TWM532095U - Movable pallet device for production line - Google Patents

Description

Mobile carrier device for production line

The present invention relates to a carrier device, and more particularly to a portable carrier device for a production line.

The U.S. Patent No. 6,344,106 B1 Approved Publication No. (hereinafter referred to as the prior) discloses a technique for improving the uniformity of the etching rate. Referring to Figure 1, the previous example is to improve the etch rate through the electrostatic chuck unit 1 shown in Figure 1. In detail, the electrostatic chuck unit 1 is disposed in a wafer processing chamber 20 of a plasma processing apparatus 2 and is used as a carrier to be processed. The carrier of the wafer 21 is also used as an electrode for igniting a plasma. When the etching is actually performed, a reactive gas (not shown) is introduced into the wafer processing chamber 20, and the electrostatic chuck unit (ie, the electrode) 1 and the wafer processing chamber 20 are disposed. The other electrode (not shown) provides a radio frequency (hereinafter referred to as RF) power source (not shown) to cleave the reaction gas into the plasma.

As shown in FIG. 1, the electrostatic chuck unit 1 includes an electrostatic chuck 11 provided with the RF power source (not shown), an inner edge annular member 12, and an outer edge annular member 13. The electrostatic chuck 11 has a base portion 111 fixed to a bottom wall of the wafer processing chamber 20, and a protruding upward from a top edge of the base portion 111 for carrying the wafer to be processed. The carrying portion 112 of the 21 and the base portion 111 and the carrying portion 112 define a notch 113.

The inner edge annular member 12 is disposed on the notch 113 of the electrostatic chuck 11 and surrounds a periphery of the carrier portion 112 and a periphery of the wafer 21 to be processed. The outer edge annular member 13 surrounds the peripheral edge of the base portion 111 of the electrostatic chuck 11 and the inner edge annular member 12. In the foregoing case, the inner edge annular member 12 and the outer edge annular member 13 are formed of an insulating material or a dielectric material, and the inner edge annular member 12 is insulated from the outer edge annular member 13 by the inner edge annular member 12. The characteristics are such that RF coupling is formed and a plasma sheath 22 adjacent to one surface of the wafer 21 to be processed is uniformly distributed.

The electrostatic chuck unit 1 disclosed in the foregoing case can improve the uniformity of the etching rate; however, the electrostatic chuck 11 is fixed to the bottom wall of the wafer processing chamber 20. In other words, the electrostatic chuck unit 1 used as an electrode and used as a carrier for carrying the wafer 21 to be processed is only suitable for a plasma etching apparatus fixed to a single cavity type, which is difficult to apply to a wide range. A plasma etching apparatus for a batch production line or an in-line production line used in related industries such as semiconductors and optical coatings at the present stage.

As can be seen from the above description, improving the structure of the tray device for use in a production line and thereby reducing the production time of the related industries such as semiconductors and optical coatings is a problem to be solved by those skilled in the art.

Accordingly, it is an object of the present invention to provide a portable carrier device for a production line.

Therefore, the movable tray device for the production line of the present invention is for carrying a substrate to be processed and moving on a conveying mechanism in a production line, which comprises a metal carrier plate, an electrode plate, and an insulation unit. . The metal carrier is movably located on the transport mechanism and includes at least one perforation. The electrode plate is disposed on the metal carrier plate and carries the substrate to be processed. The electrode plate has at least one perforation facing the metal carrier and is exposed to a power loading region outside the perforation of the metal carrier. The insulating unit is disposed on the metal carrier plate and sandwiched between the metal carrier plate and the electrode plate, and surrounds a peripheral edge of the electrode plate and a peripheral edge of the substrate to be processed. The insulating unit has at least one through hole communicating with the through hole of the metal plate and exposing the power loading region of the electrode plate.

The effect of the present invention is to enhance the standby by the auxiliary plasma across the upper surface of the substrate to be processed by the metal carrier and the insulating unit when the upper surface of one of the substrates to be processed is subjected to a plasma etching process. The uniformity of the surface treatment of the substrate is processed; in addition, the movable carrier device of the present invention can move the substrate to be processed on the conveying mechanism in the production line, and can be widely used in the related industries such as semiconductor and optical coating at present. The use of batch production lines or continuous production lines is conducive to reducing the production man-hours of semiconductors, optical coatings and other related industries.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

