TWM562547U - Case structure - Google Patents

Abstract

A case structure is configured to accommodate a a host panel and a plurality of components disposed on the host panel. The case including a first housing and a second housing is provided. The second housing is connected to the first housing and form an accommodating space. A junction of the first housing and the second housing has at least one step. Wherein, the host panel is disposed in the accommodating space. The components are disposed in the accommodating space and matches at least one height of the accommodating space.

Description

Case structure

The novel creation relates to a casing structure, and in particular to a casing structure for an electronic device

The existing mini desktop computer case type is aimed at minimizing the volume. At present, in the design of the casing, the frame for carrying is made based on the internal parts and the space required for heat dissipation, and then the matching casing is made in the size of the frame. Since the existing frame is mostly integrally formed and has a fixed length, width and height dimension, the outer casing made of the mating frame cannot jump out of the shape of one block, and further, the existing fixed size outer casing cannot further reduce the volume and The appearance presented as a piece has a bulky look.

The novel creation provides a casing structure that can further reduce the volume and exhibit a thin and light look.

The casing structure of the present invention is for accommodating a main board and a plurality of parts disposed on the main board. The housing structure includes a first housing and a second housing. The second housing is connected to the first housing to form an accommodating space, and the connection between the first housing and the second housing has an appearance of at least one step. The motherboard is disposed in the accommodating space, and the plurality of components are disposed at least one height of the accommodating space.

In an embodiment of the present invention, the first housing has a first side panel, a second side panel, a first front side panel, a first rear side panel, and a bottom panel. The first side panel is opposite to the first side panel. The second side panel and the first front side panel are opposite to the first rear side panel.

In an embodiment of the present invention, the second housing has a third side panel, a fourth side panel, a second front side panel, a second rear side panel, and a top panel. The third side panel is retracted. On the first side panel and abutting the first front side panel and the first rear side panel, the fourth side panel portion protrudes from the second side panel, the second front side panel protrudes from the first front side panel, and the second rear side panel portion is retracted to the first side panel The rear side panels are spaced relative to the bottom panel.

In an embodiment of the present invention, the first rear side panel has a first connecting portion, and the second rear side panel is connected to the first connecting portion and gradually retracts toward the first side panel, and the second front side panel There is a second connecting portion, and the first front side plate is connected to the second connecting portion and is contracted to the second front side plate in a direction toward the first rear side plate.

In an embodiment of the present invention, a plurality of bumps are further disposed at a plurality of corners of the second side panel and the fourth side panel.

In an embodiment of the present invention, a support base is further disposed on a bottom plate of the first housing.

In an embodiment of the present invention, the support base has a support plate and a locking portion. The locking portion is disposed on the support plate and faces the bottom plate. The locking portion is fixed to a locking hole on the bottom plate.

In an embodiment of the present invention, the above method further includes a plurality of heat dissipation holes respectively disposed on the first housing and the second housing for performing heat exchange to reduce the temperature of the host unit.

In an embodiment of the present invention, a plurality of input and output slots are disposed on the first front side panel and the first rear side panel, and are used to connect the plurality of connectors for positioning the motherboard.

Based on the above, the casing structure of the present invention is composed of a first casing and a second casing which are connected to each other in a protruding manner, so that the outer shape of the casing structure does not appear as a whole structure, but in the first casing and the second casing. A step is formed between the housings. Thereby, the casing structure is made thinner to achieve a light impression. In addition, the casing structure can effectively utilize the accommodating space with the step difference to fit the corresponding host unit, avoiding the waste of the accommodating space, and achieving the purpose of miniaturization.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

1A is a perspective view of a casing structure created in accordance with the present invention. Figure 1B is a plan view of the casing structure of Figure 1A in one direction. 1C is a schematic plan view of the casing structure of FIG. 1A in another direction. 1D is a partial cross-sectional view of the casing structure and the main unit of FIG. 1A.

Referring to FIG. 1A to FIG. 1D , the casing structure 100 of the embodiment is used for accommodating the motherboard 210 and the plurality of components 220 disposed on the motherboard 210 . The motherboard 210 is adapted to provide a variety of expansion slots and joints. The plurality of parts 220 include a processor, a display card, a sound card, a hard disk drive, a memory, a power supply, or the like, and are respectively coupled to corresponding expansion slots and joints in the motherboard 210.

The casing structure 100 of the embodiment includes a first casing 110 and a second casing 120. The second housing 120 is connected to the first housing 110 , and the second housing 120 and the plurality of outer edges E of the first housing 110 protrude from each other, and the second housing 120 is connected to the first housing 110 . A plurality of step differences are formed at the appearance. Referring to FIG. 1D, the first housing 110 and the second housing 120 are connected to form an accommodating space S. In detail, the two opposite inner wall surfaces of the accommodating space S are not integrated or smooth, and are accommodated in the accommodating space. The inside of S forms two heights H1 and H2 which are interlaced by a plurality of step differences. Further, the motherboard 210 is disposed in the first casing 110 and the second casing 120. In actual applications, the motherboard 210 is fixed to the first casing 110 and the second casing by bolt locking or other fixing manner. Shell 120. The plurality of parts 220 are respectively disposed on the two sides of the main board 210, and are disposed in the accommodating space S having the step difference. Further, the plurality of parts 220 are disposed to match the two heights H1 and H2, so that the plurality of parts 220 can be It is completely filled in the accommodating space S.

