TWM562487U - Conductive terminal material and resistor - Google Patents

Abstract

The present invention discloses a conductive terminal material and a resistor. The conductive terminal material comprises a plurality of conductive particles. Each conductive particle comprises a core layer and a cladding layer covering the core layer. The material of the core layer comprises metal or alloy thereof. The material of the cladding layer comprises graphene, graphite, carbon nanotube, carbon nanoball, or combinations thereof. The present invention can meet the requirements of restriction of the use of hazardous substance in electrical and electronic products (RoHS).

Description

Conductive terminal material and resistor

The present invention relates to a conductive terminal material and a resistor.

According to the European Parliament and the EU Ministerial Council, it has been agreed to ban the use of four heavy metals such as lead, cadmium, mercury and chromium in electrical and electronic equipment since July 2006. Therefore, electrical and electronic products sold to the EU need to comply with the hazardous substances requirements of the Restriction of Hazardous Substances (RoHS) in electrical and electronic products.

The purpose of the present invention is to provide a conductive terminal material and a resistor. The new resistors are compatible with the hazardous substances requirements of the Restriction of Hazardous Substances (RoHS) in electrical and electronic products.

The present invention provides a conductive terminal material comprising a plurality of conductive particles, each conductive particle comprising a core layer and a cladding layer covering the core layer, the material of the core layer comprises a metal or an alloy thereof, and the material of the cladding layer comprises graphite Alkene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof.

The present invention further provides a resistor comprising a substrate, an impedance element and two conductive terminals. The impedance element is disposed on the substrate. The two conductive terminals are disposed on the substrate and are respectively connected to two sides of the impedance element. The two conductive terminals respectively have a plurality of conductive particles, and each of the conductive particles comprises a core layer and a cladding layer covering the core layer, and the core layer The material comprises a metal or an alloy thereof, and the material of the coating layer comprises graphene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof.

As described above, in a conductive terminal material and a resistor of the present invention, the conductive terminal material or the conductive terminal includes a plurality of conductive particles, and each of the conductive particles includes a core layer and a cladding layer covering the core layer, and the core layer The material comprises a metal or an alloy thereof, and the material of the coating layer comprises Graphene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof. Therefore, the resistor of the present invention can meet the requirements of hazardous substances stipulated by the RoHS Directive for Restriction of Hazardous Materials in Electrical and Electronic Products.

1‧‧‧Resistors

11‧‧‧Substrate

12‧‧‧ impedance components

13a, 13b‧‧‧ conductive terminals

131‧‧‧ conductive particles

1311‧‧‧ core layer

1312‧‧‧Cladding

14‧‧‧Protective layer

M‧‧‧Mixed materials

S‧‧‧ solvent

S1‧‧‧ first surface

S2‧‧‧ second surface

S3‧‧‧ third surface

S01~S05‧‧‧Steps

1 is a flow chart showing a method of manufacturing a resistor according to a preferred embodiment of the present invention.

2A to 2F are respectively schematic views showing a manufacturing process of a resistor according to a preferred embodiment of the present invention.

3 is another flow diagram of a method of fabricating a resistor in accordance with a preferred embodiment of the present invention.

The conductive terminal material and the resistor according to the preferred embodiment of the present invention will be described below with reference to the related drawings, wherein the same elements will be described with the same reference numerals.

Referring to FIG. 1 and FIG. 2A to FIG. 2F , FIG. 1 is a flow chart of a method for manufacturing a resistor 1 according to a preferred embodiment of the present invention, and FIGS. 2A to 2F are respectively a preferred embodiment of the present invention. A schematic diagram of the manufacturing process of the resistor 1 of the example.

As shown in FIG. 1, the manufacturing method of the resistor 1 may include: disposing an impedance element on a substrate (step S01); mixing a plurality of conductive particles with a solvent to form a mixed material, wherein the conductive particles comprise a a core layer and a cladding layer covering the core layer, the material of the core layer comprises a metal or an alloy thereof, and the material of the cladding layer comprises graphene, graphite, a carbon nanotube, a carbon sphere, or a combination thereof (step S02); disposing the mixed material on a substrate, and connecting the mixed materials to both sides of the impedance element respectively (step S03); and performing a sintering process to form two conductive terminals on the substrate (step S04). Hereinafter, please refer to FIG. 2A to FIG. 2F, respectively, to explain the manufacturing process of the resistor 1.

