TWM556054U - Circuit board - Google Patents

Description

circuit board

The present invention relates to a circuit board, and in particular to a circuit layer provided with a printed layer on the surface thereof, thereby obtaining a circuit board having high voltage resistance, insulation resistance and high temperature resistance.

At present, in the existing circuit board soldering process, the circuit board is coated with tape on the surface of the circuit board before soldering in the tin soldering furnace to prevent the device body and the polyester plastic layer (PET) on the circuit board when the product is in the tin soldering furnace. ) Non-metallic materials are burnt, causing a short circuit between the device and the board. At the same time, in places with high voltage, high current and high insulation requirements, it is also necessary to attach tape to enhance pressure resistance and insulation.

Please refer to FIG. 1. FIG. 1 is a schematic structural view of a circuit board with tape attached in the prior art. As shown in FIG. 1, the tape 2 is attached to a position of a high voltage and a large current of the wiring layer 11 on the wiring board 1, for example, a region of a magnetic element and a capacitive element (TAPE) 111. This location usually contains copper foil lines and vias that are connected to other layer lines, but in practice, this approach clearly has the following disadvantages:

1. The artificial or machine-applied tape has a quality gap with the surface of the circuit board, such as weak gap, inaccuracy, and oxidation of the circuit board.

2. Increased assembly and production links, time-consuming and labor-intensive materials.

Therefore, there is an urgent need to develop a circuit board that overcomes the above drawbacks.

The technical problem to be solved by the present invention is to provide a circuit board comprising a substrate on which a circuit layer is formed, wherein the circuit board further comprises a printed layer, the printed layer is coated on the circuit layer, and the substrate At least one via is disposed on the material, and the printed layer fills at least one of the at least one via.

The above circuit board, wherein the circuit layer includes a first region that is subjected to a large current, and the printed layer is coated on the first region.

The above circuit board, wherein the circuit layer comprises a second region that is subjected to a high voltage, and the printed layer is coated on the second region.

The circuit board described above, wherein the circuit layer includes a pad for soldering the device, and the printed layer is not applied to the pad.

In the above circuit board, the printed layer is a resin ink layer.

In the above circuit board, the resin ink layer is coated on the wiring layer, and the resin ink layer has a minimum thickness of 0.06 mm.

The above circuit board further includes a solder resist ink layer between the circuit layer and the printed layer.

The effect of the present invention on the prior art is that by providing a printed layer on the surface of the circuit layer, the circuit board has the characteristics of high voltage resistance, insulation resistance and high temperature resistance, and no additional staff and material assembly are required in the production process. On the circuit board, the production cost is reduced; the printed layer and the surface of the circuit layer are firmly combined without gaps, which not only avoids the risk of unsatisfactory contact between personnel or machines, but also reduces the weakness of the circuit board due to the presence of gaps. Accurate, circuit board oxidation and other quality problems.

The detailed description and technical description of the present invention are further illustrated by a preferred embodiment, but should not be construed as limiting the implementation of the present invention.

2 to FIG. 4, FIG. 2 is a schematic diagram of the circuit board of the present invention, FIG. 3 is a schematic structural view of the first embodiment of the circuit board, and FIG. 4 is a cross-sectional view of FIG. As shown in FIGS. 2 to 4, the circuit board 3 of the present invention includes a substrate 31, a first wiring layer 32, and a printing layer 33. The first wiring layer 32 is formed on the substrate 31, and the printed layer 33 is coated on the first wiring layer 32. In this embodiment, the printed layer 33 is a resin ink layer, and the combination of the substrate 31 and the first circuit layer 32 is a multilayer circuit board in the prior art, but the present invention is not limited thereto, and the substrate 31 and The combination of the first wiring layers 32 may also be a single layer circuit board or the like.

Further, the first circuit layer 32 includes a first region 321 that is subjected to a large current and a second region 322 that is subjected to a high voltage, and the printed layer 33 is coated on the first region 321 and the second region 322. In the embodiment, the first area 321 and the second area 322 are the same area, but the present invention is not limited thereto. Typically, the area subject to high currents and high voltages is where the power circuit is located, such as the area 111 of the prior art described above.

Still further, the first circuit layer 32 further includes pads 323 for soldering the device to the first wiring layer 32. In some embodiments, at least one device hole 311 is further formed in the substrate 31 for interposing the device. In order to complete the soldering and fixing of the above device in the post-process, the printed layer 33 is not applied to the pad 323 and the device via 311.

Further, the circuit board further includes a solder resist ink layer 34, and the solder resist ink layer 34 is located between the first circuit layer 32 and the printed layer 33, but the present invention is not limited thereto. In other embodiments, solder resist The ink layer may also be applied over the first circuit layer 32 in one layer.

