TWM533310U - Die package structure and die carrier thereof - Google Patents
Die package structure and die carrier thereofInfo
- Publication number
- TWM533310U TWM533310U TW105211801U TW105211801U TWM533310U TW M533310 U TWM533310 U TW M533310U TW 105211801 U TW105211801 U TW 105211801U TW 105211801 U TW105211801 U TW 105211801U TW M533310 U TWM533310 U TW M533310U
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- carrier
- corners
- foil layer
- carrying surface
- Prior art date
Links
Abstract
A die carrier includes a carrier and a cooper foil layer. The carrier has a die carrying surface, wherein a die junction region and a bonding pad array surrounding the die junction region are disposed on the die carrying surface. The bonding pad array includes a plurality of bonding pads. The die carrying surface has a plurality of first corners, wherein portions of the bonding pads nearby the first comers are ground bonding pads. The cooper foil layer covers the die carrying surface, wherein there is a gap between a border of the cooper foil layer and a border of the die carrying surface. The cooper foil layer includes a plurality of second corners and a plurality of tip structures. The second corners correspond to the first corners, and the tip structures are extended from the second corners, respectively. The ground bonding pads are covered by the cooper foil layer. Moreover, a die package structure having the die carrier is also provided.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105211801U TWM533310U (en) | 2016-08-04 | 2016-08-04 | Die package structure and die carrier thereof |
CN201621072389.1U CN206098386U (en) | 2016-08-04 | 2016-09-22 | Die package structure and die carrier thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105211801U TWM533310U (en) | 2016-08-04 | 2016-08-04 | Die package structure and die carrier thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM533310U true TWM533310U (en) | 2016-12-01 |
Family
ID=58225961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105211801U TWM533310U (en) | 2016-08-04 | 2016-08-04 | Die package structure and die carrier thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN206098386U (en) |
TW (1) | TWM533310U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111730161B (en) * | 2020-06-30 | 2021-06-22 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
-
2016
- 2016-08-04 TW TW105211801U patent/TWM533310U/en unknown
- 2016-09-22 CN CN201621072389.1U patent/CN206098386U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111730161B (en) * | 2020-06-30 | 2021-06-22 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
Also Published As
Publication number | Publication date |
---|---|
CN206098386U (en) | 2017-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD812063S1 (en) | Overlay | |
WO2012138868A3 (en) | Exposed die package for direct surface mounting | |
GB2501019A (en) | A multi-chip package having a substrate with a plurality of vertically-embedded die and process of forming the same | |
EP3091571A3 (en) | Fan-out package structure including an antenna or a conductive shielding layer | |
IN2014CN04680A (en) | ||
SG10201803738UA (en) | Semiconductor device | |
USD746240S1 (en) | LED package | |
TW201614789A (en) | Semiconductor device and method of forming pad layout for flipchip semiconductor die | |
SG10201805946SA (en) | Semiconductor package | |
WO2012109050A3 (en) | Junction termination structures including guard ring extensions and methods of fabricating electronic devices incorporating same | |
JP2013247131A5 (en) | Semiconductor device | |
TW201613049A (en) | Semiconductor package and method of manufacture | |
TW201613142A (en) | Light-emitting unit and semiconductor light-emitting device | |
SG11201907932UA (en) | Semiconductor memory device | |
SG10201805091VA (en) | Semiconductor package and method of manufacturing the same | |
JP2015076617A5 (en) | ||
MY165666A (en) | Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame | |
WO2016081318A3 (en) | Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield | |
TW201712845A (en) | Electronic device | |
TW201614777A (en) | Techniques and configurations associated with a package load assembly | |
MY184608A (en) | Pre-molded integrated circuit packages | |
PH12018502443A1 (en) | Fabry-perot interference filter and production method for fabry-perot interference filter | |
WO2012159029A3 (en) | Tape having pattern of adhesive layers | |
SG195124A1 (en) | Semiconductor device | |
SG10201805511TA (en) | Semiconductor packages |