TWM521865U - Flexible printed circuit board thickening device - Google Patents

Description

Thickening device for flexible circuit board

This creation relates to a machine for electroplating a flexible circuit board, especially a flexible circuit board which is easy to repair and replenish the plating solution, and which does not cause the flexible circuit board to be stretched or peeled off due to the unsynchronized rotation of the drum. Device.

Because of its advantages of being bendable and low in cost, flexible circuit boards are widely used in electronic products that are currently being developed in large quantities. Currently, flexible circuit boards are mostly manufactured by a single discontinuous suspension, which is easy to cause during processing. Due to the single non-continuous hanging mode of operation or other human factors, the appearance of the flexible circuit board is poor, which in turn affects the product yield and increases the production cost.

Therefore, the manufacturer uses a multi-roll conveying method to achieve the purpose of continuously processing a flexible circuit board in a single sheet. However, such a multi-roll conveying method is liable to cause a length of the flexible circuit board due to the difference in speed of rotation of the respective reels. Less than the transport path, causing the flexible circuit board to be stretched, or causing the flexible circuit board to be longer than the transport path and loose, and when one of the reels fails or the plating solution needs to be replenished, it must be on the machine. The flexible circuit board is removed for the repair of the reel or the replenishment of the plating solution. Therefore, it is quite troublesome in repairing and replenishing the plating solution. Moreover, in the processing of the conventional flexible circuit board, it is electroplated or resistant. After the oxidation treatment, after the cleaning operation, on the flexible circuit board Drying work, however, the drying method used today is easy to leave water marks on the flexible circuit board, so it is not a good design.

In view of the shortcomings derived from the above-mentioned conventional methods, the creators of this case have improved and innovated, and after years of painstaking research, they finally succeeded in research and development of the thickening device of this flexible circuit board.

In order to solve the above problems of the prior art, one of the aims of the present invention is to provide a thickening device for a flexible circuit board that can simultaneously drive a flexible circuit board.

In order to solve the above problems of the prior art, another object of the present invention is to provide a thickening device for a flexible circuit board which is convenient for repairing and replenishing a plating solution.

In order to solve the above problems of the prior art, another object of the present invention is to provide a thickening device for a flexible circuit board which can avoid residual water marks on a flexible circuit board.

In order to achieve the above purpose, the thickening device of the flexible circuit board comprises a feeder, a discharge machine, at least one electroplating thickening machine, a first cleaning device, an anti-oxidation treatment machine, a second cleaning device and A wind knife dryer, the thickening device of the soft circuit board of the present invention uses a feeder to send a flexible circuit board book to an electroplating thickening machine for electroplating, and then the first cleaning device electroplating the electroplated flexible circuit board. The liquid is washed away, and then the anti-oxidation treatment machine is used to perform anti-oxidation treatment on the soft circuit board after the first cleaning device is cleaned, and when the flexible circuit board is subjected to anti-oxidation treatment, the soft cleaning circuit board is cleaned by the second cleaning device. In the end, the flexible circuit board was blown dry with a high-pressure hot air knife through a wind knife dryer to remove water marks.

Among them, the electroplating thickening machine can be arranged into a single electroplating thickening machine or a plurality of continuous electroplating thickening machines according to the size of the processing space of the flexible circuit board.

Wherein, a second air knife dryer may be disposed between the first cleaning device and the anti-oxidation treatment machine for drying the soft circuit board after cleaning the plating solution, and then performing oxidation treatment by the antioxidant machine. .

Wherein, the electroplating thickening machine comprises a machine frame, a plurality of roller mechanisms, a plurality of pulleys and a plurality of plating equipment.

