TWM545934U - Thermosyphon radiating plate and electronic device having the same - Google Patents

Abstract

This present invention discloses a thermosyphon radiating plate includes a first plate, a second plate and a working fluid. The first plate is partially pasted to the second plate to be formed a chamber between the first plate and the second plate. The working fluid is disposed in the chamber, and The working fluid is accumulated in the bottom of the chamber along the direction of gravity. When a heat source is pasted to the thermosyphon radiating plate, a heat of the heat source is transferred to the working fluid, and the working fluid absorbs the heat becomes a gaseous working fluid and rise up to the top of chamber. The gaseous working fluid is dissipated the heat in the top of chamber and changes back to the working fluid, and the working fluid is turn back to the bottom of the chamber along the direction of gravity.

Description

Siphon type heat sink and electronic device using the same

The present invention relates to a heat sink, and more particularly to a siphon type heat sink that can be used in an electronic device.

Today's electronic display devices, such as liquid crystal televisions or large screens, have a display panel and a heat source inside, and the heat source is a light-emitting element, a light bar or a light-emitting diode. When the light generated by the heat source enters the display panel, the display panel will generate an image. However, since the heat source continuously emits a large amount of heat energy, it is necessary to add a heat sink to the electronic display device to assist in heat dissipation to avoid the light-emitting element. Or other internal components are damaged by overheating.

The heat dissipating device of the conventional electronic display device attaches a heat sink or a heat conductive sheet to a heat source, and the electronic display device is provided with a heat dissipating region (for example, a vent of the TV casing), so that heat generated by the heat source passes through the heat sink or The heat conductive sheet is conducted to the heat dissipation area, and the heat energy is discharged to the outside from the heat dissipation area. The heat sink or the thermal pad itself of the prior art not only transmits heat energy to assist in heat removal, but also has a low heat dissipation function. If a large screen and a large amount of heat are generated, the heat dissipation efficiency cannot be improved. There are still areas for improvement in conventional technology.

In order to solve the problems of the prior art, the present invention provides a siphon type heat sink for use in an electronic display device. The siphonic heat sink of the present invention has heat conduction and heat dissipation. The function can absorb the heat generated by the heat source to conduct heat and directly dissipate heat to improve the heat dissipation efficiency, and can effectively achieve the heat dissipation effect when used on a large screen or a large number of heat sources.

In order to achieve the above object, a siphon type heat dissipation plate is provided, comprising: a first plate body having a first inner surface and a first outer surface; a second plate body having a second inner surface and a first a second outer surface facing the first inner surface and spaced apart from each other, the second plate portion conforming to the first plate body, and forming a first inner surface and the second inner surface a chamber comprising a top region and a bottom region; and a working fluid disposed in the chamber, and the working fluid accumulates in the bottom region along a gravity direction; wherein a heat source fits the siphon a heat sink that contacts the first outer surface or the second outer surface, and the heat source is disposed at a position corresponding to the bottom region of the chamber, the heat source generating a thermal energy through the first outer surface or the second outer The surface is transferred into the chamber, the working fluid absorbs the thermal energy, evaporates into a working fluid vapor and enters the top region, and the working fluid vapor dissipates the heat energy to the outside in the top region and then condenses back to the working fluid The work It was attached to the inner surface of the first surface and the second inner region and back to the bottom along a gravity direction.

Preferably, the siphon type heat dissipation plate comprises a boiling structure disposed in the bottom portion of the chamber and immersed in the working fluid, the boiling structure transferring the thermal energy to the bottom portion The working fluid causes the working fluid to absorb heat energy and evaporate into the working fluid vapor and enter the top region.

Preferably, the boiling structure contacts the first inner surface or the second inner surface, and the boiling structure may be selected from one of a metal foamed material body, a woven mesh, and a powder metallurgy structure.

Preferably, the heat source comprises a heat transfer surface, the heat transfer surface is attached to the first outer surface or the second outer surface, and the heat transfer surface is in a direction perpendicular to the gravity direction.

Preferably, the heat source further comprises a heat conducting substrate, the heat conducting substrate being attached to the first outer surface or the second outer surface.

Preferably, the bonding direction of the heat conducting substrate to the first outer surface or the second outer surface is perpendicular to the direction of gravity.

