TWM533315U - Waterproof package module - Google Patents

Waterproof package module

Info

Publication number
TWM533315U
TWM533315U TW105212879U TW105212879U TWM533315U TW M533315 U TWM533315 U TW M533315U TW 105212879 U TW105212879 U TW 105212879U TW 105212879 U TW105212879 U TW 105212879U TW M533315 U TWM533315 U TW M533315U
Authority
TW
Taiwan
Prior art keywords
package module
waterproof package
waterproof
module
package
Prior art date
Application number
TW105212879U
Other languages
English (en)
Inventor
Shao-Pin Ru
Zzu-Chi Chiu
Original Assignee
Tong Hsing Electronic Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tong Hsing Electronic Industries Ltd filed Critical Tong Hsing Electronic Industries Ltd
Priority to TW105212879U priority Critical patent/TWM533315U/zh
Publication of TWM533315U publication Critical patent/TWM533315U/zh

Links

Classifications

    • H10W72/01515
    • H10W72/075
    • H10W72/884
    • H10W90/754
TW105212879U 2016-08-24 2016-08-24 Waterproof package module TWM533315U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105212879U TWM533315U (en) 2016-08-24 2016-08-24 Waterproof package module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105212879U TWM533315U (en) 2016-08-24 2016-08-24 Waterproof package module

Publications (1)

Publication Number Publication Date
TWM533315U true TWM533315U (en) 2016-12-01

Family

ID=58225966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105212879U TWM533315U (en) 2016-08-24 2016-08-24 Waterproof package module

Country Status (1)

Country Link
TW (1) TWM533315U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656611B (zh) * 2017-12-28 2019-04-11 黃斐琪 功率晶片覆晶封裝結構及其封裝方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656611B (zh) * 2017-12-28 2019-04-11 黃斐琪 功率晶片覆晶封裝結構及其封裝方法

Similar Documents

Publication Publication Date Title
GB2567047B (en) Optoelectronic module package
PL3373384T3 (pl) Moduł akumulatorowy
PL3379638T3 (pl) Moduł akumulatorowy
PL3340338T3 (pl) Moduł akumulatorowy
PL3312931T3 (pl) Moduł baterii
PL3331060T3 (pl) Moduł akumulatorowy
PT3475998T (pt) Módulo acumulador
GB2547157B (en) Waterproof backlight module
SG10201504271YA (en) Power module
PL3490025T3 (pl) Moduł akumulatora
EP3104411A4 (en) Semiconductor module
HUE060138T2 (hu) Akkumulátor modul
EP3113222A4 (en) Chip packaging module
SG10201508520PA (en) Power module
ZA201701778B (en) Chopping module
GB201511366D0 (en) Integrated circuit package
HUE053224T2 (hu) Akkumulátormodul
GB201700533D0 (en) Bumper module
AU201716398S (en) Power module
HUE060730T2 (hu) Akkumulátormodul
SG10201504273UA (en) Power module
HUE065260T2 (hu) Akkumulátormodul
GB201609781D0 (en) Secured chip
GB201601630D0 (en) Package
GB2565071B (en) Semiconductor module

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees