TWM522464U - Chopper - Google Patents

Description

chopper

This creation is about a file, especially a file for wafer splitting.

In the conventional semiconductor process, after the wafer is manufactured, the thinning process, the singulation process, the packaging process, and the like are performed. Among them, the singulation process is various, for example, laser cutting, mechanical cutting, splitting and the like.

As shown in FIGS. 1A and 1B, the conventional splitting and separating apparatus 9 includes: a machine body (not shown), a base 90 disposed on the lower side of the machine body, and a base disposed on the machine body. The upper side splitting device 92 and a film 93 disposed on the base 90.

In the cleaving operation, a wafer 8 having a plurality of pre-cut streets 80 is first adhered to the film 93, and an external structure 7 is disposed on the wafer 8 (eg, jig, line, insulating mold, passive). The external structure 7 has an exposed space 70 to expose the pre-cutting path 80, and the boring tool 1 of the splitting device 92 is placed on one of the pre-cutting streets 80, and the splitting device 92 is utilized. The vibrating member 91 strikes the file 1 so that the file 1 touches the back surface position A of the wafer 8 corresponding to the pre-cutting path 80 to cause the wafer 8 to be split along the pre-cutting path 80 (such as a crack S). . Then, the cleaving step of the cleaving device 92 is repeated, so that the back surface of the wafer 8 is split in the straight direction and the lateral direction. The pre-cutting track 80 separates the wafer 8 into a plurality of crystal grains 8a.

As shown in FIG. 1C, the file 1 includes a support portion 13, a blade portion 10, and a blade portion 12. The width of the blade portion 10 is tapered from the upper side toward the lower side, and the support portion 13 is coupled to the upper side of the blade portion 10, and the blade portion 12 is coupled to the lower side of the blade portion 10, and the blade edge is The width of the portion 12 and the width of the blade portion 10 are tapered.

Alternatively, as shown in FIG. 1D, the file 1' is further included between the support portion 13 and the blade portion 10 to form an adjustment portion 10' of an adjustable angle a, and the width of the blade portion 12 and the blade body The width of the portion 10 is non-decreasing.

However, although the strength of the file 1' shown in Fig. 1D is strong, the adjustment portion 10' is provided. Therefore, when the wafer is cleaved, the outer structure 7 is easily collided and damaged.

Further, if the trowel 1 shown in Fig. 1C is used, the problem of collision and damage to the external structure 7 can be avoided, but the strength of the trowel 1 shown in Fig. 1C is weak, so that the wafer 劈 is performed. The file 1 is easily broken during the splitting operation.

Therefore, how to overcome various problems of the prior art is an important issue.

In order to solve the above problems in the prior art, the present invention discloses a file including a blade body, an extension portion and a blade portion which are sequentially connected, wherein the blade portion has opposite first and second sides, and The width of the first side is greater than the width of the second side, the extension extends from the second side of the blade portion to the blade portion, and the width of the extension portion is equal to the blade portion on the second side The width.

In one embodiment of the foregoing file, the width of the blade portion tapers from the first side toward the second side.

In one embodiment of the trowel, the blade portion, the extension portion, and the blade portion are integrally formed.

In one embodiment of the foregoing file, the sides of the extension are rectangular.

In one embodiment of the foregoing file, the sides of the blade are triangular.

In one embodiment of the trowel, the support portion is coupled to the first side of the blade portion, wherein the width of the support portion is equal to the width of the blade portion on the first side.

It can be seen from the above that the file of the present invention mainly extends straight from the second side of the blade portion by the extension portion, so as to avoid collision and damage to the external structure on the wafer during the wafer splitting operation.

1, 1', 2‧‧‧ sickle

10, 20 ‧ ‧ knives

10’‧‧‧Adjustment Department

12, 22‧‧‧ Blade Department

13, 23‧‧ ‧ support

20a‧‧‧ first side

20b‧‧‧ second side

21‧‧‧Extension

22a‧‧‧ split end

7‧‧‧External structure

70‧‧‧Exposed space

8‧‧‧ wafer

8a‧‧‧ grain

80‧‧‧ pre-cutting road

81‧‧‧Protective layer

9‧‧‧ splitting separation equipment

90‧‧‧Base

91‧‧‧Vibration parts

92‧‧‧Cleavage device

93‧‧‧ film

A‧‧‧ angle

θ ₁ , θ ₂ ‧‧‧ angle

A‧‧‧back position

S‧‧‧ crack

D, R, W‧‧‧ width

L‧‧‧ length

F‧‧‧ splitting force

1A is a schematic cross-sectional view of a conventional splitting separation apparatus; FIG. 1B is a partial enlarged view of FIG. 1A; and 1C and 1D are partial enlarged views of different aspects of the sickle of FIG. 1A; Schematic diagram; Fig. 2 is a schematic view of the side of the scribing of the creation; and Fig. 3 is a schematic side view of the scythe of the creation.