Preferably, the siphon type heat sink further comprises a heat dissipating component disposed on the first outer surface and/or the second outer surface and located in the top region corresponding to the chamber.

Preferably, the heat dissipating component is selected from one of a heat sink fin, a fan, and a heat pipe.

Preferably, the siphon type heat sink further includes a support structure disposed in the chamber, and the support structure connects the first inner surface and the second inner surface.

Preferably, the support structure extends from the second inner surface toward the first inner surface and connects the first inner surface.

Preferably, the support structure is a wave plate disposed in the chamber and connecting the first inner surface and the second inner surface.

Preferably, the first plate body and the second plate body are made of different materials, and the material of the first plate body and the second plate body may be selected from one of copper, aluminum and stainless steel.

Preferably, the heat source is a light source, and the light source may be selected from one of a light emitting diode, a light bar and a light bulb.

Preferably, the working fluid is disposed in the chamber and occupies 50% to 98% of the total volume of the chamber.

In order to achieve the goal, a display device includes: a display panel; a siphon-type heat sink adjacent to the display panel, the siphon-type heat sink includes: a first inner surface and a second inner surface, the first The inner surface faces the second inner surface and is spaced apart from each other, and a cavity is formed between the first inner surface and the second inner surface, the chamber includes a top region and a bottom region; a working fluid is disposed on the In the chamber, and the working fluid accumulates in the bottom region along a gravity direction; a heat source is disposed between the display panel and the siphon type heat sink, the heat source is attached to the siphon type heat sink and the chamber is In the bottom region, the heat source generates a light and a heat energy; wherein the light enters the display panel, the display panel receives the light and generates an image, and the heat is transmitted through the siphon type heat sink to the chamber, so that The working fluid absorbs the thermal energy and evaporates into a working fluid vapor and enters the top region, and the working fluid vapor dissipates the heat energy to the outside in the top region and then condenses back to the work. The working fluid is attached to the first inner surface and back into the bottom region of the second inner surface along a gravity direction.

Preferably, the siphon type heat sink is disposed in a direction parallel to the display panel.

Preferably, the siphon type heat dissipation plate comprises a boiling structure disposed in the bottom portion of the chamber and immersed in the working fluid, the boiling structure transferring the thermal energy to the bottom portion The working fluid causes the working fluid to absorb heat energy and evaporate into the working fluid vapor and enter the top region.

Preferably, the boiling structure contacts the first inner surface or the second inner surface, and the boiling structure may be selected from the group consisting of a metal foamed material body, a woven mesh, and a powder metallurgy structure. One

Preferably, the siphon type heat dissipation plate includes a first outer surface and a second outer surface, the heat source is attached to the first outer surface or the second outer surface, and the thermal energy passes through the first outer surface or the The second outer surface is transferred into the chamber.

Preferably, the siphon type heat sink further comprises a heat dissipating component disposed on the first outer surface and/or a second outer surface and corresponding to the top region of the chamber.

Preferably, the heat dissipating component is selected from one of a heat sink fin, a fan, and a heat pipe.

Preferably, the heat source includes a heat transfer surface, the heat transfer surface is attached to the first outer surface or the second outer surface, and the heat transfer surface is attached to the first outer surface or the second outer surface. The fitting direction is perpendicular to the direction of gravity.

Preferably, the heat source includes a heat conductive substrate, the heat conductive substrate is attached to the first outer surface or the second outer surface, and the heat conductive substrate is attached to the first outer surface or the second outer surface. The direction is perpendicular to the direction of gravity.

Preferably, the siphon type heat sink further comprises a support structure disposed in the chamber, and the support structure connects the first inner surface and the second inner surface.

Preferably, the supporting structure extends from the second inner surface of the second plate body toward the first plate body and connects the first inner surface of the first plate body.

Preferably, the support structure is a wave plate disposed in the chamber and connecting the first inner surface and the second inner surface.

Preferably, the siphon type heat dissipation plate comprises a first plate body and a second plate body, wherein the first inner surface is located on the first plate body, and the second inner surface is located on the second plate body, the second plate Body part Laminating the first plate body, and forming the chamber between the first inner surface and the second inner surface, the first plate body and the second plate body are made of different materials, and the first plate body and the first plate body The material of the second plate may be selected from one of copper, aluminum and stainless steel.

Preferably, the heat source is a light source, and the light source may be selected from one of a light emitting diode, a light bar and a light bulb.

