TWM555627U - Casing heat dissipation structure - Google Patents

Description

Chassis heat dissipation structure

This creation is a field of heat dissipation, especially regarding a chassis heat dissipation structure.

In recent years, with the advancement of technology, the operating speed of the server host has been continuously improved, and thus the heating power of the electronic components inside the server main body has been continuously increased. In order to prevent the electronic components inside the server host from overheating and causing the electronic components to fail, it is necessary to provide sufficient heat dissipation performance of the electronic components. Therefore, it is known to separately provide a heat dissipation structure on each server host.

However, it is known that the heat dissipation structure disposed on the server host heats the server host itself, which may result in an additional increase in the size of the server host. In particular, the server host is stacked in the chassis of the server host, each of which is More than one heat dissipation structure is set on the server host, which results in a small number of server hosts that can be carried by the conventional chassis. The efficiency of the internal space of the chassis and the heat dissipation can be reduced without reducing the size of the server host and its heat dissipation structure. The effect is poor.

Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, one of the purposes of the present invention is to provide a heat dissipation structure for a chassis that reduces the heat dissipation of the heat dissipation module to the internal space of the chassis body and contributes to the heat dissipation effect of the internal space of the chassis body.

Another object of the present invention is to provide a chassis heat dissipation structure that avoids the heat dissipation module occupying the internal space of the chassis body.

Another object of the present invention is to provide a heat dissipation unit that can be horizontally or vertically disposed with respect to a heat generating module, and can improve the use of the chassis heat dissipation structure of the internal space of the chassis body.

In order to achieve the above purpose, the present invention provides a chassis heat dissipation structure for at least one server host. The server host has a heat generating module, and the heat dissipation structure of the chassis comprises: a chassis body having a frame and a The heat dissipation module and the at least one heat conduction unit are disposed on the at least one server host, the heat dissipation module has at least one heat dissipation unit and a plurality of fan units, and the at least one heat dissipation unit is disposed on the fan unit and the at least one Between the server mainframes, the at least one heat conducting unit has at least one first end and a second end, the at least one first end contacting the heat generating module of the at least one server main body, and the second end contacting the heat dissipating mold At least one heat dissipating unit of the group, the at least one heat conducting unit transmits heat of the heat generating module to the at least one heat dissipating unit, and the at least one heat dissipating unit transmits heat through the fan unit.

In one embodiment, the heat generating module has at least one heat source and at least one susceptor, and the at least one pedestal is disposed on the at least one heat source, and at least one first end of the at least one heat conducting unit contacts the at least one Pedestal.

In one implementation, the at least one first end of the at least one heat conducting unit is a free end that is inserted into the at least one pedestal, and the second end of the at least one heat conducting unit is fixed at the fixed end of the heat dissipating module At least one heat sink unit.

In one implementation, at least one first end of the at least one heat conducting unit is fixed to the at least one pedestal, and the second end of the at least one heat conducting unit is a free end that is inserted into the heat sink At least one heat sink unit of the group.

In one implementation, at least one first end of the at least one heat conducting unit is a free end that is plugged into the at least one pedestal, and the second end of the at least one heat conducting unit is inserted into the heat sink by another free end At least one heat sink unit of the group.

In one implementation, the at least one heat dissipating unit of the at least one heat dissipating module has a first heat dissipating unit and a second heat dissipating unit, and the first and second heat dissipating units are configured to clamp the second end of the at least one heat conducting unit.

In one implementation, the heat generating module has at least one heat source, and at least one first end of the at least one heat conducting unit contacts the at least one heat source.

In one implementation, at least one first end of the at least one heat conducting unit is fixed to the at least one heat source by a fixed end, and the second end of the at least one heat conducting unit is a free end plugged in the heat dissipation At least one heat dissipation unit of the module.

In one embodiment, the at least one heat dissipating unit of the heat dissipating module has a first heat dissipating unit and a second heat dissipating unit, and the first and second heat dissipating units are configured to clamp the second end of the at least one heat conducting unit.

In one implementation, the second end of the at least one heat conducting unit is in a parallel direction relative to the heat generating module.

In one implementation, the at least one heat conduction unit has a first bending section, the first bending section is located between the first and second ends, and the second end of the at least one heat conduction unit is opposite to the heating module In the vertical direction.

