TWM533310U - Die package structure and die carrier thereof - Google Patents

Die package structure and die carrier thereof

Info

Publication number
TWM533310U
TWM533310U TW105211801U TW105211801U TWM533310U TW M533310 U TWM533310 U TW M533310U TW 105211801 U TW105211801 U TW 105211801U TW 105211801 U TW105211801 U TW 105211801U TW M533310 U TWM533310 U TW M533310U
Authority
TW
Taiwan
Prior art keywords
die
carrier
corners
foil layer
carrying surface
Prior art date
Application number
TW105211801U
Other languages
Chinese (zh)
Inventor
Nai-Shung Chang
Tsai-Sheng Chen
Original Assignee
Via Alliance Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Alliance Semiconductor Co Ltd filed Critical Via Alliance Semiconductor Co Ltd
Priority to TW105211801U priority Critical patent/TWM533310U/en
Priority to CN201621072389.1U priority patent/CN206098386U/en
Publication of TWM533310U publication Critical patent/TWM533310U/en

Links

Abstract

A die carrier includes a carrier and a cooper foil layer. The carrier has a die carrying surface, wherein a die junction region and a bonding pad array surrounding the die junction region are disposed on the die carrying surface. The bonding pad array includes a plurality of bonding pads. The die carrying surface has a plurality of first corners, wherein portions of the bonding pads nearby the first comers are ground bonding pads. The cooper foil layer covers the die carrying surface, wherein there is a gap between a border of the cooper foil layer and a border of the die carrying surface. The cooper foil layer includes a plurality of second corners and a plurality of tip structures. The second corners correspond to the first corners, and the tip structures are extended from the second corners, respectively. The ground bonding pads are covered by the cooper foil layer. Moreover, a die package structure having the die carrier is also provided.
TW105211801U 2016-08-04 2016-08-04 Die package structure and die carrier thereof TWM533310U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105211801U TWM533310U (en) 2016-08-04 2016-08-04 Die package structure and die carrier thereof
CN201621072389.1U CN206098386U (en) 2016-08-04 2016-09-22 Die package structure and die carrier thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105211801U TWM533310U (en) 2016-08-04 2016-08-04 Die package structure and die carrier thereof

Publications (1)

Publication Number Publication Date
TWM533310U true TWM533310U (en) 2016-12-01

Family

ID=58225961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105211801U TWM533310U (en) 2016-08-04 2016-08-04 Die package structure and die carrier thereof

Country Status (2)

Country Link
CN (1) CN206098386U (en)
TW (1) TWM533310U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111730161B (en) * 2020-06-30 2021-06-22 安徽安美半导体有限公司 Copper particle double-side pre-welding device and welding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111730161B (en) * 2020-06-30 2021-06-22 安徽安美半导体有限公司 Copper particle double-side pre-welding device and welding method

Also Published As

Publication number Publication date
CN206098386U (en) 2017-04-12

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