TWM534861U - Image capturing device and electronic system - Google Patents
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Abstract
Description
本創作是關於取像裝置,且特別是有關於應用在電子系統的小型化取像裝置。This creation relates to an image taking device, and in particular to a miniaturized image taking device applied to an electronic system.
接觸式影像感知器(contact image sensor)為線型影像感知器的一種,可供應用於掃描器、傳真機及多功能事務機中,用以將平面的圖像或文件掃描成電子格式,以便於儲存、顯示或傳輸。A contact image sensor is a type of line image sensor that can be used in scanners, fax machines, and multifunction printers to scan flat images or documents into an electronic format. Store, display or transfer.
接觸式影像感知器的工作原理是將光源所產生的光束照射到待掃描的圖像或文字上,並利用對焦透鏡組以將圖像或文字反射的光束(以下稱反射光束)聚集於電荷耦合元件(charge-coupled device, CCD)或是互補式金屬氧化物半導體(complementary metal oxide semiconductor, CMOS)等感知元件上。感知元件會將反射光束轉換成為相對應的電信號,並進一步地產生類比或數位畫素(pixel)資料。The working principle of the contact image sensor is to illuminate the light beam generated by the light source onto the image or text to be scanned, and use the focus lens group to concentrate the light beam reflected by the image or the text (hereinafter referred to as the reflected light beam) on the charge coupling. A charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) sensor. The sensing element converts the reflected beam into a corresponding electrical signal and further produces analog or digital pixel data.
手持式掃描器因具備方便攜帶之特點,因而深受消費者的喜愛。傳統的手持式掃描器在進行圖像或文字的掃描時,是利用組裝其上的馬達及齒條配合運算手持式掃描器的移動距離,以便於在後續進行影像處理時使用;然而,安裝在手持式掃描器上的馬達及齒條具有一定的體積,致使手持式掃描器的整體體積無法有效地縮小。Handheld scanners are popular among consumers because of their portability. The conventional hand-held scanner uses the motor and the rack assembled thereon to calculate the moving distance of the handheld scanner when scanning images or texts, so as to be used in subsequent image processing; however, it is installed in The motor and rack on the hand-held scanner have a certain volume, so that the overall volume of the hand-held scanner cannot be effectively reduced.
本創作提供一種取像裝置,其利用光學式的位置感知件以感知的移動距離,使取像裝置具備小型化的特點。The present invention provides an image capturing device that utilizes an optical position sensing member to sense the moving distance to make the image capturing device compact.
根據本創作提供的取像裝置,用以採集一物件的光學影像。取像裝置包含殼體、發光單元、透光件、複數影像感知件、對焦透鏡及至少一位置感知模組。發光單元位於殼體中並用以產生光束。透光件安裝於殼體上。影像感知件沿著一軸線排列地安裝於殼體中,影像感知件之感知面面對物件,影像感知件用以採集該物件反射該光束所產生的光學影像。對焦透鏡位於透光件及影像感知件之間。位置感知模組設於殼體上並位於透光件的至少一側面,位置感知模組用以採集物件的光學影像,並依據所採集到之物件的光學影像進行取像裝置之移動距離之運算。According to the image capturing device provided by the present invention, an optical image of an object is collected. The image capturing device comprises a housing, a light emitting unit, a light transmitting member, a plurality of image sensing members, a focusing lens and at least one position sensing module. The lighting unit is located in the housing and is used to generate a light beam. The light transmissive member is mounted on the housing. The image sensing member is arranged in the housing along an axis, and the sensing surface of the image sensing member faces the object, and the image sensing member is configured to collect the optical image generated by the object reflecting the light beam. The focus lens is located between the light transmissive member and the image sensing member. The position sensing module is disposed on the housing and located on at least one side of the light transmissive member. The position sensing module is configured to collect an optical image of the object, and perform an operation distance of the image capturing device according to the optical image of the collected object. .
本創作另提供一種電子系統,其包含可攜式電子裝置及前述取像裝置,電子系統可以採集物件的光學影像,並可進行取像裝置移動距離的運算。The present invention further provides an electronic system comprising a portable electronic device and the aforementioned image capturing device, wherein the electronic system can collect an optical image of the object and perform an operation of moving the distance of the image capturing device.
根據本創作提供之電子系統包含取像裝置及可攜式電子裝置,可攜式電子裝置電連接於取像裝置,取像裝置用以採集物件的光學影像,並將光學影像轉換成為相對應的數位影像信號後傳遞至可攜式電子裝置。The electronic system provided by the present invention comprises an image capturing device and a portable electronic device. The portable electronic device is electrically connected to the image capturing device, and the image capturing device is configured to collect an optical image of the object and convert the optical image into a corresponding image. The digital image signal is then transmitted to the portable electronic device.
請參閱圖1及圖2,圖1繪示依照本創作第一實施方式之電子系統之立體組合圖,圖2繪示依照本創作第一實施方式之電子系統之立體分解圖。由圖1及圖2可知,電子系統(未另標號)包含取像裝置1及可攜式電子裝置4,取像裝置1安裝於可攜式電子裝置4的一側邊(例如為長邊);電子裝置4可例如為行動電話或平板電腦。可攜式電子裝置4可進一步包含控制單元(Control Unit)、顯示單元(Display Unit)44、儲存單元(Storage Unit)、暫儲存單元(RAM)或其組合。1 and FIG. 2, FIG. 1 is a perspective assembled view of an electronic system according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view of the electronic system according to the first embodiment of the present invention. As can be seen from FIG. 1 and FIG. 2, the electronic system (not labeled) includes the image capturing device 1 and the portable electronic device 4. The image capturing device 1 is mounted on one side of the portable electronic device 4 (for example, the long side). The electronic device 4 can be, for example, a mobile phone or a tablet. The portable electronic device 4 may further include a control unit, a display unit 44, a storage unit, a temporary storage unit (RAM), or a combination thereof.
請同時參閱圖3,圖3係繪示依照本創作第一實施方式之取像裝置的剖視圖。取像裝置1用以擷取形成在物件5上的(以下簡稱物件5的光學影像),並將光學影像轉換成數位影像信號後傳遞至可攜式電子裝置4。取像裝置1包含電路板10、影像感知件12、承載座14、對焦透鏡16、透光件18、發光單元20及位置感知模組22。Please refer to FIG. 3 at the same time. FIG. 3 is a cross-sectional view of the image taking device according to the first embodiment of the present invention. The image capturing device 1 is configured to capture an optical image formed on the object 5 (hereinafter referred to as the optical image of the object 5), and convert the optical image into a digital image signal for transmission to the portable electronic device 4. The imaging device 1 includes a circuit board 10, an image sensing device 12, a carrier 14, a focus lens 16, a light transmissive member 18, a light emitting unit 20, and a position sensing module 22.
電路板10為印刷電路板(printed circuit board, PCB),影像感知件12設於電路板10上,且影像感知件12的光軸121平行於Z軸,並用以感知物件5的光學影像。取像裝置1可包含複數個沿著取像裝置1的長邊方向(即Y軸方向)呈線性排列的影像感知件12,且影像感知件12可以為電荷耦合元件、互補式金屬氧化物半導體或其它具有光電轉換特性之元件。The circuit board 10 is a printed circuit board (PCB). The image sensing unit 12 is disposed on the circuit board 10. The optical axis 121 of the image sensing unit 12 is parallel to the Z axis and is used to sense the optical image of the object 5. The image capturing device 1 may include a plurality of image sensing members 12 linearly arranged along the longitudinal direction of the image capturing device 1 (ie, the Y-axis direction), and the image sensing member 12 may be a charge coupled device or a complementary metal oxide semiconductor. Or other components having photoelectric conversion characteristics.
承載座14設於電路板10上,且其上開設有沿著Z軸方向延伸的通孔140。對焦透鏡16收容於承載座14的通孔140內,並位於影像感知件12的正上方,對焦透鏡16的出光面162面對影像感知件12的感知面122,以將光學影像對焦在影像感知件12上。對焦透鏡16可例如是柱狀透鏡;對焦透鏡16的數量相同於影像感知件12的數量,且每個對焦透鏡16分別位於其中之一個影像感知件12的正上方。The carrier 14 is disposed on the circuit board 10 and has a through hole 140 extending along the Z-axis direction. The focusing lens 16 is received in the through hole 140 of the carrier 14 and directly above the image sensing member 12, and the light emitting surface 162 of the focusing lens 16 faces the sensing surface 122 of the image sensing member 12 to focus the optical image on the image sensing. On the 12th. The focus lens 16 may be, for example, a lenticular lens; the number of focus lenses 16 is the same as the number of image sensing members 12, and each of the focus lenses 16 is located directly above one of the image sensing members 12.
