TWM549470U - A high frequency connector - Google Patents
A high frequency connector Download PDFInfo
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- TWM549470U TWM549470U TW106200446U TW106200446U TWM549470U TW M549470 U TWM549470 U TW M549470U TW 106200446 U TW106200446 U TW 106200446U TW 106200446 U TW106200446 U TW 106200446U TW M549470 U TWM549470 U TW M549470U
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Description
本創作是有關於一種被用以傳輸高頻訊號之具有屏蔽板的高頻連接器,尤指一種可以用來傳輸頻率高達百萬赫茲(MHz)以上高頻電子訊號之連接器。 The present invention relates to a high frequency connector with a shielding plate for transmitting high frequency signals, and more particularly to a connector for transmitting high frequency electronic signals having a frequency of up to and including a million hertz (MHz).
連接器是一種在不同電子裝置間交換電子訊號的媒介,各個電子裝置可透過可相互匹配的連接器建立電器連接關係,使該不同電子裝置間的電子訊號得以相互傳遞或交換。由於連接器所傳遞的電子訊號頻率不斷升高,且高頻電子訊號對空間中的電磁場相當敏感,因對連接器內部空間的電磁場採取有效隔離措施是必要的。有效率的電磁場隔離措施可以降低連接器傳遞的多數組高頻訊號間相互干擾,抑制高頻電子訊號受電磁場感應生成的雜音,有助於高頻電子訊號的完整傳遞。 A connector is a medium for exchanging electronic signals between different electronic devices. Each electronic device can establish an electrical connection relationship through mutually compatible connectors, so that electronic signals between the different electronic devices can be transmitted or exchanged with each other. Since the frequency of the electronic signal transmitted by the connector is constantly increasing, and the high-frequency electronic signal is relatively sensitive to the electromagnetic field in the space, it is necessary to take effective isolation measures against the electromagnetic field in the internal space of the connector. Efficient electromagnetic field isolation measures can reduce the mutual interference between the multi-array high-frequency signals transmitted by the connector, suppress the noise generated by the electromagnetic field induced by the high-frequency electronic signal, and contribute to the complete transmission of the high-frequency electronic signal.
有關於隔離連接器內部電磁場交互干擾的先前技藝至少包括了美國第8,167,631號專利及美國第8,808,029號專利。在理解本創作的揭露之前,應參考前述相關先前技藝,以利於理解本創作所揭露的技術。 Prior art relating to electromagnetic field interaction interference within an isolated connector includes at least U.S. Patent No. 8,167,631 and U.S. Patent No. 8,808,029. Before understanding the disclosure of the present work, reference should be made to the related prior art described above to facilitate understanding of the techniques disclosed in the present disclosure.
在先前技藝美國第8,167,631號專利揭露的連接器為一種卡緣連接器(card edge connector),或稱邊緣卡連接器(edge card connector)。該卡緣連接器的各端子是被排列為二排,各排端子中具有以二接地端子 (ground line contact,G)排列於相鄰的一對訊號端子外側的組合,使該組合中的各端子排列成G-S-S-G狀態,藉以保護該訊號端子對傳輸的差動訊號(differential signal)。 The connector disclosed in the prior art is disclosed as a card edge connector, or edge card connector. Each terminal of the card edge connector is arranged in two rows, and each row of terminals has two ground terminals (ground line contact, G) is arranged in a combination of adjacent pairs of signal terminals, so that the terminals in the combination are arranged in a G-S-S-G state, thereby protecting the differential signal transmitted by the signal terminal pair.
如第8圖所示,美國第8,808,029號專利所揭露的連接器主要是由一外殼A、一第一端子組B、一第二端子組C及一屏蔽板E所組成。該外殼A具有一收納槽A1。該第一端子組B及第二端子組C分別具有多數導電端子D,各該導電端子分別具有一定位部D3及一接觸部D4,且各該端子組分別具有多數訊號端子D1及至少一接地端子D2。各該導電端子定位部D3至少被固定於該外殼A的一位置,各該導電端子接觸部D4分別延伸進入該收納槽A1。該屏蔽板E是被定位於該第一端子組B與該第二端子組C間,且該屏蔽板E具有多數接觸臂E1,該屏蔽板E延伸之彈臂接觸該第一端子組B之該特定接地端子。 As shown in FIG. 8, the connector disclosed in U.S. Patent No. 8,808,029 is mainly composed of a casing A, a first terminal group B, a second terminal group C and a shielding plate E. The outer casing A has a receiving groove A1. Each of the first terminal group B and the second terminal group C has a plurality of conductive terminals D, and each of the conductive terminals has a positioning portion D3 and a contact portion D4, and each of the terminal groups has a plurality of signal terminals D1 and at least one ground. Terminal D2. Each of the conductive terminal positioning portions D3 is fixed to at least one position of the outer casing A, and each of the conductive terminal contact portions D4 extends into the receiving groove A1. The shielding plate E is positioned between the first terminal group B and the second terminal group C, and the shielding plate E has a plurality of contact arms E1, and the elastic arm extending from the shielding plate E contacts the first terminal group B. This particular ground terminal.
在該美國第8,808,029號專利的揭露中,由於該屏蔽板E是依靠各個接觸臂E1的彈力而與適當接地端子D2形成電性連接狀態,然而各該接觸臂E1自該屏蔽板E延伸的角度公差控制不易,使各個接觸臂E1對個別端子施加的正向力不易掌握,有電性斷路的風險。 In the disclosure of the U.S. Patent No. 8,808,029, since the shielding plate E is electrically connected to the appropriate grounding terminal D2 by the elastic force of each of the contact arms E1, the angle of each of the contact arms E1 extending from the shielding plate E is The tolerance control is not easy, and the positive force applied to the individual terminals by the respective contact arms E1 is difficult to grasp, and there is a risk of electrical disconnection.