The implementation of the present invention will be described below by way of specific embodiments. Those skilled in the art can readily appreciate the other advantages and functions of the present disclosure from the disclosure herein.

It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second" and "one" as used in this specification are for convenience only, and are not intended to limit the scope of the creation of the creation. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.

The second picture is a schematic side view of the file 2 of the creation. As shown in FIG. 2, the file 2 includes a support portion 23, a blade portion 20, an extension portion 21, and a blade edge portion 22.

The blade portion 20 has opposite first and second sides 20a, 20b, and the width D of the first side 20a is greater than the width R of the second side 20b.

In this embodiment, the width of the blade portion 20 is tapered from the first side 20a toward the second side 20b, so that the side of the blade portion 20 is tapered, and an angle θ _{1 is} generated, wherein the angle is θ ₁ can be determined according to needs.

The support portion 23 is coupled to the first side 20a of the blade portion 20 and has a width equal to the width D of the first side 20a.

The extension portion 21 is straight from the second side 20b of the blade portion 20. Extends to a length L.

In this embodiment, the side surface of the extending portion 21 is rectangular, such that the width W of the extending portion 21 is equal to the width R of the second side 20b, wherein the length L of the extending portion 21 and the width W are According to the needs.

The blade portion 22 is coupled to the extending portion 21 such that the extending portion 21 is located between the blade portion 22 and the blade portion 20.

In this embodiment, the side of the blade portion 22 is triangular, so that the blade portion 22 generates a split end 22a having an included angle θ ₂ , wherein the angle of the angle θ ₂ can be determined according to requirements.

When the boring tool 2 is used, as shown in Fig. 3, the boring tool 2 is placed on a cleavage device (not shown in Figs. 1A and 1B). However, the variety of the cleaving equipment is not limited to the above, and it is hereby stated.

During the splitting operation, an external structure 7 having an exposed space 70 is disposed on the wafer 8, and the splitting force F of the file 2 is concentrated on the blade portion 22, and then evenly dispersed in the extended portion. In the portion 21, the split end 22a of the blade portion 22 is passed through the wafer 8 to generate a crack S, so that the wafer 8 is forced to be ruptured along the pre-cutting path 80.

Therefore, the boring tool 2 extends straight from the second side 20b of the blade portion 20 by the extending portion 21, so that when the wafer splitting operation is performed, collision and damage of the external structure 7 can be avoided, and The support of the blade portion 20 gives the file 2 a strong strength.

Furthermore, if the wafer 8 has a protective layer 81 such as an insulating film, and the hardness of the protective layer 81 is smaller than the hardness of the wafer 8, the design of the boring tool 2 of the present invention is designed by the extension portion 21, For wafer splitting operations, After the blade portion 22 passes through the protective layer 81, the extending portion 21 can smoothly pass through the protective layer 81 compared to the blade portion 20 to prevent the protective layer 81 from being warped or deformed.

In summary, the design of the blade is not only made of the blade but also has a strong strength, and can effectively avoid collision and damage of the wafer during the splitting operation. External structure.

The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

2‧‧‧劈

20‧‧‧Knife body

20a‧‧‧ first side

20b‧‧‧ second side

21‧‧‧Extension

22‧‧‧ Blade Department

22a‧‧‧ split end

23‧‧‧Support

θ ₁ , θ ₂ ‧‧‧ angle

D, R, W‧‧‧ width

L‧‧‧ length

Claims (7)

A trowel includes a blade portion, an extension portion and a blade portion that are sequentially connected, wherein the blade portion has opposite first and second sides, and a width of the first side is greater than a width of the second side, The extension extends from the second side of the blade portion toward the blade portion, and the width of the extension portion is equal to the width of the blade portion on the second side. The file of claim 1, wherein the width of the blade portion tapers from the first side toward the second side. The file according to claim 1, wherein the side of the extension is rectangular. The file according to claim 1, wherein the side of the blade portion is triangular. The file according to claim 1, wherein the blade portion, the extension portion, and the blade portion are integrally formed. The file according to claim 1, wherein the file includes a support portion coupled to the first side of the blade portion. The file of claim 6, wherein the width of the support portion is equal to the width of the blade portion on the first side.