First, as shown in FIG. 2A, step S01 is to set an impedance element 12 on a substrate 11. The substrate 11 may be a rigid substrate or a soft substrate, and the rigid substrate may be a glass, a metal, a ceramic or a resin substrate, or a composite substrate. The substrate 11 of the present embodiment is exemplified by a hard substrate of alumina (Al 2 O 3 ). In addition, the impedance element 12 is composed of a resistive material and does not contain four heavy metals such as lead, cadmium, mercury, and chromium to meet the hazardous substance requirements stipulated by the RoHS Directive for Restriction of Hazardous Substances in Electrical and Electronic Products. In FIG. 2A, the substrate 11 has a first a surface S1, two second surfaces S2 and a third surface S3, the first surface S1 and the third surface S3 are opposite surfaces of the substrate 11, and the two second surfaces S2 are located on the left and right sides of the substrate 11, and respectively The first surface S1 and the third surface S3 are connected, and the impedance element 12 is disposed on the first surface S1 of the substrate 11.

In addition, as shown in FIG. 2B and FIG. 2C, step S02 is: mixing a plurality of conductive particles 131 with a solvent S to form a mixed material, wherein the conductive particles 131 include a core layer 1311 and a cladding core layer 1311. The cladding layer 1312, the material of the core layer 1311 comprises a metal or an alloy thereof, and the material of the cladding layer 1312 comprises graphene, graphite, carbon nanotube (CNT), nano carbon sphere. (carbon nanoball), or a combination thereof. Here, the conductive terminal material containing the plurality of conductive particles 131 may be mixed in the solvent S and stirred uniformly to obtain a paste-like mixed material. The core layer 1311 of the conductive particles 131 is a metal containing no heavy metals such as lead, cadmium, mercury, or chromium, such as a metal such as silver, copper, manganese, nickel, gold, aluminum, iron or tin, or any of the above metals. The alloy of the combination is not limited. In addition, if the material of the cladding layer 1312 of the conductive particles 131 is graphite, it may be natural graphite or artificial graphite, and is not limited. In the conductive particles 131 of the present embodiment, the cladding layer 1312 covers the core layer 1311 for the purpose of rapid heat conduction, and avoids burning the resistor 1 when the temperature is too high.

Further, the solvent S may be, for example, water, dimethylformamide (DMF), tetrahydrofuran (THF), ketones, alcohols, ethyl acetate, or toluene. The solvent S of this embodiment is exemplified by water. In various embodiments, when the solvent S is a ketone, it may be N-methylpyrrolidone (NMP), or acetone; when the solvent S is an alcohol, it may be ethanol (Ethanol), or ethylene glycol. (Ethylene glycol). Further, the solvent S may be any mixture of the above solvents (water, dimethylformamide, tetrahydrofuran, ketones, or alcohols), and is not limited.

Next, as shown in FIG. 2D, step S03 is performed to set the mixed material M on a substrate 11 and connect the mixed materials M to both sides of the impedance element 12, respectively. The mixed material M can be provided on the substrate 11 by coating, sticking, printing, or supping. Here, the coating may be spray coating or spin coating, and the printing may be inkjet printing or screen printing, and is not limited. It is to be noted that the order of the substrate 11 is in the order of the impedance element 12 of the step S01 and the mixed material M of the steps S02 and S03, but not limited thereto. In different embodiments, Alternatively, the setting of the mixed material M in steps S02 and S03 may be performed first, and then the setting of the impedance element 12 in step S01 may be performed.

Next, a sintering process is performed to form the two conductive terminals 13a, 13b on the substrate 11 (step S04). Wherein, the sintering temperature of the sintering process may be between 800 ° C and 1050 ° C to remove the solvent S (eg, moisture) in the mixed material M, and the conductive terminal material (the plurality of conductive particles 131 ) remaining in the mixed material M The molecules are rearranged, and after cooling (which can be cooled at room temperature), two conductive terminals 13a, 13b can be formed on the substrate 11. As shown in FIG. 2D, the conductive terminals 13a, 13b are respectively located on the first surface S1 of the substrate 11, and are respectively connected to both sides of the impedance element 12, and extend to the third surface S3 via the two second surfaces S2, so that The resistor 1 of this embodiment is a surface-mount device (SMD). In different embodiments, the resistor 1 can also be a different type of resistor, and the present invention does not limit the manner in which it is actually presented. In some embodiments, the components of the conductive terminals 13a, 13b and their weight percentages can be as follows: copper powder, 80% to 90%; manganese powder, 5% to 15%; nickel powder, 1% to 10%; tin powder, 1%~10%; carbon, 1%~10%.

