2. The implementation of this creation is not limited by the above examples.

Please refer to FIG. 7, which is a schematic diagram of an embodiment of a use scenario for centralized management using a gas filling control device. As shown in FIG. 7, the gas filling control device 1 can be fluidly connected to a plurality of wafer box loading ports LP at the same time to perform gas filling control on the wafer box FP carried thereon. In FIG. 7, the gas filling control device 1 can communicate with the central control system through a wired or wireless method such as the Internet Protocol (TCP / IP) for various management purposes. The central control system is, for example, a manufacturing execution system (MES ) 710 or Machine Automation (EAP) system 720. The machine automation system 720 may communicate with a manufacturing execution system 710. Thereby, the gas filling control device 1 can transmit the detection signal or status of the wafer cassette FP corresponding to each wafer cassette loading port LP to the machine automation system 720 and the manufacturing execution system 710, and the manufacturing execution system 710 or machine automation The system 720 can also be used to set and manage the gas filling control device 1 so as to manage the gas filling control of the plurality of wafer cassette loading ports LP. In addition, the gas filling control device 1, the manufacturing execution system 710, and the machine automation system 720 can communicate using industry standard communication protocols, such as the Semiconductor Equipment Communication Standard (SECS) or high-speed SECS message service. (High-Speed SECS Message Services, HSMS). However, the implementation of this creation is not limited by the above examples.

In the above embodiments, the plurality of gas filling control units 20 may be removably installed in the casing 10 of the gas filling control device 1 for centralized management. In addition, semiconductor manufacturers no longer need to modify the wafer cassette loading port in order to provide a gas fill control function to the wafer cassette, which greatly reduces the complexity of setup, makes maintenance and setup more convenient, and can reduce setup and maintenance costs. . In addition, the centralized management of the management unit 30 makes it easier for managers to grasp and schedule the status of multiple wafer box loading ports LP in the plant. When necessary, it can be controlled by gas replacement. The unit 20 performs maintenance or condition elimination. Furthermore, the management unit 30 can also be configured to provide management functions required by a manager, such as tracking status events of the gas filling control unit 20. In this way, the complexity of the setting of the gas filling control is greatly reduced, the maintenance and the setting are more convenient, and the cost of the setting and the maintenance can be reduced.

This creation has been disclosed above with a preferred embodiment, but those skilled in the art should understand that this embodiment is only used to describe this creation, and should not be interpreted as limiting the scope of this creation. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be defined by the scope of the patent application.

1‧‧‧Gas filling control device
10‧‧‧Box
11‧‧‧ front door
12‧‧‧ side entrance
20‧‧‧Gas filling control unit
21‧‧‧Gas Filled Module
22‧‧‧Gas Recovery Module
30‧‧‧Management Unit
31‧‧‧Control Module
32‧‧‧Display Module
40‧‧‧ Diversion Module
41‧‧‧On-off valve
45‧‧‧ Regulator
50‧‧‧collection module
51‧‧‧on-off valve
60‧‧‧Power supply unit
110‧‧‧Air Regulator
111, 112‧‧‧ regulating valve
120‧‧‧The first pressure sensor
130‧‧‧Gas Flu Detector
140‧‧‧filter
210‧‧‧ exhaust valve
220‧‧‧Second pressure sensor
230‧‧‧Humidity sensor
710‧‧‧Manufacturing Execution System
720‧‧‧machine automation system
GS‧‧‧Gas source
SK‧‧‧ Recovery Tank
LP‧‧‧Wafer Box Loading Port
LI‧‧‧Gas input
LO‧‧‧Gas output
FP‧‧‧ Wafer Box
IN1‧‧‧First input connection
OUT1‧‧‧First output connection
IN2‧‧‧Second input connection
OUT2‧‧‧Second output connection

[Fig. 1A] is a schematic diagram of the appearance of a gas filling control device in an embodiment of the present invention. [Fig. 1B] is a schematic diagram of an appearance of an embodiment of a box of a gas filling control device. [Fig. 2] is a block diagram of a gas filling control device in an embodiment of the present invention. [Fig. 3] A block diagram of an embodiment of a gas filling control device. [Fig. 4] It is a schematic block diagram of an embodiment of a gas filling control unit. [Fig. 5] It is a block diagram of an embodiment of a gas filling module of a gas filling control unit. [Fig. 6] It is a block diagram of an embodiment of a gas recovery module of a gas filling control unit. [Fig. 7] It is a schematic diagram of an embodiment of a use scenario for centralized management using a gas filling control device.