Preferably, the working fluid is disposed in the chamber and occupies 50% to 98% of the total volume of the chamber.

1‧‧‧ display device

10, 50, 60, 70, 80‧‧‧ siphonic heat sink

11, 51, 61, 71, 81‧‧‧ first plate

111, 511, 611, 811‧‧‧ first inside

112, 711‧‧‧ first outer surface

12, 52, 62, 72, 82‧‧‧ second plate

121, 621, 821‧‧‧ second inner face

122, 721‧‧‧ second outer surface

13, 53, 63, 73, 83 ‧ ‧ room

131, 531, 631, 731‧‧‧ top area

132, 532, 632, 732‧‧‧ bottom area

20, 55, 65, 75, 85 ‧ ‧ working fluid

201, 551, 651, 751 ‧ ‧ working fluid vapor

30‧‧‧heat source

31, 56, 66, 76‧‧‧ Thermal energy

32‧‧‧heat transfer surface

33‧‧‧thermal substrate

34‧‧‧Light

35‧‧‧Lighting parts

40‧‧‧ display panel

54‧‧‧ boiling structure

64, 84‧‧‧Support structure

74‧‧‧Heat components

841‧‧‧ wave board

G1, g2, g3, g4‧‧‧ gravity direction

S1, S2, S3, S4‧‧‧ evaporation direction

L1, L2, L3, L4‧‧‧ return direction

1 is an exploded perspective view of a display device according to a first preferred embodiment of the present invention.

2 is a cross-sectional view showing the display device of the first preferred embodiment of the present invention.

3 is a perspective view of a siphon type heat sink and a heat source according to a first preferred embodiment of the present invention.

4 is an exploded perspective view of the siphon type heat sink and the heat source of the first preferred embodiment of the present invention.

FIG. 5 is a cross-sectional view showing the siphon type heat sink of the first preferred embodiment and the heat source during heat dissipation.

6 is an exploded perspective view of a siphon type heat sink according to a second preferred embodiment of the present invention.

FIG. 7 is a cross-sectional view showing the siphon type heat dissipation plate of the second preferred embodiment of the present invention when the heat dissipation is performed.

FIG. 8 is an exploded perspective view of a siphon type heat sink according to a third preferred embodiment of the present invention.

FIG. 9 is a cross-sectional view showing the siphon type heat dissipation plate of the third preferred embodiment of the present invention when the heat dissipation is performed.

FIG. 10 is an exploded perspective view of a siphon type heat sink according to a fourth preferred embodiment of the present invention.

FIG. 11 is a cross-sectional view showing the siphon type heat dissipation plate of the fourth preferred embodiment of the present invention when the heat dissipation is performed.

FIG. 12 is an exploded perspective view of a siphon type heat sink according to a fifth preferred embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a siphon type heat sink according to a fifth preferred embodiment of the present invention.

The preferred embodiment of the present invention will now be described with reference to the drawings.

First, a first preferred embodiment of the present creation will be described. 1 is a perspective exploded view of the display device of the first preferred embodiment of the present invention and FIG. 2 is a schematic cross-sectional view of the display device of the first preferred embodiment of the present invention. The display device 1 of the present invention includes a display panel 40, a siphonic heat sink 10, and a heat source 30. The siphon type heat sink 10 includes a first inner surface 111, a second inner surface 121, and a working fluid 20, and a cavity 13 is formed between the first inner surface 111 and the second inner surface 121. The chamber 13 includes a top region 131 and a bottom region 132. The heat source 30 includes a heat transfer surface 32, a heat conductive substrate 33, and a light emitting member 35. The heat transfer surface 32 is disposed on the heat conductive substrate 33, and the light emitting member 35 is disposed on the heat conductive substrate 33. The siphon type heat sink 10 is adjacent to the display panel 40, and the arrangement direction of the siphon type heat sink 10 is parallel to the display panel 40. The working fluid 20 is disposed in the chamber 13, and the working fluid 20 is accumulated in the bottom region 132 of the chamber 13 in a gravity direction g1. The heat source 30 is disposed between the display panel 40 and the siphon type heat sink 10, and the position of the heat source 30 corresponds to the bottom region 132 of the chamber 13. The heat transfer surface 32 of the heat source 30 is attached to the siphon type heat sink 10, and the light-emitting member 35 corresponds to the display panel 40. The illuminating member 35 of the heat source 30 generates a light ray 34 and a heat energy 31. The light 34 is incident on the display panel 40 to cause the display panel 40 to generate an image. The heat energy 31 passes through the heat conductive substrate 33 and is transmitted to the chamber 13 of the siphon type heat sink 10 through the heat transfer surface 32 for heat dissipation.

