TWM558454U - Integrated structure of high power density power supply power module and filter - Google Patents

Abstract

The present invention is an integrated structure of a power module and a filter of a high power density power supply. The power supply has a plurality of cooling fans in the chassis, and the chassis is respectively provided with a first filter circuit on both sides of the cooling fan. a first power filter is disposed on the first filter circuit board, and a plurality of second filter circuit boards are disposed on the upper side of the heat dissipation fan, and the second filter circuit board is disposed below a second filter, whereby the first filter, the second filter, and the power module are alternately arranged, and the space on the upper and lower sides of the power supply is fully utilized to improve a good heat flow path. The cooling fan can effectively dissipate the power modules, so that the creation can achieve excellent heat dissipation in a chassis with high power density.

Description

Integrated structure of power module and filter for high power density power supply

This creation is related to a power supply, especially a high power density power supply power module and filter integrated structure.

Press, the general power supply is composed of power switching components (such as power transistors, power diodes, etc.), electrical energy storage and filtering components (such as inductors, capacitors, transformers, chokes, etc.), detection and control components. Forming, by which the power switching element is controlled by the detecting and controlling element, the voltage or current is modulated (switched and rectified), and the energy storage and filtering component is used to provide filtering and temporary conversion required for converting electrical energy Energy storage, however, during power conversion, converts part of the energy supplied by the power supply into thermal energy, where the thermal energy is concentrated in the power crystal.

In addition, the demand for industrial-grade power supplies is extremely large, and the power supplies are respectively disposed in the cabinet through a rack group. At the same time, the general enterprise concentrates the power supplies and servers in a machine room for convenience. Management, and the power supply and the server are all around the clock, so the heat dissipation of the power supply is especially important. For the convenience of management and space saving, the chassis size of the general rack power converter is usually adopted. A common industry standard with a width of 19 inches and a height in U (1U = 1.75 inches = 44.45 mm). There are usually several standard chassis such as 1U, 2U or 3U. In general, the power supply is due to its Internally, it must include power switching components, electrical energy storage and filtering components, and detection and control components. In addition, it requires a large heat dissipation condition, so it is often necessary to use a large space chassis, such as a 3U chassis.

However, the input voltage of the above power supply is usually limited to 220V or 380V. The manufacturer is developing a power supply for a general-purpose power supply of 180~460V, but because it needs more electronic components and is larger, it needs The heat dissipation condition is higher, so the heat dissipation is often caused. The reason is that the space of the chassis is small, the electronic parts shield the wind of the fan, and the smooth heat flow path cannot be provided, resulting in poor heat dissipation of the power crystals disposed at the rear, which is easy to cause. The power supply is overheated to stop the malfunction, malfunction and damage.

In view of this, the creators of this case, after observing the above-mentioned deficiencies, adhered to the spirit of excellence and concentrating on research and improvement, and finally had the creation of this creation.

The main purpose of this creation is to provide a high power density power supply power module and filter integrated structure, which can be integrated in the power supply chassis, the power module and the filter module are integrated. Better heat flow path for better heat dissipation.

In order to achieve the above objective, the high power density power supply power module and the filter are provided by the present invention. The power supply is provided with a chassis, and the front side of the chassis is provided with a panel, characterized in that: a plurality of powers a module, the power modules are arranged side by side in the direction of the panel, and a cooling fan is disposed on a front side of each power module; and a first filter circuit board is disposed in the chassis and located in the chassis A first filter is disposed on the front side of the cooling fan, and a first filter is disposed on the first filter circuit board; and a plurality of second filter circuit boards are disposed in the chassis, and the second filter circuit boards are respectively fixed in the phase Corresponding to the cooling fans, a second filter is disposed under the second filter circuit board, and the second filter circuit board is provided with a plurality of sides corresponding to the first filter circuit board a first conductive sheet, wherein the bottom ends of the first conductive sheets are fixed to the first filter circuit board, so that the second filter circuit boards are electrically connected to the first filter circuit board, and Etc The filter circuit board is provided with a plurality of second conductive sheets facing one side of the power module, so that the bottom ends of the second conductive sheets are fixed to the corresponding power modules, so that the The second filter circuit board is electrically connected to the corresponding power modules.

The integrated structure of the power module and the filter of the high power density power supply provided by the present invention, the power supply is fully utilized because the first filter, the second filter and the power modules are mutually staggered The space on the upper and lower sides of the device improves the heat flow path, so that the cooling fans can effectively dissipate the power modules, so that the creation can achieve better heat dissipation in the same size chassis.

