TWM522464U - Chopper - Google Patents
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- TWM522464U TWM522464U TW105201415U TW105201415U TWM522464U TW M522464 U TWM522464 U TW M522464U TW 105201415 U TW105201415 U TW 105201415U TW 105201415 U TW105201415 U TW 105201415U TW M522464 U TWM522464 U TW M522464U
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Description
本創作係關於一種劈刀,尤指一種用於晶圓劈裂製程之劈刀。 This creation is about a file, especially a file for wafer splitting.
習知半導體製程中,晶圓於製造完成後,會進行薄化加工、切單製程、封裝製程等,其中,切單製程之方式繁多,例如、雷射切割、機械切割、劈裂分離等。 In the conventional semiconductor process, after the wafer is manufactured, the thinning process, the singulation process, the packaging process, and the like are performed. Among them, the singulation process is various, for example, laser cutting, mechanical cutting, splitting and the like.
如第1A及1B圖所示,習知劈裂式分離設備9係包括:一機台本體(圖略)、一設於該機台本體下側之基座90、一設於該機台本體上側之劈裂裝置92、以及一設於該基座90上之貼膜93。 As shown in FIGS. 1A and 1B, the conventional splitting and separating apparatus 9 includes: a machine body (not shown), a base 90 disposed on the lower side of the machine body, and a base disposed on the machine body. The upper side splitting device 92 and a film 93 disposed on the base 90.
於進行劈裂作業時,先將一具有複數預切割道80的晶圓8黏貼於該貼膜93上,且於該晶圓8上設有外部結構7(如治具、線路、絕緣模、被動元件等),該外部結構7係具有外露空間70以外露該預切割道80,再將該劈裂裝置92之劈刀1對位於其中一預切割道80上,並利用該劈裂裝置92之震動件91撞擊該劈刀1,使該劈刀1碰觸該晶圓8對應該預切割道80之背面位置A,以令該晶圓8沿該預切割道80裂開(如裂痕S)。之後重複上述該劈裂裝置92之劈裂步驟,以於該晶圓8背面之直向與橫向上劈裂各 該預切割道80,使該晶圓8分離成複數晶粒8a。 In the cleaving operation, a wafer 8 having a plurality of pre-cut streets 80 is first adhered to the film 93, and an external structure 7 is disposed on the wafer 8 (eg, jig, line, insulating mold, passive). The external structure 7 has an exposed space 70 to expose the pre-cutting path 80, and the boring tool 1 of the splitting device 92 is placed on one of the pre-cutting streets 80, and the splitting device 92 is utilized. The vibrating member 91 strikes the file 1 so that the file 1 touches the back surface position A of the wafer 8 corresponding to the pre-cutting path 80 to cause the wafer 8 to be split along the pre-cutting path 80 (such as a crack S). . Then, the cleaving step of the cleaving device 92 is repeated, so that the back surface of the wafer 8 is split in the straight direction and the lateral direction. The pre-cutting track 80 separates the wafer 8 into a plurality of crystal grains 8a.
如第1C圖所示,該劈刀1係包括:一支撐部13、一刀身部10以及一刀鋒部12。該刀身部10之寬度係自該上側朝該下側漸縮,且該支撐部13係結合該刀身部10之上側,而該刀鋒部12係結合該刀身部10之下側,並使該刀鋒部12之寬度與該刀身部10之寬度為漸縮。 As shown in FIG. 1C, the file 1 includes a support portion 13, a blade portion 10, and a blade portion 12. The width of the blade portion 10 is tapered from the upper side toward the lower side, and the support portion 13 is coupled to the upper side of the blade portion 10, and the blade portion 12 is coupled to the lower side of the blade portion 10, and the blade edge is The width of the portion 12 and the width of the blade portion 10 are tapered.
或者,如第1D圖所示,該劈刀1’復包括於該支撐部13與該刀身部10之間形成一可調整角度a之調整部10’,且該刀鋒部12之寬度與該刀身部10之寬度為非漸縮者。 Alternatively, as shown in FIG. 1D, the file 1' is further included between the support portion 13 and the blade portion 10 to form an adjustment portion 10' of an adjustable angle a, and the width of the blade portion 12 and the blade body The width of the portion 10 is non-decreasing.