由於前述已知二先前技藝所揭露之高頻訊號連接器結構皆有其不經濟的缺失,因此對於用來傳輸高頻電子訊號的高密度連接器提出改善設計是有必要的。 Because of the uneconomical lack of high frequency signal connector structures disclosed in the aforementioned prior art, it is necessary to propose an improved design for high density connectors for transmitting high frequency electronic signals.
本創作的主要目的在於提供一種可以用來傳輸高頻電子訊號的連接器,該連接器是至少適於傳輸百萬赫茲以上頻率的電子訊號。 The main purpose of this creation is to provide a connector that can be used to transmit high frequency electronic signals, the connector being at least suitable for transmitting electronic signals at frequencies above megahertz.
本創作所揭露的該連接器主要是由一絕緣殼體、一第一組件、一第二組件、一屏蔽板及一遮蔽殼體所組成。該絕緣殼體具有一收納槽,該收納槽是用來收納一對接裝置的一部分。該第一端子組及第二端子組分別具有多數導電端子,各該端子組分別具有多數訊號端子及至少一接地端子。各該訊號端子可以被用來傳送高頻電子訊號,各該接地端子是被電連接至地。各該導電端子分別具有一定位部及一接觸部,各該導電端子定位部至少被相對固定於該絕緣殼體的一位置,各該導電端子接觸部分別延伸進入該收納槽,藉各該導電端子接觸部分別與一對接電子裝置或對接連接器的適當電路或端子形成電性連接關係。該屏蔽板是被定位於該第一端子組與該第二端子組間,且該屏蔽板具有多數接觸臂分別朝向第一端子組或第二端子組的接地端子延伸。該屏蔽板至少有一接觸臂是被焊接於該第一端子組中的一接地端子。 The connector disclosed in the present invention is mainly composed of an insulating housing, a first component, a second component, a shielding plate and a shielding shell. The insulative housing has a receiving slot for receiving a portion of the mating device. The first terminal group and the second terminal group respectively have a plurality of conductive terminals, and each of the terminal groups has a plurality of signal terminals and at least one ground terminal. Each of the signal terminals can be used to transmit high frequency electronic signals, each of which is electrically connected to ground. Each of the conductive terminals has a positioning portion and a contact portion, and each of the conductive terminal positioning portions is at least fixed to a position of the insulating housing, and each of the conductive terminal contact portions respectively extends into the receiving slot, and each of the conductive terminals The terminal contact portions are electrically connected to respective circuits or terminals of the pair of electronic devices or the mating connectors. The shielding plate is positioned between the first terminal group and the second terminal group, and the shielding plate has a plurality of contact arms extending toward the ground terminals of the first terminal group or the second terminal group, respectively. The shielding plate has at least one contact arm that is soldered to a ground terminal of the first terminal group.
本創作所揭露的技術至少包括以下詳細說明之揭露,但本創作所揭露的技術應用不以此為限,凡習於此項技藝者因本創作所揭露的技術所能思及的簡單變化,凡不脫離本創作申請專利範圍的界定範圍內,皆屬本創作的實施及應用。 The technology disclosed in the present invention includes at least the following detailed description, but the technical application disclosed in the present application is not limited thereto, and any simple change that can be considered by the skilled person in the art disclosed by the present invention is The implementation and application of this creation are within the scope of the definition of the patent application scope of this creation.
A‧‧‧外殼 A‧‧‧shell
A1‧‧‧收納槽 A1‧‧‧ storage trough
B‧‧‧第一端子組 B‧‧‧First terminal group
C‧‧‧第二端子組 C‧‧‧second terminal group
D‧‧‧導電端子 D‧‧‧conductive terminal
D1‧‧‧訊號端子 D1‧‧‧ signal terminal
D2‧‧‧接地端子 D2‧‧‧ Grounding terminal
D3‧‧‧定位部 D3‧‧‧ Positioning Department
D4‧‧‧接觸部 D4‧‧‧Contacts
E‧‧‧屏蔽板 E‧‧‧Shield
E1‧‧‧接觸臂 E1‧‧‧Contact arm
1‧‧‧連接器 1‧‧‧Connector
2‧‧‧絕緣殼體 2‧‧‧Insulated housing
21‧‧‧頂壁 21‧‧‧ top wall
211‧‧‧止退孔 211‧‧‧ 退退孔
22‧‧‧底壁 22‧‧‧ bottom wall
221‧‧‧凸柱 221‧‧‧Bump
23‧‧‧側壁 23‧‧‧ side wall
231‧‧‧凸部 231‧‧‧ convex
232‧‧‧斜面 232‧‧‧Bevel
233‧‧‧凸塊 233‧‧‧Bumps
234‧‧‧引導通道 234‧‧‧ Guide channel
24‧‧‧端子槽 24‧‧‧Terminal slot
25‧‧‧承板 25‧‧‧ board
26‧‧‧開孔 26‧‧‧Opening
27‧‧‧段差 27‧‧‧ paragraph difference
28‧‧‧收納槽 28‧‧‧ Storage trough
29‧‧‧間隔板 29‧‧‧ Spacer
3‧‧‧第一端子組 3‧‧‧First terminal group
4‧‧‧第二端子組 4‧‧‧Second terminal group
5‧‧‧導電端子 5‧‧‧Electrical terminals
51‧‧‧接觸部 51‧‧‧Contacts
52‧‧‧定位部 52‧‧‧ Positioning Department
53‧‧‧焊接部 53‧‧‧Welding Department
54‧‧‧接地端子 54‧‧‧ Grounding terminal
55‧‧‧訊號端子 55‧‧‧ Signal Terminal
6‧‧‧定位件 6‧‧‧ Positioning parts
61‧‧‧缺口 61‧‧‧ gap
62‧‧‧突起 62‧‧‧ Protrusion
63‧‧‧止退結構 63‧‧‧Retirement structure
7‧‧‧屏蔽板 7‧‧‧Shield
71‧‧‧平板 71‧‧‧ tablet
711‧‧‧子平板 711‧‧‧sub-table
712‧‧‧孔洞 712‧‧‧ hole
72‧‧‧連接板 72‧‧‧Connecting plate
73‧‧‧接觸臂 73‧‧‧Contact arm
8‧‧‧絕緣子 8‧‧‧Insulators
81‧‧‧卡合件 81‧‧‧Cards
82‧‧‧貫穿孔 82‧‧‧through holes
83‧‧‧凹陷部 83‧‧‧Depression
9‧‧‧遮蔽殼體 9‧‧‧Shaded housing
91‧‧‧頂板 91‧‧‧ top board
911‧‧‧接合部 911‧‧‧ joint
912‧‧‧對接孔 912‧‧‧ docking holes
913‧‧‧覆蓋部 913‧‧‧ Coverage
92‧‧‧側板 92‧‧‧ side panels
921‧‧‧凹槽 921‧‧‧ Groove
922‧‧‧耳扣 922‧‧‧ ear buckle
923‧‧‧保護結構 923‧‧‧Protection structure
924‧‧‧接腳 924‧‧‧ feet
93‧‧‧收容空間 93‧‧‧ accommodating space
第1圖,為本創作所揭露的技術被應用於一第一例的完整立體外觀圖。 Fig. 1 is a full perspective view showing the technique disclosed in the present application applied to a first example.