The machine frame includes a first side wall, a second side wall and two connecting walls. The first side wall and the second side wall have a plating space. The two connecting walls are disposed on the first side wall and the second side wall. The two sides of the gap are connected to the first side wall and the second side wall, and an inlet and an outlet are formed on the connecting wall for the flexible circuit board to pass through. One end of the plating space is a flexible circuit board which is accessed by the inlet and outlet of the connecting wall. The feeding direction of the plating space, the other end of the plating space relative to the feeding direction is a discharge direction of the flexible circuit board from the inlet and outlet of the connecting wall leaving the plating space, and the first side wall is provided with a plurality of roller positioning portions, The roller positioning portions are arranged at equal intervals above and below the first sidewall, and the second sidewalls are provided with a plurality of cutout holes corresponding to the positions of the plating devices for the plating devices to be taken out from the cutout holes. To supplement the plating solution of the plating equipment.

The above roller mechanism is a single roller mechanism, a double roller mechanism or a multi-roller mechanism or a combination of at least two thereof.

The single roller mechanism includes a roller portion and a transmission portion, wherein the transmission portion is configured to drive the roller portion to rotate, and the flexible circuit board is moved to the discharge direction, and the roller portion is disposed on the first connecting wall and Between the second connecting walls, the transmission portion extends to the other side of the first side wall opposite to the plating space, and a connecting portion between the driving portion and the roller portion is locked to the roller positioning portions.

The double roller mechanism includes a first roller portion, a second roller portion, a first transmission portion and a second transmission portion, and the first roller portion and the second roller portion are disposed on the first connecting wall And the first transmission portion and the second transmission portion extend to the other side of the first side wall opposite to the plating space, the first transmission portion is configured to drive the first roller portion to rotate The second transmission portion is configured to drive the second roller portion to rotate, the first transmission portion and the second transmission portion are interlocked with each other by a gear or a pulley, and the first transmission portion and the first roller portion and the second transmission portion There is a connecting portion between the portion and the second roller portion that is locked to the roller positioning portions.

Wherein, the multi-roller mechanism includes a plurality of roller portions and a plurality of transmission portions, the roller portions are disposed between the first connecting wall and the second connecting wall, and the driving portions extend to the first side wall relative to the plating space On the other side, the transmission portions are respectively configured to drive the roller portions to rotate, and the transmission portions are interlocked with each other by a gear or a pulley, and the transmission portion and the roller portions are each locked with a lock. a connecting portion of the roller positioning portions.

The pulleys are connected to the transmission parts of the roller mechanisms, so that the transmission parts of the roller mechanisms synchronously drive the rotation of the drums by the linkage of the pulleys.

The electroplating apparatus described above is disposed between the roller mechanisms in the plating space for electroplating on the surface of one side or both sides of the flexible circuit board.