2A is a perspective view of the casing structure of FIG. 1A in another direction. 2B is an exploded perspective view of the housing structure of FIG. 2A. 2B is an exploded perspective view of the housing structure of FIG. 2A.

Referring to FIGS. 2A-2C , the first housing 110 has a first side panel 111 , a second side panel 112 , a first front side panel 113 , a first rear side panel 114 , and a bottom panel 115 . The first side panel 111 is opposite to the second side panel 112 and the first front side panel 114 is opposite to the first rear side panel 114. In this embodiment, the first side plate 111, the second side plate 112, and the first front side plate 113 are trapezoidal, and the first rear side plate 114 and the bottom plate 115 are rectangular, but the present invention is not limited thereto. In other embodiments not shown, the first housing 110 can change the shape of the first side panel, the second side panel, the first front side panel, the first rear side panel, and the bottom panel according to the manufacturing requirements.

The second housing 120 has a third side plate 121, a fourth side plate 122, a second front side plate 123, a second rear side plate 124 and a top plate 125 connected to each other. In this embodiment, the third side plate 121, the fourth side plate 122, and the second front side plate 123 are trapezoidal, and the second rear side plate 124 and the top plate 125 are rectangular, but the present invention is not limited thereto. In other embodiments not shown, the second housing 120 can change the shapes of the third side panel, the fourth side panel, the second front side panel, the second rear side panel, and the top panel according to manufacturing requirements. The second housing 120 is coupled to the first housing 110.

Referring to FIGS. 1A, 1D, and 2A to 2C, the third side plate 121 is retracted into the first side plate 111 and abuts against the first front side plate 113 and the first rear side plate 114 to form a height H1 in the accommodating space S. . The fourth side plate 122 partially protrudes from the second side plate 112 to form a height H2 in the accommodation space S.

Further, the second front side panel 123 protrudes from the first front side panel 113, and the second rear side panel 124 partially retracts into the first rear side panel 114, and thereby forms a step on the front and rear outer surfaces of the cabinet structure 100. The top plate 125 is spaced relative to the bottom plate 115. In detail, the first rear side panel 114 has a first connecting portion 1141 , and the second rear side panel 124 is connected to the first connecting portion 1141 and gradually retracts toward the first side panel 111 . The second front side panel 123 has a second connecting portion 1231. The first front side panel 113 is coupled to the second connecting portion 1231 and is retracted toward the second front side panel in a direction toward the first rear side panel 124. Further, the first connecting portion and the second connecting portion may adopt a magnetic element, a snapping structure or a locking structure to achieve the effects of fixing the first housing 110 and the second housing 120.

1A, 2B, and 2C, the housing structure 100 of the present embodiment includes a support base 130 and a plurality of heat dissipation holes 140 disposed in the bottom plate 115 of the first housing 110 and located on the first side plate 111 and the second side plate 112. between. In detail, the support base 130 has a support plate 131 and a locking portion 132. The locking portion 132 is disposed on the support plate 131 and faces the bottom plate 115. The locking portion 132 is fixed to the bottom plate 115 through a locking member, for example. Lock the hole O. Further, since the area of the support plate 131 is larger than the area of the bottom plate 115, when the chassis structure 100 is mounted with the support base 130, the casing structure 100 will be switched to the upright mode. Referring to FIG. 1A, in the upright mode, the connection between the first side panel 111 and the third side panel 121 and the first front side panel 113 and the second front side panel 123 will exhibit the appearance of the chassis structure 100 being misaligned. .

The plurality of heat dissipation holes 140 are respectively disposed on the first side plate 111, the second side plate 112, the first front side plate 113, the bottom plate 115, and the second front side plate 123 and the top plate 125 of the second casing 120 of the first casing 110. In this embodiment, each of the heat dissipation holes 140 has a triangular appearance and has different sizes, and each of the heat dissipation holes 140 is used for heat exchange to reduce the temperature of the motherboard 210 and the plurality of parts 220. For example, the cold air in the environment enters the first housing or the second housing through the respective heat dissipation holes 140, and the heat generated when the motherboard 210 and the plurality of components 220 are operated is discharged from the respective heat dissipation holes 140. In other embodiments, each of the louvers can be changed to a rectangular, circular or other shaped hole according to requirements.