第2圖,為第1圖的爆炸圖。 Figure 2 is an exploded view of Figure 1.
第3圖,為自第1圖變化的一二實施例。 Fig. 3 is a two-second embodiment which is changed from Fig. 1.
第4圖,為第3圖的正視圖。 Fig. 4 is a front view of Fig. 3.
第5圖,為第4圖中的A-A剖面圖。 Fig. 5 is a cross-sectional view taken along line A-A in Fig. 4.
第6圖,為第4圖中的B-B圖。 Figure 6 is a B-B diagram in Figure 4.
第7圖,為第4圖中第一端子組中的接地端子、第二端子組中的接地端子及屏蔽板的相互關聯示意圖。 Figure 7 is a schematic diagram showing the interconnection of the ground terminal in the first terminal group, the ground terminal in the second terminal group, and the shield plate in Fig. 4.
第8圖,為為先前技術美國專利公告第8808029號專利之圖式。 Figure 8 is a diagram of the prior art U.S. Patent No. 8,880,029.
如第1圖及第2圖所示,本創作第一實施例是以SAS協會制定的SlimSAS連接器標準為例,惟本創作技術的實際應用不以此為限。本案較佳實施例揭露一種具有屏蔽板的高頻連接器,該連接器1包含一絕緣殼體2、一第一端子組3、一第二端子組4、一屏蔽板7及一遮蔽殼體9,該連接器1是可被固定在一電子裝置(圖未標示)內的一電路基板(圖未揭示),且該連接器1可在該電路基板與一對接裝置(圖未揭示)間傳輸電子訊號。 As shown in FIG. 1 and FIG. 2, the first embodiment of the present creation is based on the SlimSAS connector standard developed by the SAS Association, but the actual application of the creation technique is not limited thereto. The preferred embodiment of the present invention discloses a high frequency connector having a shielding plate. The connector 1 includes an insulating housing 2, a first terminal set 3, a second terminal set 4, a shielding plate 7, and a shielding housing. 9, the connector 1 is a circuit substrate (not shown) that can be fixed in an electronic device (not shown), and the connector 1 can be between the circuit substrate and the pair of devices (not shown) Transmit electronic signals.
本案較佳實施例揭露中,請參閱圖式第3圖,該絕緣殼體2為塑膠材料射出成形,該絕緣殼體2包含一頂壁21、一底壁22及二側壁23,該頂壁21、該底壁22及該些側壁23形成一收納槽28,該收納槽28是用來收納該對接裝置的一部分,該頂壁21及底壁22上設有複數間隔板29朝該收納槽28開口方向延伸形成複數端子槽24,且該收納槽28之空間包含該些端子槽24,該收納槽28開口處在該頂壁21及底壁22各設有一承板25覆蓋該些間隔板29,該些承板25平行於該頂壁21及該底壁22,每一端子槽24鄰近該收納槽28開口處各設有一開孔26貫穿該頂壁21或該底壁22,該些開孔26的設計使該些端子槽24增加緩衝空間,該絕緣殼體2鄰近該收納槽28開口處之該 頂壁21及各該側壁23設有一段差27,使靠近該收納槽28開口處之該頂壁21及各該側壁23表面低於遠離該收納槽28開口處之該頂壁21及各該側壁23,該頂壁21表面設有複數止退孔211,該些止退孔211為矩形結構且貫穿該頂壁21,且該些止退孔211遠離該收納槽28開口,各該側壁23於該收納槽28開口外側各設有一凸部231,每一凸部231均位於一引導通道234中,且該凸部231朝該收納槽28開口方向設有一斜面232,可方便扣合,該些引導通道234位於各該側壁23外表面,該些側壁23兩端各設有一凸塊233,該些凸塊233分別鄰近該頂壁21及該底壁22,兩凸塊233中間所夾之區域即為該引導通道234,該些引導通道234引導方向為平行該收納槽28開口對接之方向,且該底壁22表面設有圓形或矩形結構之複數凸柱221,該些凸柱221可提供組裝固定之功效。 In the preferred embodiment of the present invention, referring to FIG. 3, the insulating housing 2 is injection molded of a plastic material, and the insulating housing 2 includes a top wall 21, a bottom wall 22 and two side walls 23, the top wall The bottom wall 22 and the side walls 23 form a receiving groove 28 for accommodating a part of the docking device. The top wall 21 and the bottom wall 22 are provided with a plurality of partition plates 29 toward the receiving groove. A plurality of terminal slots 24 are formed in the opening direction of the opening, and the space of the receiving slot 28 includes the terminal slots 24, and the opening of the receiving slot 28 is provided on the top wall 21 and the bottom wall 22 with a receiving plate 25 covering the partitioning plates. 29, the carrier plate 25 is parallel to the top wall 21 and the bottom wall 22, and each of the terminal slots 24 is provided with an opening 26 extending through the top wall 21 or the bottom wall 22 adjacent to the opening of the receiving slot 28. The opening 26 is designed to increase the buffer space of the terminal slots 24, and the insulating housing 2 is adjacent to the opening of the receiving slot 28. The top wall 21 and each of the side walls 23 are provided with a difference 27 such that the top wall 21 and the surface of each of the side walls 23 adjacent to the opening of the receiving groove 28 are lower than the top wall 21 and each side wall away from the opening of the receiving groove 28. The surface of the top wall 21 is provided with a plurality of recessed holes 211. The recessed holes 211 have a rectangular structure and penetrate the top wall 21, and the recessed holes 211 are open away from the receiving slot 28, and the side walls 23 are respectively Each of the outer sides of the opening of the receiving groove 28 is provided with a convex portion 231. Each convex portion 231 is located in a guiding passage 234, and the convex portion 231 