Please refer to FIG. 1 , which is a perspective view of a power supply of the present invention, which discloses a high power density power supply power module and a filter integrated structure, and the power supply 100 is provided with a chassis 101 . A front panel of the chassis 101 is provided with a panel 102, which is characterized by:

A plurality of power modules 10, as shown in Figures 2 and 3, are perspective views and partial exploded views of the interior of the chassis. The power modules 10 are arranged side by side in the direction of the panel 102. In the chassis 101, a plurality of heat dissipating fins 11 are disposed under the power module 10, and a cooling fan 12 is disposed on the front side of each of the power modules 10, and the cooling fan 12 is also located on the front side of the heat dissipating fins 11. That is, the size of the cooling fan 12 covers the electronic components on the power module 10 and the heat dissipation fins 11 therebelow. In addition, the power modules 10 are provided with a plurality of third locking seats 13, each of which is third. The locking seat 13 is provided with a third locking hole 131.

a first filter circuit board 20 is disposed in the chassis 101 and located on the front side of the heat dissipation fan 12, and the first filter circuit board 20 is provided with a first filter 21 having a differential mode inductance, and the first filter circuit board 20 A filter circuit board 20 is provided with a plurality of first locking seats 22, and each of the first locking seats 22 is provided with a first locking hole 221.

The second filter circuit board 30 is disposed in the chassis 101. The second filter circuit board 30 is provided with an insulating sheet 31. The insulating sheets 31 are transparent. The second locking circuit board 311 is respectively fixed to the cooling fan 12, and the second filter circuit 30 is provided with a second filter 32 having a common mode inductance. The second filter circuit board 30 is provided with a plurality of first conductive sheets 33 facing downwardly on one side of the first filter circuit board 20, so that the bottom ends of the first conductive sheets 33 are fixed to the first filter. On the circuit board 30, one of the first conductive strips 33 is respectively provided with a first through hole 331 corresponding to the first locking hole 221, so that the plurality of first bolts 332 respectively pass through the first through holes 331. And the first locking holes 221, one end of the first conductive sheets 33 is fixed to the first filter circuit board 20, and the second filter circuit boards 30 are opposite to the other end of the first conductive sheets 33. A second locking seat 34 is disposed, and each of the second locking seats 34 is provided with a second locking hole 341, and the same A second through hole 333 is defined in the second locking hole 341 for the second locking hole 341 to pass through the second through hole 333 and the second locking hole 341 respectively. The other end of the first conductive sheet 33 is fixed to the second filter circuit board 30, so that the second filter circuit board 30 is electrically connected to the first filter circuit board 20, and the second filter is further The circuit board 30 is provided with a plurality of second conductive strips 35 on one side of the power module 10, such that the bottom ends of the second conductive strips 35 are fixed to the corresponding power modules 10. The second conductive strips 35 are respectively provided with a third through hole 351 corresponding to the third locking hole 131 for the plurality of third bolts 352 to pass through the third through holes 351 and the third respectively. The second hole of the second conductive piece 35 is fixed to the power module 10, and the second filter circuit board 30 is opposite to the other end of the second conductive piece 35. Each of the fourth locking seats 36 is provided with a fourth locking hole 361, and the second conductive sheets 35 are respectively corresponding to the fourth The second hole 353 is disposed through the fourth through hole 353 and the fourth locking hole 361, and the other end of the second conductive piece 35 is fixed to the other end of the second conductive piece 35. The second filter circuit boards 30 are electrically connected to the corresponding power modules 10 respectively.

In order to further understand the characteristics of this creation, the use of technical means and the expected results, we will describe the use of this creation, and believe that we can have a deeper and more specific understanding of this creation, as follows:

Please refer to FIG. 5, FIG. 6 and FIG. 7 for the front view, the cross-sectional view and the side cross-sectional view of the present invention, because the first filter 21, the second filter 32 and the power modules 10 are The devices are interleaved to make full use of the space on the upper and lower sides of the power supply 100. When the power supply 100 is started, the external current is filtered before the first filter circuit board 20 to reduce electromagnetic interference (EMI). Then, current flows through the first conductive sheets 33 to the second filter circuit boards 30 for second filtering to stabilize the quality of the current, and then the current flows through the second conductive sheets 35 to the The power module 10 outputs the required current value and voltage value, and the first filter 21, the second filter 32, and the power modules 10 are generated during operation. The heat can be dissipated through the heat dissipating fan 12, and the first filter 21, the second filter 32, and the power modules 10 are mutually offset, so that the cooling fan 12 can wind Blowing to the rear setting The power module 10 enables the creation of the present invention to achieve better heat dissipation in the existing chassis 101, that is, in the same chassis volume, the creation can be applied to a general-purpose power supply having a frequency of 180 to 460V, and has a high power. Power density power supply with greater power output.

Hereby, the characteristics of this creation and its achievable expected effects are stated as follows:

1. The first filter 21, the second filter 32, and the power modules 10 are interleaved with each other by placing the second filter circuit board 30 above the heat dissipation fan 12. There is a good heat flow path, which does not shield the wind blowing of the cooling fan 12, so that the power modules 10 and the heat dissipating fins 11 disposed at the rear can still be subjected to the heat dissipation of the wind, and the power supply 100 can be fully utilized. Side space.

2. The first filter 21, the second filter 32, and the power modules 10 are offset from each other, so that the cooling fans 12 can blow the wind to the power modules 10 disposed at the rear. In this way, the creation can still achieve excellent heat dissipation in the chassis 101 under certain specifications, for example, a 3U height chassis, that is, within the same chassis volume, the creation can be installed with 180~460V and A universal power input with a power of up to 15 kW and a high-power power module and filter, and still have excellent heat dissipation.

