TWM561088U - Heat dissipation device capable of preventing expansion and explosion - Google Patents

Abstract

The present invention is an anti-expansion and heat-dissipating device, which is provided with an upper plate and a lower plate. The upper plate and the lower plate are sealed and connected to form a cavity, and the cavity is filled with a refrigerant; the upper plate and the lower plate are respectively provided with a plurality of supports. a rib, one of the upper plate or the lower plate is provided with a plurality of columns fixedly connected to the upper plate or the lower plate; the inner surfaces of the upper plate and the lower plate are respectively adhered with a copper powder plating layer, and the column The outer surface of the body and the outer surface of the support rib are also respectively adhered with a copper powder plating layer. The anti-expansion heat-dissipating device has good anti-explosion performance by providing the support rib and the main body.

Description

Anti-expansion and heat dissipation device

The present invention relates to the technical field of a heat sink, and more particularly to an anti-expansion heat sink.

As electronic products gradually develop toward integration and high speed, the heat dissipation performance of electronic products has become an urgent problem to ensure the quality of electronic products.

There is a technical description of the heat dissipation by using the capillary principle of the condensing tube. In the prior art, the structure of a heat sink having a small volume and good heat dissipation performance is composed of two substrates, which are respectively disposed on the inner walls of the two substrates. There is a capillary functional layer composed of a metal powder having a rough surface structure, and the two substrates are sealed and filled with a cooling liquid, and the capillary functional layer is usually copper powder, which passes through the capillary functional layer, and the gap position in the copper powder at normal temperature Absorbing coolant, when the heat generating part generates heat, the copper powder in the cavity will be discharged outward due to the capillary phenomenon, pushing the coolant to move, thereby forming a driving force for the movement of the coolant in the cavity, promoting the flow of the coolant to timely heat Transfer, in order to ensure the effectiveness of the cavity, the two substrates are usually arranged to have a certain groove structure. In practice, it has been found that the heat dissipating device of this structure has poor anti-explosion property and poor pressure resistance. Once the thermal expansion occurs, the overall heat dissipating component will fail and cannot be used.

Therefore, in view of the deficiencies of the prior art, it is necessary to provide an anti-expansion and heat-dissipating device to overcome the disadvantages of the prior art.

The purpose of the present invention is to provide an anti-expansion and heat-dissipating device which avoids the deficiencies of the prior art, and has good rigidity, good anti-explosion performance, strong capillary force and fast heat dissipation, and can realize about seconds. Level of heat dissipation.

Therefore, in order to achieve the above object, the present invention is an anti-expansion and heat-dissipating device, comprising an upper plate and a lower plate, wherein the upper plate and the lower plate are sealingly connected to form a cavity, and the cavity is filled with a refrigerant; the upper plate and the lower plate; The plates are respectively provided with a plurality of supporting ribs, and one of the upper plate or the lower plate is provided with a plurality of columns fixedly connected to the upper plate or the lower plate; the inner surfaces of the upper plate and the lower plate are respectively attached There is a copper powder plating layer, and the outer surface of the cylinder and the outer surface of the supporting rib are also respectively adhered with a copper powder plating layer.

The anti-expansion heat-dissipating device is described above, wherein the pillars have a cylindrical shape, a rectangular parallelepiped shape, a conical shape, a truncated cone shape or a polyhedral structure.

The anti-expansion heat sink of the above-mentioned cylinders is perpendicular to the upper plate or the lower plate.

The anti-expansion heat-dissipating device is described, wherein the axis lines of the pillars are parallel to the upper plate or the lower plate.

The anti-expansion heat-dissipating device is described, wherein the pillars have a folded structure.

The anti-expansion heat-dissipating device is described, wherein the pillars are surrounded by a rectangle.

In the above-mentioned anti-expansion and heat-dissipating device, the columns provided on the upper plate are distributed in a matrix, or the columns arranged in the lower plate are distributed in a matrix.

In the above-mentioned anti-expansion and heat-dissipating heat-dissipating device, the column provided by the upper plate is irregularly distributed, or the column provided by the lower plate is irregularly distributed.