In one implementation, the at least one heat dissipation unit of the heat dissipation module is any combination of any one or a combination of a heat dissipation fin set, a water cooling module, and a temperature equalization plate.

In one implementation, the heat dissipation module is disposed on one side of the chassis body adjacent to an internal space facing the chassis body and an external environment outside the chassis body.

In one implementation, the at least one heat transfer unit is any one or any combination of a heat pipe, a one-circuit heat pipe, and another temperature equalization plate.

With the design of the present invention, the heat dissipation structure of the chassis of the present invention can improve the heat dissipation effect and the flexibility of space use of the internal space of the chassis body.

10‧‧‧Chassis heat dissipation structure

110‧‧‧Chassis body

111‧‧‧Rack

112‧‧‧ Thermal Module

112a‧‧‧Heat unit

112a1‧‧‧First heat sink unit

112a2‧‧‧second heat sink unit

112b‧‧‧Fan unit

114a, 114b, 114c‧‧‧heat conduction unit

1141a, 1141b, 1141c‧‧‧ first end

1142a, 1142b, 1142c‧‧‧ second end

1143a‧‧‧First bend

1144a‧‧‧second bend

115‧‧‧Internal space

116‧‧‧External environment

20‧‧‧Server Host

210‧‧‧heating module

211‧‧‧heat source

212‧‧‧Base

The following figures are intended to make the present invention easier to understand, and the drawings are described in detail herein and form part of the specific embodiments. Through the specific embodiments herein and with reference to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the function principle of the creation is explained.

1 is an exploded perspective view of a first embodiment of a heat dissipation structure of the present invention; FIG. 2 is a three-dimensional combination diagram of a first embodiment of the heat dissipation structure of the creation chassis; and FIG. 3 is a heat dissipation structure of the creation chassis The heat dissipation unit and the heat conduction unit of the first embodiment are a side view; the fourth figure is a three-dimensional combination diagram of the heat dissipation unit and the heat conduction unit of the first embodiment of the heat dissipation structure of the creation chassis; FIG. 6 is a perspective exploded view of a second embodiment of the heat dissipation structure of the creation chassis; FIG. 7 is an exploded perspective view of the third embodiment of the heat dissipation structure of the creation chassis. 8 is a three-dimensional combination diagram of the heat dissipation unit and the heat conduction unit of the third embodiment of the heat dissipation structure of the creation chassis; FIG. 9 is a three-dimensional combination diagram of the heat dissipation unit and the heat conduction unit of the fourth embodiment of the heat dissipation structure of the creation chassis. Figure 10 is a side view of the heat dissipation unit and the heat conduction unit of the fifth embodiment of the heat dissipation structure of the creation chassis; 11 is a perspective view of a heat dissipation unit and a heat conduction unit according to a fifth embodiment of the heat dissipation structure of the creation chassis; FIG. 12 is a side view of an alternative embodiment of the fifth embodiment of the heat dissipation structure of the creation chassis; The figure is a side view of the heat dissipation unit and the heat conduction unit of the sixth embodiment of the heat dissipation structure of the creation chassis; and FIG. 14 is a perspective combination diagram of the heat dissipation unit and the heat conduction unit of the sixth embodiment of the heat dissipation structure of the creation chassis.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to Figures 1, 2, 3 and 4, which are perspective exploded view, stereo combination diagram, side view of heat dissipation unit and heat conduction unit, heat dissipation unit and heat conduction unit of the first embodiment of the heat dissipation structure of the creation chassis. As shown in the figure, the chassis heat dissipation structure 10 of the present invention includes a chassis body 110. The chassis body 110 has a frame 111, a heat dissipation module 112, and at least one heat conduction unit 114a. A server host 20 is set up.

In the present embodiment, the rack 111 is shown as being provided for a server host 20. The server host 20 has a heat generating module 210 having at least one heat source 211 and at least one base 212. In this embodiment, the heat generating module 210 is shown as having a heat source 211 and a pedestal 212. The susceptor 212 is disposed on the heat source 211. The heat source 211 is an electronic component, but Limited to this, this creation does not limit the application of the chassis heat dissipation structure 10. Moreover, in the embodiment, the chassis body 110 is represented as a semi-open chassis body, but is not limited thereto, and the chassis body 110 can also be represented as a completely open chassis body (that is, there is no Side wall, such as a frame body, or a closed chassis body.