Further, in the equation of the impedance, the resistance value = resistance constant (ρ) × length / area, therefore, factors affecting the impedance values of the conductive terminals 13a, 13b may include the material itself (the core layer 1311 of the conductive particles 131 and The characteristics of the cladding layer 1312), the particle size of the conductive particles 131, the cross-sectional area or thickness of the conductive particles 131, and the process temperature, the designer can control the conductive terminals 13a, 13b by appropriately adjusting the composition components by the above factors (mixed materials) The impedance value is such that the lower the impedance value, the better, so as to be a conductive terminal applicable to the resistor 1.

In addition, please refer to FIG. 3, which is another flow chart of the method for manufacturing the resistor 1 of the preferred embodiment of the present invention. The difference from FIG. 1 is that, in addition to steps S01 to S04, the manufacturing method of FIG. 3 may further include step S05: providing a protective layer 14 overlying the impedance element 12. As shown in FIGS. 2E and 2F, the protective layer 14 is disposed and covered on the impedance element 12 to protect the impedance element 12 from damage by foreign matter. In some embodiments, the material of the protective layer 14 is, for example but not limited to, Epoxy or Acrylic.

Therefore, the resistor 1 of the present embodiment is a surface mount component (SMD) including a substrate 11, an impedance element 12, two conductive terminals 13a, 13b, and a protective layer 14. The impedance element 12 is disposed on the substrate 11, and the two conductive terminals 13a, 13b are disposed on the substrate 11, and are respectively connected to the resistor On both sides of the resistive element 12, wherein the two conductive terminals 13a, 13b respectively have a plurality of conductive particles 131, each of the conductive particles 131 comprises a core layer 1311 and a cladding layer 1312 covering the core layer 1311, and the material of the core layer 1311 comprises The metal or alloy thereof, and the material of the cladding layer 1312 comprises graphene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof. In addition, a protective layer 14 is overlaid on the impedance element 12 to protect the impedance element 12 from damage by foreign matter.

Through the above-mentioned conductive terminal material, the resistor 1 obtained in the present embodiment can meet the requirements of harmful substances stipulated by the Restriction of Hazardous Substances (RoHS) in motor electronic products (lead-free, cadmium, mercury, chromium, etc.) Heavy metal).

In summary, in a conductive terminal material and resistor of the present invention, the conductive terminal material or the conductive terminal comprises a plurality of conductive particles, each conductive particle comprises a core layer and a cladding layer covering the core layer, and the core layer The material comprises a metal or an alloy thereof, and the material of the coating layer comprises graphene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof. Therefore, the resistor of the present invention can meet the requirements of hazardous substances stipulated by the RoHS Directive for Restriction of Hazardous Materials in Electrical and Electronic Products.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims.

Claims (6)

A conductive terminal material comprising: a plurality of conductive particles, each of the conductive particles comprising a core layer and a cladding layer covering the core layer, the core layer material being a metal or an alloy thereof, the material of the cladding layer It is graphene, graphite, carbon nanotubes, nanocarbon spheres, or a combination thereof. The conductive terminal material according to claim 1, wherein the metal is silver, copper, manganese, nickel, gold, aluminum, iron or tin. A resistor comprising: a substrate; an impedance element disposed on the substrate; and two conductive terminals disposed on the substrate and respectively connected to two sides of the impedance element, the two conductive terminals respectively having Conductive particles, each of the conductive particles comprising a core layer and a cladding layer covering the core layer, the core layer is made of a metal or an alloy thereof, and the material of the cladding layer is graphene, graphite, and nanometer. Carbon tube, nano carbon sphere, or a combination thereof. The resistor of claim 3, wherein the metal is silver, copper, manganese, nickel, gold, aluminum, iron or tin. The resistor of claim 3, wherein the substrate has a first surface, two second surfaces, and a third surface, the impedance element is disposed on the first surface, and the two surfaces are respectively connected The first surface and the third surface, and the two conductive terminals are respectively located on the first surface and extend through the two second surfaces to the third surface. The resistor of claim 3, further comprising: a protective layer overlying the impedance element.