TWM532565U - Biological test chip - Google Patents
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- TWM532565U TWM532565U TW105211983U TW105211983U TWM532565U TW M532565 U TWM532565 U TW M532565U TW 105211983 U TW105211983 U TW 105211983U TW 105211983 U TW105211983 U TW 105211983U TW M532565 U TWM532565 U TW M532565U
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Description
本新型為有關一種檢測試片,尤指一種生物檢測試片。The present invention relates to a test strip, and more particularly to a bioassay strip.
醫療的進步雖然使得人們的壽命較以往延長了不少,但慢性病卻逐漸取代傳染疾病,成為人類死亡的主要原因之一,因此,藉由檢測人體內之血糖、膽固醇、尿酸等數值,可進一步判斷生物體是否有潛在的慢性疾病,除此之外,亦可對蛋白質、DNA等進行相關檢測,而可以應用於各種生物數值的檢測。Although medical progress has made people's lifespan much longer than before, chronic diseases have gradually replaced infectious diseases and become one of the main causes of human death. Therefore, by detecting blood sugar, cholesterol, uric acid and other values in the human body, further To determine whether a organism has a potential chronic disease, in addition to protein, DNA, etc., it can be applied to the detection of various biological values.
常見的居家型檢測用具主要可以分成檢測機台以及供檢測機台檢測的試片,將待測物質與試片接觸後,檢測機台即可以進行快速的檢測,而常見的檢測試片如美國專利第US 9039877號之「Electrode strip and sensor strip and manufacture method thereof and system thereof」,包含有一第一基板、一設置於該第一基板的第一電極組、一設置於該第一電極組的第一絕緣層、一設置於該第一絕緣層的第二基板、一設置於該第二基板的第二電極組以及一設置於該第二電極組的第二絕緣層,該第一絕緣層包含一第一凹槽,該第二基板包含一取樣口及一孔洞,其中該取樣口設置於該第二基板之外緣,該孔洞設置於該第二基板之內部,該第二電極組不形成該孔洞,該第二絕緣層包含一第二凹槽,其中該孔洞垂直連通該第一凹槽及該第二凹槽。The common home-type testing tools can be mainly divided into a testing machine and a test piece for testing by the testing machine. After the test substance is in contact with the test piece, the testing machine can perform rapid detection, and common testing pieces such as the United States. The "Electrode strip and sensor strip and manufacture method thereof and system thereof" includes a first substrate, a first electrode group disposed on the first substrate, and a first electrode group disposed on the first electrode group. An insulating layer, a second substrate disposed on the first insulating layer, a second electrode group disposed on the second substrate, and a second insulating layer disposed on the second electrode group, the first insulating layer comprising a first recess, the second substrate includes a sampling port and a hole, wherein the sampling port is disposed at an outer edge of the second substrate, the hole is disposed inside the second substrate, and the second electrode group is not formed The second insulating layer includes a second recess, wherein the hole vertically communicates with the first recess and the second recess.
而於其中,該第一電極組與該第二電極組的材料為金膠,且為利用網版印刷的方式製作而成,然而,眾所皆知的,金的價格較為昂貴,於進行網版印刷時,會使大量的金膠殘留於網版上,而導致成本上升,且網版印刷容易發生塞板的問題,而導致厚度不均勻,此外,每一批印刷完成的基板進行烘烤時,其烘烤溫度會有所不同,進而影響到金的結晶效果,導致電阻不同,而影響量測的準確度。因此,如何降低成本、精準地控制金層的厚度以及提高量測的準確度,實為一大課題。Wherein, the material of the first electrode group and the second electrode group is gold glue, and is made by screen printing, however, it is well known that the price of gold is relatively expensive. When printing, a large amount of gold glue will remain on the screen, which will lead to an increase in cost, and screen printing is prone to the problem of plugging, resulting in uneven thickness. In addition, each batch of printed substrates is baked. At the same time, the baking temperature will be different, which will affect the crystallization effect of gold, resulting in different electrical resistance and affecting the accuracy of the measurement. Therefore, how to reduce the cost, accurately control the thickness of the gold layer and improve the accuracy of the measurement is a major issue.
本新型的主要目的,在於解決利用網版印刷形成電極的方式成本高、無法精準地控制金層的厚度以及量測準確度低的問題。The main purpose of the novel is to solve the problem that the method of forming an electrode by screen printing is costly, the thickness of the gold layer cannot be accurately controlled, and the measurement accuracy is low.