然而,習知第1D圖所示之劈刀1’之強度較強,但其因具有該調整部10’,因而於進行晶圓劈裂作業時,容易碰撞及損毀該外部結構7。 However, although the strength of the file 1' shown in Fig. 1D is strong, the adjustment portion 10' is provided. Therefore, when the wafer is cleaved, the outer structure 7 is easily collided and damaged.
再者,若改用第1C圖所示之劈刀1,雖可避免碰撞及損毀該外部結構7之問題,但第1C圖所示之劈刀1之強度較弱,故於進行晶圓劈裂作業時,該劈刀1容易斷裂。 Further, if the trowel 1 shown in Fig. 1C is used, the problem of collision and damage to the external structure 7 can be avoided, but the strength of the trowel 1 shown in Fig. 1C is weak, so that the wafer 劈 is performed. The file 1 is easily broken during the splitting operation.
因此,如何克服習知技術之種種問題,實為一重要課題。 Therefore, how to overcome various problems of the prior art is an important issue.
為解決上述習知技術之問題,本創作遂揭露一種劈刀,係包括依序連接之刀身部、延伸部及刀鋒部,其中,該刀身部具有相對之第一側與第二側,且該第一側之寬度大於該第二側之寬度,該延伸部係自該刀身部之第二側向該刀鋒部延伸,且該延伸部之寬度等於該刀身部在第二側 之寬度。 In order to solve the above problems in the prior art, the present invention discloses a file including a blade body, an extension portion and a blade portion which are sequentially connected, wherein the blade portion has opposite first and second sides, and The width of the first side is greater than the width of the second side, the extension extends from the second side of the blade portion to the blade portion, and the width of the extension portion is equal to the blade portion on the second side The width.
在前述劈刀之一具體實施例中,該刀身部之寬度係自該第一側朝該第二側漸縮。 In one embodiment of the foregoing file, the width of the blade portion tapers from the first side toward the second side.
在前述劈刀之一具體實施例中,該刀身部、延伸部及刀鋒部係一體成形者。 In one embodiment of the trowel, the blade portion, the extension portion, and the blade portion are integrally formed.
在前述劈刀之一具體實施例中,該延伸部之側面係為矩形。 In one embodiment of the foregoing file, the sides of the extension are rectangular.
在前述劈刀之一具體實施例中,該刀鋒部之側面係為三角形。 In one embodiment of the foregoing file, the sides of the blade are triangular.
在前述劈刀之一具體實施例中,復包括支撐部,係結合在該刀身部之第一側,其中,該支撐部之寬度等於該刀身部在第一側之寬度。 In one embodiment of the trowel, the support portion is coupled to the first side of the blade portion, wherein the width of the support portion is equal to the width of the blade portion on the first side.
由上可知,本創作之劈刀主要藉由該延伸部自該刀身部之第二側平直延伸,以於進行晶圓劈裂作業時,能避免碰撞及損毀晶圓上之外部結構。 It can be seen from the above that the file of the present invention mainly extends straight from the second side of the blade portion by the extension portion, so as to avoid collision and damage to the external structure on the wafer during the wafer splitting operation.