Continued to explain the structure of the siphonic heat sink 10 and the heat dissipation, please refer to 3 is a perspective view of the siphon type heat sink and the heat source of the first preferred embodiment of the present invention, FIG. 4 is a perspective exploded view of the siphon type heat sink and the heat source of the first preferred embodiment, and FIG. The schematic diagram of the siphon type heat sink of the preferred embodiment and the heat source during the heat dissipation operation. In detail, the siphon type heat sink 10 is composed of a first plate body 11 and a second plate body 12. The first plate body 11 has the first inner surface 111 and a first outer surface 112. The second plate body 12 has the second inner surface 121 and a second outer surface 122. The outer peripheral portion of the first plate body 11 is fitted to the second plate body 12, and the first inner surface 111 is spaced apart from the second inner surface 121 so that the chamber 13 is formed between the first inner surface 111 and the second inner surface 121. The heat source 30 is attached to the first outer surface 112 or the second outer surface 122, and the present embodiment will be described in a state of being attached to the first outer surface 112. The heat conductive substrate 33 of the heat source 30 and the heat transfer surface 32 are attached to the first outer surface 112 of the first plate body 11, and the bonding direction P is perpendicular to the gravity direction g1. The heat energy 31 is transferred into the chamber 13 of the siphonic heat sink 10 through the first outer surface 112 of the first plate body 11. The working fluid 20 absorbs the heat energy 31 and evaporates into a working fluid vapor 201, and the working fluid vapor 201 evaporates from the bottom region 132 of the chamber 13 in the evaporation direction S1 to the top region 131 by the principle of liquid heat absorption evaporation. After the working fluid vapor 201 dissipates the thermal energy 31 to the outside in the top region 131, the working fluid vapor 201 is recondensed back to the working fluid 20 by discharging the thermal energy 31. The working fluid 20 is attached to the first inner face 111 and the second inner face 121 by the principle that the liquid flows in the direction of gravity, and flows back to the bottom region 132 in the reflow direction L1. The reflow direction L1 is the same as the direction of the gravity direction g1.

It is to be noted that the volume of the working fluid 20 accounts for 50% to 98% of the total space of the chamber 13. The first plate body 11 and the second plate body 12 may be made of different materials, and the material may be selected from one of copper, aluminum, and stainless steel. The heat source 30 is a light source, and the light source may be selected from one of a light emitting diode, a light bar, and a light bulb.

The second preferred embodiment of the present invention, please refer to FIG. 6 for an exploded perspective view of the siphon type heat sink of the second preferred embodiment, and FIG. 7 shows the siphon type heat sink of the second preferred embodiment. Schematic diagram of the time. The structure and operation of the second preferred embodiment are the same as those of the first preferred embodiment, so the details are not described in detail. The siphon type heat sink 50 of the second preferred embodiment includes a first plate body 51, a second plate body 52, a working fluid 55, and a boiling structure 54. The first plate body 51 and the second plate body 52 are partially attached to each other to form a chamber 53 therein. The chamber 53 includes a top region 531 and a bottom region 532. The working fluid 55 is accumulated in the bottom region 532 in the gravity direction g2. The boiling structure 54 is disposed in the bottom region 532 of the chamber 53 and immersed in the working fluid 55. The boiling structure 54 is a porous body, and the boiling structure 54 contacts the first plate 51 or the second plate 52. In this embodiment, the boiling structure 54 is disposed on the second plate 52 and contacts the first body. The first inner surface 511 of the plate body 51 will be described. When the thermal energy 56 enters the interior of the chamber 53 through the first inner surface 511, the thermal energy 56 is transferred into the boiling structure 54. Since the boiling structure 54 is immersed in the working fluid 55, the internal pores contact the working fluid 55, thereby increasing the thermal energy 56. The transferred area enables faster transfer of the thermal energy 56 to the working fluid 55 and accelerates the evaporation of the working fluid 55 into the working fluid vapor 551, causing the working vapor 551 to evaporate along an evaporation direction S2. After the working fluid vapor 551 releases the thermal energy 56 in the top region 531, the condensation returns to the working fluid 55 and returns to the bottom region 532 of the chamber 53 in the reflow direction L2. The boiling structure 54 can be selected from one of a metal foamed material, a woven mesh, and a powder metallurgy structure.