1‧‧‧ Feeder

2‧‧‧Electroplating thickener

21‧‧‧ machine frame

211‧‧‧First side wall

2111‧‧‧First roller positioning unit

2112‧‧‧Second roller positioning unit

2113‧‧‧ Third roller positioning unit

2114‧‧‧Four roller positioning unit

2115‧‧‧Fifth roller positioning unit

212‧‧‧ second side wall

2121‧‧‧Change hole

213‧‧‧ plating space

214‧‧‧ Feeding direction

215‧‧‧Drawing direction

216‧‧‧ first connecting wall

217‧‧‧Second connection wall

218‧‧‧Import

221‧‧‧First roller mechanism

222‧‧‧Second roller mechanism

223‧‧‧third roller mechanism

224‧‧‧fourth roller mechanism

225‧‧‧ fifth roller mechanism

226‧‧‧Rolling Department

2261‧‧‧First Roller

2262‧‧‧second roller

227‧‧‧Transmission Department

2271‧‧‧First transmission unit

2272‧‧‧Second transmission unit

228‧‧‧Connecting Department

23‧‧‧ Gears

24‧‧‧ Pulley

3‧‧‧First cleaning equipment

4‧‧‧Antioxidant processor

5‧‧‧Second cleaning equipment

6‧‧‧Air knife dryer

7‧‧‧Dropper

8‧‧‧Soft circuit board

1 is a structural view of a thickening device for creating a flexible circuit board; FIG. 2 is a perspective view of the creative plating thickening machine; FIG. 3 is a perspective view of the frame of the creative machine; Figure 4 is a perspective view of another perspective of the creation machine frame; Figure 5 is a schematic view of the construction of the pulley connecting roller mechanism; Figure 6 is a three-dimensional appearance of the creation of a single roller mechanism; Figure 7 is the creation of this The three-dimensional appearance of the double roller mechanism; FIG. 8 is a three-dimensional appearance of the creation of the multi-roller mechanism; FIG. 9 is a conveying path diagram of the creative soft circuit board in the electroplating thickening machine.

The specific embodiments are described below to illustrate the implementation of the present invention, but are not intended to limit the scope of the present invention:

Please refer to FIG. 1 , which is an embodiment of a thickening device for creating a flexible circuit board 8 . The embodiment includes a feeder 1 , a plurality of consecutively arranged plating thickening machines 2 , a first cleaning device 3 , and an antioxidant. The processor 4, a second cleaning device 5, an air knife dryer 6 and a discharge machine 7.

The continuously arranged electroplating thickening machine 2 is connected to the feeder 1 and the first cleaning device 3, and the first cleaning device 3 is connected to the continuously arranged electroplating thickener 2 and the anti-oxidation treatment device. The oxidation treatment device is connected to the first cleaning device 3 and the second cleaning device 5, and the second cleaning device 5 is connected to the anti-oxidation treatment machine 4 and the air knife dryer 6, and the air knife dryer 6 is It is connected to the second cleaning device 5 and the discharge device 7.

Referring to FIG. 2 , the successively arranged electroplating thickening machines 2 each include a machine frame 21 , a single roller mechanism, two double roller mechanisms, two multi-roller mechanisms, a plurality of pulleys 24 and a plurality of plating devices (not shown) ).

Referring to FIGS. 3 to 5 , the machine frame 21 includes a first sidewall 211 , a second sidewall 212 , a first connecting wall 216 , and a second connecting wall 217 . The first sidewall 211 and the second sidewall 212 . The first side wall 211 and the second side wall 217 are disposed on the two sides of the first side wall 211 and the second side wall 212. For connecting the first side wall 211 and the second side wall 212, the first connecting wall 216 is oriented toward the feeder 1 , and the second connecting wall 217 is oriented toward the discharging machine 7 , therefore, the The plating space 213 faces the one end of the first connecting wall 216 as a feeding direction 214, and the plating space 213 faces the one end of the second connecting wall 217 as a discharging direction 215.

In addition, the first connecting wall 216 and the second connecting wall 217 are respectively provided with an inlet and an outlet. The first side wall 211 is arranged with a first roller positioning portion 2111 and a third roller at a distance from the feeding direction 214 to the discharging direction 215. The positioning portion 2113 and the fifth roller positioning portion 2115 are arranged at a lower distance from the feeding direction 214 to the discharging direction 215 according to the second roller positioning portion 2112 and the fourth roller positioning portion 2114. The two roller positioning portions 2112 are located between the first roller positioning portion 2111 and the third roller positioning portion 2113, and the fourth roller positioning portion 2114 is located between the third roller positioning portion 2113 and the fifth roller positioning portion 2115. The second side wall 212 is provided with a plurality of cutout holes 2121 at positions corresponding to the positions between the roller positioning portions.

The plurality of pulleys 24 are configured to connect the roller portion 226 of the first roller mechanism 221 and the second roller mechanism 222, the roller portion 226 of the second roller mechanism 222 and the third roller mechanism 223, the third roller mechanism 223, and the fourth roller mechanism, respectively. a roller portion 226 of the 224, a third roller mechanism 223, and a roller portion 226 of the fifth roller mechanism 225, and a plurality of plating devices are disposed between the roller mechanisms in the plating space 213, and respectively corresponding to the second sidewall 212 The position of the hole 2121 is changed. Therefore, when the plating apparatus needs to replenish the plating solution, it is only necessary to directly extract the plating apparatus from the extraction hole 2121.