為達上述目的,本新型提供一種生物檢測試片,包含有一基板、一電極、一第一鎳層、一第一金層,該基板包含有一檢測部以及一量測部,該電極設置於該基板上,並包含有一工作電極、一參考電極以及一輔助電極,該工作電極具有一位於該檢測部的第一工作端以及一位於該量測部的第一讀取端,該第一鎳層形成於該第一工作端遠離該基板之一側,該第一金層利用化鎳浸金的方式而形成於該第一鎳層遠離該基板之一側。In order to achieve the above object, the present invention provides a bio-detection test piece comprising a substrate, an electrode, a first nickel layer, and a first gold layer, the substrate comprising a detecting portion and a measuring portion, wherein the electrode is disposed on the substrate On the substrate, and including a working electrode, a reference electrode and an auxiliary electrode, the working electrode has a first working end located at the detecting portion and a first reading end located at the measuring portion, the first nickel layer The first gold layer is formed on the side of the first working end away from the substrate, and the first gold layer is formed by the nickel immersion gold on the side of the first nickel layer away from the substrate.
綜上所述,本新型利用化鎳浸金的方式,在該第一鎳層放出電子的同時,使金形成於該第一鎳層上,而可以減少金的浪費,以降低成本,並可以精準地控制該第一金層的厚度,此外,無須進行烘烤的步驟,而可以使電阻一致,提高量測的準確度。In summary, the new method utilizes nickel immersion gold to form gold on the first nickel layer while the first nickel layer emits electrons, thereby reducing gold waste and reducing cost. The thickness of the first gold layer is precisely controlled, and in addition, the step of baking is not required, and the electric resistance can be made uniform, and the accuracy of the measurement can be improved.
有關本新型的詳細說明及技術內容,現就配合圖式說明如下:The detailed description and technical content of this new model are described below with the following diagram:
請參閱「圖1」及「圖2」所示,本新型為一種生物檢測試片,包含有一基板10、一電極20、一第一鎳層31、一第一金層41,該基板10包含有一檢測部11以及一量測部12,該電極20設置於該基板10上,並包含有一工作電極21、一參考電極22以及一輔助電極23,該工作電極21具有一位於該檢測部11的第一工作端211以及一位於該量測部12的第一讀取端212,該參考電極22具有一位於該檢測部11的第二工作端221以及一位於該量測部12的第二讀取端222,該輔助電極23具有一位於該檢測部11的第三工作端231以及一位於該量測部12的第三讀取端232,而該第一鎳層31形成於該第一工作端211遠離該基板10之一側,該第一金層41為利用化鎳浸金的方式而形成於該第一鎳層31遠離該基板10之一側。其中,該電極20的材質為銅,而該第一金層41的厚度為3微英寸(μin)以上。如此,利用化鎳浸金的方式,可以減少金的浪費,以降低成本,並可以精準地控制該第一金層41的厚度,且無須進行烘烤,而可以使電阻一致,提高量測的準確度。Referring to FIG. 1 and FIG. 2, the present invention is a bioassay test piece comprising a substrate 10, an electrode 20, a first nickel layer 31, and a first gold layer 41. The substrate 10 includes A detecting portion 11 and a measuring portion 12 are disposed on the substrate 10 and include a working electrode 21, a reference electrode 22 and an auxiliary electrode 23. The working electrode 21 has a detecting portion 11 a first working end 211 and a first reading end 212 of the measuring portion 12, the reference electrode 22 has a second working end 221 at the detecting portion 11 and a second reading at the measuring portion 12. The auxiliary electrode 23 has a third working end 231 located at the detecting portion 11 and a third reading end 232 located at the measuring portion 12, and the first nickel layer 31 is formed in the first working The end 211 is away from one side of the substrate 10, and the first gold layer 41 is formed on the side of the first nickel layer 31 away from the substrate 10 by means of immersion gold. The material of the electrode 20 is copper, and the thickness of the first gold layer 41 is 3 microinches (μin) or more. In this way, by using nickel immersion gold, the waste of gold can be reduced, the cost can be reduced, and the thickness of the first gold layer 41 can be precisely controlled without baking, and the resistance can be made uniform, and the measurement can be improved. Accuracy.
而於本實施例中,更包含有一第二鎳層32、一第二金層42、一第二導電層52、一第三鎳層33、一第三金層43以及一第三導電層53,該第二鎳層32、該第二金層42與該第二導電層52為依序設置於該第二工作端221遠離該基板10之一側,該第三鎳層33、該第三金層43以及該第三導電層53為依序設置於該第三工作端231遠離該基板10之一側,而若為了進一步降低成本,該第二鎳層32、該第二金層42、該第三鎳層33、該第三金層43亦可以省略,直接於該第二工作端221與該第三工作端231遠離該基板10之一側分別形成該第二導電層52與該第三導電層53。而該第二導電層52的材質可以為銀、氯化銀及其組合,該第三導電層53的材質可以為碳、白金或其組合。In this embodiment, a second nickel layer 32, a second gold layer 42, a second conductive layer 52, a third nickel layer 33, a third gold layer 43, and a third conductive layer 53 are further included. The second nickel layer 32, the second gold layer 42 and the second conductive layer 52 are sequentially disposed on a side of the second working end 221 away from the substrate 10, the third nickel layer 33, the third The gold layer 43 and the third conductive layer 53 are sequentially disposed on a side of the third working end 231 away from the substrate 10, and if the cost is further reduced, the second nickel layer 32, the second gold layer 42, The third nickel layer 33 and the third gold layer 43 may be omitted, and the second conductive layer 52 and the first portion are formed directly from the second working end 221 and the third working end 231 away from the substrate 10 Three conductive layers 53. The material of the second conductive layer 52 may be silver, silver chloride or a combination thereof, and the material of the third conductive layer 53 may be carbon, platinum or a combination thereof.