is provided with a slope 232 in the opening direction of the receiving groove 28 for convenient fastening. The guiding channel 234 is located on the outer surface of each of the side walls 23. The two ends of the side walls 23 are respectively provided with a protrusion 233. The protrusions 233 are adjacent to the top wall 21 and the bottom wall 22, respectively. That is, the guiding channel 234, the guiding direction of the guiding channel 234 is parallel to the direction in which the opening of the receiving groove 28 is abutted, and the surface of the bottom wall 22 is provided with a plurality of protrusions 221 of a circular or rectangular structure, and the protrusions 221 can be Provides the effect of assembly fixation.
本案較佳實施例揭露中,請參閱圖式第2圖,該第一端子組3及該第二端子組4分別具有複數導電端子5及一定位件6,該些導電端子5分別包含一接觸部51、一焊接部53及連接該接觸部51與該焊接部53之一定位部52,各該端子組分別具有複數訊號端子55及至少一接地端子54,該些接地端子54之各該定位部52表面鍍上一層焊錫,各該訊號端子55可以用來傳送高頻電子訊號,各該接地端子54電性接地;各該定位件6分別以射出成形的方式包覆在該些導電端子5之各該定位部52,以形成該第一端子組3及該第二端子組4,該些定位件6為塑膠材料製成可與該些導電端子5絕緣,該些定位件6分別包含複數缺口61、複數突起62及複數止退結構63,該些缺口61露出部分該些導電端子5,該些止退結構63設於至少一定位件6之外表面,該第一端子組3之該些突起62與該第二端子組4之該些突起62相向延伸且垂 直各該定位件6表面,該第一端子組3之該定位件6形狀與該第二端子組4之該定位件6形狀互相匹配,且匹配時該些突起62交錯排列,可使該第一端子組3與該第二端子組4互相組合。 In the preferred embodiment of the present invention, referring to FIG. 2, the first terminal group 3 and the second terminal group 4 respectively have a plurality of conductive terminals 5 and a positioning member 6, and the conductive terminals 5 respectively comprise a contact. a portion 51, a soldering portion 53 and a positioning portion 52 connecting the contact portion 51 and the soldering portion 53. Each of the terminal groups has a plurality of signal terminals 55 and at least one grounding terminal 54, respectively, and the positioning of the grounding terminals 54 The surface of the portion 52 is plated with a layer of solder, and each of the signal terminals 55 can be used to transmit high-frequency electronic signals, and the grounding terminals 54 are electrically grounded; and the positioning members 6 are respectively coated on the conductive terminals 5 by injection molding. Each of the positioning portions 52 is formed to form the first terminal group 3 and the second terminal group 4, and the positioning members 6 are made of a plastic material and can be insulated from the conductive terminals 5. The positioning members 6 respectively include a plurality of a notch 61, a plurality of protrusions 62 and a plurality of non-returning structures 63, the notches 61 exposing a portion of the conductive terminals 5, wherein the non-returning structures 63 are disposed on the outer surface of the at least one positioning member 6, the first terminal group 3 The protrusions 62 are opposite to the protrusions 62 of the second terminal group 4 Extending and hanging Straight to the surface of the positioning member 6, the shape of the positioning member 6 of the first terminal group 3 and the shape of the positioning member 6 of the second terminal group 4 are matched with each other, and the protrusions 62 are staggered when matched, so that the first A terminal group 3 and the second terminal group 4 are combined with each other.
該第一端子組3及該第二端子組4分別具有至少一對相鄰的該些訊號端子55形成一差動訊號端子對(differential signal pair),藉由該差動訊號端子對傳送差動電子訊號,且該差動訊號端子對兩外側分別相鄰一接地端子54形成:接地端子-訊號端子-訊號端子-接地端子(G-S-S-G)的排列方式,其中該差動訊號端子對兩側相鄰之各該接地端子54可將該差動訊號端子傳遞的高頻差動訊號(differential signal)時所產生的干擾及雜訊接地,可有效降低該差動訊號端子對傳遞高頻訊號時對於其他該些訊號端子的干擾。 The first terminal group 3 and the second terminal group 4 respectively have at least one pair of adjacent signal terminals 55 forming a differential signal pair, and the differential signal terminal transmits differential An electronic signal, and the differential signal terminal is formed by a ground terminal 54 adjacent to the two outer sides: a ground terminal-signal terminal-signal terminal-ground terminal (GSSG) arrangement, wherein the differential signal terminal is adjacent to both sides Each of the ground terminals 54 can ground the interference and the noise generated by the differential signal transmitted by the differential signal terminal, thereby effectively reducing the differential signal terminal to transmit the high frequency signal to other The interference of these signal terminals.