The heat dissipation module 112 is disposed on a side opposite to the outside of the chassis body 110 and adjacent to an internal space 115 in the chassis body 110 and an external environment 116 outside the chassis body 110. The heat of the internal space 115 of the chassis body 110 is transmitted to the external environment 116 for heat dissipation. In the embodiment, the heat dissipation module 112 is disposed on the rear side of the chassis body 110. The heat dissipation module 112 has at least one heat dissipation unit 112a and a plurality of fan units 112b. In the embodiment, the heat dissipation module 112 is shown as having a heat dissipation unit 112a and a plurality of fan units 112b. The heat dissipation unit 112a is disposed between the fan unit 112b and the server host 20, and the fan unit 112b is configured to heat-dissipate heat of the heat dissipation unit 112a to the external environment 116. In this embodiment, the heat dissipation unit 112a of the heat dissipation module 112 is a heat dissipation fin group, a water cooling module, and a temperature equalization plate. However, the heat dissipation unit 112a of the heat dissipation module 112 can also be represented as a combination of the heat dissipation fin group and the water cooling module and the temperature equalization plate. In addition, the heat dissipating unit 112a of the heat dissipating module 112 of the present invention is not limited to the above, and any function that can reach the heat dissipating unit 112a of the heat dissipating module 112 of the present invention is the spirit of the creation.

The heat conducting unit 114a has at least a first end 1141a and a second end 1142a. In the embodiment, the heat conducting unit 114a is shown as having a first end 1141a and a second end 1142a. The first end 1141a is in contact with the heat generating module 210 of the server host 20, and the second end 1142a is in contact with the heat dissipating unit 112a of the heat dissipating module 112. The base 212 of the heat generating module 210 is disposed on the heat source 211. Therefore, the first end 1141a of the heat conduction unit 114a contacts the base 212 of the heat generating module 210. In this embodiment, the first end 1141a of the heat conduction unit 114a is a free end of the base 212, and the second end 1142a of the heat conduction unit 114a is fixed to the heat dissipation module. The heat dissipation unit 112a of 112. The heat conduction unit 1144 transmits the heat of the heat generating module 210 to the heat dissipation unit 112a of the heat dissipation module 112, and then the fan unit 112b transmits the heat of the heat dissipation unit 112a to the external environment 116 to dissipate heat. The heat dissipating means of the heat dissipating unit 112a and the fan unit 112b are specifically heat conduction or heat convection or heat radiation or a combination thereof.

In this embodiment, the first end 1141a of the heat conduction unit 114a extends longitudinally to the second end 1142a in a horizontal direction, and the second end 1142a is in a parallel direction with respect to the heat generating module 210. However, in another alternative embodiment, as shown in FIG. 5, the heat conducting unit 114a has a first bending section 1143a, and the first bending section 1143a is located between the first and second ends 1141a, 1142a, such that The second end 1142a of the heat conducting unit 114a is in a vertical direction relative to the heat generating module 210.

In the present embodiment, the heat conducting unit 114a is represented as a heat pipe, but is not limited thereto. In an alternative embodiment, the heat conducting unit 114a may also be represented as a temperature equalizing plate or a loop heat pipe. In another alternative embodiment, the heat transfer unit 114a can also be represented as any combination of the heat pipe and the temperature equalizing plate or loop heat pipe or any thermally conductive metal. In addition, the thermal conduction unit 114a of the present invention is not limited to the above, and any function that can achieve the heat conduction unit 114a as in the present case is the spirit of the creation.

With the design of the present invention, the heat dissipation module 112 is fixed to the frame 111, and the second end 1142a of the heat conduction unit 114a is fixed to the heat dissipation unit 112a of the heat dissipation module 112. Therefore, the server host 20 can be disposed from the external environment to the chassis 111 of the chassis body 110, whereby the first end 1141a of the heat conduction unit 114a is plugged into the heat generating module of the server host 20. The base 212 of the 210. When the heat source 211 of the heat generating module 210 of the server main body 20 generates heat during operation, the susceptor 212 absorbs the heat of the heat generating source 211, and the first end 1141a of the heat conducting unit 114a absorbs the heat from the pedestal 212. The heat of the heat source 211.

