TWM558383U - Wafer positioning device of coating machine - Google Patents

Abstract

A wafer positioning device for a coater, comprising: a disc and an adsorption structure. The disk has a bearing surface, and the bearing surface is formed with a receiving groove; the adsorption structure is disposed on the disk and a plurality of adsorption portions are formed on the bottom surface of the groove for receiving the groove; wherein the wafer is received and sunk in the receiving groove The adsorption is positioned inside via the adsorption section. Thereby, the effect of not breaking the wind phenomenon and the effect of ensuring the exposure accuracy due to the adsorption positioning can be achieved.

Description

Coating machine wafer positioning device

The present invention relates to a coater, and more particularly to a wafer positioning device for a coater for positioning a wafer.

In the semiconductor process, wafer exposure mainly uses lithography to transfer the layout of the mask to the exposed area of the wafer. During the transfer process, a photoresist (Photo Resist) is applied to the wafer by a coater to chemically change the exposed area of the photoresist after exposure, and then the circuit layout is recorded by development. On the photoresist layer...etc. Wherein, the formation of the photoresist layer mainly drops at least one droplet of photoresist on the center of the wafer surface, and then rotates the wafer to spread the central photoresist solution to the surface of the entire wafer due to the centrifugal force.

However, the outlines of the wafers are not all rounds that are favorable for rotation. For example, a rectangular or polygonal wafer with straight sides will generate wind resistance due to the presence of straight edges during rotation, which will affect the rotation and break the wind. , to be overcome.

According to the research of the creator of the present case, even if the outline of the wafer is not circular, the wafers can be placed on a circular rotating seat, so that when the rotation is expected, the rotation is rotated by a circular rotating seat, so Wind resistance will occur, and there will be no wind breakage. However, such a design still has to be improved, that is: First, the thickness of the wafer itself still protrudes from the circular rotating seat, so the wind resistance will still be more or less due to the straight side of the wafer; The wafer must be removably positioned in the circular rotating seat so as to avoid offset of the wafer relative to the circular rotating seat, thereby ensuring the accuracy of exposure.

Therefore, how to design a novel that can improve and overcome the above problems is a major issue that the creators of this case want to solve.

The purpose of this creation is to provide a wafer positioning device for a coating machine which can have the effects of avoiding wind resistance and wind breaking, and can avoid wafer offset by adsorption positioning.

In order to achieve the above object, the present invention provides a wafer positioning device for a coating machine for positioning a wafer having an arbitrary contour shape, the positioning device comprising: a disk having a bearing surface, the bearing surface forming a cavity a groove having a groove bottom surface; and an adsorption structure disposed on the disk and having a plurality of adsorption portions formed on the bottom surface of the groove; wherein the wafer is received and sunk in the receiving portion The adsorption is positioned in the groove via the plurality of adsorption portions.

Compared with the prior art, the creation has the following effects: no wind breakage occurs, and the accuracy of exposure can be ensured because of vertical adsorption positioning.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are provided for reference and description only, and are not intended to limit the creation.

As shown in FIGS. 1 to 4, the present invention provides a wafer positioning device for a coater for positioning a wafer 500 having an arbitrary contour shape (see FIG. 5). The present inventive positioning device 100 includes: a disk 1 and an adsorption structure 3.

The disc 1 is a circular turntable having a bearing surface 10a and a back surface 10b opposite to each other. The receiving surface 10a is formed with a large and shallow receiving groove. The receiving groove 11 has a groove bottom surface 111. The groove bottom surface 111 is substantially parallel to the bearing surface 10a. In addition, the receiving recess 11 also has a surrounding inner periphery 112 protruding from the groove bottom surface 111.

Specifically, a rotating shaft 14 is further connected to the center of the back surface 10b of the disc 1 to drive the rotating shaft 14 to rotate.

The adsorption structure 3 is mainly provided on the disk 1 and forms a plurality of adsorption portions 32 on the groove bottom surface 111, so that the wafer 500 can be detachably adsorbed by the adsorption portion 32.

The adsorption structure 3 can be various structures having adsorption capacity, such as magnetic adsorption, electrostatic adsorption (not shown) or vacuum adsorption (as shown), and the present invention is not limited thereto. In the example, vacuum adsorption is taken as an example: a vacuum extractor 31 (see FIG. 2) and a plurality of adsorption portions 32, preferably further comprising at least one connecting flow channel 33, as described in detail below.

The vacuum extractor 31 can be connected to the disk 1 or the rotating shaft 14 in any feasible manner, as long as the vacuum extractor 31 can be connected to each of the adsorption portions 32, for example, a connecting tube (not shown). The radial connection and the communication with the rotating shaft 14 are described below by way of example in the present embodiment.