It should be noted that in the present embodiment, the thickness of the printed layer 33 is not limited. In another embodiment, the printed layer 33 may be provided as a resin ink layer and its minimum thickness is 0.06 mm because the resin ink reaches A certain thickness can be subjected to high pressure resistance, insulation resistance, and high temperature resistance. In other embodiments, the designer can also change to other materials or design to different thicknesses as needed.

Please refer to FIG. 5 and FIG. 6. FIG. 5 is a schematic structural view of a second embodiment of the circuit board according to the present invention, and FIG. 6 is a cross-sectional view of FIG. The circuit board shown in FIGS. 5 and 6 is substantially the same as the circuit board structure shown in FIGS. 3 and 4, and only differences will be described here. The substrate 31 of the circuit board shown in FIG. 5 and FIG. 6 further includes at least one via 312, and the printed layer 33 fills at least one of the at least one via 312. When the circuit board 3 passes through the tin furnace, the via hole The printed layer 33 in the 312 can prevent the tin from climbing through the via 312 to the first circuit layer 32, scalding the device mounted on the first circuit layer 32, etc., to further improve the high temperature resistance of the circuit board 3, or In the process of preventing the back circuit of the circuit board 3, the residual water in the via hole 312 affects the reliability of the electronic product, and the via hole 312 can be a hole for connecting the plurality of copper foils between the circuit boards 3. Further, in Figs. 5 and 6, a second wiring layer 32' is further provided on the surface of the substrate 31 facing away from the first wiring layer 32. In this embodiment, the second circuit layer 32' is not covered with a printed layer, but the invention is not limited thereto, and may be similar to the first circuit layer 32 and the second circuit layer according to actual product requirements. The corresponding position of 32' can likewise be covered with a printed layer 33.

In summary, the circuit board of the present invention has a printed layer on the surface of the circuit layer, so that the circuit board has the characteristics of high voltage resistance, insulation resistance and high temperature resistance, and no additional staff and materials are needed in the production process. The assembly on the circuit board reduces the production cost; the printed layer and the surface of the circuit layer are firmly combined without gaps, which not only avoids the risk of unsatisfactory contact between personnel or machines, but also reduces the weakness of the circuit board due to the presence of gaps. Inaccurate, circuit board oxidation and other quality hazards; and, the filling of the printing layer in the via hole can prevent the circuit board from passing through the tin furnace tin to the circuit layer to smash the device and the circuit board in the back stage process. The residual water in the via hole affects the reliability of the electronic product. Sex.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and those skilled in the art can make various corresponding according to the present creation without departing from the spirit of the present invention and its essence. Changes and modifications, but such corresponding changes and modifications are intended to fall within the scope of the claimed invention.

1‧‧‧ circuit board
11‧‧‧Line layer
111‧‧‧Area
2‧‧‧ Tape
3‧‧‧ circuit board
31‧‧‧Substrate
311‧‧‧Device Hole
312‧‧‧through hole
32‧‧‧First circuit layer
32'‧‧‧Second circuit layer
321‧‧‧First area
322‧‧‧Second area
323‧‧‧ pads
33‧‧‧Printing layer
34‧‧‧ solder mask ink layer

FIG. 1 is a schematic view showing the structure of a circuit board with a tape attached in the prior art. Figure 2 is a schematic view of the circuit board of the present invention. FIG. 3 is a schematic structural view of a first embodiment of the circuit board of the present invention. Figure 4 is a cross-sectional view of Figure 3. FIG. 5 is a schematic structural view of a second embodiment of the creation circuit board. Figure 6 is a cross-sectional view of Figure 5.

31‧‧‧Substrate

311‧‧‧Device Hole

32‧‧‧First circuit layer

33‧‧‧Printing layer

Claims (7)

A circuit board comprising a substrate having a circuit layer formed thereon, the circuit board further comprising a printed layer, the printed layer being coated on the circuit layer; wherein the substrate is provided with at least one via hole, The printed layer fills at least one of the at least one via. The circuit board of claim 1, wherein the circuit layer comprises a first region that is subjected to a large current, and the printed layer is coated on the first region. The circuit board of claim 1, wherein the circuit layer comprises a second region that is subjected to a high voltage, and the printed layer is coated on the second region. The circuit board of claim 1, wherein the circuit layer comprises a pad for soldering the device, the printed layer not being applied to the pad. The circuit board of claim 1, wherein the printed layer is a resin ink layer. The circuit board of claim 5, wherein the resin ink layer is coated on the wiring layer, and the resin ink layer has a minimum thickness of 0.06 mm. The circuit board according to any one of claims 1 to 6, further comprising a solder resist ink layer between the circuit layer and the printed layer.