該些定位件6之各該缺口61分別露出該些導電端子5之該些訊號端子55及該些接地端子54,使該些訊號端子55及該些接地端子4與空氣接觸,由於空氣的介電系數小於該些定位件6的介電系數,當傳遞高頻訊號時,該些訊號端子55部分裸露在空氣中可降低被該些定位件6影響的因素,藉以調整該些訊號端子55的阻抗值,使該些訊號端子55具有較佳之高頻特性。 Each of the notches 61 of the positioning members 6 respectively exposes the signal terminals 55 of the conductive terminals 5 and the ground terminals 54 to make the signal terminals 55 and the ground terminals 4 contact with air due to the introduction of air. The electrical coefficient is smaller than the dielectric constant of the positioning members 6. When the high frequency signal is transmitted, the portions of the signal terminals 55 are exposed to the air to reduce the factors affected by the positioning members 6, thereby adjusting the signal terminals 55. The impedance values cause the signal terminals 55 to have better high frequency characteristics.
本案較佳實施例揭露中,請參閱圖式第2圖該屏蔽板7為導電材料製造而成,且於該屏蔽板7表面鍍上一層焊錫,該屏蔽板7拗折成具有一對平板71、一連接板72及複數接觸臂73,該連接板72兩側各延伸一平板71,各該平板71分別由複數個子平板711所組成,各該子平板711分別與該連接板72呈垂直夾角,且各該子平板711表面設有一孔洞712貫穿,該些接觸臂73由該連接板72兩側延伸且夾於該些子平板711之間,該些接觸臂73具 有彈性,且該屏蔽板可以使用沖壓、裁切、彎折等工法產生。 In the preferred embodiment of the present invention, referring to FIG. 2, the shielding plate 7 is made of a conductive material, and a surface of the shielding plate 7 is plated with a layer of solder, and the shielding plate 7 is folded into a pair of flat plates 71. a connecting plate 72 and a plurality of contact arms 73. Each of the connecting plates 72 extends a flat plate 71. Each of the flat plates 71 is composed of a plurality of sub-panels 711, and each of the sub-flat plates 711 is perpendicular to the connecting plate 72. And a hole 712 is formed in the surface of each of the sub-plates 711. The contact arms 73 extend from the two sides of the connecting plate 72 and are sandwiched between the sub-plates 711. The contact arms 73 have It is flexible, and the shield can be produced by stamping, cutting, bending, and the like.
塑膠材料射出成形為一絕緣子8,該絕緣子8夾設於該屏蔽板7之一對平板71間,該絕緣子8上相對兩表面設有複數卡合件81、複數貫穿孔82及複數凹陷部83,該些貫穿孔83與該些凹陷部83交錯設置,該些卡合件81扣合於各該子平板711對應之各該孔洞712,使該絕緣子8固定於該屏蔽板7,且各該子平板711分別夾持於該絕緣子8之相對表面,各該子平板711之該些孔洞712與該絕緣子8相對應之該些貫穿孔82重合,該屏蔽板7之該些接觸臂73夾持於對應之各該凹陷部83,該些接觸臂73具有彈性彎折,且該些凹陷部83可提供緩衝空間收容部分之該些接觸臂73。 The plastic material is injection-molded into an insulator 8. The insulator 8 is interposed between the pair of plates 71 of the shielding plate 7. The opposite sides of the insulator 8 are provided with a plurality of engaging members 81, a plurality of through holes 82 and a plurality of recessed portions 83. The through holes 83 are interlaced with the recessed portions 83, and the engaging members 81 are fastened to the corresponding holes 712 of the sub-plates 711 to fix the insulator 8 to the shielding plate 7, and each of the holes The sub-plates 711 are respectively clamped on the opposite surfaces of the insulators 8. The holes 712 of the sub-plates 711 are overlapped with the through holes 82 corresponding to the insulators 8. The contact arms 73 of the shielding plate 7 are clamped. The contact arms 73 have elastic bending portions corresponding to the respective recessed portions 83, and the recessed portions 83 can provide the contact arms 73 of the buffer space receiving portion.
本創作較佳實施例揭露中,請參閱圖式第2圖,該遮蔽殼體9為金屬薄板所形成,該遮蔽殼體9包含一頂板91及一對側板92,該頂板91相對兩側分別延伸出該側板92,各該側板92同向延伸形成一收容空間93,該頂板91設有一接合部911,該接合部911由該頂板91遠離該收容空間93凸起形成,且該接合部911上設有複數對接孔912用以固定一對接裝置(圖未揭示),該接合部911延伸出一覆蓋部913,各該側板92之一邊緣設有一凹槽921,與該些凹槽921相對另一邊緣延伸出一耳扣922,各該耳扣922之一側邊延伸出一扣合元件(圖未標示),各該側板92延伸出該耳扣922處設有一保護結構923,該些保護結構923為各該側板92往該收容空間93延伸之凸起,該些保護結構923可有效保護並防止該絕緣殼體2受損,且各該側板92於再一邊緣延伸出複數接腳924。 In the preferred embodiment of the present invention, referring to FIG. 2, the shielding shell 9 is formed by a thin metal plate. The shielding shell 9 includes a top plate 91 and a pair of side plates 92. The side plate 92 extends from the same side to form a receiving space 93. The top plate 91 is provided with a joint portion 911. The joint portion 911 is formed by the top plate 91 protruding away from the receiving space 93, and the joint portion 911 is formed. A plurality of mating holes 912 are defined for fixing a pair of connecting devices (not shown). The engaging portion 911 extends from a covering portion 913. One edge of each of the side plates 92 is provided with a groove 921 opposite to the grooves 921. The other end of the ear button 922 has a fastening component (not shown), and each of the side panels 92 extends from the earloop 922 to provide a protection structure 923. The protective structure 923 is a protrusion extending from the side plate 92 to the receiving space 93. The protective structure 923 can effectively protect and prevent the insulating case 2 from being damaged, and each of the side plates 92 extends beyond the edge to form a plurality of pins. 924.