1、1’、2‧‧‧劈刀 1, 1', 2‧‧‧ sickle
10、20‧‧‧刀身部 10, 20 ‧ ‧ knives
10’‧‧‧調整部 10’‧‧‧Adjustment Department
12、22‧‧‧刀鋒部 12, 22‧‧‧ Blade Department
13、23‧‧‧支撐部 13, 23‧‧ ‧ support
20a‧‧‧第一側 20a‧‧‧ first side
20b‧‧‧第二側 20b‧‧‧ second side
21‧‧‧延伸部 21‧‧‧Extension
22a‧‧‧劈裂端 22a‧‧‧ split end
7‧‧‧外部結構 7‧‧‧External structure
70‧‧‧外露空間 70‧‧‧Exposed space
8‧‧‧晶圓 8‧‧‧ wafer
8a‧‧‧晶粒 8a‧‧‧ grain
80‧‧‧預切割道 80‧‧‧ pre-cutting road
81‧‧‧保護層 81‧‧‧Protective layer
9‧‧‧劈裂式分離設備 9‧‧‧ splitting separation equipment
90‧‧‧基座 90‧‧‧Base
91‧‧‧震動件 91‧‧‧Vibration parts
92‧‧‧劈裂裝置 92‧‧‧Cleavage device
93‧‧‧貼膜 93‧‧‧ film
a‧‧‧角度 A‧‧‧ angle
θ1、θ2‧‧‧夾角 θ 1 , θ 2 ‧‧‧ angle
A‧‧‧背面位置 A‧‧‧back position
S‧‧‧裂痕 S‧‧‧ crack
D、R、W‧‧‧寬度 D, R, W‧‧‧ width
L‧‧‧長度 L‧‧‧ length
F‧‧‧劈裂作用力 F‧‧‧ splitting force
第1A圖係為習知劈裂式分離設備之剖面示意圖;第1B圖係為第1A圖之局部放大示意圖;第1C及1D圖係為第1A圖之劈刀之不同態樣之側面局部放大示意圖;第2圖係為本創作之劈刀之側面示意圖;以及第3圖係為本創作之劈刀於使用時之側面示意圖。 1A is a schematic cross-sectional view of a conventional splitting separation apparatus; FIG. 1B is a partial enlarged view of FIG. 1A; and 1C and 1D are partial enlarged views of different aspects of the sickle of FIG. 1A; Schematic diagram; Fig. 2 is a schematic view of the side of the scribing of the creation; and Fig. 3 is a schematic side view of the scythe of the creation.
以下藉由特定的具體實施例說明本創作之實施方 式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。 The implementation of the present invention will be described below by way of specific embodiments. Those skilled in the art can readily appreciate the other advantages and functions of the present disclosure from the disclosure herein.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。 It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second" and "one" as used in this specification are for convenience only, and are not intended to limit the scope of the creation of the creation. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.
第2圖係為本創作之劈刀2之側面示意圖。如第2圖所示,該劈刀2係包括:一支撐部23、一刀身部20、一延伸部21以及一刀鋒部22。 The second picture is a schematic side view of the file 2 of the creation. As shown in FIG. 2, the file 2 includes a support portion 23, a blade portion 20, an extension portion 21, and a blade edge portion 22.
所述之刀身部20係具有相對之第一側20a與第二側20b,且該第一側20a之寬度D大於該第二側20b之寬度R。 The blade portion 20 has opposite first and second sides 20a, 20b, and the width D of the first side 20a is greater than the width R of the second side 20b.
於本實施例中,該刀身部20之寬度係自該第一側20a朝該第二側20b漸縮,使該刀身部20之側面呈錐狀,且產生一夾角θ1,其中,該夾角θ1可依需求而定。 In this embodiment, the width of the blade portion 20 is tapered from the first side 20a toward the second side 20b, so that the side of the blade portion 20 is tapered, and an angle θ 1 is generated, wherein the angle is θ 1 can be determined according to needs.
所述之支撐部23係結合該刀身部20之第一側20a,其寬度等於該第一側20a之寬度D。 The support portion 23 is coupled to the first side 20a of the blade portion 20 and has a width equal to the width D of the first side 20a.
所述之延伸部21係自該刀身部20之第二側20b平直 延伸至一長度L。 The extension portion 21 is straight from the second side 20b of the blade portion 20. Extends to a length L.
於本實施例中,該延伸部21之側面係為矩形,使該延伸部21之寬度W等於該第二側20b之寬度R,其中,該延伸部21之長度L及該寬度W之尺寸可依需求而定。 In this embodiment, the side surface of the extending portion 21 is rectangular, such that the width W of the extending portion 21 is equal to the width R of the second side 20b, wherein the length L of the extending portion 21 and the width W are According to the needs.
所述之刀鋒部22係結合該延伸部21,使該延伸部21位於該刀身部22與該刀鋒部20之間。 The blade portion 22 is coupled to the extending portion 21 such that the extending portion 21 is located between the blade portion 22 and the blade portion 20.
於本實施例中,該刀鋒部22之側面係為三角形,使該刀鋒部22產生一具有夾角θ2之劈裂端22a,其中,該夾角θ2之角度可依需求而定。 In this embodiment, the side of the blade portion 22 is triangular, so that the blade portion 22 generates a split end 22a having an included angle θ 2 , wherein the angle of the angle θ 2 can be determined according to requirements.