When the heat conducting unit 114a is the heat pipe or the other temperature equalizing plate or the loop heat pipe, the heat conducting unit 114a is internally provided with a chamber as a working fluid flow path, and is contained in the working fluid in the chamber. The heat transfer is performed by phase change, movement, or the like of evaporation, condensation, or the like. Using the heat pipe or the other temperature equalizing plate or the loop heat pipe as a remote heat conducting component, the low temperature working fluid filled inside the heat pipe or the other temperature equalizing plate or the loop heat pipe is at the first end 1141a The heat is evaporated, and the working fluid in the vapor moves toward the second end 1142a, and the heat source 211 is generated at the second end 1142a. The heat is transferred to the heat dissipation unit 112a of the heat dissipation module 112, and the heat on the heat dissipation unit 112a is transmitted to the external environment 116 by the fan unit 112b.

Therefore, the heat dissipation module 112 reduces the heat applied to the internal space 115 of the chassis body 110 to improve the heat dissipation effect of the internal space 115 of the chassis body 110. At the same time, the heat dissipation module 112 can be prevented from occupying the internal space 115 of the chassis body 110, and the heat conduction unit 114a can be disposed horizontally or vertically with respect to the heat generating module 210, thereby greatly improving the use flexibility of the internal space 115 of the chassis body 110.

Please refer to FIG. 6 , which is a perspective exploded view of the second embodiment of the heat dissipation structure of the present invention, and is supplemented with reference to FIGS. 1 to 5 . As shown in the figure, part of the structure and function of the present embodiment and the first The embodiment is the same, so it will not be described here. However, the difference between this embodiment and the foregoing first embodiment is that the rack 111 is represented as a stacking interval between the two server hosts 20, and the heat dissipation module is provided. 112 has two heat dissipation units 112a corresponding to the server host 20, and the chassis body 110 has two heat conduction units 114a respectively disposed between the server host 20 and the heat dissipation units 112a, and the heat conduction units 114a The first end 1141a is in contact with the heat generating module 210 of the server host 20, and the second ends 1142a of the heat conducting units 114a are respectively in contact with the heat dissipating units 112a. In addition, the server host 20 of the present invention is not limited to one or two. In other embodiments, there may be more than two server hosts 20, and a corresponding number of heat dissipation units 112a and heat conduction units 114a.

In addition, a plurality of heat generating modules 210 may be disposed in the server host 20, and each of the heat generating modules 210 is thermally contacted by a single heat conduction unit 114a and/or by the plurality of heat conducting units 114a for each of the heat generating modules 210. The contact conducts heat to the heat radiating unit 112a for heat exchange and heat dissipation.

Please refer to Figures 7 and 8 for the perspective view of the third embodiment of the heat dissipation structure of the creation chassis, the heat dissipation unit and the heat conduction unit, and the reference figures 1 to 6, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing second embodiment, and therefore will not be further described herein. However, the difference between the embodiment and the first embodiment is that the heat dissipation module 112 has a corresponding servo. a heat dissipation unit 112a of the main unit 20, and the chassis body 110 has only one heat conduction unit 114a disposed on the server Between the host 20 and the heat dissipating unit 112a, the heat conducting unit 114a has two first ends 1141a and a second end 1142a, and a second bend between one end 1141a and the second end 1142a The segments 1144a are arranged to meet the stacking of the server hosts 20, and the first ends 1141a are respectively in contact with the pedestals 212 of the heat generating modules 210.

Please refer to FIG. 9 , which is a three-dimensional combination diagram of the heat dissipation unit and the heat conduction unit of the fourth embodiment of the heat dissipation structure of the creation chassis, and is supplemented with reference to the first to fifth figures. As shown in the figure, some structures and functions of the embodiment are shown. The first embodiment is the same as the foregoing first embodiment, and therefore will not be described again. However, the difference between the embodiment and the first embodiment is that the heat generating module 210 of the server host 20 is represented as having a plurality of heat sources. 211 and a plurality of pedestals 212 corresponding to the heat source 211, the heat sources 211 are disposed in parallel with each other, and the susceptors 212 are respectively disposed on the heat sources 211, and the heat conduction units 114a are arranged in parallel intervals. The first end 1141a and the second end 1142a are respectively in contact with the pedestals 212 of the heat generating module 210 in parallel with the first ends 1141a. In addition, the heat source 211 and the pedestal 212 of the heat generating module 210 of the present invention are not limited to one or two. In other embodiments, there may be two or more heat generating sources 211 and pedestals 212, and have corresponding The first end 1141a of the number of thermal conduction units 114a.