本創作較佳實施例揭露中,請參閱圖式第4-6圖,圖示第5圖為圖式第4圖之A-A剖面圖、圖示第6圖為圖式第4圖之B-B剖面圖,該第 一端子組3與該第二端子組4該些定位件6之各該突起62分別組裝於該屏蔽板7與該絕緣子8重合之各該孔洞712與各該貫穿孔82中,藉由該些突起62將該絕緣子8與該屏蔽板7安裝於該第一端子組3與該第二端子組4之間,該屏蔽板7之各該平板71分別鄰近該第一端子組3及該第二端子組4,該屏蔽板7之各該接觸臂73分別朝向第一端子組3及該第二端子組4之各該接地端子54延伸,該些接觸臂73藉由各該定位件6上之各該缺口61與該些接地端子54之各該定位部52接觸並電性連接,該屏蔽板7電性連接每一接地端子54,故每一接地端子54藉由該屏蔽板7電性彼此連接,當其中一接地端子54接收到大量信號干擾時,可藉由該屏蔽板7將干擾訊號傳輸到其他接地端子54,迅速的將雜訊接地,以避免傳遞高頻訊號時該些訊號端子55之間彼此干擾,提高訊號傳輸的品質。 In the preferred embodiment of the present invention, please refer to FIG. 4-6. FIG. 5 is a cross-sectional view taken along line AA of FIG. 4, and FIG. 6 is a cross-sectional view taken along line BB of FIG. , the first Each of the protrusions 62 of the positioning member 6 of the first terminal group 3 and the second terminal group 4 are respectively assembled in the holes 712 and the through holes 82 of the shielding plate 7 and the insulator 8 by the plurality of holes The protrusions 62 are mounted between the first terminal group 3 and the second terminal group 4, and the flat plates 71 of the shielding plate 7 are adjacent to the first terminal group 3 and the second Each of the contact arms 73 of the shielding plate 7 extends toward the grounding terminal 54 of the first terminal group 3 and the second terminal group 4, and the contact arms 73 are respectively disposed on the positioning members 6 Each of the grounding portions 61 is electrically connected to each of the grounding portions 54 of the grounding terminals 54. The shielding plate 7 is electrically connected to each of the grounding terminals 54. Therefore, each of the grounding terminals 54 is electrically connected to each other by the shielding plate 7. When a ground terminal 54 receives a large amount of signal interference, the interference signal can be transmitted to the other ground terminal 54 by the shielding plate 7, and the noise is quickly grounded to avoid the signal terminals when the high frequency signal is transmitted. 55 interfere with each other to improve the quality of signal transmission.
該第一端子組3與該第二端子組4各別具有排列為一排之該些導電端子5,該第一端子組3之該些導電端子5之各該接觸部51可以被排列於接近該絕緣殼體2之該收納槽28的一表面,該第二端子組4之該些導電端子5之各該接觸部51可以被排列於接近該絕緣殼體2之該收納槽28的另一相對表面,該些端子組分別由後向前組裝至該絕緣殼體2,各該導電端子5接觸部51分別延伸進入該收納槽28之各該端子槽24,且該接觸部51前端抵接於相對應之該些承板25,且該些接觸部51相向延伸於該絕緣殼體2之該收納槽28中,該些焊接部53分別延伸出該絕緣殼體2外;該些定位件6之該些止退結構63固定於該絕緣殼體2之各該止退孔211,使該第一端子組3及該第二端子組4之各該定位件6被固定於該絕緣殼體2內的一定位,該第一端子組3及該第二端子組4中的各該導電端子5被間接定位於該絕緣殼體2,且各該導 電端子5之該些定位部52至少被相對固定於該絕緣殼體2的一位置。 The first terminal group 3 and the second terminal group 4 respectively have the conductive terminals 5 arranged in a row, and the contact portions 51 of the conductive terminals 5 of the first terminal group 3 can be arranged close to each other. a contact surface 51 of the conductive terminals 5 of the second terminal group 4 may be arranged on the surface of the receiving groove 28 of the insulating housing 2 The terminal groups of the conductive terminals 5 extend into the terminal slots 24 of the receiving slots 28, and the front ends of the contact portions 51 abut. Corresponding to the plurality of receiving plates 25, wherein the contact portions 51 extend in the receiving groove 28 of the insulating housing 2, the soldering portions 53 respectively extend out of the insulating housing 2; The retaining structures 63 are fixed to the respective recessed holes 211 of the insulating housing 2, so that the positioning members 6 of the first terminal set 3 and the second terminal set 4 are fixed to the insulating housing. A positioning in the second terminal group 3 and each of the second terminal group 4 are indirectly positioned in the insulating housing 2 And each of the guides The positioning portions 52 of the electrical terminals 5 are at least relatively fixed to a position of the insulative housing 2.
每一導電端子5之該接觸部51前端施加一力量於該承板25上,各該接觸部51前端受制於於該承板25,故該些接觸部51只能朝該承板25反向彈性變形,使該些接觸部51未與該對接裝置插接時即受到該些承板25提供之一預應力(pre-load),當該連接器1與該對接裝置插接時各該導電端子5之該些接觸部51即可輸出較大之一正向力,使該些導電端子5的訊號傳輸更為穩定。 A front end of the contact portion 51 of each of the conductive terminals 5 applies a force to the carrier 25, and the front end of each of the contact portions 51 is restrained by the carrier 25, so that the contact portions 51 can only be reversed toward the carrier 25. The elastic deformation causes the contact portions 51 to be pre-loaded by the plurality of receiving plates 25 when the connecting portions 51 are not inserted into the docking device, and each of the conductive members 1 is electrically connected when the connector 1 is inserted into the docking device. The contact portions 51 of the terminal 5 can output a larger positive force, so that the signal transmission of the conductive terminals 5 is more stable.