The anti-explosion-dissipating heat-dissipating device, wherein the copper powder plating layer comprises at least a primer layer connected to an inner surface of the upper plate or the lower plate, a snow-like metal layer attached to the bottom layer, and attached to the snowflake a fastening layer on the metal layer; wherein the metal particle of the underlayer has a particle diameter of 0.2 to 0.8 nm, and the thickness of the underlayer is 0.02 to 0.03 mm; wherein the particle diameter of the metal particle of the snowflake metal layer is 2.0 ~8nm, the thickness of the snowflake metal layer is 0.3~1.6mm; wherein the diameter of the fastening layer metal particles is 0.8~1.2nm, and the thickness of the fastening layer is 1.5~4.5nm.

According to the anti-expansion and heat-dissipating device, the underlayer is composed of a plurality of layers, and the snow-like metal layer is composed of a plurality of layers, and the fastening layer is composed of a plurality of layers.

The anti-expansion and heat-dissipating device of the present invention has good anti-explosion performance through the provision of the support rib and the main body.

To sum up, this case is not only innovative in terms of space type, but also can enhance the above-mentioned multiple functions compared with customary articles. It should fully comply with the statutory new patent requirements of novelty and progressiveness, and apply in accordance with the law. This new type of patent application, to encourage creation, to the sense of virtue.

100‧‧‧Upper board

200‧‧‧ Lower board

300‧‧‧ cylinder

400‧‧‧Support ribs

500‧‧‧copper powder plating

600‧‧‧Degas head

700‧‧‧heat source

The first picture shows the structure of the anti-expansion and heat-dissipating device.

FIG. 2 is a schematic structural view of the upper plate of the first embodiment of the anti-expansion and heat-dissipating device.

FIG. 3 is a schematic structural view of the lower plate of the first embodiment of the anti-expansion and heat-dissipating device.

Fig. 4 is a schematic view showing the working principle of the first embodiment of the anti-expansion and heat-dissipating device.

FIG. 5 is a schematic structural view of the upper plate of the third embodiment of the creation of the anti-expansion and heat-dissipating device.

Figure 6 is a schematic view showing the structure of the cylinder of the fourth embodiment of the anti-expansion and heat-dissipating device.

Referring to Figures 1 to 3, the present invention is an anti-expansion and heat-dissipating device, which is composed of an upper plate 100 and a lower plate 200. The upper plate 100 and the lower plate 200 are sealingly connected to form a cavity, and the cavity system and the deaeration head 600 are provided. Connected to evacuate the chamber and be filled with refrigerant. The upper plate 100 and the lower plate 200 are welded by laser welding or friction welding, and the refrigerant in the cavity may be water or alcohol or acetone or R12 or Freon or other components, which are not enumerated here.

The upper plate 100 and the lower plate 200 are respectively provided with a plurality of supporting ribs 400. The supporting ribs 400 are groove structures formed by pressing, and the grooves on the inner surfaces of the upper plate 100 and the lower plate 200 are convex. The supporting ribs 400 provide a supporting function between the upper plate 100 and the lower plate 200 to prevent the occurrence of explosion due to other external factors such as heat or force during subsequent processing and use.

The upper plate 100 is provided with a plurality of cylinders 300 fixedly coupled to the upper plate 100, and the lower plate 200 is provided with a plurality of cylinders 300 fixedly coupled to the lower plate 200. On board The other end of the column 300 provided at 100 is in contact with the lower plate 200, and the other end of the column 300 provided in the lower plate 200 is in contact with the upper plate 100. The arrangement of the cylinder 300 effectively improves the anti-explosion performance of the anti-expansion heat sink. The 1000 samples were tested, and the anti-explosion resistance of the overall heat sink was up to 99.99%.

A copper powder plating layer 500 is attached to the inner surfaces of the upper plate 100 and the lower plate 200, respectively, and the outer surface of the column 300 and the outer surface of the support rib 400 are also adhered with a copper powder plating layer 500, respectively.

The copper powder plating layer 500 includes at least a primer layer connected to the inner surface of the upper plate 100 or the lower plate 200, a snowflake-shaped metal layer attached to the primer layer, and a fastening layer attached to the snowflake-shaped metal layer.

The particle size of the underlying metal particles is 0.2 to 0.8 nm, and the thickness of the underlying layer is 0.02 to 0.03 mm; the particle size of the metal particles of the snowflake metal layer is 2.0 to 8 nm, and the thickness of the snowflake metal layer is 0.3 to 1.6 mm. The fastening layer metal particles have a particle diameter of 0.8 to 1.2 nm, and the fastening layer has a thickness of 1.5 to 4.5 nm.