In summary, this creation has its excellent progress and practicality in similar products. At the same time, it has investigated the technical information about such structures at home and abroad. The same structure has not been found in the literature. This creation has already possessed new types of patent requirements, and applied for it according to law.

However, the above-mentioned ones are only one of the preferred embodiments of the present invention, and the equivalent structural changes in the application of the present specification and the scope of the patent application are intended to be included in the scope of the present patent.

100‧‧‧Power supply
101‧‧‧Chassis
102‧‧‧ panel
10‧‧‧Power Module
11‧‧‧ Heat sink fins
12‧‧‧ cooling fan
13‧‧‧ Third lock seat
131‧‧‧ third keyhole
20‧‧‧First filter board
21‧‧‧First filter
22‧‧‧First lock seat
221‧‧‧ first keyhole
30‧‧‧Second filter board
31‧‧‧Insulation sheet
311‧‧‧Locker
32‧‧‧Second filter
33‧‧‧First conductive sheet
331‧‧‧First perforation
332‧‧‧First bolt
333‧‧‧Second perforation
334‧‧‧second bolt
34‧‧‧Second lock seat
341‧‧‧Second keyhole
35‧‧‧Second conductive sheet
351‧‧‧ third perforation
352‧‧‧ Third bolt
353‧‧‧fourth perforation
354‧‧‧four bolts
36‧‧‧Four lock seat
361‧‧‧fourth keyhole

[Fig. 1] is a perspective view of the power supply of the present creation. [Fig. 2] is a perspective view of the inside of the chassis of the present creation. [Fig. 3] is a partial exploded view of the inside of the chassis of the present creation. [Fig. 4] is an enlarged exploded view of the second filter circuit board of the present invention. [Fig. 5] is a front view of the panel in which the creation is not installed. [Fig. 6] is a cross-sectional view of the creation. [Fig. 7] is a side cross-sectional view of the present creation.

Claims (5)

An integrated structure of a power module and a filter of a high power density power supply, the power supply is provided with a chassis, and a front panel is provided with a panel, wherein: a plurality of power modules, the power modules are The first filter circuit board is disposed in the chassis and is located on the front side of the cooling fan, and the first filter is disposed in the chassis. a first filter is disposed above the circuit board; a plurality of second filter circuit boards are disposed in the chassis, and the second filter circuit boards are respectively fixed on the corresponding cooling fans, and the same A second filter is disposed under the second filter circuit board, and the second filter circuit board is provided with a plurality of first conductive sheets facing one side of the first filter circuit board to make the first conductive materials The bottom end of the chip is fixed on the first filter circuit board, so that the second filter circuit boards are electrically connected to the first filter circuit board, and the second filter circuit boards are correspondingly waitable. A plurality of second conductive sheets are disposed on one side of the rate module, such that the bottom ends of the second conductive sheets are fixed to the corresponding power modules, so that the second filter boards are respectively Electrically connected to the corresponding power modules. According to the integrated structure of the high power density power supply power module and the filter according to the first aspect of the patent application, wherein the second filter circuit board is provided with an insulating sheet, and the insulating sheets are transmitted through the two locks. The firmware locks the second filter boards to the heat dissipation fans. According to the integrated structure of the power module and the filter of the high power density power supply according to claim 1, wherein the first filter circuit board is respectively provided with a first lock on one end of the first conductive sheet The first locking hole is provided with a first locking hole, and the first conductive sheets are respectively provided with a first perforation corresponding to the first locking hole, so that the first first bolts are respectively worn Passing the first through holes and the first locking holes, fixing one end of the first conductive sheets to the first filter circuit board, and the second filter circuit boards are opposite to the first conductive sheets Each of the second locking seats is provided with a second locking hole, and each of the first conductive sheets is respectively provided with a second perforation corresponding to the second locking hole. A plurality of second bolts respectively pass through the second through holes and the second locking holes, and the other ends of the first conductive sheets are fixed to the second filter circuit boards. According to the integrated structure of the high power density power supply power module and the filter according to claim 1, wherein the power modules are respectively provided with a third locking end of the second conductive piece Each of the third locking bases is provided with a third locking hole, and the second conductive sheets are respectively provided with a third perforation corresponding to the third locking hole, so that the plurality of third bolts respectively pass through The third through holes and the third locking holes fix one end of the second conductive sheets to the power modules, and the second filter circuit boards are opposite to the other ends of the second conductive sheets The fourth locking seat is provided with a fourth locking hole, and the second conductive sheets are respectively provided with a fourth perforation corresponding to the fourth locking hole for several The fourth bolt passes through the fourth through holes and the fourth locking holes respectively, and the other ends of the second conductive sheets are fixed to the second filter circuit boards. According to the integrated structure of the high power density power supply power module and the filter according to the first aspect of the patent application, wherein the power modules are provided with a plurality of heat dissipation fins, and the cooling fans are also located The front side of the fins.