於使用該劈刀2時,如第3圖所示,係將該劈刀2設於一劈裂設備(圖略,可參考第1A及1B圖所示)上。然而,有關劈裂設備之種類繁多,並不限於上述,特此述明。 When the boring tool 2 is used, as shown in Fig. 3, the boring tool 2 is placed on a cleavage device (not shown in Figs. 1A and 1B). However, the variety of the cleaving equipment is not limited to the above, and it is hereby stated.
於進行劈裂作業時,於該晶圓8上設置一具有外露空間70之外部結構7,並使該劈刀2之劈裂作用力F集中於該刀鋒部22上,再平均分散於該延伸部21上,使該刀鋒部22之劈裂端22a經過該晶圓8而產生裂痕S後,以令該晶圓8受力後可沿該預切割道80裂開。 During the splitting operation, an external structure 7 having an exposed space 70 is disposed on the wafer 8, and the splitting force F of the file 2 is concentrated on the blade portion 22, and then evenly dispersed in the extended portion. In the portion 21, the split end 22a of the blade portion 22 is passed through the wafer 8 to generate a crack S, so that the wafer 8 is forced to be ruptured along the pre-cutting path 80.
因此,該劈刀2藉由該延伸部21自該刀身部20之第二側20b平直延伸,故於進行晶圓劈裂作業時,能避免碰撞及損毀該外部結構7,且藉由該刀身部20之支撐,使該劈刀2具有較強之強度。 Therefore, the boring tool 2 extends straight from the second side 20b of the blade portion 20 by the extending portion 21, so that when the wafer splitting operation is performed, collision and damage of the external structure 7 can be avoided, and The support of the blade portion 20 gives the file 2 a strong strength.
再者,若該晶圓8上具有一如絕緣薄膜之保護層81,且該保護層81之硬度小於該晶圓8之硬度,使本創作之劈刀2藉由該延伸部21之設計,以於進行晶圓劈裂作業時, 該刀鋒部22經過該保護層81後,相較於該刀身部20,該延伸部21能順利通過該保護層81,以避免該保護層81發生翹曲或變形。 Furthermore, if the wafer 8 has a protective layer 81 such as an insulating film, and the hardness of the protective layer 81 is smaller than the hardness of the wafer 8, the design of the boring tool 2 of the present invention is designed by the extension portion 21, For wafer splitting operations, After the blade portion 22 passes through the protective layer 81, the extending portion 21 can smoothly pass through the protective layer 81 compared to the blade portion 20 to prevent the protective layer 81 from being warped or deformed.
綜上所述,本創作之劈刀係藉由該刀身部與延伸部之設計,不僅使該劈刀具有較強之強度,且於進行劈裂作業時,能有效避免碰撞及損毀晶圓之外部結構。 In summary, the design of the blade is not only made of the blade but also has a strong strength, and can effectively avoid collision and damage of the wafer during the splitting operation. External structure.
上述實施例係用以例示性說明本創作之原理及其功效,而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修改。因此本創作之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.
2‧‧‧劈刀 2‧‧‧劈
20‧‧‧刀身部 20‧‧‧Knife body
20a‧‧‧第一側 20a‧‧‧ first side
20b‧‧‧第二側 20b‧‧‧ second side
21‧‧‧延伸部 21‧‧‧Extension
22‧‧‧刀鋒部 22‧‧‧ Blade Department
22a‧‧‧劈裂端 22a‧‧‧ split end
23‧‧‧支撐部 23‧‧‧Support
θ1、θ2‧‧‧夾角 θ 1 , θ 2 ‧‧‧ angle
D、R、W‧‧‧寬度 D, R, W‧‧‧ width
L‧‧‧長度 L‧‧‧ length
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW105201415U TWM522464U (en) | 2016-01-29 | 2016-01-29 | Chopper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW105201415U TWM522464U (en) | 2016-01-29 | 2016-01-29 | Chopper |
Publications (1)
Publication Number | Publication Date |
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TWM522464U true TWM522464U (en) | 2016-05-21 |
Family
ID=56511022
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TW105201415U TWM522464U (en) | 2016-01-29 | 2016-01-29 | Chopper |
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Country | Link |
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TW (1) | TWM522464U (en) |
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2016
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