Please refer to Figures 10 and 11 for the three-dimensional combination of the heat dissipation unit and the heat conduction unit side view, the heat dissipation unit and the heat conduction unit of the fifth embodiment of the heat dissipation structure of the creation chassis, and supplemented with reference to Figures 1 to 5, as shown in the figure. The structure and function of the embodiment are the same as those of the foregoing first embodiment, and therefore will not be described herein again. However, the difference between this embodiment and the foregoing first embodiment is that, in this embodiment, The first end 1141b of the heat conducting unit 114b is fixed to the base 212. The second end 1142b of the heat conducting unit 114b is a heat radiating unit 112a that is freely inserted into the heat dissipation module 112. The heat dissipation unit 112a of the heat dissipation module 112 has a first heat dissipation unit 112a1 and a second heat dissipation unit 112a2. The first and second heat dissipation units 112a1 and 112a2 sandwich the second end 1142b of the heat conduction unit 114b.

In addition, in an alternative embodiment, as shown in FIG. 12, the heat generating module 210 of the server host 20 has the heat source 211 and the base 212 is omitted, and the first end 1141b of the heat conducting unit 114b is fixed. On the heat source 211, the second end 1142b of the heat conduction unit 114b is inserted into the heat dissipation unit 112a of the heat dissipation module 112.

Thereby, the first end 1141b of the heat conduction unit 114b is fixed on the base 212 or the heat source 211 of the server host 20, thereby enabling the server host 20 to be set from the external environment to the chassis body. The heat dissipating unit 112a of the heat dissipating module 112 is clamped by the first and second heat dissipating units 112a1 and 112a2 through the second end 1142b of the heat conducting unit 114b. The same efficacy of the examples.

Please refer to Figures 13 and 14 for the three-dimensional combination of the heat dissipation unit and the heat conduction unit side view, the heat dissipation unit and the heat conduction unit of the sixth embodiment of the heat dissipation structure of the creation chassis, and supplemented with reference to the first to fourth and fourth to tenth As shown in the figure, the structure and function of the embodiment are the same as those of the foregoing fifth embodiment, and therefore will not be described again here, but the difference between the embodiment and the foregoing fifth embodiment is that the heat conduction is The first end 1141c of the unit 114c is a free end that is inserted into the base 212. The second end 1142c of the heat conducting unit 114c is a heat dissipating unit 112a that is inserted into the heat dissipation module 112 by another free end.

In one implementation, the first end 1141c of the thermal conduction unit 114c is plugged into the server host 20, and then the server host 20 is placed on the chassis 111, and the second end 1142c of the thermal conduction unit 114c is inserted. Connected to the heat dissipation unit 112a of the heat dissipation module 112. In another implementation, the second end 1142c of the heat conduction unit 114c is inserted into the heat dissipation unit 112a of the heat dissipation module 112, and then the server host 20 is disposed on the frame 111, so that the heat conduction unit 114c The first end 1141c is plugged into the server host 20. Thereby, the same effects as the foregoing fifth embodiment are achieved.

Therefore, the heat conduction unit 114a, 114b, and 114c of the chassis heat dissipation structure 10 of the present invention transmits the heat of the heat generation module 210 to the heat dissipation module 112, and the heat dissipation module 112 transmits heat through the fan unit 112b. Further, the heat dissipation effect of the internal space 115 of the chassis body 110 can be improved. efficacy. At the same time, it can be set by the plurality of server units 20 corresponding to the plurality of heat conduction units 114a, 114b, 114c and the plurality of heat dissipation units 112a, or by the plurality of server units 20 corresponding to a heat conduction unit 114a, 114b, 114c and a heat dissipation unit 112a, or by a The plurality of heat generating modules 210 in the server host 20 are disposed corresponding to a heat conducting unit 114a, 114b, 114c and a heat dissipating unit 112a, and the heat dissipating module 112 need not be disposed on the server host 20 to avoid occupying the chassis body 110. The internal space 115, while the heat conducting units 114a, 114b, 114c are horizontally or vertically disposed with respect to the heat generating module 210, thereby improving the use flexibility of the internal space 115 of the chassis body 110.

