TWM547225U - Circuit board - Google Patents

Abstract

A circuit board includes a substrate and a first solderable area. The substrate has a first surface, a second surface and a plurality of through holes. The first surface and the second surface are opposite to each other. The through holes are formed through the first surface and the second surface. The first solderable area is disposed on the first surface. The first solderable area has a plurality of first recesses. At least one of the through holes is located in one of the first recesses. The invention may plug a side of the through hole, which is not overlapped with the solderable area, by an ink plug, so as to solve the problem of solder leaking. When a shielding case is soldered onto the circuit board, the shielding case can be soldered by the solder completely, so as to ensure shielding effect.

Description

Circuit board

The present invention relates to a circuit board, and more particularly to a circuit board in which a through hole is located in a recess of a solderable area.

Generally, the circuit board is composed of a multi-layer conductive copper plate and an insulating plate, wherein each layer of the conductive copper plate has its own conductive line, and the insulating plate isolates the adjacent two conductive copper plates. In addition, the circuit board has a plurality of through holes for electrically connecting the conductive lines of the plurality of conductive copper plates. In order to prevent the problem of tin leakage in the through holes, the prior art usually seals the through holes with an ink stopper or a resin plug. If the through hole is sealed by the ink plug, the ink will remain around the opening of the through hole. When the shield frame is soldered to the circuit board, the solder resist effect of the ink may cause poor soldering of the shield frame and the circuit board, so that the shield frame and the circuit There is a gap between the plates, which in turn loses the shielding effect. If the through hole is sealed with a resin plug, the manufacturing cost of the board is increased.

The present invention provides a circuit board in which the through holes are located in the recesses of the solderable area to solve the above problems.

According to an embodiment, the circuit board of the present invention includes a substrate and a first solderable area. The substrate has a first surface, a second surface, and a plurality of through holes. The first surface and the second surface are opposite each other. The through hole penetrates the first surface and the second surface. The first solderable area is disposed on the first surface. The first solderable area has a plurality of first grooves. At least one of the through holes is located in one of the first grooves.

According to another embodiment, the circuit board of the present invention includes a substrate, a first solderable area, and a second solderable area. The substrate has a first surface, a second surface, and a plurality of through holes. The first surface and the second surface are opposite each other. The through hole penetrates the first surface and the second surface. The first solderable area is disposed on the first surface. The first solderable area has a plurality of first grooves. The second solderable area is disposed on the second surface. The second solderable area has a plurality of second grooves. One side of a first portion of the plurality of through holes is located in one of the plurality of first grooves, and the other side is located in the second solderable area. One side of a second portion of the plurality of through holes is located in one of the plurality of second grooves, and the other side is located in the first solderable area.

In summary, the present invention makes the through hole in the groove of the solderable area on one side of the circuit board, so that one side of the through hole overlaps with the solderable area, and the other side of the through hole does not overlap with the solderable area. . The creation can seal the through hole with an ink plug on the side of the through hole that is not overlapped with the solderable area, thereby solving the problem of leakage of tin. When the shield frame is soldered to the board, the solder can completely solder the shield frame to ensure shielding. Since no resin plug is required, this creation can effectively reduce the manufacturing cost of the board.

The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic plan view of a circuit board 1 according to an embodiment of the present invention, and FIG. 2 is a bottom view of the circuit board 1 in FIG. 1 .

In this specification, a solderable area (SMT pad, or copper pad) refers to a position on the surface of the board that is not coated with a solder mask due to metal exposure, solder or solder paste. It can usually be attached to the solderable area; the surface of the board is painted with solder resist, and solder or solder paste is usually not attached because there is no metal exposure.

As shown in FIGS. 1 and 2, the circuit board 1 includes a substrate 10, a first solderable region 12, and a second solderable region 14. The substrate 10 may be formed by laminating a plurality of conductive copper plates and an insulating plate, wherein each of the conductive copper plates has a respective conductive line, and the insulating plate isolates the adjacent two conductive copper plates. The substrate 10 has a first surface 100, a second surface 102, and a plurality of through holes 104, wherein the first surface 100 and the second surface 102 face away from each other. The through hole 104 penetrates the first surface 100 and the second surface 102 to electrically connect the conductive lines of the multilayer conductive copper plate.

As shown in FIG. 1, the first solderable region 12 is disposed on the first surface 100 of the substrate 10. The first weldable region 12 on the first surface 100 and other locations other than the weldable regions not shown may be covered by the solder resist. The first solderable region 12 has a plurality of first recesses 120 such that at least one of the vias 104 is located in one of the first recesses 120. In the present embodiment, the depth D1 of the first groove 120 may be less than or equal to one third of the width W1 of the first solderable region 12.