The bottom layer is a small particle to be effectively combined with the metal substrate. The particle of the snowflake metal layer is larger than the metal particle of the underlying layer, and the fastening layer is used for effectively combining the snowflake metal layer with the metal substrate, and the capillary of the whole metal layer The force is better, and a microstructure of the copper powder plating layer 500 of the present invention is as shown in FIG. Compared with the micro-structure of the copper powder plating layer prepared by the sintering process in the prior art, as shown in FIG. 2, it can be seen that the copper powder plating layer 500 of the present invention has a snowflake-like or coral-like layer structure, and the structure in FIG. It has a porous structure. With the arrangement of the multi-layer metal layer, the firmness of the copper powder plating layer 500 is greatly improved, and mechanical damage is required to fall off.

It should be noted that the microstructure of the copper powder plating layer 500 prepared by the present invention is a small particle multi-layered structure, and the whole body shows a snowflake shape or a mountain. In the state of the coral, this structure is described in the form of snowflakes or corals. The specific name can be adjusted accordingly.

It should be noted that each layer of the underlying layer, the snowflake-shaped metal layer and the fastening layer may be composed of multiple layers, which are flexibly determined according to the actual use requirements.

In this embodiment, the cylinder 300 is disposed in a cylindrical shape, and the axis line of the cylinder 300 is perpendicular to the upper plate 100 or the lower plate 200. The cylinders 300 are linearly distributed. The structure is set and has the characteristics of convenient processing.

The anti-expansion and heat-dissipating device has the working principle that, in the non-heated state (ie, in the non-operating state), the internal refrigerant liquid is immersed in the copper powder plating layer 500 of the upper plate 100 and the lower plate 200, which is substantially Saturated state. When any one of the upper plate 100 or the lower plate 200 is in the heat source 700, the upper plate 100 is close to the heat source 700. When the upper plate 100 is heated, the copper powder plating layer 500 inside is evaporated by heat, and part of the vapor reaches the other end. When the plate 200 is cold, some of the vapor encounters the cylinder 300 or the copper powder plating layer 500 on the surface of the supporting rib 400 is cooled, and the condensation recirculation flows along the cylinder 300 or the supporting rib 400 to the upper plate 100, so that the heat is continuously looped. The heat dissipation loop of the upper plate 100 to the lower plate 200. During the evaporation process, a part of the vapor reaches the copper powder plating layer 500 on the surface of the cylinder 300 or the copper powder plating layer 500 on the surface of the supporting rib 400, and the same raw material reaches the copper powder plating layer 500 and the supporting rib 400 on the surface of the cylinder 300. The vapor of the surface copper powder plating layer 500 is cooled, and the condensation back flows to the upper plate 100 along the column 300 or the support rib 400. The anti-expansion heat-dissipating device has an effective time required for heat dissipation of substantially several seconds to ten seconds, as shown in FIG. The explosion-proof heat dissipating device of the present invention has a copper powder plating layer 500 disposed on the inner surfaces of the upper plate 100 and the lower plate 200, so that the evaporating heat dissipation between the upper plate 100 and the lower plate 200 can be quickly switched, thereby improving the heat dissipation effect.

It should be noted that the metal substrate can be a copper plate, an aluminum plate, a zinc plate, Tin plate, titanium plate or stainless steel plate.

The anti-expansion and heat-dissipating device of the present invention has the advantages that the adhesion between the copper powder plating layer 500 of the upper plate 100 and the lower plate 200 and the metal substrate is strong, the capillary force is strong, and the evaporation performance is good, and the rigidity of the metal substrate is not caused during the preparation process. Destruction can maintain the hardness of the metal substrate. The prepared heat dissipating device has heat conduction, rapid heat dissipation, and good anti-explosion performance.

The anti-expansion and heat-dissipating device of the present invention subverts the traditional uniform temperature plate processing process by the process of attaching the metal copper powder to electroplat the copper powder plating layer to subvert the metal plating layer formed by the conventional sintering, the metal substrate has strong adhesion and stronger capillary force. More environmentally friendly. The welding process of high-temperature copper solder paste is replaced by laser or friction welding, and the preparation process has the characteristics of short time, low energy consumption, energy saving and environmental protection.

