TWM527806U - Laser machine table of dual surface processing - Google Patents

Description

Double-sided processing laser machine

This creation is about a laser machine, especially a double-sided laser machine.

Due to the development of touch technology, many electronic devices are currently equipped with touch screens. However, the sensing electrodes of the capacitive touch screen are formed by a chemical wet process, including multiple processes, such as mask manufacturing, development exposure, chemical etching, cleaning, repeated line forming and repair, etc., which are not only complicated, but also Yield is not easy to maintain.

An embodiment of the present invention provides a double-sided processing laser machine for processing a workpiece having a first processing surface and a second processing surface. The double-sided processing laser machine includes: a laser processing machine and a robot arm. The laser processing machine comprises: a laser light source outputting a laser light; a light guiding focusing mirror group, modulating the laser light and adjusting a traveling path of the laser light; and a three-axis motion platform carrying the processing piece to Moving the workpiece in an axial direction; an optical detecting device detecting a current horizontal coordinate and a current height at which the workpiece is located; and a control device driving the three-axis moving platform to move according to the current horizontal coordinate and the current height The workpiece is machined to a horizontal coordinate and a machining height, and the laser light source and the light guiding focusing lens are driven to focus the laser light on the first processing surface of the workpiece. a robot arm connected to the laser processing machine to be controlled by the control device of the laser processing machine, and after the first processing surface of the workpiece is processed, the workpiece is turned over for the laser processing machine The second machined surface of the workpiece is machined.

According to the above double-sided processing laser machine, it can be applied to workpieces that require double-sided laser processing. Through precise alignment and energy control, it can not damage another processing surface when processing a machined surface. . When applied to the touch panel process, it can replace complicated wet process steps and improve process yield.

Referring to Fig. 1, there is shown a plan view of a laser machine table 100 (hereinafter referred to as "laser machine table") for double-sided processing according to an embodiment of the present invention. The laser machine 100 includes a laser processing machine 200 and a robot arm 300. The laser processing machine 200 is disposed in a first zone Z1, and the robot arm 300 is disposed in a second zone Z2. The first region Z1 is adjacent to the second region Z2, and another third region Z3 is adjacent to the first region Z1 and the second region Z2, respectively. The third zone Z3 is a loading and unloading zone for placing the workpiece 400 (shown in FIG. 3), which will be further described later.

FIG. 2 and FIG. 3 are respectively a perspective view of a laser processing machine 200 of a laser machine 100 according to an embodiment of the present invention and a block diagram of a laser machine 100. The laser processing machine 200 includes a laser light source 210, a light guiding focusing mirror group 220, a three-axis motion platform 230, an optical detecting device 240, and a control device 250.

The laser source 210 is used to output a laser light. The workpiece 400 can be processed by using the laser light. The workpiece 400 can be, for example, a double-sided ITO (indium tin oxide) conductive glass of the touch panel, and has two opposite processing surfaces (ie, the first processed surface and the second surface). Machined surface), while processing one side, will not hurt the other side. Here, the thickness of the glass substrate of the double-sided ITO conductive glass suitable for processing can be up to 0.4 mm (mm), and the double-sided ITO conductive glass having a thinner glass substrate thickness can be processed by a focusing system with a special optical path. The laser source 210 includes a laser cavity 211 and an energy modulator 212. The laser cavity 211 is used to generate laser light, and the energy modulator 212 adjusts the energy of the laser light to output the modulated energy of the laser light to the light guiding focusing lens group 220. The laser light can be an ultraviolet laser, but the creation is not limited thereto, and a suitable laser light source can be selected according to the material of the workpiece 400. The energy modulator 212 can be, for example, a power modulator for adjusting the power of the laser light.

The light guiding focusing mirror group 220 is configured to modulate the laser light and adjust the traveling path of the laser light, and includes a beam modulating mirror group 221, a focusing direct mirror 222, and a scanning mirror group 223. The beam modulation mirror group 221 is used to modulate the beam shape of the laser light, and in particular, the beam shape of the laser light can be modulated into a flat head wave to maintain the uniform output energy of the laser light. The focusing direct mirror 222 is used to adjust the size of the focused spot of the laser light to the depth of focus. The scanning mirror group 223 is configured to guide and output the laser light modulated by the energy modulator 212, the beam modulation mirror group 221 and the focusing direct mirror 222 according to a required processing position, and can change the laser light to focus on the workpiece 400. The position is to process the workpiece 400.

