TWM527472U - Light emitting temperature adjustment for floor tile device - Google Patents
Light emitting temperature adjustment for floor tile device Download PDFInfo
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- TWM527472U TWM527472U TW105203355U TW105203355U TWM527472U TW M527472 U TWM527472 U TW M527472U TW 105203355 U TW105203355 U TW 105203355U TW 105203355 U TW105203355 U TW 105203355U TW M527472 U TWM527472 U TW M527472U
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Description
本新型是有關於一種地磚裝置,特別是指一種發光調溫地磚裝置。The present invention relates to a floor tile device, and more particularly to a light-emitting temperature-controlled floor tile device.
地磚是常見的建築裝飾素材,通常由黏土燒製而成,並呈現出各種色彩及紋路的搭配,以提供空間裝飾及行進路線導引的效果。一般的地磚於鋪設工程完成後,即已固著於地面,無法任意變更結構,因此較不易調整其外觀呈現效果。此外,地磚通常是以熱傳佳的材質製作,保溫效果較差,於氣溫低時容易讓使用者感到冰冷。Floor tiles are common architectural decorative materials, usually made of clay, and are presented in a variety of colors and textures to provide space decoration and route guidance. After the general floor tile is completed, it is fixed on the ground and cannot be arbitrarily changed. Therefore, it is difficult to adjust its appearance. In addition, the floor tiles are usually made of materials with good heat transfer, and the heat preservation effect is poor, so that the user feels cold when the temperature is low.
因此,本新型之其中一目的,即在提供一種具有發光調溫功能的地磚裝置。Therefore, one of the objects of the present invention is to provide a floor tile device having a light-emitting temperature control function.
於是,本新型發光調溫地磚裝置,包含至少一基本地磚。該基本地磚包括一磚體、一導電線路層及至少一發光發熱模組。該磚體具有一表層及一裡層,該裡層位於該表層的內表面,且該裡層的側緣相較於該表層的側緣內縮而界定一階梯狀輪廓。該導電線路層形成於該表層的內表面。該發光發熱模組設置於該表層的內表面,且沿該裡層的側緣延伸。該發光發熱模組電連接於該導電線路層,並且具有至少一發光元件及至少一發熱元件。Thus, the novel luminous tempering floor tile apparatus comprises at least one basic floor tile. The basic floor tile comprises a brick body, a conductive circuit layer and at least one light-emitting heating module. The brick body has a surface layer and an inner layer, the inner layer is located on the inner surface of the surface layer, and the side edge of the inner layer is retracted to define a stepped contour compared to the side edge of the surface layer. The conductive circuit layer is formed on an inner surface of the surface layer. The illuminating heat generating module is disposed on an inner surface of the surface layer and extends along a side edge of the inner layer. The illuminating heat generating module is electrically connected to the conductive circuit layer and has at least one illuminating element and at least one heating element.
在一些實施態樣中,該磚體的材質包含陶瓷土、碳酸鈣與氮化鋁。In some embodiments, the material of the brick body comprises ceramic soil, calcium carbonate and aluminum nitride.
在一些實施態樣中,該發光發熱模組是一具有多個發光元件與多個發熱元件的燈條。In some embodiments, the illuminating heating module is a light bar having a plurality of illuminating elements and a plurality of heating elements.
在一些實施態樣中,該等發光元件為發光二極體,該等發熱元件為表面貼片型電阻器。In some embodiments, the light emitting elements are light emitting diodes, and the heat generating elements are surface mount type resistors.
在一些實施態樣中,該基本地磚包括兩個發光發熱模組,且該等發光發熱模組沿該裡層的兩相鄰側緣延伸而呈L型排列。In some embodiments, the basic tile includes two illuminating heating modules, and the illuminating heating modules extend in an L-shape along two adjacent side edges of the inner layer.
在一些實施態樣中,該導電線路層為藉由印刷電路技術或網印技術製作於該磚體的金屬線路。In some embodiments, the conductive circuit layer is a metal line fabricated on the tile body by printed circuit technology or screen printing technology.
在一些實施態樣中,該發光調溫地磚裝置還包含一電連接於該基本地磚的主控地磚,該主控地磚包括一磚體、一導電線路層、至少一發光發熱模組及一控制模組。該磚體具有一表層及一裡層,該裡層位於該表層的內表面,且該裡層的側緣相較於該表層的側緣內縮而界定一階梯狀輪廓。該導電線路層形成於該表層的內表面。該發光發熱模組設置於該表層的內表面,且沿該裡層的側緣延伸。該發光發熱模組電連接於該導電線路層,並且具有至少一發光元件及至少一發熱元件。該控制模組設置於該磚體,用以控制該主控地磚的該發光發熱模組以及該基本地磚的該發光發熱模組。In some implementations, the illuminating floor tile apparatus further includes a main control floor tile electrically connected to the basic floor tile, the main control floor tile comprising a brick body, a conductive circuit layer, at least one illuminating heating module, and a control Module. The brick body has a surface layer and an inner layer, the inner layer is located on the inner surface of the surface layer, and the side edge of the inner layer is retracted to define a stepped contour compared to the side edge of the surface layer. The conductive circuit layer is formed on an inner surface of the surface layer. The illuminating heat generating module is disposed on an inner surface of the surface layer and extends along a side edge of the inner layer. The illuminating heat generating module is electrically connected to the conductive circuit layer and has at least one illuminating element and at least one heating element. The control module is disposed on the brick body for controlling the illuminating heating module of the main control floor tile and the illuminating heating module of the basic floor tile.
在一些實施態樣中,該主控地磚還包括一感測模組,該感測模組設置於該磚體且電連接於該控制模組,並具有一溫度感測器及一濕度感測器。In some implementations, the main control tile further includes a sensing module disposed on the brick body and electrically connected to the control module, and has a temperature sensor and a humidity sensing Device.
在一些實施態樣中,該主控地磚還包括一供輸入訊息及輸出訊息的操控介面。In some implementations, the master tile also includes a manipulation interface for inputting messages and outputting messages.
本新型至少具有以下功效:藉由發光發熱模組的設置,可讓基本地磚與主控地磚在發光元件的作用下呈現出多樣化的色彩及外觀視覺效果,並可由發熱元件提供溫度調節的功能。The present invention has at least the following effects: by the arrangement of the illuminating heating module, the basic floor tile and the main control floor tile can exhibit various colors and visual effects under the action of the illuminating elements, and can provide temperature adjustment function by the heating element. .
參閱圖1,為本新型發光調溫地磚裝置100的一實施例,該發光調溫地磚裝置100包含多個基本地磚101及一主控地磚102,例如在圖中是以八個基本地磚101配合一個主控地磚102的方式呈現,並將主控地磚102安置於左上角的位置。然而,視實際需要,基本地磚101與主控地磚102的數量與排列方式均可調整,且除了以地磚的方式實施,發光調溫地磚裝置100也可以實施為牆磚的態樣,不以特定實施方式為限。Referring to FIG. 1 , an embodiment of a light-emitting tempering floor tile apparatus 100 includes a plurality of basic floor tiles 101 and a master floor tile 102. For example, in the figure, eight basic floor tiles 101 are used. A method of controlling the floor tiles 102 is presented, and the master floor tiles 102 are placed in the upper left corner position. However, depending on actual needs, the number and arrangement of the basic tiles 101 and the master tiles 102 can be adjusted, and in addition to being implemented in the manner of a floor tile, the light-emitting and temperature-control tile device 100 can also be implemented as a wall tile, not specific. The implementation is limited.
參閱圖1至圖3,以下說明基本地磚101的實施方式,其中圖1是正視圖,圖2是後視圖,圖3是側視圖。每一基本地磚101包括一磚體1、一導電線路層2及兩個發光發熱模組3。Referring to Figures 1 to 3, an embodiment of a basic tile 101 will be described below, wherein Figure 1 is a front view, Figure 2 is a rear view, and Figure 3 is a side view. Each of the basic tiles 101 includes a brick body 1, a conductive circuit layer 2, and two light-emitting heating modules 3.
磚體1具有一表層11及一裡層12,裡層12位於表層11的內表面111,且裡層12的側緣相較於表層11的側緣內縮而界定一階梯狀輪廓(見圖3),該階梯狀輪廓可用於容置導電線路層2、發光發熱模組3等構件。本實施例中,磚體1的材質包含陶瓷土、碳酸鈣與氮化鋁等成分,在陶瓷土、碳酸鈣中加入氮化鋁可讓燒結後的磚體1呈現出細緻平坦的表面,如此不但能夠增進磚體1的外觀質感,還能讓磚體1本身可用作為製作導電線路層2的承載基材。此外,裡層12的表面形成多個平行排列的長條狀溝槽121,藉以增進與其他建築材料(如混凝土)之間的結合性。The brick body 1 has a surface layer 11 and an inner layer 12, and the inner layer 12 is located on the inner surface 111 of the surface layer 11, and the side edges of the inner layer 12 are retracted to define a stepped contour compared to the side edges of the surface layer 11 (see FIG. 3) The stepped profile can be used to accommodate components such as the conductive circuit layer 2, the light-emitting heating module 3, and the like. In this embodiment, the material of the brick body 1 comprises ceramic clay, calcium carbonate and aluminum nitride, and the addition of aluminum nitride to the ceramic clay or calcium carbonate allows the sintered brick body 1 to exhibit a fine and flat surface. Not only can the appearance of the brick body 1 be improved, but also the brick body 1 itself can be used as a carrier substrate for the conductive wiring layer 2. Further, the surface of the inner layer 12 is formed with a plurality of elongated grooves 121 arranged in parallel to enhance bonding with other building materials such as concrete.
導電線路層2形成於該表層11的內表面111,藉以提供發光發熱模組3與外部電路(圖中未繪製)之間的電性連接功能。由於本實施例的磚體1具有平整表面,因此導電線路層2可直接藉由印刷電路技術或網印技術製作於磚體1的內表面111,而形成銅線、銀線等金屬線路。The conductive circuit layer 2 is formed on the inner surface 111 of the surface layer 11 to provide an electrical connection function between the light-emitting heat generating module 3 and an external circuit (not shown). Since the brick body 1 of the present embodiment has a flat surface, the conductive circuit layer 2 can be directly formed on the inner surface 111 of the brick body 1 by a printed circuit technology or a screen printing technique to form a metal line such as a copper wire or a silver wire.
發光發熱模組3設置於表層11的內表面111,且分別沿裡層12的兩相鄰側緣延伸,而呈現出L型的排列方式。例如,圖1中每個基本地磚101的兩個發光發熱模組3是分別位於左側及頂側,而右側及底側則可由鄰近基本地磚101的發光發熱模組3提供相應發光、發熱功能。本實施例中,發光發熱模組3是採用設有多個發光元件31與多個發熱元件32的燈條,該等發光元件31例如為能發出紅光、綠光、藍光、白光等不同顏色光線之發光二極體,該等發熱元件32則例如為表面貼片型電阻器,且其排列方式例如為每兩個發光元件31之間設置一個發熱元件32。如此一來,藉由發光元件31及發熱元件32的設置,能讓基本地磚101實現發光、發熱之功能,且能夠藉由發光二極體、表面貼片型電阻器等微型元件的使用而實現整體結構的薄型輕量化。在不同的實施方式中,發光發熱模組3也可以採用不同類型的發光元件31、發熱元件32,且其數量及排列方式均可視需要而調整,不以前述實施方式為限。The illuminating heat generating module 3 is disposed on the inner surface 111 of the surface layer 11 and extends along two adjacent side edges of the inner layer 12 to exhibit an L-shaped arrangement. For example, the two light-emitting heating modules 3 of each of the basic tiles 101 in FIG. 1 are respectively located on the left side and the top side, and the right side and the bottom side are provided with corresponding light-emitting and heat-generating functions by the light-emitting heat-generating module 3 adjacent to the basic floor tiles 101. In this embodiment, the light-emitting heat generating module 3 is a light bar provided with a plurality of light-emitting elements 31 and a plurality of heat-generating elements 32, and the light-emitting elements 31 are, for example, capable of emitting different colors such as red light, green light, blue light, and white light. The light-emitting diodes of the light are, for example, surface-mount resistors arranged in a manner such that one heat-generating element 32 is disposed between each two light-emitting elements 31. In this way, the arrangement of the light-emitting element 31 and the heat-generating element 32 allows the basic tile 101 to function as a light-emitting and heat-generating device, and can be realized by the use of a micro-element such as a light-emitting diode or a surface-sMD resistor. The overall structure is thin and lightweight. In different embodiments, the light-emitting heat generating module 3 can also adopt different types of light-emitting elements 31 and heat-generating elements 32, and the number and arrangement thereof can be adjusted as needed, and are not limited to the foregoing embodiments.
主控地磚102電連接於基本地磚101,其構造類似於基本地磚101,具有相同於基本地磚101之磚體1、導電線路層2、發光發熱模組3等結構的相應構件,在此不再針對類似的構件重複說明。除了此等基礎構件外,主控地磚102還包含一控制模組6、一感測模組7及一操控介面8。控制模組6設置於主控地磚102的磚體4,可採用各式控制晶片及微處理器,用於控制主控地磚102的發光發熱模組5以及基本地磚101的發光發熱模組3,並對感測模組7及操控介面8提供控制功能。感測模組7設置於主控地磚102的磚體4且電連接於控制模組6,並具有一溫度感測器71及一濕度感測器72,用於偵測及顯示溫度、濕度資訊。操控介面8電連接於控制模組6,可設置按鍵、開關、旋鈕、觸控螢幕、揚聲器等各式操控單元,以提供輸入訊息及輸出訊息之功能。The main control floor tile 102 is electrically connected to the basic floor tile 101, and its structure is similar to that of the basic floor tile 101, and has corresponding components corresponding to the structure of the brick body 1, the conductive circuit layer 2, the light-emitting heat generating module 3, and the like of the basic floor tile 101, and is no longer Repeat the instructions for similar components. In addition to the basic components, the master tile 102 further includes a control module 6, a sensing module 7, and a manipulation interface 8. The control module 6 is disposed on the brick body 4 of the main control floor tile 102, and can adopt various control chips and microprocessors for controlling the light-emitting heating module 5 of the main control floor tile 102 and the light-emitting heating module 3 of the basic floor tile 101. The sensing module 7 and the manipulation interface 8 are provided with control functions. The sensing module 7 is disposed on the brick body 4 of the main control floor tile 102 and is electrically connected to the control module 6 and has a temperature sensor 71 and a humidity sensor 72 for detecting and displaying temperature and humidity information. . The control interface 8 is electrically connected to the control module 6, and can be provided with various control units such as buttons, switches, knobs, touch screens, and speakers to provide functions for inputting messages and outputting messages.
使用者欲操作發光調溫地磚裝置100時,可從主控地磚102的感測模組7得知溫溼度資訊,並能透過操控介面8設定基本地磚101及主控地磚102的發光顏色、發光亮度及加熱溫度,且還能進一步針對特定日期或特定時刻進行不同的預先設定。在不同的實施方式中,發光調溫地磚裝置100也可以省略主控地磚102的設置,此時發光調溫地磚裝置100僅由基本地磚101預設的亮度、溫度值進行運作。When the user wants to operate the illuminating and tempering floor tile device 100, the temperature and humidity information can be obtained from the sensing module 7 of the master floor tile 102, and the illuminating color and illuminating of the basic floor tile 101 and the master floor tile 102 can be set through the control interface 8. Brightness and heating temperature, and can be further preset for a specific date or specific time. In different embodiments, the illuminating and tempering tile device 100 can also omit the setting of the master tile 102. At this time, the illuminating tile device 100 operates only by the brightness and temperature values preset by the basic tile 101.