透光件18呈平板狀,並位於對焦透鏡16的入光面164前方;換言之,對焦透鏡16是排列在影像感知件12及透光件18之間,且影像感知件12的感知面122面對對焦透鏡16及透光件18。透光件18至少可以提供保護對焦透鏡16及發光單元20的效果;透光件18可例如使用具有高透射率的玻璃或透明樹脂材料製作而成,藉以防止光束被透光件18所吸收或散射。The light transmissive member 18 has a flat shape and is located in front of the light incident surface 164 of the focus lens 16; in other words, the focus lens 16 is arranged between the image sensing member 12 and the light transmissive member 18, and the sensing surface 122 of the image sensing member 12 is The focus lens 16 and the light transmissive member 18 are provided. The light transmissive member 18 can at least provide an effect of protecting the focus lens 16 and the light emitting unit 20; the light transmissive member 18 can be made of, for example, a glass or a transparent resin material having high transmittance, thereby preventing the light beam from being absorbed by the light transmissive member 18 or scattering.
發光單元20用以產生線型光束。發光單元20具有光軸21,發光單元20的光軸21與影像感知件12的光軸121具有夾角q;其中,夾角q為銳角。The light emitting unit 20 is used to generate a linear beam. The light emitting unit 20 has an optical axis 21, and the optical axis 21 of the light emitting unit 20 has an angle q with the optical axis 121 of the image sensing member 12; wherein the angle q is an acute angle.
發光單元20包含發光件200、導光件202及反光件204。發光件200可例如為發光二極體(light emitting diode, LED),並用以產生沿著Y軸方向傳遞的點狀光束。導光件202呈條狀,可透光,通常由壓克力(PMMA)或塑膠(PC)製成。導光件202設置鄰近於發光件200,接收發光件200產生的點狀光束,並可例如是利用全反射原理以將發光件200產生的點狀光束轉換成為線型光束後照射物件5。The light emitting unit 20 includes a light emitting member 200, a light guiding member 202, and a light reflecting member 204. The illuminating member 200 can be, for example, a light emitting diode (LED) and used to generate a point beam transmitted along the Y-axis direction. The light guiding member 202 is strip-shaped and permeable to light, and is usually made of acrylic (PMMA) or plastic (PC). The light guide 202 is disposed adjacent to the illuminating member 200, receives the point beam generated by the illuminating member 200, and can illuminate the object 5 by converting the point beam generated by the illuminating member 200 into a linear beam, for example, by using the principle of total reflection.
反光件204設在承載座14上,並包覆導光件202非用以出射線型光束的部分表面,用以將洩漏出導光件202的光線再次引導回導光件202內,以提高發光單元20的光利用效率。反光件204是使用具有低透射率(transmittance)的材質製作而成,且反光件202的整體或面對導光件202表面可以經設計而為具有高反射率(reflectance)的顏色,例如白色或銀色。The reflector 204 is disposed on the carrier 14 and covers a portion of the surface of the light guide 202 that is not used to emit the light beam, so as to guide the light leaking out of the light guide 202 back into the light guide 202 to improve The light utilization efficiency of the light emitting unit 20. The reflector 204 is fabricated using a material having a low transmittance, and the entire surface of the reflector 202 or facing the surface of the light guide 202 can be designed to have a high reflectance color, such as white or Silver.
取像裝置1還包含殼體30,前述的電路板10、影像感知器12、承載座14、對焦透鏡16及透光件18依照前述排列方式分別安裝在殼體30中。當使用取像裝置1感知物件5的光學影像時,電子系統會站立在物件5上,透光件18鄰近物件5,並使影像感知件12的感知面122面對物件5,如圖3所示。使用者可以藉由握持並移動可攜式電子裝置4來改變電子系統的影像感知路徑。The image capturing device 1 further includes a housing 30, and the above-described circuit board 10, image sensor 12, carrier 14, focus lens 16, and light transmissive member 18 are respectively mounted in the housing 30 in accordance with the above arrangement. When the optical image of the object 5 is sensed by the image capturing device 1, the electronic system will stand on the object 5, the light transmitting member 18 is adjacent to the object 5, and the sensing surface 122 of the image sensing member 12 faces the object 5, as shown in FIG. Show. The user can change the image sensing path of the electronic system by holding and moving the portable electronic device 4.