此外,本實施例更可以設置一絕緣層60,該絕緣層60設置於該基板10上且相鄰於該電極20,並與該電極20、該第一鎳層31以及該第一金層41的外圍接觸,且覆蓋住該第一金層41遠離該第一鎳層31之一側的周圍,如此,可以防止該第一鎳層31、該電極20的露出,而影響量測的精準度。In addition, the present embodiment further provides an insulating layer 60 disposed on the substrate 10 adjacent to the electrode 20, and the electrode 20, the first nickel layer 31, and the first gold layer 41. The peripheral contact contacts and covers the periphery of the first gold layer 41 away from the side of the first nickel layer 31. Thus, the exposure of the first nickel layer 31 and the electrode 20 can be prevented, thereby affecting the accuracy of measurement. .
續搭配參閱「圖3A」至「圖3F」,為本新型的製作流程,為清楚表示,係利用「圖1」之A-A剖面來進行示意,如「圖3A」所示,先於該基板10上形成該電極20,接著,如「圖3B」所示,可以先於該基板10上相鄰該電極20處形成該絕緣層60之一下絕緣部61,而後,如「圖3C」所示,分別形成該第一鎳層31、該第二鎳層32、該第三鎳層33於該第一工作端211、該第二工作端221及該第三工作端231上,再如「圖3D」所示,利用化鎳浸金的方式,分別形成該第一金層41、該第二金層42、該第三金層43於該第一鎳層31、該第二鎳層32、該第三鎳層33之上。化鎳浸金為浸入低濃度的金溶液中,透過該第一鎳層31、該第二鎳層32、該第三鎳層33丟出電子的同時,將金沉積於其上。Continued collocation Referring to "FIG. 3A" to "FIG. 3F", the manufacturing process of the present invention is clearly indicated by the AA cross-section of FIG. 1 as shown in FIG. 3A before the substrate 10 The electrode 20 is formed thereon. Then, as shown in FIG. 3B, a lower insulating portion 61 of the insulating layer 60 may be formed adjacent to the electrode 20 on the substrate 10, and then, as shown in FIG. 3C, Forming the first nickel layer 31, the second nickel layer 32, and the third nickel layer 33 on the first working end 211, the second working end 221, and the third working end 231, respectively, as shown in FIG. 3D The first gold layer 41, the second gold layer 42, and the third gold layer 43 are formed on the first nickel layer 31 and the second nickel layer 32 by means of nickel immersion gold. Above the third nickel layer 33. The nickel immersion gold is immersed in a low concentration gold solution, and gold is deposited thereon while the first nickel layer 31, the second nickel layer 32, and the third nickel layer 33 are ejected with electrons.
續參閱「圖3E」所示,於該第二金層42遠離該基板10之一側形成該第二導電層52,並於該第三金層43遠離該基板10之一側形成該第三導電層53,最後,如「圖3F」所示,於下絕緣部61上形成該絕緣層60之一上絕緣部62,而使該絕緣層60與該電極20、該第一鎳層31以及該第一金層41的外圍接觸,並覆蓋住該第一金層41遠離該第一鎳層31之一側的周圍。本實施例中,該絕緣層60亦一併覆蓋住該第二導電層52與該第三導電層53遠離該基板10之一側的周圍。此外,亦可以不分別形成該下絕緣部61與該上絕緣部62,而直接形成該絕緣層60。Continuing to refer to FIG. 3E, the second conductive layer 52 is formed on a side of the second gold layer 42 away from the substrate 10, and the third conductive layer 52 is formed on a side of the third gold layer 43 away from the substrate 10. The conductive layer 53 and finally, as shown in FIG. 3F, an insulating portion 62 of the insulating layer 60 is formed on the lower insulating portion 61, and the insulating layer 60 and the electrode 20, the first nickel layer 31, and The periphery of the first gold layer 41 contacts and covers the periphery of the first gold layer 41 away from the side of the first nickel layer 31. In this embodiment, the insulating layer 60 also covers the periphery of the second conductive layer 52 and the third conductive layer 53 away from the side of the substrate 10. Further, the insulating layer 60 may be directly formed without separately forming the lower insulating portion 61 and the upper insulating portion 62.