3 is a perspective exploded view of the siphon type heat sink of the third preferred embodiment of the present invention, and FIG. 9 is a schematic view of the siphon type heat sink of the third preferred embodiment. Schematic diagram of the section. The structure and operation of the third preferred embodiment are the same as those of the first preferred embodiment, so the details are not described in detail. The third preferred embodiment of the present creation The siphon type heat sink 60 includes a first plate body 61, a second plate body 62, a working fluid 65, and a support structure 64. The first plate body 61 and the second plate body 62 partially fit together to form a chamber 63. The first plate body 61 includes a first inner face 611. The second plate body includes a second inner face 621. The chamber 63 includes a top region 631 and a bottom region 632. The working fluid 65 is disposed in the chamber 63 and accumulates in the bottom region 632 in the direction of gravity g3. The support structure 64 is disposed in the chamber 63 and connects the first inner surface 611 and the second inner surface 621. Preferably, the support structure 64 of the embodiment is a protruding cylinder, and the second plate 62 is second. The inner surface 621 protrudes in the direction of the first plate body 61 and connects the first inner surface 611 of the first plate body. The support structure 64 is disposed in the chamber 63 so that the first plate body 61 and the second plate body 62 are not easily deformed when combined, and the space of the chamber 63 is kept unobstructed. After the thermal energy 66 enters the bottom region 632 of the chamber 63, the working fluid 65 absorbs the thermal energy 66 and evaporates into the working fluid vapor 651 and evaporates in the evaporation direction S3 to the top region 631. After the working liquid vapor 651 is condensed and returned to the working liquid 65 in the top region 631, it is returned to the bottom portion 632 in the return flow direction L3.

4 is a perspective exploded view of the siphon type heat sink of the fourth preferred embodiment of the present invention, and FIG. 11 is a schematic view of the siphon type heat sink of the fourth preferred embodiment. Schematic diagram of the section. The structure and operation of the fourth preferred embodiment are the same as those of the first preferred embodiment, and thus the same portions will not be described again. The siphon type heat sink 70 of the fourth preferred embodiment of the present invention includes a first plate body 71, a second plate body 72, a working fluid 75, and a heat dissipating member 74. The first plate body 71 and the second plate body 72 partially fit to form a chamber 73. The chamber 73 includes a top portion 731 and a bottom portion 732. The first plate body 71 includes a first outer surface 711. The second plate body 72 includes a second outer surface 721. The heat dissipating member 74 is disposed on the first outer surface 711 or the second outer surface 721, and the heat dissipating member 74 is disposed at a position corresponding to the top region 731 of the chamber 73. The working fluid 75 is disposed in the chamber 73 and accumulates in the bottom region 732 in the gravity direction g4. When the heat is 76 After the bottom region 732 of the chamber 73, the working fluid 75 absorbs the thermal energy 76 and evaporates into the working fluid vapor 751 and evaporates in the evaporation direction S4 to the top region 731. The heat dissipating member 74 at the top region 731 assists in dissipating the thermal energy 76 to the outside. The working fluid vapor 751 can be quickly condensed and returned to the working fluid 75, and is returned to the bottom region 732 in the return direction L4 to accumulate. Used to improve the heat dissipation effect. The heat dissipating component 74 of the present embodiment is described as a heat dissipating fin, and the heat dissipating component 74 may be selected from one of a heat dissipating fin, a fan, or a heat pipe.