綜合前述說明,本新型發光調溫地磚裝置100透過基本地磚101的發光發熱模組3以及主控地磚102的發光發熱模組5之設置,得以實現外觀亮度、顏色之調整,並能提供溫度控制功能。此外,藉由主控地磚102的功能設計,能夠提供多樣化的操控功能。是故,本新型發光調溫地磚裝置100確實能達成本新型的目的。Based on the foregoing description, the light-emitting temperature-control tile device 100 of the present invention can realize the adjustment of the brightness and color of the appearance through the setting of the light-emitting heating module 3 of the basic floor tile 101 and the light-emitting heating module 5 of the main control floor tile 102, and can provide temperature control. Features. In addition, by controlling the functional design of the floor tile 102, it is possible to provide various control functions. Therefore, the novel illuminating and tempering floor tile apparatus 100 can achieve the object of the present invention.
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.
100‧‧‧發光調溫地磚裝置
101‧‧‧基本地磚
1‧‧‧磚體
11‧‧‧表層
111‧‧‧內表面
12‧‧‧裡層
121‧‧‧溝槽
2‧‧‧導電線路層
3‧‧‧發光發熱模組
31‧‧‧發光元件
32‧‧‧發熱元件
102‧‧‧主控地磚
4‧‧‧磚體
5‧‧‧發光發熱模組
6‧‧‧控制模組
7‧‧‧感測模組
71‧‧‧溫度感測器
72‧‧‧濕度感測器
8‧‧‧操控介面
100‧‧‧Lighting and temperature control floor tile installation
101‧‧‧Basic floor tiles
1‧‧‧Brick body
11‧‧‧ surface layer
111‧‧‧ inner surface
12‧‧‧ inner layer
121‧‧‧ trench
2‧‧‧ Conductive circuit layer
3‧‧‧Lighting heating module
31‧‧‧Lighting elements
32‧‧‧heating components
102‧‧‧Main control floor tiles
4‧‧‧Bricks
5‧‧‧Lighting heating module
6‧‧‧Control module
7‧‧‧Sensing module
71‧‧‧Temperature Sensor
72‧‧‧ Humidity sensor
8‧‧‧Control interface
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一正視圖,說明本新型發光調溫地磚裝置之一實施例; 圖2是一後視圖,說明發光調溫地磚裝置的基本地磚的實施方式;及 圖3是基本地磚的側視圖。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a front view showing an embodiment of the novel illuminating and tempering floor tile apparatus; Fig. 2 is a rear view An embodiment of a basic floor tile of a light-emitting tempering floor tile apparatus; and FIG. 3 is a side view of a basic floor tile.
100‧‧‧發光調溫地磚裝置 100‧‧‧Lighting and temperature control floor tile installation
101‧‧‧基本地磚 101‧‧‧Basic floor tiles
1‧‧‧磚體 1‧‧‧Brick body
3‧‧‧發光發熱模組 3‧‧‧Lighting heating module
102‧‧‧主控地磚 102‧‧‧Main control floor tiles
4‧‧‧磚體 4‧‧‧Bricks
5‧‧‧發光發熱模組 5‧‧‧Lighting heating module
6‧‧‧控制模組 6‧‧‧Control module
7‧‧‧感測模組 7‧‧‧Sensing module
71‧‧‧溫度感測器 71‧‧‧Temperature Sensor
72‧‧‧濕度感測器 72‧‧‧ Humidity sensor
8‧‧‧操控介面 8‧‧‧Control interface
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CN112647662A (en) * | 2019-10-11 | 2021-04-13 | 温瑞琦 | Intelligent scene temperature control ceramic tile |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112647662A (en) * | 2019-10-11 | 2021-04-13 | 温瑞琦 | Intelligent scene temperature control ceramic tile |
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