The vacuum extractor 31 has a drawing portion 311 which is connected to and communicates with the disk 1 or the aforementioned rotating shaft 14.

Each of the adsorption portions 32 is provided on the groove bottom surface 111 and communicates with the extraction portion 311 of the vacuum extractor 31, so that each of the adsorption portions 32 has a vacuum adsorption capability.

As shown in FIG. 2, the drawing portion 311 is preferably disposed coaxially on a driving shaft 4 (the driving shaft 4 is for connecting and driving the rotating shaft 14 to rotate), and the drawing portion 311 is connected and communicates with the rotating shaft 14, one end of the rotating shaft 14. It is connected to the back surface 10b of the disk 1. The disk 1 is provided with an air hole 13 communicating with the rotating shaft 14, so that the drawing portion 311 is communicated with the air hole 13. The adsorption portion 32 is preferably an adsorption flow path formed on the bottom surface 111 of the groove. Each of the adsorption channels is surrounded by a layer surrounded by the inside and the outside, and the air holes 13 are opened at an inner position of the innermost adsorption channel; the connecting flow path 33 is also formed on the bottom surface 111 of the groove. Preferably, in the air hole 13 and each of the adsorption channels, the connecting flow path 33 is communicated between the air hole 13 and each of the adsorption flow paths (adsorption portion 32), that is, between the drawing portion 311 and each of the adsorption flow paths, so that The adsorption channels all have vacuum adsorption capabilities. Specifically, the number of the connecting channels 33 may be one or two or more, and the two or more connecting channels 33 are connected to each other through the air holes 13 and communicate with each other from the inside to the outside. The flow path is such that each portion of each adsorption flow path has the same adsorption strength.

As shown in FIG. 5 to FIG. 8 , as long as the wafer 500 is housed and sunk in the accommodating recess 11 , the wafer 500 can be adsorbed by the adsorption channels (adsorption portion 32 ) and then vertically positioned. The wafer 500 on the groove bottom surface of the recess 11 and the adsorbed and positioned wafer 500 will be extremely difficult or impossible to be offset, thereby ensuring the accuracy of exposure.

In addition, the aforementioned surrounding inner circumference 112 of the receiving recess 11 may preferably be adjacent to the contour 51 of the wafer 500 (see FIGS. 6 and 8). Specifically, the receiving recess 11 has the same The corresponding shape of the outline 51 of the wafer 500 (for example, a polygonal or rectangular shape as shown in the drawing), that is, the outline 51 of the wafer 500 corresponds to surrounding the inner circumference 112, so that the wafer 500 can sink and fill the entire volume. The groove 11 is placed so as to have a horizontal positioning effect.

Furthermore, as shown in FIG. 1 , FIG. 5 and FIG. 6 , the outer peripheral edge 12 of the disc 1 is preferably further provided with at least one notch 121 , and the notch 121 is expanded from the outside to the receiving recess 11 . At least a portion of the outline 51 of the wafer 511 can be exposed corresponding to at least one of the notches 121. In this embodiment, the number of the notches 121 may be a plurality, and the portions of the outline 51 of the wafer 500 are respectively exposed corresponding to the notches 121, thereby facilitating the pick-and-place of the wafer 500 by tools or fingers. The width of the notch 121 may be substantially corresponding to the finger width of the human finger, so that the user can directly access the hand by hand.

As shown in FIG. 7 and FIG. 8 , the depth D1 of the receiving recess 11 is preferably less than or equal to the thickness D2 of the wafer 500. Therefore, when the wafer 500 is adsorbed and positioned in the receiving recess. 11 when the surface 52 of the wafer 500 will be slightly convex or flush with the bearing surface 10a of the disk 1, the surface 52 as shown is slightly convex with a height difference D3 (the bearing surface 10a has a height difference D3) About 0.1mm). In this way, regardless of whether the surface 52 is slightly convex or flush with the bearing surface 10a, the photoresist liquid (not shown) dripped on the wafer 500 can be rotated inside the driving disk 1 When it spreads out, it can pass directly around the inner circumference 112, so that there is no accumulation of liquid.

In other embodiments, not shown, when the wafer 500 is smaller than the receiving recess 11 , a plurality of splices may be separately spliced to the contour 51 of the wafer 500 and accommodated. The groove 11 surrounds the gap between the inner circumferences 112, and each of the splices is also adsorbed and positioned on the bottom surface 111 of the groove, thereby also having a horizontal positioning effect.

In summary, the present invention has the following effects as compared with the prior art: the wafers 500 of various contour shapes are vertically displaceably positioned in the accommodating manner in the accommodating recess 11 by removing the wafer 500. Since the disc 1 itself is circular and has no windage problem, the wafer 500 having the straight side may have no or almost no wind resistance due to sinking into the accommodating recess 11, so that no wind breakage occurs; Since the wafer 500 is adsorbed and positioned, it is not offset, thereby ensuring the accuracy of exposure.