Referring to FIGS. 3 to 4 and 6, the single roller mechanism includes a roller portion 226 and a transmission portion 227. The roller portion 226 is disposed between the first connecting wall 216 and the second connecting wall 217. The portion 227 extends to the other side of the first side wall 211 opposite to the plating space 213, and the connecting portion 228 of the driving portion 227 and the roller portion 226 is locked to the fifth roller positioning portion 2115.

Referring to FIGS. 3 to 4 and 7, the two double roller mechanisms each include a roller portion 226 and a transmission portion 227. The roller portion 226 includes a first roller 2261 and a second roller 2262. The transmission portion 227 includes a first portion. The first unit 2261 and the second unit 2262 are disposed between the first connecting wall 216 and the second connecting wall 217, the first transmission unit 2271 and the second driving unit 2271 The second transmission unit 2272 extends to the other side of the first side wall 211 opposite to the plating space 213, the first transmission unit 2271 is configured to drive the rotation of the first roller 2261, and the second transmission unit is used to drive the The second roller 2262 rotates, the first transmission unit 2271 and the second transmission unit 2272 are interlocked with each other by the pulley 24, and the first transmission unit 2271 and the first roller 2261 and the second transmission portion 227 and the second roller 2262 portion The 226 has a connecting portion 228, and the double drum device is respectively locked to the second roller positioning portion 2112 and the fourth roller positioning portion 2114 by the connecting portion 228.

Referring to FIGS. 3 to 4 and 8, the two-roller mechanism includes a plurality of roller portions 226 and a plurality of transmission portions 227. The roller portions 226 are disposed between the first connecting wall 216 and the second connecting wall 217. The transmission portion 227 extends to the other side of the first sidewall 211 opposite to the plating space 213. The transmission portions 227 are configured to respectively drive the roller portions 226 to rotate, and the transmission portions 227 are interlocked with each other by the pulleys 24 The connecting portion 228 and the roller portion 226 each have a connecting portion 228, and the multi-rolling device is respectively locked to the third roller positioning portion 2113 and the fifth roller positioning portion 2115 by the connecting portion 228.

Referring to FIGS. 1-9, in the thickening device of the flexible circuit board 8 of the embodiment, the flexible circuit board 8 is fed by the feeder along the electroplating thickening machine 2, the first cleaning device 3, and the anti-oxidation treatment machine 4. Second clear The path of the washing device 5 and the air knife drying device is pulled toward the discharge machine 7. When the thickening device of the flexible circuit board 8 of the embodiment is actuated, the surface of the flexible circuit board 8 is pre-processed (first in softness). The surface of the circuit board 8 is plated with a layer of medium), and then the flexible circuit board 8 is driven by one of the feeder and the discharger 7 or the feeder and the discharge machine 7 through the electroplating thickening machine 2, the first cleaning device 3. The anti-oxidation treatment machine 4, the second cleaning device 5, and the air knife drying device are moved in the direction of the discharge machine 7.

When the flexible circuit board 8 enters the electroplating thickener 2, the flexible circuit board 8 enters the plating space 213 of the electroplating thickener 2 via the inlet and outlet 218 of the first connecting wall 216, according to the first roller mechanism 221 and the second roller. The order of the mechanism 222, the third roller mechanism 223, the fourth roller mechanism 224, and the fifth roller mechanism 225 is wound around the first roller mechanism 221, the second roller mechanism 222, the third roller mechanism 223, the fourth roller mechanism 224, and The roller portion 226 of the fifth roller mechanism 225 is separated from the plating space 213 by the inlet and outlet 218 of the second connecting wall 217 and enters the first cleaning device 3.