The triaxial motion platform 230 is used to carry the workpiece 400 while moving the workpiece 400 in a three-axis direction (ie, axial X, Y, Z). As shown in FIG. 2, the three-axis motion platform 230 includes an XY-axis motion platform 231 and a Z-axis linear slide 232 coupled to the XY-axis motion platform 231. The XY axis motion platform 231 is responsible for the displacement of the axial X and the axial direction Y, and the Z axis linear slide 232 is responsible for the displacement of the axial Z. The Z-axis slide rail 232 can be a ball screw.

The optical detecting device 240 is configured to detect the current horizontal coordinate (ie, the XY axis coordinate) where the workpiece 400 is located and the current height. The optical detection device 240 includes one or two vision sensors 241 (here, two vision sensors 241 are exemplified) and a height sensor 242. The visual sensor 241 and the height sensor 242 are located above the workpiece 400. The visual sensor 241 is used to capture an image of the workpiece 400 downward to obtain the current horizontal coordinate of the workpiece 400. The height sensor 242 detects its distance from the workpiece 400 to obtain the current height of the workpiece 400. Here, the height sensor 242 uses a red semiconductor laser to detect the distance, but the present invention is not limited thereto. If the accuracy requirements allow, you can also use other methods such as infrared, ultrasonic, laser interferometer to detect the distance. The visual sensor 241 can be a high resolution camera of 5 million pixels. The control device 250 can analyze the image using image recognition technology to determine the horizontal coordinate of the workpiece 400.

The control device 250 can drive the three-axis motion platform 230 to move the workpiece 400 to a machining horizontal coordinate and a machining height according to the current horizontal coordinate and the current height of the workpiece 400, and drive the laser light source 210 and the light guiding focusing lens group 220. The laser light is focused on the first processing surface of the workpiece 400. Thereby, a desired pattern (such as a projected capacitive electrode pattern) can be formed on the first processed surface of the workpiece 400 by passing through a laser line. The control device 250 can be a computer with calculation and control capabilities such as a desktop computer, an industrial computer, an embedded controller, etc., and stores a control program and can execute the same.

The robot arm 300 is connected to the control device 250 of the laser processing machine 200, and is controlled by the control device 250. After the first processing surface of the workpiece 400 is processed, the processing member 400 is turned over for the laser processing machine 200 to process the workpiece. The second processing surface of the 400 is processed to form a pattern to be processed (such as a projected capacitive electrode pattern) through a laser line.

As shown in FIG. 3, the laser processing machine 200 further includes a laser power detector 260, a laser spot monitor 270, and a current detecting device 280. The laser power detector 260 is disposed on the branch of the laser light path to detect the power of the laser light. The laser spot monitor 270 is also disposed in the branch of the laser light path to detect the quality of the focused spot of the laser light. The current detecting device 280 is configured to detect whether the conductive material to be processed (here, the ITO conductive film) on the first processed surface and the second processed surface of the workpiece 400 is indeed ablated by laser light.

Referring to FIG. 1, before processing, the workpiece 400 is placed in the loading and unloading zone (third zone Z3), and then the robot arm 300 can move the workpiece 400 to the three-axis motion platform 230 of the laser processing machine 200, The laser processing machine 200 performs laser processing on the first processed surface of the workpiece 400. After the first processing surface is processed, the robot arm 300 moves the workpiece 400 to the loading and unloading zone, and the workpiece 400 is turned over in the loading and unloading zone. Next, the inverted workpiece 400 is placed back into the triaxial motion platform 230 for the laser processing machine 200 to perform laser processing on the second processing surface of the workpiece 400. In this way, the larger workpiece 400 can be made to have sufficient space to be reversed so as not to collide with the laser processing machine 200 during the turning process.

In summary, the double-sided processing laser machine 100 proposed in the present embodiment can be applied to the workpiece 400 requiring double-sided laser processing, and can be used for a processing surface through precise alignment and energy control. It will not damage another processing surface during processing. When applied to the touch panel process, it can replace complicated wet process steps and improve process yield.