In addition, the present invention has other functions: by accommodating the recess 11 having a shape corresponding to the contour 51 of the wafer 500, the wafer 500 can sink and fill the entire accommodating recess 11 and thus have a level The positioning effect; further, the depth D1 of the receiving recess 11 is less than or equal to the thickness D2 of the wafer 500, so that the photoresist liquid on the wafer 500 can directly pass around the inner circumference 112 when diffusing from the inside to the outside. Therefore, the photoresist liquid is never allowed to surround the inner circumference 112. Moreover, the wafer 500 is facilitated by the opening 121 formed in the outer periphery 12 of the disk 1.

The above is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the creation, and the equivalent structural changes that are made by using the present specification and the contents of the schema are all included in the creation. Within the scope of the rights, it is given to Chen Ming.

100‧‧‧ Positioning device

1‧‧‧ disc

10a‧‧‧ bearing surface

10b‧‧‧back

11‧‧‧ accommodating grooves

111‧‧‧Slot bottom

112‧‧‧ Around the inner circumference

12‧‧‧ outer periphery

121‧‧‧ gap

13‧‧‧ stomata

14‧‧‧ shaft

3‧‧‧Adsorption structure

31‧‧‧Vacuum extractor

311‧‧‧Extraction

32‧‧‧Adsorption Department

33‧‧‧Connected runner

4‧‧‧Drive shaft

500‧‧‧ wafer

51‧‧‧ contour

52‧‧‧ Surface

D1‧‧ depth

D2‧‧‧ thickness

D3‧‧‧ height difference

Figure 1 is a perspective view of the creation positioning device.

2 is a cross-sectional view of the creation positioning device of the present invention.

FIG. 3 is a partial enlarged view of the creation according to one of FIG. 2.

Figure 4 is a partial enlarged view of another part of the creation according to Figure 2

FIG. 5 is an exploded perspective view of the authoring positioning device before positioning the wafer.

FIG. 6 is a perspective view of the creation after positioning according to FIG. 5 .

Figure 7 is a schematic cross-sectional view of the creation according to Figure 6.

Figure 8 is a partial enlarged view of the creation according to Figure 7.

Claims (10)

A wafer positioning device for a coating machine for positioning a wafer having an arbitrary contour shape, the positioning device comprising: a disk having a bearing surface, the bearing surface forming a receiving groove, the receiving groove a bottom surface of the groove; and an adsorption structure disposed on the disk and having a plurality of adsorption portions formed on the bottom surface of the groove; wherein the wafer is received and sunk in the receiving groove and passes through the plurality of adsorption portions And adsorption positioning. The wafer positioning device of the coater of claim 1, wherein the receiving recess further has an inner circumference that is adjacent to the contour of the wafer. The wafer positioning device of the coating machine of claim 1, wherein the disk has an outer periphery, the outer periphery is provided with at least one notch, and at least a portion of the outline of the wafer is exposed to at least one of the notches. The wafer positioning device of the coater of claim 3, wherein the notch is set to be a plurality. The wafer positioning device of the coater of claim 1, wherein the receiving groove has a shape corresponding to a contour of the wafer. The wafer positioning device of the coating machine according to claim 1 or 5, wherein the depth of the receiving groove is less than or equal to the thickness of the wafer, and the bearing surface of the disk is lower than or flush with The surface of the wafer. The wafer positioning device of the coating machine of claim 1, wherein the adsorption structure comprises a vacuum extractor and the plurality of adsorption portions, the vacuum extractor is coupled to the disk, and the plurality of adsorption portions are disposed on the The bottom surface of the groove is connected to the vacuum extractor. The wafer positioning device of the coating machine of claim 7, wherein the adsorption structure further comprises at least one connecting flow channel, the at least one connecting flow channel is formed on the bottom surface of the groove and communicates with the vacuum extractor and the majority Between the adsorption sections. The wafer positioning device of the coating machine according to claim 8, wherein the adsorption portion is an adsorption flow channel formed on a bottom surface of the groove, and each of the adsorption flow channels is surrounded and separated from the inside and the outside. a layer surrounding the configuration, the disc is provided with an air hole corresponding to an inner position of the most inner circumference of the adsorption flow channel, the at least one connecting flow channel is connected to the air hole and each of the adsorption flow channels, and the vacuum extractor is connected to the Stomata. The wafer positioning device of the coating machine of claim 7, wherein the disk further has a back surface opposite to the bearing surface, the back surface is coupled to a rotating shaft, and the vacuum pump is connected to the rotating shaft, the rotating shaft One end is connected to the plurality of adsorption portions via the disk.