發光單元20產生的線型光束會沿著光軸21射出,並通過透光件18照射物件5。物件5反射線型光束並形成光學影像,此光學影像會通過透光件18進入對焦透鏡16,並由對焦透鏡16對焦在影像感知件12。影像感知件12會將所採集到的光學影像轉換成數位影像信號,以利後續儲存及傳輸之用(詳見後述)。The linear beam generated by the light emitting unit 20 is emitted along the optical axis 21, and the object 5 is irradiated through the light transmitting member 18. The object 5 reflects the linear beam and forms an optical image that enters the focus lens 16 through the light transmissive member 18 and is focused by the focus lens 16 on the image sensing member 12. The image sensing component 12 converts the acquired optical image into a digital image signal for subsequent storage and transmission (see below for details).
此外,取像裝置1的殼體30上還設有接觸件34。在取像裝置1進行物件5的光學影像的採集時,接觸件34會接觸物件5,讓取像裝置1與物件5之間的距離為一定值,藉以維持所採集到的光學影像的品質的一致性。由取像裝置1的側剖面觀之,接觸件34是位在透光件18兩側而不遮蔽透光件18。Furthermore, a contact 34 is provided on the housing 30 of the image capture device 1. When the image capturing device 1 performs the optical image collection of the object 5, the contact member 34 contacts the object 5, so that the distance between the image capturing device 1 and the object 5 is a certain value, thereby maintaining the quality of the collected optical image. consistency. Viewed by the side cross-section of the image taking device 1, the contact members 34 are positioned on both sides of the light transmitting member 18 without shielding the light transmitting member 18.
殼體30上還更進一步設有卡槽302(如圖2所示),卡槽302設在殼體30供與可攜式電子裝置4相結合的側面上,並用以與形成在可攜式電子裝置4一側面的卡合件42對應接合;藉此,可以提高取像裝置1及可攜式電子裝置4之間的結合強度。The housing 30 is further provided with a card slot 302 (shown in FIG. 2). The card slot 302 is disposed on the side of the housing 30 for coupling with the portable electronic device 4, and is formed on the portable type. The engaging members 42 on one side of the electronic device 4 are coupled to each other; thereby, the bonding strength between the image taking device 1 and the portable electronic device 4 can be improved.
請參閱圖4,其繪示依照本創作第一實施方式之電子系統之電路方塊圖。在圖4中,取像裝置1更進一步包含儲存單元26及微處理單元28。儲存單元26用以存放數位影像信號。微處理單元28連接影像感知件12、發光件200、位置感知模組22中的位置感知件222,以及儲存單元26;微處理單元28可依據使用者的操作而啟動取像裝置1,並控制影像感知件12、發光件200、位置感知件222及儲存單元26間的溝通及個別操作狀態。Please refer to FIG. 4, which is a circuit block diagram of an electronic system in accordance with a first embodiment of the present invention. In FIG. 4, the image taking device 1 further includes a storage unit 26 and a micro processing unit 28. The storage unit 26 is configured to store digital image signals. The micro processing unit 28 connects the image sensing component 12, the light emitting component 200, the position sensing component 222 in the position sensing module 22, and the storage unit 26; the micro processing unit 28 can activate the image capturing device 1 according to the operation of the user, and control Communication between the image sensing device 12, the light emitting device 200, the position sensing member 222, and the storage unit 26 and individual operating states.
影像感知件12提供的數位影像信號會依據微處理單元28的控制而選擇存放於儲存單元26或通過連接件24傳遞至可攜式電子裝置4;當然,微處理單元28也可以將存放於儲存單元26的數位影像信號通過連接件24傳遞至可攜式電子裝置4。如圖3所示,連接件24是(電性)連接在電路板10上,部分露出殼體30外,並如圖2所示般供與可攜式電子裝置的連接座40對應接合。The digital image signal provided by the image sensing unit 12 is selectively stored in the storage unit 26 or transmitted to the portable electronic device 4 according to the control of the micro processing unit 28; of course, the micro processing unit 28 can also be stored in the storage. The digital image signal of the unit 26 is transmitted to the portable electronic device 4 through the connector 24. As shown in FIG. 3, the connector 24 is (electrically) connected to the circuit board 10, partially exposed outside the housing 30, and is provided for corresponding engagement with the connector 40 of the portable electronic device as shown in FIG.