As shown in FIG. 2 and FIG. 3, a first embodiment of the movable tray device C for a production line of the present invention is for carrying a substrate to be processed 7 and transmitting it in a continuous production line 9. The mechanism 92 moves. In detail, the continuous production line 9 has a cavity unit 91 and the transfer mechanism 92 disposed in the cavity unit 91. The cavity unit 91 has a loading cavity 911, an etching chamber 912, a sputtering chamber 913, and an unloading cavity 914 in a transport direction X. A plurality of transport assemblies 921 of the transport mechanism 92 are disposed in each of the cavities 911, 912, 913, and 914. The movable tray device C is a plurality of rollers 922 passing through each group of conveying assemblies 921, and enters the loading chamber 911 from an inlet end 901 of the loading chamber 911, and the direction is along the conveying direction X. The mobile substrate device C carries the substrate 7 to be processed thereon to be sequentially moved to the etching chamber 912 to apply a plasma etching process and the sputtering chamber 913 to apply a coating process ( The coating process and the removable tray device C are moved out of the continuous line 9 at an outlet end 902 of the unloading chamber 914. The first embodiment of the present invention is described by taking the continuous production line 9 as an example, but is not limited thereto.

It should be noted that, in the movable tray device C of the first embodiment of the present invention, the coating process is performed multiple times in the sputtering chamber 913 to accumulate the surface of the surface. The coating may still be removed from the exit end 902 of the unloading cavity 914 after completion of the coating process to remove the coating deposited on the surface of the movable carrier device C by appropriate means.

Referring to FIG. 4, FIG. 5 and FIG. 6, the movable carrier device C of the first embodiment of the present invention comprises a metal carrier plate 3, an electrode plate 4, an insulation unit 5, and three metal conductors 6.

The metal carrier 3 is movably located on the transport mechanism (see Fig. 2) 92 and includes three perforations 30.

The electrode plate 4 is disposed on the metal carrier 3 and carries the substrate 7 to be processed. The electrode plate 4 includes a peripheral edge 41, a carrying portion 42 and a base portion 43. The carrying portion 42 is configured to carry the substrate 7 to be processed, and has a peripheral edge region 421 and a bottom edge region 422 that are connected to each other. The base portion 43 extends outward from the bottom edge region 422 of the carrier portion 42 of the electrode plate 4 and has three power loading regions 431 and a peripheral edge region 432. Each of the power loading regions 431 of the electrode plate 4 corresponds to each of the through holes 30 facing the metal carrier 3 and corresponding to the respective through holes 30 exposed to the metal carrier 3. The peripheral edge portion 421 of the carrier portion 42 and the peripheral edge region 432 of the base portion 43 define the peripheral edge 41 of the electrode plate 4.

The insulating unit 5 is disposed on the metal carrier 3 and sandwiched between the metal carrier 3 and the electrode plate 4 and surrounds the peripheral edge 41 of the electrode plate 4 and the peripheral edge of the substrate 7 to be processed. The insulating unit 5 includes an insulating plate 51 and an insulating frame 52. The insulating plate 51 has a base portion 511 and a frame portion 512. The base portion 511 of the insulating plate 51 is interposed between the metal carrier plate 3 and the base portion 43 of the electrode plate 4, and has three through holes 510. Each of the through holes 510 of the base portion 511 of the insulating plate 51 is corresponding to each of the through holes 30 of the metal carrier plate 3, and corresponding to each of the power loading regions 431 of the electrode plate 4. The frame portion 512 of the insulating plate 51 protrudes upward from a peripheral edge of the base portion 511 of the insulating plate 51, so that the insulating plate 51 is formed with a recess 513 for accommodating the electrode plate 4, and the insulating plate 51 is A height of the frame portion 512 is higher than a height of the bearing portion 42 of the electrode plate 4, so that the frame portion 512 of the insulating plate 51 and the carrying portion 42 of the electrode plate 4 jointly define an insulating frame. An annular space of 52, and a height of the insulating frame 52 is sufficient to surround the circumference of the substrate 7 to be processed. In order to save the material cost of the movable carrier device C of the first embodiment of the present invention, preferably, the insulating plate 51 is made of glass, and the insulating frame 52 is made of quartz.

The metal conductors 6 are for introducing power into the power supply, and each of the metal conductors 6 is corresponding to each of the through holes 510 of the insulating plate 51 of the metal plate 3 and the insulating plate 5 of the insulating unit 5, and correspondingly contacts the electrode. Each power source of the board 4 is loaded into the area 431. In the first embodiment of the present invention, each of the metal conductors 6 is inserted through the plurality of bolts 61 from the lower surface of the metal conductor 6 toward the respective power loading regions 431 of the electrode plate 4, so that the metal conductors 6 are Corresponding to each power loading region 431 contacting the electrode plate 4.

More specifically, as shown in FIG. 6, the first embodiment of the present invention provides an RF power supply to each of the metal conductors 6 and grounds the metal carrier 3 so that the substrate 7 to be processed is in the etching cavity. When the plasma etching process is performed in 912, an electric field generated between the electrode plate 4 and another electrode plate (not shown) in the etching cavity 912 is prevented from being formed on the lower surface of the electrode plate 4, and The electric field is uniformly concentrated on an upper surface of the substrate 7 to be processed.