本創作較佳實施例揭露中,請參閱圖式第1圖,該遮蔽殼體9之該些側板91延伸之各該耳扣922分別扣合該絕緣殼體2之該些側壁23之各該凸部231,各該耳扣922沿著各該引導通道234準確地接觸各該凸部231,藉由該些凸部231之各該斜面232引導,將各該耳扣922套設於各該凸部231,該些耳扣922一邊緣延伸之各該扣合元件(圖未揭示)固定於該絕緣殼體2之該底壁22上之該些凸柱221,該遮蔽殼體9之各該保護結構923設置於該絕緣殼體2之該收納槽28開口處且鄰近各該側壁23表面,該些保護結構923可用於引導該對接裝置之一舌板(圖未揭示)的插接方向,使該舌板能順利插入該絕緣殼體2之收納槽28,其中該舌板可為一電路板,該些保護結構923可有效防止該舌板刮傷該絕緣殼體2,增加該連接器1的使用壽命,該遮蔽殼體9之該接合部911延伸之該覆蓋部913貼合於該絕緣殼體2之該頂壁21並抵接該頂壁21上之該段差27,且該遮蔽殼體9形成之該收容空間93與該絕緣殼體2之該收納槽28互向連通;本發明之範圍不以該遮蔽殼體9為限,可由該絕緣殼體2、該第一端子組3、該第二端子組4、該屏蔽板7及該絕緣子8組合而形成另一實施例。 In the preferred embodiment of the present invention, referring to FIG. 1 , each of the ear straps 922 extending from the side plates 91 of the shielding shell 9 respectively engages the sidewalls 23 of the insulating housing 2 . The convex portion 231, each of the ear buckles 922 accurately contacts each of the convex portions 231 along the guiding passages 234, and is guided by the inclined surfaces 232 of the convex portions 231, and each of the ear buckles 922 is sleeved on each of the convex portions 231. The protrusions 231 are fixed to the bottom pillars 22 of the insulating housing 2 by the fastening elements (not shown) extending from the edge of the ear button 922, and the shielding shells 9 are respectively The protective structure 923 is disposed at the opening of the receiving slot 28 of the insulating housing 2 and adjacent to the surface of each of the side walls 23. The protective structures 923 can be used to guide the insertion direction of one of the docking devices (not shown). The tongue plate can be smoothly inserted into the receiving groove 28 of the insulating case 2, wherein the tongue plate can be a circuit board, and the protective structures 923 can effectively prevent the tongue plate from scratching the insulating case 2, thereby increasing the connection. The cover portion 913 extending from the joint portion 911 of the shield shell 9 is attached to the top wall 21 of the insulating housing 2 Abutting the step 27 on the top wall 21, and the receiving space 93 formed by the shielding shell 9 communicates with the receiving groove 28 of the insulating housing 2; the scope of the invention is not the shielding shell 9 Alternatively, another embodiment can be formed by combining the insulating housing 2, the first terminal set 3, the second terminal set 4, the shielding plate 7, and the insulator 8.
該連接器1組裝完成後再經過加熱的方式,如使用迴流焊(Reflow Soldering)的製程,將該連接器1固定於該電路基板(圖未揭示),該電路基板上具有複數焊點(圖未揭示),該焊點上塗設有焊錫,該連接器1之該些導電端子5之各該焊接部53分別對位排列於相對應之各該焊點上,焊接時溫度上升到焊錫熔融的狀態,該焊錫填充該些焊接部53及該些焊點之接合表面,待溫度下降後使該焊錫將該連接器1之該些焊接部53固定於該電路基板之各該焊點並彼此電性連接;由於在加熱的過程中該連接器1整體溫度也隨著上升,該屏蔽板7之各該接觸臂73與該些接地端子54之各該定位部52相互接觸表面之焊錫形成熔融狀態並互相接合,使該屏蔽板7至少一接觸臂73焊接於該第一端子組3或該第二端子組4之一接地端子54之該定位部52,待冷卻後該屏蔽板7之各該接觸臂73與該些接地端子54之各該定位部52藉由焊錫互相焊接固定並提升電性連接特性,故該屏蔽板7是透過該第一端子組3及該第二端子組4中的接地端子54及該定位件6而被固定於該絕緣殼體2的一定位;藉由加熱到冷卻的過程同時完成將該連接器1固定於該電路基板,以及將該些接觸臂73焊接於各該接地端子54,有效簡化製程步驟,提升生產效率。 After the connector 1 is assembled and then heated, such as using a reflow soldering process, the connector 1 is fixed to the circuit substrate (not shown), and the circuit substrate has a plurality of solder joints (Fig. It is not disclosed that the solder joint is coated with solder, and the soldering portions 53 of the conductive terminals 5 of the connector 1 are respectively aligned and aligned on the corresponding solder joints, and the temperature rises to solder melting during soldering. a state in which the solder fills the bonding portions of the soldering portions 53 and the solder joints, and after the temperature is lowered, the solders are fixed to the solder joints of the circuit board 1 and electrically connected to each other. The soldering state of the contact surface of the contact arm 73 of the shielding plate 7 and the positioning portions 52 of the grounding terminals 54 is molten, as the whole temperature of the connector 1 is also increased. And engaging each other, so that at least one contact arm 73 of the shielding plate 7 is soldered to the positioning portion 52 of the ground terminal 54 of the first terminal group 3 or the second terminal group 4, and the shielding plate 7 is to be cooled. Contact arm 73 and each of the ground terminals 54 The positioning portion 52 is soldered and fixed to each other and the electrical connection characteristics are improved. Therefore, the shielding plate 7 is fixed through the ground terminal 54 and the positioning member 6 in the first terminal group 3 and the second terminal group 4. Positioning the insulating housing 2; fixing the connector 1 to the circuit substrate by heating to the cooling process, and soldering the contact arms 73 to the grounding terminals 54, thereby simplifying the process steps. Improve production efficiency.