在此要特別說明的是,對應接合的連接件24及連接座40除了可以將數位影像信號由取像裝置1傳遞至可攜式電子裝置4,並將數位影像信號以畫素資料顯示於顯示單元44之外,也可以將使用者透過安裝在可攜式電子裝置4上的應用程式產生的操作指令傳遞至取像裝置1,以控制取像裝置1的操作。It should be particularly noted that the corresponding connector 24 and the connector 40 can transmit the digital image signal from the image capturing device 1 to the portable electronic device 4, and display the digital image signal on the display. In addition to the unit 44, the operation command generated by the user through the application installed on the portable electronic device 4 can also be transmitted to the image capturing device 1 to control the operation of the image capturing device 1.
對應接合的連接件24及連接座40更可以將可攜式電子裝置4內儲電件46的所提供的電力傳遞至取像裝置1。也就是說,取像裝置1可以是利用儲電件46提供的電力以進行物件5的光學影像的採集;藉此,取像裝置1便不需要額外安裝電池,並可具備小型化的特點。當然,在實際實施時,取像裝置1也可以額外增設電池而不使用可攜式電子裝置4的電力。The correspondingly connected connector 24 and the connector 40 can transmit the power provided by the power storage member 46 in the portable electronic device 4 to the image capturing device 1 . That is to say, the image taking device 1 can use the power supplied from the electricity storage member 46 to collect the optical image of the object 5; thereby, the image capturing device 1 does not require an additional battery installation, and can be miniaturized. Of course, in actual implementation, the image capturing device 1 can additionally add a battery without using the power of the portable electronic device 4.
微處理單元28還可以控制發光件200的發光強度,並與可攜式電子裝置4溝通,以確定數位影像信號是否傳遞至可攜式電子裝置4。進一步地,微處理單元28更可以依據位置感知模組22所提供的位置感知信號以確定取像裝置1的移動距離(詳見後述)。The micro-processing unit 28 can also control the luminous intensity of the illuminating device 200 and communicate with the portable electronic device 4 to determine whether the digital image signal is transmitted to the portable electronic device 4. Further, the micro processing unit 28 can further determine the moving distance of the image capturing device 1 according to the position sensing signal provided by the position sensing module 22 (described later).
請參照圖5,其繪示依照本創作第一實施方式之取像裝置的局部分解圖。位置感知模組22包含承載板220、位置感知件222及信號傳輸件224,承載板220可例如是印刷電路板,位置感知件222及信號傳輸件224分別設於承載板220的相反二板面。Referring to FIG. 5, a partial exploded view of the image taking device according to the first embodiment of the present invention is shown. The position sensing module 22 includes a carrier board 220, a position sensing component 222, and a signal transmission component 224. The carrier board 220 can be, for example, a printed circuit board. The position sensing component 222 and the signal transmission component 224 are respectively disposed on opposite boards of the carrier board 220. .
殼體30上設有穿孔300。如圖1及圖2所示,穿孔300可以是兩個,並分別位在透光件18的短邊方向;接觸件34設在穿孔300在X軸方向的兩側,並沿著Y軸方向延伸。位置感知模組22安裝在穿孔300中,並可透過圖5所示的結合件36以與殼體30相結合;也就是說,位置感知模組22及透光件18是沿著垂直於影像感知件12的光軸121的Y軸方向排列。在圖5中,結合件36為螺絲,並螺合在形成於殼體30上的螺孔304中;然而,在實際實施時,位置感知模組22及殼體30可以是利用卡扣或膠材相結合。A perforation 300 is provided in the housing 30. As shown in FIG. 1 and FIG. 2, the through holes 300 may be two and are respectively located in the short side direction of the light transmitting member 18; the contact members 34 are disposed on both sides of the through hole 300 in the X-axis direction and along the Y-axis direction. extend. The position sensing module 22 is mounted in the through hole 300 and can be coupled to the housing 30 through the coupling member 36 shown in FIG. 5; that is, the position sensing module 22 and the light transmitting member 18 are perpendicular to the image. The optical axis 121 of the sensing element 12 is arranged in the Y-axis direction. In FIG. 5, the coupling member 36 is a screw and is screwed into the screw hole 304 formed in the housing 30; however, in actual implementation, the position sensing module 22 and the housing 30 may be buckled or glued. The materials are combined.