Claims (10)

A gas filling control device includes: a box body; at least one gas filling control unit, each of which is removably installed in the box body, for fluidly connecting a gas source to receive the gas source The gas of the gas source is detected and processed to output the processed gas to a gas input terminal of a corresponding wafer box load port, and to receive the gas of the wafer box load port The gas at the output end is detected and discharged to at least one recovery tank; a shunt module is used to fluidly connect between the gas source and the at least one gas-filled control unit; a current collecting module is used to fluidly connect Between the at least one recovery tank and the at least one gas-filled control unit; a management unit electrically coupled to the at least one gas-filled control unit for managing each of the gas-filled control units. The gas filling control device according to claim 1, wherein the shunt module includes a plurality of first switching valves, and each of the first switching valves is used to fluidly connect between the gas source and the corresponding gas filling control unit; The current collecting module includes a plurality of second switching valves, and each of the second switching valves is used for fluidly connecting between the at least one recovery tank and the corresponding gas filling control unit. The gas filling control device according to claim 1, wherein the gas filling control device further comprises a regulator for fluidly connecting between the gas source and the shunt module. The gas filling control device according to claim 1, wherein the gas filling control device further includes a power supply unit for outputting a power signal for internal use of the gas filling control device. The gas filling control device according to claim 1, wherein the gas filling control unit includes: a gas filling module for fluidly connecting the gas source to receive the gas from the gas source, and detecting the gas from the gas source Measuring, controlling and filtering to output the processed gas to the corresponding gas input end of the wafer cassette loading port, wherein the gas filling module has a first input connection end and a first output connection end, the A first input connection end for receiving gas from the gas source, the first output connection end for outputting the processed gas to a corresponding gas input end of the wafer box loading port; and a gas recovery module, The gas recovery terminal is used for receiving the gas at the gas output terminal of the loading box of the wafer cassette for detection and discharge to the at least one recovery tank. The gas recovery module has a second input connection terminal and a second output connection terminal. Two input connections are used to receive the gas from the gas output of the wafer box loading port, and the second output connection is used to discharge the gas from the gas output of the wafer box loading port to the at least Recovery tank. The gas filling control device according to claim 5, wherein the gas recovery module is configured to detect the humidity of the gas from the second input connection terminal and output a humidity sensing signal, and the management unit is based on the humidity sensing signal The gas filling module is controlled to change the flow rate of the processed gas. The gas filling control device according to claim 6, wherein if the humidity sensing signal indicates that the humidity of the gas from the second input connection terminal is greater than a humidity threshold, the management unit controls the gas filling module to increase the economy Flow rate of the processed gas. The gas filling control device according to claim 5, wherein the gas filling module comprises: an airflow regulator, the input end of the airflow regulator is fluidly connected to the first input connection end; a first pressure sensor Fluidly connected to the airflow regulator to sense the pressure of the gas output by the airflow regulator and output a first pressure sensing signal; a gas flu detector is fluidly connected to the airflow regulator to sense The airflow velocity of the gas output by the airflow regulator outputs a flu test signal; and a filter is fluidly connected between the first input connection end and the first output connection end. The gas filling control device according to claim 5, wherein the gas recovery module includes: an exhaust valve fluidly connected between the second input connection end and the second output connection end; a second pressure sensing A device fluidly connected between the second input connection end and the second output connection end, for sensing the pressure of the gas from the second input connection end and outputting a second pressure sensing signal; a humidity sensing A device fluidly connected between the second input connection end and the second output connection end, for sensing the humidity of the gas from the second input connection end and outputting a humidity sensing signal. The gas filling control device according to claim 1, wherein the management unit includes: a control module; and a display module electrically coupled to the control module for displaying a user interface; wherein the control module It is used to control the display module to display the states of the gas filling control units on the use interface.