TWM522388U - Heat-dissipation device for computer enclosure - Google Patents

Description

Computer case heat sink

This creation is about a computer case heat sink, especially an innovative heat sink that can be applied to computer systems, taking into account the new architecture of heat dissipation and shielding of the upper power supply.

Press, in general, the internal parts of the computer will generate a lot of heat energy during normal operation. In order to avoid the temperature rise caused by the accumulation of heat energy, which seriously affects the normal operation of the electronic components, the internal temperature of the computer is usually maintained at a certain specific working temperature through the heat sink. However, the current heat dissipation device on the market only uses a single or a small number of fans to blow away the high-temperature airflow to assist the heat dissipation. The heat dissipation device only radiates the heat generated by the heat-generating electronic components to the inside of the computer system, and cannot be effectively discharged to the outside air. In the long-term operation of electronic components, the temperature inside the computer system will gradually increase, thus affecting the efficiency and stability of the computer system, and thus needs to be improved.

In view of this, the creator has carefully studied and repeatedly tested and improved. Now, he has finally created a new structure for the computer case heat sink to take care of heat dissipation and shield the upper power supply, which can eliminate the disadvantages of the conventional products and improve the efficacy.

The reason is that the main purpose of this creation is to provide a new structure for the heat dissipation of the computer case and to shield the upper power supply. The system is provided with a vent hole on the bottom plate of the computer case and a side panel thereof, and the upper part of the computer case is partitioned. Forming a duct, the partition also has a beautifying visual function for shielding the upper power source and the wire, and is arranged to discharge heat outward in the upper and rear portions of the computer casing. The fan forms a negative pressure on the lower part of the computer casing, and sucks the wind upward from the bottom, and discharges the high-temperature airflow through the fan to strengthen the heat sink.

In order to achieve the above objectives, the present invention adopts the following technical means: a computer case heat sink, the bottom plate of the computer case and a side panel thereof are provided with ventilation holes, and the upper part of the computer case is formed by a partition to form a duct, the partition There are cooling holes on the upper part of the computer case, and 1~3 fans are blown to the ventilation holes of the corresponding side panels, and a fan is arranged at the rear of the computer case; the fans are all exhausted outwards, so that the lower part of the computer case forms a negative Pressing, the wind is sucked up from the ventilation hole at the bottom, and the high-temperature airflow is discharged from the outside air of the computer through the fan.

In order to let your review board have a better understanding of this creation, Zize elaborated on the creation as follows:

(10) ‧‧‧ computer case

(11, 12, 13, 15) ‧‧‧ panels

(14) ‧‧‧floor

(141, 151) ‧ ‧ ventilation holes

(16) ‧ ‧ partition

(161) ‧‧‧Wind

(162) ‧‧‧ vents

(17, 18) ‧ ‧ fans

The first figure is an appearance view of the present embodiment.

Second figure: The internal structure diagram of the present embodiment.

Third figure: is an internal structure diagram on the other side of the present embodiment.

Figure 4: Appearance of the other side of the present embodiment.

Please refer to the first figure, which is a diagram of an embodiment of the present invention. After the front, left, and upper panels 11, 12, and 13 are installed around the computer casing 10, a complete computer casing is formed; as shown in the second figure, The internal structure of the computer casing 10 after the left side panel 12 is removed, the heat dissipation device inside the computer casing 10 can be clearly seen from the figure, wherein the bottom plate 14 of the computer casing 10 has a mesh-shaped ventilation hole 141; As shown in the figure, the upper portion of the computer casing 10 is formed with a partition 16 to form a duct 161. The partition 16 is provided with a heat dissipation hole 162. The partition 16 also has a beautifying visual function for shielding the upper power source (such as a power supply...). As shown in the fourth figure, the panel 15 on the right side of the computer casing 10 is provided with a mesh-shaped venting hole 151; as shown in the second figure, the upper part of the computer casing 10 is provided with 1 to 3 fans 17 corresponding to each other. The ventilation hole 151 of the side panel 15 is actually set in this embodiment. Three heat sinks 17, a fan 18 is also disposed at the rear of the computer casing 10, and the fan 18 is a dedicated fan of the power supply (PSU), which faces the direction of the system fan, and can enhance the heat dissipation effect; the fans 17 and 18 both discharge heat outward. The lower part of the computer casing 10 forms a negative pressure, and the wind is sucked up from the bottom, and the high-temperature airflow is discharged from the outside air of the computer casing 10 through the ventilation holes 151 of the panel 15 via the fans 17, 18 (as shown in the fourth figure). Enhanced heat dissipation.

In summary, the computer case heat sink of the present invention is an innovative computer case heat sink, which can effectively achieve the heat dissipation effect. The practical effect is undoubted, and this creation has never been made public or has been seen in other publications. It has already complied with the provisions of the Patent Law and has filed a patent application according to law.

((10)‧‧‧ computer case

(11, 13) ‧ ‧ panels

(14) ‧‧‧floor

(141) ‧ ‧ ventilation holes

(17, 18) ‧ ‧ fans

Claims (2)

A heat dissipation device for a computer casing, wherein a bottom plate of the computer casing and a side panel thereof are provided with ventilation holes, and an upper portion of the computer casing is formed by a partition to form a air passage, and the partition plate is provided with a heat dissipation hole, and the upper portion of the computer casing is provided with at least A fan is blown to the venting hole of the corresponding side panel, and a fan is further disposed at the rear of the computer casing; the fan is arranged to discharge heat outward, so that a lower pressure is formed in the lower part of the computer casing, and the wind is sucked up from the bottom vent hole through the fan. The high temperature airflow is discharged from the outside air of the computer. For example, the computer case heat sink according to the first aspect of the patent application, wherein the fan provided on the upper part of the computer case is preferably three.