As shown in FIG. 2, the second solderable region 14 is disposed on the second surface 102 of the substrate 10. The second solderable area 14 on the second surface 102 and other locations other than the solderable areas not shown may be covered by the solder resist. The second solderable region 14 has a plurality of second recesses 140 such that at least one of the through holes 104 is located in one of the second recesses 140. In the present embodiment, the depth D2 of the second groove 140 may be less than or equal to one third of the width W2 of the second solderable region 14.

In this embodiment, the first groove 120 of the first solderable region 12 and the second groove 140 of the second solderable region 14 are alternately disposed such that each of the through holes 104 is located at a first portion of the first solderable region 12. A recess 120 is in one of the second recesses 140 of the second solderable region 14. In other words, either side of a first portion of the plurality of vias 104 is located in one of the plurality of first recesses 120 of the first solderable region 12 and the other side is located in the second solderable region 14; one side of a second portion of the plurality of through holes 104 is located in one of the plurality of second grooves 140 of the second solderable region 14, and the other side is located in the first solderable region 12 in. Therefore, one side of any one of the through holes 104 is located in the solderable area, and the other side is located outside the solderable area. Further, when one side of a through hole 104 is located in the first solderable area 12, the other side of the through hole 104 is located in a second groove 140 of the second solderable area 14; when the other through hole 104 is When one side is located in the second solderable area 14, the other side of the through hole 104 is located in a first recess 120 of the first solderable area 12. Therefore, one side of the through hole 104 overlaps with the solderable area, and the other side of the through hole 104 does not overlap with the solderable area.

In this embodiment, only a single through hole 104 is revealed in the single first groove 120 or the second groove 140. However, in other embodiments, the present invention may also have more than two through holes 104 in the same first groove 120 or second groove 140.

In this embodiment, the present invention can seal the through hole with the ink plug 16 on the side where the through hole 104 does not overlap the solderable area, and the other side of the through hole 104 overlapping the solderable area does not seal the through hole. Holes, and then solve the problem of leakage of tin. Further, any one of the first portions of the plurality of through holes 104 is filled with an ink plug 16 on one side of the first surface 100; and any one of the second portions of the plurality of through holes 104 is located on the second surface 102. An ink plug 16 is filled on one side. Since the through hole 104 is located in a first groove 120 of the first solderable region 12 or a second groove 140 of the second solderable region 14 is sealed by the ink plug 16, the shielding frame is not displayed (not shown) When soldered to the circuit board 1, the solder can completely solder the shield frame to ensure the shielding effect. Since no resin plug is required, the present invention can effectively reduce the manufacturing cost of the circuit board 1.

Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a schematic top view of the circuit board 1 ′ according to another embodiment of the present invention, and FIG. 4 is a bottom view of the circuit board 1 ′ in FIG. 3 . The main difference between the circuit board 1' and the above-described circuit board 1 is that the second solderable area 14 of the circuit board 1' does not have the second recess 140 described above. In the present embodiment, one side of each of the through holes 104 is located in one of the first grooves 120 of the first solderable area 12. In other words, one side of any through hole 104 is located in the second solderable area 14, and the other side of the through hole 104 is located in a first groove 120 of the first solderable area 12, as shown in FIG. 3 and Figure 4 shows. In the present embodiment, any one of the plurality of through holes 104 is located on one side of the first surface 100 with an ink plug 16 filled, and the other side of the second surface 102 is filled with no ink plug.

Please refer to FIG. 5 and FIG. 6. FIG. 5 is a top plan view of a circuit board 1 ′′ according to another embodiment of the present invention, and FIG. 6 is a bottom view of the circuit board 1 ′′ in FIG. 5 . The main difference between the circuit board 1'' and the above-mentioned circuit board 1 is that the first recesses 120 of the circuit board 1" are alternately located on opposite sides of the first solderable area 12, and the circuit board 1" The second grooves 140 are alternately located on opposite sides of the second solderable region 14, as shown in FIGS. 5 and 6. In addition, the first solderable area 12 and the second solderable area 14 define a center line C, wherein the through holes 104 are located on opposite sides of the center line C. In this embodiment, any two adjacent first grooves 120 do not overlap in the direction of the vertical center line C, and any two adjacent second grooves 140 do not overlap in the direction of the vertical center line C. Thereby, when the shield frame (not shown) is soldered to the circuit board 1", the solder can completely solder the shield frame, thereby ensuring the shielding effect. The center line C may be a position where the bottom edge of a shield frame is welded to the solderable region 12 or the solderable region 14.