Fig. 3 is a schematic view showing the state in which the casing structure of Fig. 1A is switched to the horizontal position. Referring to FIG. 2C and FIG. 3 , the casing structure 100 includes a plurality of protrusions 150 respectively disposed at a plurality of corners C of the second side plate 112 and the fourth side plate 122 , where the plurality of protrusions 150 are integrally formed, for example. On the first housing 110 and the second housing 120. When the cabinet structure 100 removes the support base 130 and abuts the plane G with the plurality of bumps 150, the cabinet structure 100 is switched to the lie mode. The second side plate 112 and the fourth side plate 122 are parallel to the plane G through the support of the plurality of bumps 150. Further, since the fourth side plate 122 of the second casing 120 partially protrudes from the second side plate 112 of the first casing 110, the casing structure 110 generates a high and low staggered shape in the lie mode, in detail The second side panel 112 having a higher level of height and the fourth side panel 122 having a lower level of height provide a visual suspension feeling, so that the outer shape of the casing structure 100 is thinned and lightly perceived.

Referring to FIG. 1A and FIG. 1B , in the embodiment, the casing structure 100 includes a plurality of input and output slots 160 respectively disposed on the first front side plate 113 and the first rear side plate 114 and configured to connect the plurality of positioning motherboards 210 . The connector 211 is for connecting an external storage device, an input device, an output device, a transmission line, or the like.

In summary, the casing structure of the present invention is composed of a first casing and a second casing which are connected to each other so that the outer shape of the casing structure does not appear as a whole structure, but in the first casing and A step is formed between the second housings. Thereby, the casing structure is made thinner to achieve a light impression. In addition, the casing structure can effectively utilize the accommodating space with the step difference to fit the corresponding host unit, avoiding the waste of the accommodating space, and achieving the purpose of miniaturization.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

100‧‧‧Shell structure
110‧‧‧First housing
120‧‧‧second housing
121‧‧‧ Third side panel
130‧‧‧ support
140‧‧‧ vents
150‧‧‧Bumps
160‧‧‧Input and output slots
210‧‧‧ motherboard
211‧‧‧Connector
220‧‧‧ parts
E‧‧‧ outer edge
H1, H2‧‧‧ height
O‧‧‧Lock hole
G‧‧‧ Plane
S‧‧‧ accommodating space

1A is a perspective view of a casing structure created in accordance with the present invention. Figure 1B is a plan view of the casing structure of Figure 1A in one direction. 1C is a schematic plan view of the casing structure of FIG. 1A in another direction. 1D is a partial cross-sectional view of the casing structure and the main unit of FIG. 1A. 2A is a perspective view of the casing structure of FIG. 1A in another direction. 2B is an exploded perspective view of the housing structure of FIG. 2A. 2C is an exploded perspective view of the housing structure of FIG. 2A. Fig. 3 is a schematic view showing the state in which the casing structure of Fig. 1A is switched to the horizontal position.

Claims (9)

A casing structure for accommodating a main board and a plurality of parts disposed on the main board, the housing structure comprising: a first housing; and a second housing connected to the first housing An accommodating space, wherein the connection between the first casing and the second casing has at least one difference, wherein the main board is disposed in the accommodating space, and the parts are matched with the accommodating space. A height setting. The casing structure of claim 1, wherein the first casing has a first side plate, a second side plate, a first front side plate, a first rear side plate and a bottom plate connected to each other. The first side panel is opposite to the second side panel and the first front side panel is opposite to the first rear side panel. The casing structure of claim 2, wherein the second casing has a third side plate, a fourth side plate, a second front side plate, a second rear side plate and a top plate connected to each other. The third side panel is retracted to the first side panel and abuts the first front side panel and the first rear side panel, the fourth side panel portion protrudes from the second side panel, and the second front side panel protrudes from the first front panel a side panel, the second rear side panel portion being retracted to the first rear side panel, the top panel being spaced relative to the bottom panel. The casing structure of claim 3, wherein the first rear side panel has a first connecting portion, and the second rear side panel is connected to the first connecting portion and gradually faces the first side panel. The second front side panel has a second connecting portion, and the first front side panel is connected to the second connecting portion and is retracted toward the second front side panel toward the first rear side panel. The casing structure of claim 3, further comprising a plurality of bumps disposed at a plurality of corners of the second side panel and the fourth side panel. The casing structure of claim 1, further comprising a support base disposed on a bottom plate of the first casing. The housing structure of claim 6, wherein the support base has a support plate and a locking portion, the locking portion is disposed on the support plate and faces the bottom plate, and the locking portion is fixed to the a locking hole in the bottom plate. The casing structure of claim 1, further comprising a plurality of heat dissipation holes respectively disposed on the first casing and the second casing for performing heat exchange to reduce the temperature of the main unit. The casing structure of claim 2, further comprising a plurality of input and output slots disposed on the first front side panel and the first rear side panel, and configured to connect the plurality of connectors for positioning the motherboard .