The present invention has been described in detail above, but the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

10‧‧‧Chassis heat dissipation structure

110‧‧‧Chassis body

111‧‧‧Rack

112‧‧‧ Thermal Module

112a‧‧‧Heat unit

112b‧‧‧Fan unit

114a‧‧‧Heat conduction unit

115‧‧‧Internal space

116‧‧‧External environment

20‧‧‧Server Host

Claims (14)

A chassis heat dissipation structure is provided for at least one server host. The at least one server host has a heat generating module. The chassis heat dissipation structure comprises: a chassis body having a frame, a heat dissipation module and at least one heat conduction a unit, the rack is provided for the at least one server host, the heat dissipation module has at least one heat dissipating unit and a plurality of fan units, and the at least one heat dissipating unit is disposed between the fan unit and the at least one server host, The at least one first end is in contact with the heat generating module of the at least one server main body, and the second end is in contact with the at least one heat dissipating unit of the heat dissipating module, The at least one heat conduction unit conducts heat of the heat generating module to the at least one heat dissipating unit, and the at least one heat dissipating unit transmits heat through the fan units. The heat dissipation module of claim 1, wherein the heat generating module has at least one heat source and at least one base, and the at least one base is disposed on the at least one heat source, the at least one heat conducting unit At least one first end contacts the at least one pedestal. The chassis heat dissipation structure of claim 2, wherein at least one first end of the at least one heat conduction unit is a free end plugged into the at least one base, and the second end of the at least one heat conduction unit The fixing end is fixed to the at least one heat dissipating unit of the heat dissipation module. The chassis heat dissipation structure of claim 2, wherein at least one first end of the at least one heat conduction unit is fixed to the at least one pedestal, and the second at least one heat conduction unit is The end is a free end that is inserted into the at least one heat dissipation unit of the heat dissipation module. The chassis heat dissipation structure of claim 2, wherein at least one first end of the at least one heat conduction unit is a free end plugged into the at least one base, and the second end of the at least one heat conduction unit The other free end is inserted into the at least one heat dissipation unit of the heat dissipation module. The heat dissipation structure of the chassis of claim 4, wherein the at least one heat dissipation unit of the at least one heat dissipation module has a first heat dissipation unit and a second heat dissipation unit, and the first and second heat dissipation units are Holding the second end of the at least one heat conduction unit. The heat dissipation module of claim 1, wherein the heat generating module has at least one heat source, and at least one first end of the at least one heat conducting unit contacts the at least one heat source. The chassis heat dissipation structure of claim 7, wherein at least one first end of the at least one heat conduction unit is fixed to the at least one heat source, and the second heat conduction unit is second. The end is a free end of the at least one heat dissipating unit of the heat dissipation module. The at least one heat dissipating unit of the heat dissipating module has a first heat dissipating unit and a second heat dissipating unit, wherein the first and second heat dissipating units are configured to clamp the at least one heat dissipating unit. a second end of a thermal conduction unit. The chassis heat dissipation structure according to claim 1, wherein the second end of the at least one heat conduction unit is in a parallel direction with respect to the heat generating module. The chassis heat dissipation structure of claim 3, 4 or 5, wherein the at least one heat conduction unit has a first bending section, and the first bending section is located between the first and second ends. The second end of the at least one heat conducting unit is in a vertical direction relative to the heat generating module. The heat dissipation structure of the heat dissipation module of claim 1, wherein at least one heat dissipation unit of the heat dissipation module is any one or a combination of a heat dissipation fin group, a water cooling module, and a temperature equalization plate. . The heat dissipation module of the present invention, wherein the heat dissipation module is disposed on one side of the chassis body adjacent to an internal space of the chassis body and an external environment outside the chassis body. . The chassis heat dissipation structure according to claim 1, wherein the at least one heat conduction unit is any one or any combination of a heat pipe, a one-circuit heat pipe and another temperature plate.