At this time, when the flexible circuit board 8 is displaced from the first roller mechanism 221 to the second roller mechanism 222, the flexible circuit board 8 is plated through the plating device between the first roller mechanism 221 and the second roller mechanism 222. When the flexible circuit board 8 is displaced by the second roller mechanism 222 to the third roller mechanism 223, the flexible circuit board 8 is plated through the plating device between the second roller mechanism 222 and the third roller mechanism 223, and the flexible circuit is used as the flexible circuit. When the plate 8 is displaced by the third roller mechanism 223 to the fourth roller mechanism 224, the transparent circuit board 8 is plated through the plating device between the third roller mechanism 223 and the fourth roller mechanism 224, when the flexible circuit board 8 is When the fourth roller mechanism 224 is displaced toward the fifth roller mechanism 225, the soft circuit board 8 is plated through the plating device between the fourth roller mechanism 224 and the fifth roller mechanism 225, and when the flexible circuit board 8 passes the fifth After the roller mechanism 225, the first and second cleaning devices 3 are separated from the plating thickener 2 by the inlet and outlet 218 of the second connecting wall 217.

Then, the plating solution adhered to the flexible circuit board 8 is cleaned by the first cleaning device 3, and then the anti-oxidation layer is formed on the flexible circuit board 8 through the anti-oxidation treatment machine 4, and then the second cleaning device is used. 5 The cleaning process is performed on the flexible circuit board 8 on which the anti-oxidation layer is formed, and after cleaning, the water knife on the flexible circuit board 8 is dried by the air knife dryer 6 through the air knife dryer to remove water marks, and finally baked. The dried flexible circuit board 8 is separated from the discharge opening for subsequent winding or other operations.

Wherein, the thickening device of the flexible circuit board 8 of the present invention drives the flexible circuit board 8 to be displaced through one of the feeder and the discharger 7 or the feeder and the discharger 7, so that only the feeder or the control is required. The discharging machine 7 drives the displacement speed of the flexible circuit board 8, so that the plating thickness of the flexible circuit board 8 can be controlled. For example, when the displacement speed of the flexible circuit board 8 is fast, the plating equipment can be plated on the flexible circuit board 8 for a short time. Therefore, the plating layer on the flexible circuit board 8 will be thinner, and when the displacement speed of the flexible circuit board 8 is slow, the plating equipment can be plated on the flexible circuit board 8 for a long time, so that the plating equipment has a long time. The surface of the flexible circuit board 8 is plated with a plating layer. Therefore, the thickening device of the flexible circuit board 8 can control the thickness of the plating layer on the flexible circuit board 8 by adjusting the displacement speed of the flexible circuit board 8.

Furthermore, the thickening device of the flexible circuit board 8 can also control the number of the plating thickening machine 2 by controlling the displacement speed of the flexible circuit board 8, for example, when the flexible circuit board 8 produces a small working space. When the number of the plating thickening machine 2 can be reduced, the speed of the displacement of the flexible circuit board 8 can be slowed down, so that the thickness of the surface of the printed flexible circuit board 8 can meet the requirements, and when the working space of the flexible circuit board 8 is produced, When the time is large, the number of the electroplating thickening machine 2 can be increased, and the speed of the displacement of the flexible circuit board 8 can be adjusted faster, and the flexible circuit board 8 can be plated by a plurality of electroplating thickening machines 2, which can not only make the surface of the flexible circuit board 8 The thickness of the plating layer meets the requirements and can increase the production speed.