100‧‧‧Double-sided laser machine
200‧‧ ‧ laser processing machine
210‧‧‧Laser light source
211‧‧‧Ray cavity
212‧‧‧Energy Modulator
220‧‧‧Light guiding focusing mirror
221‧‧‧ Beam Mirror Set
222‧‧‧ Focusing direct mirror
223‧‧‧ Scanning mirror
230‧‧‧Three-axis motion platform
231‧‧‧XY axis motion platform
232‧‧‧Z-axis slides
240‧‧‧Optical inspection device
241‧‧‧Vision sensor
242‧‧‧ Height sensor
250‧‧‧Control device
260‧‧‧Laser Power Tester
270‧‧‧Laser spot monitor
280‧‧‧current detection device
300‧‧‧ Robotic arm
400‧‧‧Processed parts
Z1‧‧‧ first area
Z2‧‧‧Second area
Z3‧‧‧ third area
X‧‧‧ axial
Y‧‧‧ axial
Z‧‧‧ axial

Fig. 1 is a plan view showing the arrangement of a laser machine for double-sided processing according to an embodiment of the present invention. 2 is a perspective view of a laser processing machine for a double-sided processing laser machine according to an embodiment of the present invention. 3 is a block diagram of a laser machine for double-sided processing according to an embodiment of the present invention.

210‧‧‧Laser light source

211‧‧‧Ray cavity

212‧‧‧Energy Modulator

220‧‧‧Light guiding focusing mirror

221‧‧‧ Beam Mirror Set

222‧‧‧ Focusing direct mirror

223‧‧‧ Scanning mirror

230‧‧‧Three-axis motion platform

240‧‧‧Optical inspection device

241‧‧‧Vision sensor

242‧‧‧ Height sensor

250‧‧‧Control device

260‧‧‧Laser Power Tester

270‧‧‧Laser spot monitor

280‧‧‧current detection device

300‧‧‧ Robotic arm

400‧‧‧Processed parts

Claims (10)

A double-sided processing laser machine for processing a workpiece having a first processing surface and a second processing surface, the double-sided processing laser station comprising: a laser The processing machine comprises: a laser light source for outputting a laser beam; a light guiding focusing mirror group for modulating the laser light and adjusting a traveling path of the laser light; a three-axis motion platform carrying the workpiece to be along three axes Moving the workpiece in an orientation; an optical detecting device detecting a current horizontal coordinate and a current height of the workpiece; and a control device driving the three-axis motion platform to move according to the current horizontal coordinate and the current height Processing the workpiece to a processing horizontal coordinate and a processing height, and driving the laser light source and the light guiding focusing lens to focus the laser light on the first processing surface of the processing member; and a mechanical arm connecting the lightning The processing machine is controlled by the control device of the laser processing machine, and after the processing of the first processing surface of the workpiece is completed, the workpiece is turned over for the laser processing machine to The second processing surface is processed. The double-sided processing laser machine of claim 1, wherein the light guiding focusing mirror comprises: a beam modulating mirror group modulating a beam shape of the laser light; and a focusing direct mirror adjusting the laser light a focused spot; and a scanning mirror set that changes the position of the laser light focused on the workpiece. The double-sided processing laser platform according to claim 1, wherein the three-axis motion platform comprises an XY-axis motion platform and a Z-axis linear slide connected to the XY-axis motion platform. The double-sided processing laser machine according to claim 1, wherein the optical detecting device comprises: one or two visual sensors located above the processing member to draw an image of the workpiece downwardly to Obtaining the current horizontal coordinate; and a height sensor detecting a distance between the workpiece and the workpiece to obtain the current height. The double-sided processing laser machine of claim 1, wherein the laser light source comprises a laser cavity and an energy modulator, the laser cavity generates the laser light, and the energy modulator adjusts the energy of the laser light. And outputting the adjusted energy of the laser light to the light guiding focusing lens group. The double-sided processing laser machine according to any one of claims 1 to 5, wherein the laser processing machine further comprises: a laser spot monitor for detecting a quality of the focused spot of the laser light; A laser power detector detects the power of the laser light. The double-sided processing laser machine of claim 6, wherein the laser processing machine further comprises a current detecting device for detecting the first processing surface of the workpiece and the second processing surface Whether the processed conductive material is indeed ablated via the laser light. The double-sided processing laser machine according to claim 7, further comprising a loading and unloading area for placing the workpiece, and for the robot arm to move the workpiece that completes the processing of the first processing surface Up to the loading and unloading zone, the workpiece is flipped and the inverted workpiece is placed back into the three-axis motion platform. The double-sided processing laser machine of claim 1, wherein the laser processing machine further comprises a current detecting device for detecting the first processing surface of the workpiece and the second processing surface Whether the processed conductive material is indeed ablated via the laser light. The double-sided processing laser machine according to claim 1 or 9, further comprising a loading and unloading area for placing the machining piece, and the machining arm is configured to complete the processing of the first processing surface The workpiece is moved to the loading and unloading area, and the workpiece is turned over to place the inverted workpiece to the three-axis motion platform.