Referring to FIG. 7, a second embodiment of the movable tray device C for a production line of the present invention is substantially the same as the first embodiment, and the difference lies in the second embodiment of the present invention. The height of the frame portion 512 of the insulating plate 51 is substantially higher than a height of the base portion 43 of the electrode plate 4. The insulating frame 52 of the insulating unit 5 is disposed at a peripheral portion 432 of the base portion 43 of the electrode plate 4. It is on the frame portion 52 of the insulating plate 51. In the second embodiment of the present invention, the insulating frame 52 of the insulating unit 5 is a flat plate having a thickness equal to that.

Referring to FIG. 8, a third embodiment of the movable tray device C for a production line of the present invention is substantially the same as the second embodiment, and the difference lies in the third embodiment of the present invention. The thickness of the insulating frame 52 of the insulating unit 5 is decreased toward the electrode plate 4.

Referring to FIG. 9, FIG. 6 and FIG. 1, a potential distribution diagram of the first embodiment of the present invention is shown, which is simulated by numerical simulation to simulate the movable carrier device C of the first embodiment. The environment of the program is obtained. As shown in FIG. 9 , FIG. 6 and FIG. 1 , the potential distribution is decreased from the center of the substrate 7 to be processed and its upper surface toward the periphery and upward thereof; however, the periphery of the substrate 7 to be processed and the electrode plate The peripheral edge 41 of 4 is surrounded by the insulating unit 5, so that the decreasing potential is distributed around the periphery of the insulating unit 5, so that the potential distributed on the upper surface of the substrate 7 to be processed is uniform and approaches 500 V. Moreover, the electrode plate 4 is disposed on the grounded metal plate 3 such that a potential of a high potential is not distributed under the electrode plate 4, and it is confirmed that the electric field can be concentrated on the upper surface of the substrate 7 to be processed. To provide a uniform electric field. It should be added here that when the plasma etching process is actually implemented, the potential can reach several kV according to actual needs; therefore, the present invention is only described by taking 500 V as an example, and is not limited thereto.

According to the detailed description of the numerical simulation of the various embodiments of the present invention and the first embodiment, the first embodiment of the present invention can not only make the upper surface of the substrate 7 to be processed because of the metal carrier 3 and the insulating unit 5 thereof. When the plasma etching process is performed in the etching cavity 912, the auxiliary plasma traverses the upper surface of the substrate 7 to be processed to improve the uniformity of the surface treatment of the substrate 7 to be processed; further, the novel embodiments of the present invention The movable tray device C can be sequentially moved along the transport direction X in the transport mechanism 92 in the continuous production line 9 through the loading chamber 911, the etching chamber 912, and the sputtering chamber 913. The unloading cavity 914 is used in a continuous production line which is widely used in industries such as semiconductors and optical coatings at present, and is advantageous for reducing the production man-hours of semiconductors, optical coatings and the like.

In summary, the movable tray device C for the production line of the present invention can not only allow the upper surface of the substrate 7 to be processed to align across the substrate 7 to be processed when the plasma etching process is performed. The surface is used to improve the uniformity of the surface treatment of the substrate 7 to be processed, and the substrate to be processed 7 can be moved along the transport direction X on the transport mechanism 92 in the continuous type production line 9 for the current stage of use in the industry. The use of batch production lines or continuous production lines reduces the production time required for semiconductor, optical coating and other related industries. Therefore, the purpose of the present invention can be achieved.

However, the above is only a preferred embodiment of the present invention, and when it is not possible to limit the scope of the present invention, any simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification are It is still within the scope of this new patent.

C‧‧‧Removable carrier device
52‧‧‧Insulation frame
3‧‧‧Metal board
6‧‧‧Metal conductor
30‧‧‧Perforation
61‧‧‧ bolt
4‧‧‧Electrode plate
7‧‧‧Substrate to be processed
41‧‧‧ Periphery
9‧‧‧Continuous production line
42‧‧‧Loading Department
901‧‧‧ entrance end
421‧‧‧ Peripheral area
902‧‧‧export end
422‧‧‧Bottom area
91‧‧‧ cavity unit
43‧‧‧Base section
911‧‧‧Loading cavity
431‧‧‧Power loading area
912‧‧‧etching cavity
432‧‧‧ Peripheral area
913‧‧‧Sputter chamber
5‧‧‧Insulation unit
914‧‧‧Unloading the cavity
51‧‧‧Insulation board
92‧‧‧Transportation agency
510‧‧‧Perforation
921‧‧‧Transport components
511‧‧‧ base
922‧‧‧Roller
512‧‧‧ Frame Department
X‧‧‧Transfer direction
513‧‧‧ Groove