In addition, the thickening device of the flexible circuit board 8 of the present invention interlocks the roller portion 226 between the double roller mechanisms and the roller portion 226 between the multiple roller mechanisms through the gear 23 or the pulley 24, and then the pulley 24 is interlocked. a roller mechanism 221, a second roller mechanism 222, a third roller mechanism 223, a fourth roller mechanism 224, and a transmission portion 227 of the fifth roller mechanism 225, so that the first roller mechanism 221, the second roller mechanism 222, and the third roller The rotation speeds of the roller portion 226 of the mechanism 223, the fourth roller mechanism 224 and the fifth roller mechanism 225 are the same, and the condition that the flexible circuit board 8 is stretched or loosened due to the difference in the rotational speed of the drum can be effectively avoided. Moreover, in the thickening device of the present flexible circuit board 8, when one of the roller mechanisms fails, the creation only needs to separately replace or repair the defective roller mechanism, for example, when the second roller mechanism 222 fails in the present creation. The second roller mechanism 222 can be removed for maintenance or replacement only by loosening the connection portion 228 of the second roller mechanism 222 locked to the first side wall 211, without having to remove the soft circuit as in the prior art. In order to carry out the repair action.

To sum up, this case is not only innovative in terms of technical thinking, but also has many of the above-mentioned functions that are not in the traditional methods of the past. It has fully complied with the statutory new patent requirements of novelty and progressiveness, and applied for it according to law. Approving this new type of patent application, in order to encourage creation, to the sense of virtue.

1‧‧‧ Feeder

2‧‧‧Electroplating thickener

3‧‧‧First cleaning equipment

4‧‧‧Antioxidant processor

5‧‧‧Second cleaning equipment

6‧‧‧Air knife dryer

7‧‧‧Dropper

Claims (18)