Please refer to FIG. 12 and FIG. 13 for the fifth preferred embodiment of the present creation. The partial structure and operation of the siphon type heat dissipating plate of the fifth preferred embodiment are the same as those of the first preferred embodiment, and thus the same portions will not be described again. The siphonic heat sink 80 of the fifth preferred embodiment of the present invention includes a first plate body 81, a second plate body 82, a working fluid 85, and a support structure 84. The first plate body 81 includes a first inner surface 811. The second plate body 82 includes a second inner face 821. The first plate body 81 and the second plate body 82 are partially adhered to each other, and a chamber 83 is formed between the first inner surface 811 and the second inner surface 821. The working fluid 85 is disposed in the chamber 83. The support structure 84 is a wave plate 841 disposed in the chamber 83 and immersed in the working fluid 85, and the wave plate 841 is partially connected to the first inner surface 811 and the second inner surface 821. The wave plate 841 is disposed in the chamber 83 so that the first plate body 81 and the second plate body 82 are not easily deformed when combined, and the space of the chamber 83 is kept unobstructed. The heat dissipation process of the present embodiment and the operation of the working fluid 85 are the same as those of the first embodiment, and therefore will not be described again.

The siphon-type heat sink of the present invention has a good heat dissipation function, can absorb heat generated by a heat source, directly conduct heat conduction and heat dissipation, thereby improving heat dissipation efficiency, and can effectively achieve heat dissipation when used on a large screen or a large number of heat sources, and overcome conventional techniques. Missing.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, and thus other equivalent changes that have not been made without departing from the spirit of the present disclosure. Or modifications should be included in the scope of this creation.

1‧‧‧ display device

10‧‧‧Siphonic heat sink

112‧‧‧First outer surface

30‧‧‧heat source

32‧‧‧heat transfer surface

33‧‧‧thermal substrate

35‧‧‧Lighting parts

40‧‧‧ display panel

Claims (29)