The foregoing is a first embodiment, and other embodiments are described below. The second embodiment: the anti-expansion and heat dissipation device of the embodiment has the same features as the first embodiment, except that the cylinder 300 has a square shape. The square shape is set, the assembly is more stable, and the surface thermal efficiency is also high.

It should be noted that the shape of the column 300 is not limited to a square shape, and may be provided in a conical shape or a truncated cone shape or a polyhedral structure or other irregular structures.

The third embodiment: the anti-expansion and heat-dissipating device of the embodiment has the same features as the first embodiment, except that the axial line of the partial cylinder 300 is parallel to the upper plate 100 or the lower plate 200, and some of the columns are The axis of the 300 is perpendicular to the upper plate 100 or the lower plate 200, and the cylinder 300 is irregularly distributed as shown in FIG. This structure is more flexible and has a larger surface area.

Fourth embodiment: anti-expansion and heat dissipation device of the embodiment, other The features are the same as those of the first to third embodiments, except that the partial cylinder 300 has a folded structure. As shown in FIG. 6, in this embodiment, four folded cylinders 300 are provided, and four folds are provided. The cylinders 300 are distributed in a rectangular shape. The folded column structure makes the support more stable and can better improve the anti-explosion performance of the heat sink.

Fifth Embodiment: The anti-expansion and heat-dissipating device of the present embodiment has the same features as the fourth embodiment, except that all the cylinders 300 have a folded structure, and the cylinders 300 are arranged at equal intervals. The folded column structure makes the support more stable and can better improve the anti-explosion performance of the heat sink.

It should be noted that the arrangement and arrangement of the cylinders 300 are not limited to the form of the embodiment, and can be flexibly selected and matched according to needs.

It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of the present invention. Although the present invention is described in detail with reference to the preferred embodiments, those skilled in the art should understand that Modifications or equivalent substitutions of the technical solutions of the present invention are made without departing from the spirit and scope of the present technical solutions.

Claims (10)

An anti-expansion and heat-dissipating device comprises: an upper plate and a lower plate, the upper plate and the lower plate are sealingly connected to form a cavity, wherein the cavity is filled with a refrigerant; the upper plate and the lower plate are respectively provided with a plurality of supports a rib, one of the upper plate or the lower plate is provided with a plurality of columns fixedly connected to the upper plate or the lower plate; and the inner surfaces of the upper plate and the lower plate are respectively adhered with a copper powder plating layer. The outer surface of the pillars and the outer surfaces of the support ribs are also respectively adhered to the copper powder plating layer. The anti-expansion and heat-dissipating device according to claim 1, wherein the pillars have a cylindrical shape, a rectangular parallelepiped shape, a conical shape, a truncated cone shape or a polyhedral structure. The anti-expansion heat sink of claim 2, wherein the axis of the cylinder is perpendicular to the upper plate or the lower plate. The anti-expansion heat dissipating device of claim 2, wherein the axis lines of the pillars are parallel to the upper plate or the lower plate. The anti-expansion and heat-dissipating device of claim 1, wherein the pillars have a folded structure. The anti-expansion heat-dissipating device of claim 5, wherein the pillars are rectangular. The anti-expansion and heat-dissipating heat-dissipating device of claim 3, 4 or 5, wherein the pillars provided on the upper plate are distributed in a matrix, or the columns arranged in the lower plate are distributed in a matrix. The anti-expansion and heat-dissipating device of claim 3, 4 or 5, wherein the column provided by the upper plate is irregularly distributed, or the column provided by the lower plate It is irregularly distributed. The anti-expansion and heat-dissipating device of claim 3, wherein the copper powder plating layer comprises at least a bottom layer connected to the inner surface of the upper plate or the lower plate, and a snowflake attached to the bottom layer. a metal layer and a fastening layer attached to the snowflake metal layer; wherein the underlying metal particles have a particle diameter of 0.2 to 0.8 nm, and the underlayer has a thickness of 0.02 to 0.03 mm; wherein the snowflake metal layer The particle diameter of the metal particles is 2.0 to 8 nm, and the thickness of the snowflake metal layer is 0.3 to 1.6 mm; wherein the diameter of the fastening layer metal particles is 0.8 to 1.2 nm, and the thickness of the fastening layer is 1.5 to 4.5 nm. . The anti-expansion and heat-dissipating device according to claim 9, wherein the underlayer is composed of a plurality of layers, and the snow-like metal layer is composed of a plurality of layers, and the fastening layer is formed of a plurality of layers.