A thickening device for a flexible circuit board, comprising: one or more continuous plating thickening machines for performing a plating operation on one or both sides of a flexible circuit board; a cleaning device, the first cleaning device is connected to the plating thickening base for cleaning the plating solution remaining on the electroplated flexible circuit board; an anti-oxidation treatment machine, the anti-oxidation treatment machine and the first cleaning device The connection is used for anti-oxidation treatment on the flexible circuit board after the cleaning of the first cleaning device; and a second cleaning device is connected to the anti-oxidation treatment device for cleaning the softness after the oxidation treatment a circuit board; an air knife dryer, the air knife dryer is connected to the second cleaning device to dry the flexible circuit board cleaned by the second cleaning device by using a hot air knife. The thickening device of the flexible circuit board of claim 1, wherein the plating thickening machine comprises: a machine frame, the machine frame comprises a first side wall, a second side wall, a first connecting wall and a first connecting wall a second connecting wall, the first side wall and the second side wall have a plating space, one end of the plating space is a feeding direction of the flexible circuit board into the plating space, and the other end of the plating space is a flexible circuit with respect to the feeding direction The plate is separated from the discharge direction of the plating space, and the first side wall is provided with a plurality of roller positioning portions, and the roller positioning portions are arranged at equal intervals above and below the first side wall, the first connecting wall and the first The two connecting walls are disposed at two ends of the first side wall and the second side wall for connecting the first side wall and the second side wall; a plurality of roller mechanisms, each of which includes a roller portion and a transmission portion, wherein the transmission portion is configured to drive the roller portion to rotate, and the flexible circuit board is moved to the discharge direction, and the roller portion is disposed in the first Between a connecting wall and the second connecting wall, the driving portion extends to the other side of the first sidewall opposite to the plating space, and the driving portion and the roller portion have a lock between the roller positioning portions a connecting portion; a plurality of pulleys for connecting the transmission portions of the roller mechanisms, so that the transmission portions of the roller mechanisms synchronously drive the rotation of the roller portion by the linkage of the pulleys; the plurality of plating devices, the plating devices The roller mechanisms disposed in the plating space are used for plating on the surface of one side or both sides of the flexible circuit board. The thickening device of the flexible circuit board of claim 2, wherein the machine frame further comprises two connecting walls, the connecting walls are disposed on opposite sides of the first side wall and the second side wall for connecting The first side wall and the second side wall. A thickening device for a flexible circuit board according to claim 3, wherein an inlet and an outlet are formed in the connecting walls for the flexible circuit board to pass. The thickening device of the flexible circuit board of claim 2, wherein the roller mechanism is a single roller mechanism, a double roller mechanism or a multi-roller mechanism. The thickening device of the flexible circuit board of claim 2, wherein the roller mechanism is a single roller mechanism, a double roller mechanism, and a multi-roller mechanism or a combination of the two. The thickening device of the flexible circuit board of claim 5 or 6, wherein the double roller mechanism comprises a first roller, a second roller, a first transmission unit and a second transmission unit, the first transmission unit The second transmission unit is configured to drive the second drum to rotate, and the first transmission unit and the second transmission unit are interlocked with each other by a gear or a pulley. The thickening device of the flexible circuit board of claim 5, wherein the multi-roller mechanism comprises a plurality of roller portions and a plurality of transmission portions, wherein the transmission portions are used to respectively drive the roller portions to rotate, and the transmissions are The parts are interlocked with each other by gears or pulleys. The thickening device of the flexible circuit board of claim 2, wherein the second side wall is provided with a plurality of replacement holes at positions corresponding to the electroplating equipment for the electroplating equipment to be taken out from the replacement holes to supplement Plating solution for electroplating equipment. The thickening device of the flexible circuit board of claim 1, wherein the first cleaning device and the anti-oxidation processor further have a second air knife dryer for cleaning the soft circuit after the plating solution The plate is dried and then subjected to an antioxidant treatment by an antioxidant machine. An electroplating thickening machine, comprising: a machine frame, the machine frame comprises a first side wall and a second side wall, wherein the first side wall and the second side wall have a plating space, one end of the plating space For the feeding direction of the flexible circuit board into the plating space, the other end of the plating space relative to the feeding direction is a discharge direction of the flexible circuit board away from the plating space, and the first side wall is provided with a plurality of roller positioning portions, the rollers The positioning portion is arranged at an equal interval above and below the first side wall; the plurality of roller mechanisms each include a roller portion and a transmission portion, and the transmission portion is configured to drive the roller portion to rotate The flexible circuit board moves toward the discharge direction, and the roller portion is disposed between the first connecting wall and the second connecting wall, the driving portion extends to the other side of the first sidewall opposite to the plating space, and the transmission Between the portion and the roller portion, there is a connecting portion fixed to the roller positioning portions; a plurality of pulleys for connecting the transmission portions of the roller mechanisms to enable the roller mechanisms By the movable portion of the linkage and pulley drum portion rotating entrainment; A plurality of electroplating devices are disposed between the roller mechanisms in the plating space for electroplating on one or both sides of the flexible circuit board. The electroplating thickening machine of claim 11, wherein the machine frame further comprises two connecting walls, the connecting walls are disposed on opposite sides of the first side wall and the second side wall for connecting the first a sidewall and the second sidewall. The electroplating thickening machine of claim 12, wherein an inlet and an outlet are formed in the connecting walls for the flexible circuit board to pass. The electroplating thickening machine of claim 11, wherein the roller mechanism is a single roller mechanism, a double roller mechanism or a multi-roller mechanism. The electroplating thickener of claim 11, wherein the roller mechanism comprises a single roller mechanism, a double roller mechanism, and a multi-roller mechanism or a combination of the two. The electroplating thickening machine of claim 14 or 15, wherein the double roller mechanism comprises a first roller, a second roller, a first transmission unit and a second transmission unit, wherein the first transmission unit is used to drive The first roller rotates, the second transmission unit is configured to drive the second roller to rotate, and the first transmission unit and the second transmission unit are interlocked with each other by a gear or a pulley. The electroplating thickening machine of claim 14 or 15, wherein the multi-roller mechanism comprises a plurality of roller portions and a plurality of transmission portions, wherein the transmission portions are respectively configured to drive the roller portions to rotate, and the transmission portions are Use gears or pulleys to interlock with each other. The electroplating thickening machine according to claim 11, wherein the second side wall is provided with a plurality of replacement holes at positions corresponding to the electroplating equipment for the electroplating equipment to be taken out from the exchange holes to supplement the electroplating equipment. Plating solution.