A siphon type heat dissipation plate comprising: a first plate body having a first inner surface and a first outer surface; a second plate body having a second inner surface and a second outer surface, the second inner portion Facing the first inner surface and being spaced apart from each other, the second plate portion is fitted to the first plate body, and a cavity is formed between the first inner surface and the second inner surface, the chamber includes a chamber a top region and a bottom region; and a working fluid disposed in the chamber, and the working fluid is accumulated in the bottom region along a gravity direction; wherein a heat source fits the siphon type heat sink and contacts the first An outer surface or the second outer surface, and the heat source is disposed at a position corresponding to the bottom portion of the chamber, the heat source generating a heat energy transferred into the chamber through the first outer surface or the second outer surface, After the working fluid absorbs the thermal energy, it evaporates into a working fluid vapor and enters the top region, and the working fluid vapor is condensed and returned to the working fluid after the thermal energy is emitted to the outside region, and the working fluid is attached to the working fluid. First inner face and the first And back to the inner surface of the bottom region in a gravity direction. The siphon type heat dissipation plate of claim 1, wherein the siphon type heat dissipation plate comprises a boiling structure, the boiling structure is disposed in the bottom portion of the chamber, and is immersed in the working fluid. The boiling structure transfers the thermal energy to the working fluid in the bottom region, causing the working fluid to absorb thermal energy and evaporate into the working fluid vapor and into the top region. The siphon type heat sink according to claim 2, wherein the boiling structure contacts the first inner surface or the second inner surface, and the boiling structure is selected from a metal foam material body, a woven mesh And one of the powder metallurgy structures. The siphon type heat sink according to claim 1, wherein the heat source comprises a heat transfer surface, the heat transfer surface is attached to the first outer surface or the second outer surface, and the heat transfer surface is paste The combined direction is perpendicular to the direction of gravity. The syphon-type heat sink of claim 1, wherein the heat source further comprises a heat-conducting substrate, the heat-conducting substrate being attached to the first outer surface or the second outer surface. The syphon-type heat sink of claim 5, wherein the heat-conducting substrate is attached to the first outer surface or the second outer surface in a direction perpendicular to the direction of gravity. The siphon type heat sink of claim 1, wherein the siphon type heat sink further comprises a heat dissipating component disposed on the first outer surface and/or the second outer surface and located in the pair This top area should be accommodated in the room. The siphon type heat sink of claim 7, wherein the heat dissipating component is selected from one of a heat sink fin, a fan, and a heat pipe. The siphon type heat sink according to claim 1, wherein the siphon type heat sink further comprises a support structure, the support structure is disposed in the chamber, and the support structure is connected to the first inner surface Second inside. The siphon type heat sink according to claim 9, wherein the support structure extends from the second inner surface toward the first inner surface and is connected to the first inner surface. The siphon type heat sink according to claim 9, wherein the support structure is a wave plate, the wave plate is disposed in the chamber, and connects the first inner surface and the second inner surface. The siphon type heat sink according to claim 1, wherein the first plate body and the second plate body are made of different materials, and the material of the first plate body and the second plate body are selected from copper. One of aluminum, aluminum and stainless steel. The siphon type heat sink according to claim 1, wherein the heat source is a light source, and the light source may be selected from one of a light emitting diode, a light bar and a light bulb. The siphon type heat sink according to claim 1, wherein the working fluid is disposed in the chamber to occupy 50% to 98% of the total volume of the chamber. A display device includes: a display panel; a siphon-type heat sink adjacent to the display panel, the siphon-type heat sink includes: a first inner surface and a second inner surface, the first inner surface should be second The inner surface is spaced apart from each other, and a chamber is formed between the first inner surface and the second inner surface, the chamber includes a top region and a bottom region; a working fluid is disposed in the chamber, and the chamber The working fluid accumulates in the bottom region along a gravity direction; a heat source is disposed between the display panel and the siphon type heat sink, the heat source is attached to the bottom portion of the siphon type heat sink and the chamber, the heat source Generating a light and a heat energy; wherein the light enters the display panel, the display panel receives the light and generates an image, the heat energy is transmitted to the chamber through the siphon type heat sink, and the working fluid absorbs the heat energy Evaporating into a working fluid vapor and entering the top region, and the working fluid vapor is condensed back to the outside after the heat energy is emitted to the outside region, and the working fluid is attached to the working fluid. A second inner surface and the inner surface of the bottom region and back along a gravity direction. The display device of claim 15, wherein the siphon type heat sink is disposed in a direction parallel to the display panel. The display device of claim 15, wherein the siphon type heat dissipation plate comprises a boiling structure disposed in the bottom portion of the chamber and immersed in the working fluid, the boiling The structure transfers the thermal energy to the working fluid in the bottom region, so that the working fluid absorbs thermal energy and evaporates into the working fluid vapor and enters the top region. The display device of claim 17, wherein the boiling structure contacts the first inner surface or the second inner surface, and the boiling structure is selected from the group consisting of a metal foamed material, a woven mesh, and a powder. One of the metallurgical structures. The display device of claim 15, wherein the siphon type heat dissipation plate comprises a first outer surface and a second outer surface, and the heat source is attached to the first outer surface or the second outer surface. And the thermal energy is transferred into the chamber through the first outer surface or the second outer surface. The display device of claim 19, wherein the siphon type heat sink further comprises a heat dissipating component disposed on the first outer surface or a second outer surface and corresponding to the top of the chamber region. The display device of claim 20, wherein the heat dissipating component is selected from one of a heat dissipating fin, a fan, and a heat pipe. The display device of claim 19, wherein the heat source comprises a heat transfer surface, the heat transfer surface is attached to the first outer surface or the second outer surface, and the heat transfer surface is attached to the heat transfer surface The bonding direction of the first outer surface or the second outer surface is perpendicular to the direction of gravity. The display device of claim 19, wherein the heat source comprises a heat conductive substrate, the heat conductive substrate is attached to the first outer surface or the second outer surface, and the heat conductive substrate is attached to the first The fitting direction of the outer surface or the second outer surface is perpendicular to the direction of gravity. The display device of claim 15, wherein the siphon type heat sink further comprises a support structure, the support structure is disposed in the chamber, and the support structure connects the first inner surface and the second inside. The display device of claim 24, wherein the support structure extends from the second inner surface toward the first inner surface and connects the first inner surface. The display device of claim 24, wherein the support structure is a wave plate disposed in the chamber and connecting the first inner surface and the second inner surface. The display device of claim 15, wherein the siphon type heat dissipation plate comprises a first plate body and a second plate body, wherein the first inner surface is located on the first plate body, and the second inner surface is Located in the second plate body, the second plate body portion is attached to the first plate body, and the first inner surface is Forming the chamber between the second inner surfaces, the first plate body and the second plate body are made of different materials, and the materials of the first plate body and the second plate body are selected from the group consisting of copper, aluminum, and stainless steel. One. The display device of claim 15, wherein the heat source is a light source, and the light source may be selected from one of a light emitting diode, a light bar, and a light bulb. The display device of claim 15, wherein the working fluid is disposed in the chamber to occupy 50% to 98% of the total volume of the chamber.