綜上所述,本新型具有以下特點:In summary, the new model has the following characteristics:
一、 藉由利用化鎳浸金的方式,可以減少金的浪費,以降低成本,並可以精準地控制該第一金層的厚度,且無須進行烘烤,而可以使電阻一致,提高量測的準確度。1. By using nickel immersion gold, the waste of gold can be reduced to reduce the cost, and the thickness of the first gold layer can be precisely controlled without baking, and the resistance can be made uniform, and the measurement can be improved. Accuracy.
二、 藉由該絕緣層的設置,可以防止該第一鎳層、該電極的露出,而影響量測的精準度。2. The arrangement of the insulating layer prevents the first nickel layer and the electrode from being exposed, thereby affecting the accuracy of the measurement.
因此本新型極具進步性及符合申請新型專利的要件,爰依法提出申請,祈 鈞局早日賜准專利,實感德便。Therefore, this new type is highly progressive and meets the requirements for applying for a new type of patent. It is required to apply in accordance with the law, and the Bureau of Health will grant patents as soon as possible.
以上已將本新型做一詳細說明,惟以上所述者,僅爲本新型的一較佳實施例而已,當不能限定本新型實施的範圍。即凡依本新型申請範圍所作的均等變化與修飾等,皆應仍屬本新型的專利涵蓋範圍內。The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited. That is, the equal changes and modifications made in accordance with the scope of this new application shall remain within the scope of the patent of this new type.
10‧‧‧基板
11‧‧‧檢測部
12‧‧‧量測部
20‧‧‧電極
21‧‧‧工作電極
211‧‧‧第一工作端
212‧‧‧第一讀取端
22‧‧‧參考電極
221‧‧‧第二工作端
222‧‧‧第二讀取端
23‧‧‧輔助電極
231‧‧‧第三工作端
232‧‧‧第三讀取端
31‧‧‧第一鎳層
32‧‧‧第二鎳層
33‧‧‧第三鎳層
41‧‧‧第一金層
42‧‧‧第二金層
43‧‧‧第三金層
52‧‧‧第二導電層
53‧‧‧第三導電層
60‧‧‧絕緣層
61‧‧‧下絕緣部
62‧‧‧上絕緣部10‧‧‧Substrate
11‧‧‧Detection Department
12‧‧‧Measurement Department
20‧‧‧ electrodes
21‧‧‧Working electrode
211‧‧‧ first working end
212‧‧‧First reading end
22‧‧‧ reference electrode
221‧‧‧Second working end
222‧‧‧second reading end
23‧‧‧Auxiliary electrode
231‧‧‧ Third working end
232‧‧‧ third read end
31‧‧‧First nickel layer
32‧‧‧Second nickel layer
33‧‧‧ Third nickel layer
41‧‧‧First gold layer
42‧‧‧Second gold layer
43‧‧‧ third gold layer
52‧‧‧Second conductive layer
53‧‧‧ Third conductive layer
60‧‧‧Insulation
61‧‧‧ Lower insulation
62‧‧‧Upper insulation
圖1,為本新型一較佳實施例的立體結構示意圖。 圖2,為圖1之A-A剖面示意圖。 圖3A~3F,為本新型一較佳實施例的製作流程示意圖。FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention. Figure 2 is a cross-sectional view taken along line A-A of Figure 1. 3A-3F are schematic views showing the manufacturing process of a preferred embodiment of the present invention.
10‧‧‧基板 10‧‧‧Substrate
11‧‧‧檢測部 11‧‧‧Detection Department
12‧‧‧量測部 12‧‧‧Measurement Department
20‧‧‧電極 20‧‧‧ electrodes
21‧‧‧工作電極 21‧‧‧Working electrode
211‧‧‧第一工作端 211‧‧‧ first working end
212‧‧‧第一讀取端 212‧‧‧First reading end
22‧‧‧參考電極 22‧‧‧ reference electrode
221‧‧‧第二工作端 221‧‧‧Second working end
222‧‧‧第二讀取端 222‧‧‧second reading end
23‧‧‧輔助電極 23‧‧‧Auxiliary electrode
231‧‧‧第三工作端 231‧‧‧ Third working end
232‧‧‧第三讀取端 232‧‧‧ third read end
41‧‧‧第一金層 41‧‧‧First gold layer
52‧‧‧第二導電層 52‧‧‧Second conductive layer
53‧‧‧第三導電層 53‧‧‧ Third conductive layer
60‧‧‧絕緣層 60‧‧‧Insulation
Claims (10)
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Cited By (1)
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TWI706131B (en) * | 2019-08-26 | 2020-10-01 | 臺灣塑膠工業股份有限公司 | Urine testing strip and urine testing system |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI706131B (en) * | 2019-08-26 | 2020-10-01 | 臺灣塑膠工業股份有限公司 | Urine testing strip and urine testing system |
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