The circuit boards of the above embodiments may include other solderable regions and via holes not shown in the drawings. These solderable regions and via holes may not be configured according to the rules of the foregoing embodiments. For example, the solderable area and the through hole which are not directly related to the welded shield frame are not required to be configured according to the rules of the foregoing embodiments.

In summary, the present invention makes the through hole in the groove of the solderable area on one side of the circuit board, so that one side of the through hole overlaps with the solderable area, and the other side of the through hole does not overlap with the solderable area. . The creation can seal the through hole with an ink plug on the side of the through hole that is not overlapped with the solderable area, thereby solving the problem of leakage of tin. When the shield frame is soldered to the board, the solder can completely solder the shield frame to ensure shielding. Since no resin plug is required, this creation can effectively reduce the manufacturing cost of the board.

The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.

1, 1', 1''‧‧‧ boards
10‧‧‧Substrate
12‧‧‧First solderable area
14‧‧‧Second solderable area
16‧‧‧Ink stopper
100‧‧‧ first surface
102‧‧‧ second surface
104‧‧‧through hole
120‧‧‧first groove
140‧‧‧second groove
C‧‧‧ center line
D1, D2‧‧ depth
W1, W2‧‧‧ width

FIG. 1 is a top plan view of a circuit board according to an embodiment of the present invention. Figure 2 is a bottom plan view of the circuit board in Figure 1. FIG. 3 is a top plan view of a circuit board according to another embodiment of the present invention. Figure 4 is a bottom plan view of the circuit board in Figure 3. Figure 5 is a top plan view of a circuit board of another embodiment of the present invention. Figure 6 is a bottom plan view of the circuit board in Figure 5.

1‧‧‧ boards

10‧‧‧Substrate

12‧‧‧First solderable area

16‧‧‧Ink stopper

100‧‧‧ first surface

104‧‧‧through hole

120‧‧‧first groove

D1‧‧ depth

W1‧‧‧Width

Claims (10)

A circuit board comprising: a substrate having a first surface, a second surface, and a plurality of through holes, the first surface and the second surface facing away from each other, the through hole penetrating the first surface and the second a surface; and a first solderable region disposed on the first surface, the first solderable region having a plurality of first recesses, at least one of the through holes being located in one of the first recesses in. The circuit board of claim 1, further comprising a second solderable region disposed on the second surface, the second solderable region having a plurality of second recesses, the first recess and the second The grooves are staggered, and one side of any of the through holes is located in one of the first groove and the second groove. The circuit board of claim 1, wherein a center line is defined in the first solderable area, the through hole is located on opposite sides of the center line, and the first groove is staggered in the first solderable area. Relative to the two sides, any two adjacent first grooves do not overlap in a direction perpendicular to the center line. The circuit board of claim 1, wherein the depth of the first groove is less than or equal to one third of a width of the first solderable area. The circuit board of claim 1, wherein any one of the plurality of through holes has an ink plug filling on one side of the first surface and no ink plug filling on the other side of the second surface. A circuit board comprising: a substrate having a first surface, a second surface, and a plurality of through holes, the first surface and the second surface facing away from each other, the through hole penetrating the first surface and the second a first solderable region disposed on the first surface, the first solderable region having a plurality of first recesses, and a second solderable region disposed on the second surface, the second The solderable area has a plurality of second grooves; wherein one side of a first portion of the plurality of through holes is located in one of the plurality of first grooves, and the other side is located in the second In the solderable region, one side of a second portion of the plurality of through holes is located in one of the plurality of second grooves, and the other side is located in the first solderable region. The circuit board of claim 6, wherein any one of the first portions of the plurality of through holes is filled with an ink plug on a side of the first surface; the second portion of the plurality of through holes Any one side of the second surface has an ink plug fill. The circuit board of claim 6, wherein the first groove and the second groove are staggered. The circuit board of claim 6, wherein a center line is defined between the first solderable area and the second solderable area, the through holes are located on opposite sides of the center line, and the first grooves are alternately located The two opposite sides of the first solderable area do not overlap in the direction perpendicular to the center line, and the second grooves are alternately located on opposite sides of the second solderable area. Any two adjacent second grooves do not overlap in a direction perpendicular to the center line. The circuit board of claim 6, wherein the depth of the first groove is less than or equal to one third of a width of the first solderable area, and the depth of the second groove is less than or equal to the second solderable One-third of the width of the area.