當位置感知模組22與殼體30結合後,信號傳輸件224位於殼體30鄰近於可攜式電子裝置4的一側;換言之,位置感知件222設置遠離可攜式電子裝置4。藉此,當取像裝置1在進行物件5的光學影像的採集時,位置感知件222同時也會採集光學影像並進行取像裝置1移動距離的運算。位置感知件222可以是不間斷地採集光學影像,或者,位置感知件222也可以是每隔一段時間再進行光學影像的採集。When the position sensing module 22 is combined with the housing 30, the signal transmitting member 224 is located on a side of the housing 30 adjacent to the portable electronic device 4; in other words, the position sensing member 222 is disposed away from the portable electronic device 4. Thereby, when the image capturing apparatus 1 performs the collection of the optical image of the object 5, the position sensing element 222 also acquires the optical image and performs the calculation of the moving distance of the image capturing apparatus 1. The position sensing component 222 may collect the optical image without interruption, or the position sensing component 222 may also collect the optical image at intervals.
要特別說明的是,位置感知模組22可以只具備採集光學影像的功能,並將所採集到的光學影像轉換成為位置感知信號,並通過信號傳輸件224傳遞至可攜式電子裝置4,由可攜式電子裝置4進行取像裝置1移動距離的運算;或者,位置感知模組22依據所採集到的光學影像產生的位置感知信號也可以是傳遞至微處理單元28,由微處理單元28進行取像裝置1移動距離的運算。It should be noted that the location sensing module 22 can only have the function of collecting optical images, and convert the collected optical images into position sensing signals, and transmit them to the portable electronic device 4 through the signal transmission component 224. The portable electronic device 4 performs the calculation of the moving distance of the image capturing device 1; or the position sensing signal generated by the position sensing module 22 according to the collected optical image may also be transmitted to the micro processing unit 28, and the micro processing unit 28 The calculation of the moving distance of the image taking device 1 is performed.
在前述的兩種情況下,由位置感知模組22傳遞給可攜式電子裝置4或微處理單元28的位置感知信號並不包含任何關於取像裝置1移動距離的資訊,也就是說,位置感知模組22並無法進行取像裝置1的移動距離的運算。然而,在實際實施時中,位置感知模組22也可以是輸出包含取像裝置1移動距離的資訊的位置感知信號。In the foregoing two cases, the position sensing signal transmitted by the location sensing module 22 to the portable electronic device 4 or the micro processing unit 28 does not contain any information about the moving distance of the imaging device 1, that is, the position. The sensing module 22 cannot perform the calculation of the moving distance of the image capturing apparatus 1. However, in actual implementation, the position sensing module 22 may also be a position sensing signal that outputs information including the moving distance of the image capturing device 1.
進一步地,當取像裝置1具備多個位置感知模組22時,電子系統便能夠依據多個位置感知模組22輸出的位置感知信號判定電子系統的影像感知路徑是否產生歪斜或偏移,其影像感知路徑是否歪斜或偏移可以是藉由比較多個位置感知信號,或者藉由比較多個位置感知信號及數位影像信號來達成;藉此,可以針對數位影像信號所要呈現的畫素資料進行位置及排列上的修正,使顯示在顯示單元44上的畫素資料能夠完美呈現物件的光學影像。Further, when the image capturing device 1 includes a plurality of position sensing modules 22, the electronic system can determine whether the image sensing path of the electronic system is skewed or offset according to the position sensing signals output by the plurality of position sensing modules 22, Whether the image sensing path is skewed or offset may be achieved by comparing a plurality of position sensing signals or by comparing a plurality of position sensing signals and digital image signals; thereby, the pixel data to be presented by the digital image signals may be performed. The correction of the position and arrangement enables the pixel material displayed on the display unit 44 to perfectly represent the optical image of the object.
取像裝置1還可以包含安裝在殼體30上的蓋體32。蓋體32可轉動式地樞接在殼體30上。當取像裝置1在進行物件5的光學影像的採集時,蓋體32可轉動至如圖1至圖3所示,未覆蓋透光件18及位置感知模組22的位置上,以利取像裝置1進行物件5的光學影像的採集。然而,當取像裝置1不進行物件5的光學影像的採集時,蓋體32可以經轉動而覆蓋透光件18及位置感知模組22,以避免粉塵附著或異物損壞透光件18或位置感知模組22,而影響感知結果。The image taking device 1 may further include a cover 32 mounted on the housing 30. The cover 32 is rotatably pivotally coupled to the housing 30. When the image capturing device 1 is performing the optical image capturing of the object 5, the cover 32 can be rotated to the position of the light transmitting member 18 and the position sensing module 22 as shown in FIG. 1 to FIG. The image device 1 performs the acquisition of an optical image of the object 5. However, when the image capturing device 1 does not perform the optical image collection of the object 5, the cover 32 can be rotated to cover the light transmitting member 18 and the position sensing module 22 to prevent dust adhesion or foreign matter from damaging the light transmitting member 18 or the position. The module 22 is perceived to affect the perceived outcome.