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a front elevational view showing a plasma processing apparatus disclosed in U.S. Patent No. 6,344,106, the disclosure of which is incorporated herein by reference. Figure 2 is a partial top plan view showing a first embodiment of the movable tray device of the present invention for use in a production line and a continuous production line used; Figure 3 is taken along line III-III of Figure 2 FIG. 4 is a perspective view showing the top view structure of the first embodiment of the present invention; FIG. 5 is a perspective view showing the new type of the first embodiment of the present invention; FIG. FIG. 6 is a side cross-sectional view taken along line VI-VI of FIG. 3, illustrating a detailed structure of the first embodiment of the present invention; FIG. 7 is a side cross-sectional view showing the present embodiment A second embodiment of a new type of portable carrier device for a production line; FIG. 8 is a side elevational cross-sectional view showing a third embodiment of the movable carrier device for a production line of the present invention; 9 is an electric potential distribution diagram illustrating the potential distribution of the first embodiment of the present invention.

3‧‧‧Metal board

30‧‧‧Perforation

4‧‧‧Electrode plate

41‧‧‧ Periphery

42‧‧‧Loading Department

421‧‧‧ Peripheral area

422‧‧‧Bottom area

43‧‧‧Base section

51‧‧‧Insulation board

510‧‧‧Perforation

511‧‧‧ base

512‧‧‧ Frame Department

513‧‧‧ Groove

52‧‧‧Insulation frame

6‧‧‧Metal conductor

61‧‧‧ bolt

431‧‧‧Power loading area

432‧‧‧ Peripheral area

5‧‧‧Insulation unit

7‧‧‧Substrate to be processed

912‧‧‧etching cavity

922‧‧‧Roller

Claims (8)

A movable tray device for a production line for carrying a substrate to be processed and moving on a conveying mechanism in a production line, comprising: a metal carrier plate movably located on the conveying mechanism and including At least one through hole; an electrode plate disposed on the metal carrier and carrying the substrate to be processed, the electrode plate having at least one hole facing the metal plate and exposed to the through hole of the metal plate And an insulating unit disposed on the metal carrier plate and sandwiched between the metal carrier plate and the electrode plate and surrounding a peripheral edge of the electrode plate and a peripheral edge of the substrate to be processed, the insulating unit having at least A perforation is communicated with the perforation of the metal plate and the perforation of the power loading region of the electrode plate is exposed. The movable tray device for a production line according to claim 1, further comprising a metal conductor for introducing a power source, the metal conductor being located in the through hole of the metal carrier and the through hole of the insulating unit Contacting the power loading region of the electrode plate. The movable tray device for a production line according to claim 1, wherein the electrode plate comprises a bearing portion and a base portion for carrying the substrate to be processed and having a circumference that is connected to each other a rim portion and a bottom edge region, the base portion extending outward from a bottom edge region of the bearing portion of the electrode plate and having the power loading region and the peripheral edge region, and a peripheral portion of the bearing portion and the base portion The peripheral zone collectively defines the circumference of the electrode plate. The movable tray device for a production line according to claim 3, wherein the insulating unit comprises an insulating plate and an insulating frame, the insulating plate has a base portion and a frame portion, and the base portion of the insulating plate a perforation sandwiched between the metal plate and the base portion of the electrode plate and having the insulating unit, the frame portion of the insulating plate protruding upward from a peripheral edge of the base of the insulating plate to form the insulating plate a recess for accommodating the electrode plate, and a height of the frame portion of the insulating plate is higher than a height of the bearing portion of the electrode plate, so that the frame portion of the insulating plate and the bearing portion of the electrode plate are common An annular space is provided for accommodating the insulating frame, and a height of the insulating frame is sufficient to surround a circumference of the substrate to be processed. The movable tray device for a production line according to claim 3, wherein the insulating unit comprises an insulating plate and an insulating frame, the insulating plate has a base portion and a frame portion, and the base portion of the insulating plate a perforation sandwiched between the metal plate and the base portion of the electrode plate and having the insulating unit, the frame portion of the insulating plate protruding upward from a peripheral edge of the base of the insulating plate to form the insulating plate a recess for accommodating the electrode plate, and a height of the frame portion of the insulating plate is substantially higher than a height of the base portion of the electrode plate, and the insulating frame of the insulating unit is disposed at the base portion of the electrode plate The peripheral portion is on the frame portion of the insulating plate, and a height of the insulating frame is sufficient to surround the periphery of the substrate to be processed. The movable tray device for a production line according to claim 5, wherein the insulating frame of the insulating unit is a flat plate having a thickness equal to that. The movable tray device for a production line according to Item 5, wherein the thickness of the insulating frame of the insulating unit is decreasing toward the electrode plate. The movable tray device for a production line according to any one of claims 4 to 7, wherein the insulating plate is made of glass, and the insulating frame is made of quartz.