本創作較佳實施例揭露中,請參閱圖式第7圖,該第一端子組3與該第二端子組4之該些接地端子54之各該定位部52分別與該屏蔽板7之該些接觸臂73接觸並電性連接,該些接觸臂73提供一彈力於各該接地端子54,該些接地端子54亦提供一反作用力於各該接觸臂73,各該接地端子54與各該接觸臂73接觸之表面形成一接觸面,然而物理性接觸所提供的電性連接效果會因為該接觸面平整度不均,或是接觸角度偏差,造成接觸面 積大小差異而有不同之阻抗,甚至會有接觸不良的狀況存在,為了克服此一問題並提升接地效果及穩定性,該些接地端子54與該些屏蔽板7於組裝前分別鍍上一層焊錫,其中鍍焊錫的製程不限定於電鍍、蒸鍍或濺鍍(spatter)等方法,當該些接地端子54與該些接觸臂73組裝且互相接觸時再經過一道加熱的過程,將該些接地端子54與該些接觸臂73之間的該焊錫熔融後填充於該接觸表面,待冷卻後該些接地端子54與該些接觸臂73藉由該焊錫連接,有效提升電性連接特性,排除接觸不良的疑慮。 In the preferred embodiment of the present invention, referring to FIG. 7 , each of the positioning portions 52 of the first terminal group 3 and the ground terminals 54 of the second terminal group 4 and the shielding plate 7 respectively The contact arms 73 are in contact with each other and electrically connected. The contact arms 73 provide an elastic force to the ground terminals 54. The ground terminals 54 also provide a reaction force to the contact arms 73, and the ground terminals 54 and the respective ground terminals 54 The contact surface of the contact arm 73 forms a contact surface, but the electrical connection provided by the physical contact may result in unevenness of the contact surface or a deviation of the contact angle, resulting in a contact surface. In order to overcome this problem and improve the grounding effect and stability, the grounding terminals 54 and the shielding plates 7 are respectively coated with a layer of solder before assembly. The process of plating the solder is not limited to the methods of electroplating, evaporation, or sputtering. When the grounding terminals 54 are assembled with the contact arms 73 and are in contact with each other, a heating process is performed to ground the grounding terminals 54. The solder between the terminal 54 and the contact arms 73 is melted and filled on the contact surface. After being cooled, the ground terminals 54 and the contact arms 73 are connected by the solder, thereby effectively improving the electrical connection characteristics and eliminating the contact. Bad doubts.
相較於先前技術,本創作結合焊接的概念設計出一種較佳且適用於該連接器1內部之導電端子5的電性連接技術,將各該接地端子54及屏蔽板73鍍上一層焊錫,藉由將該連接器1焊接於該電路基板的加熱過程,同步將該屏蔽板7之該些接觸臂73焊接於各該接地端子54,可有效排除該些接觸臂73施加一正向力於各該接地端子54電性連接時可能產生接觸不良之情形,以發揮該屏蔽板7連接各該接地端子54所提供的接地效果,可避免該連接器1傳輸高頻訊號時的干擾問題,提升訊號傳輸效率。 Compared with the prior art, the present invention combines the concept of soldering to design a preferred electrical connection technology for the conductive terminals 5 inside the connector 1. Each of the grounding terminals 54 and the shielding plate 73 is plated with a layer of solder. By soldering the connector 1 to the circuit substrate, the contact arms 73 of the shield plate 7 are synchronously soldered to the ground terminals 54 to effectively eliminate the application of a positive force to the contact arms 73. When the grounding terminals 54 are electrically connected, a contact failure may occur, so as to provide a grounding effect provided by the shielding plate 7 connecting the grounding terminals 54, thereby avoiding interference problems when the connector 1 transmits high-frequency signals, and improving Signal transmission efficiency.
由以上詳細說明,可使熟知本項技藝者明瞭本創作的確可達成前述目的,實已符合專利法之規定,爰提出專利申請。惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍;故凡依本創作申請專利範圍及創作說明書內容所作之簡單的等效變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。 From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the aforementioned objectives, and has been in compliance with the provisions of the Patent Law, and has filed a patent application. However, the above descriptions are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited thereto; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent.
21‧‧‧頂壁 21‧‧‧ top wall
22‧‧‧底壁 22‧‧‧ bottom wall
221‧‧‧凸柱 221‧‧‧Bump
25‧‧‧承板 25‧‧‧ board
28‧‧‧收納槽 28‧‧‧ Storage trough
29‧‧‧間隔板 29‧‧‧ Spacer
51‧‧‧接觸部 51‧‧‧Contacts
52‧‧‧定位部 52‧‧‧ Positioning Department
53‧‧‧焊接部 53‧‧‧Welding Department
72‧‧‧連接板 72‧‧‧Connecting plate
73‧‧‧接觸臂 73‧‧‧Contact arm
Claims (12)
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TW106200446U TWM549470U (en) | 2017-01-09 | 2017-01-09 | A high frequency connector |
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TW106200446U TWM549470U (en) | 2017-01-09 | 2017-01-09 | A high frequency connector |
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TWM549470U true TWM549470U (en) | 2017-09-21 |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI823997B (en) * | 2018-08-28 | 2023-12-01 | 英屬開曼群島商鴻騰精密科技股份有限公司 | Card edge connector |
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2017
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI823997B (en) * | 2018-08-28 | 2023-12-01 | 英屬開曼群島商鴻騰精密科技股份有限公司 | Card edge connector |
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