請參閱圖6及圖7,圖6繪示依照本創作第二實施方式之取像裝置之立體圖,圖7繪示依照本創作第二實施方式之電子系統之電路方塊圖。圖6繪示的取像裝置1a與圖3繪示的取像裝置1類似,且相同的元件標示以相同的符號。值得注意的是,兩者的差異在於:,圖6所繪示的取像裝置1a僅包含單一個位置感知模組22a,且位置感知模組22a還包含運算單元23。Please refer to FIG. 6 and FIG. 7. FIG. 6 is a perspective view of the image capturing apparatus according to the second embodiment of the present invention, and FIG. 7 is a circuit block diagram of the electronic system according to the second embodiment of the present invention. The image capturing device 1a shown in FIG. 6 is similar to the image capturing device 1 shown in FIG. 3, and the same components are denoted by the same reference numerals. It should be noted that the difference between the two is that the image capturing device 1a illustrated in FIG. 6 includes only a single location sensing module 22a, and the location sensing module 22a further includes an computing unit 23.
運算單元23電連接於位置感知件222,並依據位置感知件222採集光學影像所產生的位置感知信號以運算取像裝置1移動距離,並將運算結果傳遞給微處理單元28。The operation unit 23 is electrically connected to the position sensing component 222, and collects the position sensing signal generated by the optical image according to the position sensing component 222 to calculate the moving distance of the image capturing device 1 and transmits the operation result to the micro processing unit 28.
進一步地,圖7所繪示的取像裝置1a還包含電池31。在取像裝置1a具備電池31的條件下,取像裝置1a可利用無線收發單元33與可攜式電子裝置4進行數位影像信號及控制指令的傳輸。又,在此條件下,如2所繪示的連接件24及連接座40便可以被省略。Further, the image taking device 1a illustrated in FIG. 7 further includes a battery 31. Under the condition that the image taking device 1a includes the battery 31, the image capturing device 1a can transmit the digital image signal and the control command by the wireless transmitting and receiving unit 33 and the portable electronic device 4. Further, under this condition, the connecting member 24 and the connecting seat 40 as shown in Fig. 2 can be omitted.
無線收發單元33可例如是藍芽收發器或紅外線收發器。當然,取像裝置1也不排除是透過網際網路以與可攜式電子裝置4的通訊單元48進行溝通,以完成數位影像信號及控制指令的傳遞與接收。The wireless transceiver unit 33 can be, for example, a Bluetooth transceiver or an infrared transceiver. Of course, the image capturing device 1 does not exclude the communication with the communication unit 48 of the portable electronic device 4 through the Internet to complete the transmission and reception of digital image signals and control commands.
當取像裝置1a與可攜式電子裝置4形成配對而產生(電性)連接後,使用者可例如是透過安裝在可攜式電子裝置4內部的應用程式啟動取像裝置1,並驅使微處理單元28控制影像感知件12、發光件200、位置感知模組22及儲存單元26的操作狀態。取像裝置1a的各元件的功用與相關說明,實際上與第一實施方式的取像裝置1相同,在此不予贅述。取像裝置1a至少可達到與取像裝置1相同的功能。After the image capturing device 1a is paired with the portable electronic device 4 to generate an (electrical) connection, the user can activate the image capturing device 1 through an application installed in the portable electronic device 4, for example, and drive the micro device. The processing unit 28 controls the operational states of the image sensing device 12, the light emitting device 200, the position sensing module 22, and the storage unit 26. The function and related description of each element of the image capturing apparatus 1a are substantially the same as those of the image capturing apparatus 1 of the first embodiment, and will not be described herein. The image taking device 1a can at least achieve the same function as the image capturing device 1.
雖然本創作已以實施方式揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作的精神和範圍內,當可作各種的更動與潤飾,因此本創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope is subject to the definition of the scope of the patent application.
1、1a‧‧‧取像裝置1, 1a‧‧‧ image capture device
10‧‧‧電路板10‧‧‧ boards
12‧‧‧影像感知件12‧‧‧Image Perception
121、21‧‧‧光軸121, 21‧‧‧ optical axis
122‧‧‧感知面122‧‧‧ perception surface
14‧‧‧承載座14‧‧‧Hosting
140‧‧‧通孔140‧‧‧through hole
16‧‧‧對焦透鏡16‧‧‧focus lens
162‧‧‧出光面162‧‧‧Glossy
164‧‧‧入光面164‧‧‧Into the glossy surface
18‧‧‧透光件18‧‧‧Transparent parts
20‧‧‧發光單元20‧‧‧Lighting unit
200‧‧‧發光件200‧‧‧Lighting parts
202‧‧‧導光件202‧‧‧Light guide
204‧‧‧反光件204‧‧‧Reflecting parts
22‧‧‧位置感知模組22‧‧‧Location Awareness Module
220‧‧‧承載板220‧‧‧Loading board
222‧‧‧位置感知件222‧‧‧ Location-aware parts
224‧‧‧信號傳輸件224‧‧‧Signal transmission parts
23‧‧‧運算單元23‧‧‧ arithmetic unit
24‧‧‧連接件24‧‧‧Connecting parts
26‧‧‧儲存單元26‧‧‧ storage unit
28‧‧‧微處理單元28‧‧‧Microprocessing unit
30‧‧‧殼體30‧‧‧Shell
300‧‧‧穿孔300‧‧‧Perforation
302‧‧‧卡槽302‧‧‧ card slot
31‧‧‧電池31‧‧‧Battery
32‧‧‧蓋體32‧‧‧ Cover
34‧‧‧接觸件34‧‧‧Contacts
36‧‧‧結合件36‧‧‧Connected parts
4‧‧‧可攜式電子裝置4‧‧‧Portable electronic devices
40‧‧‧連接座40‧‧‧Connecting seat
42‧‧‧卡合件42‧‧‧Cards
44‧‧‧顯示單元44‧‧‧Display unit
46‧‧‧儲電件46‧‧‧Power storage parts
48‧‧‧通訊單元48‧‧‧Communication unit
5‧‧‧物件5‧‧‧ objects
q‧‧‧夾角Q‧‧‧ angle
圖1繪示依照本創作第一實施方式之電子系統之立體組合圖;1 is a perspective assembled view of an electronic system according to a first embodiment of the present invention;
圖2繪示依照本創作第一實施方式之電子系統之立體分解圖;2 is an exploded perspective view of the electronic system according to the first embodiment of the present invention;
圖3繪示依照本創作第一實施方式之取像裝置之剖視圖;3 is a cross-sectional view of the image taking device according to the first embodiment of the present invention;
圖4繪示依照本創作第一實施方式之電子系統之電路方塊圖;4 is a circuit block diagram of an electronic system in accordance with a first embodiment of the present invention;
圖5繪示依照本創作第一實施方式之取像裝置之局部分解圖;FIG. 5 is a partial exploded view of the image taking device according to the first embodiment of the present invention; FIG.
圖6繪示依照本創作第二實施方式之取像裝置之立體圖;以及6 is a perspective view of the image taking device according to the second embodiment of the present invention;
圖7繪示依照本創作第二實施方式之電子系統之電路方塊圖。7 is a circuit block diagram of an electronic system in accordance with a second embodiment of the present invention.
1‧‧‧取像裝置 1‧‧‧Image capture device
22‧‧‧位置感知模組 22‧‧‧Location Awareness Module
24‧‧‧連接件 24‧‧‧Connecting parts
30‧‧‧殼體 30‧‧‧Shell
300‧‧‧穿孔 300‧‧‧Perforation
302‧‧‧卡槽 302‧‧‧ card slot
32‧‧‧蓋體 32‧‧‧ Cover
4‧‧‧可攜式電子裝置 4‧‧‧Portable electronic devices
40‧‧‧連接座 40‧‧‧Connecting seat
42‧‧‧卡合件 42‧‧‧Cards
44‧‧‧顯示單元 44‧‧‧Display unit
Claims (14)
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TW105206372U TWM534861U (en) | 2016-05-04 | 2016-05-04 | Image capturing device and electronic system |
Applications Claiming Priority (1)
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TW105206372U TWM534861U (en) | 2016-05-04 | 2016-05-04 | Image capturing device and electronic system |
Publications (1)
Publication Number | Publication Date |
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TWM534861U true TWM534861U (en) | 2017-01-01 |
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