TWM519756U - USB chipset - Google Patents

USB chipset Download PDF

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Publication number
TWM519756U
TWM519756U TW104214580U TW104214580U TWM519756U TW M519756 U TWM519756 U TW M519756U TW 104214580 U TW104214580 U TW 104214580U TW 104214580 U TW104214580 U TW 104214580U TW M519756 U TWM519756 U TW M519756U
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Taiwan
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module
signal
coupled
differential
unit
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TW104214580U
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Chinese (zh)
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王維宇
魏郁忠
鄭媖蓮
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威盛電子股份有限公司
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Publication of TWM519756U publication Critical patent/TWM519756U/en

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Abstract

A USB chipset coupled between an first device and a second device and including a data processing unit and a transmitter is provided. The data processing unit generates a plurality of transmission information according to first information provided by the first device. The transmitter transmits the transmission information to the second device and includes a transforming module, a first output driving module, a second output driving module and a transmitting selecting module. The transforming module receives the transmission information in parallel and serially transmits the transmission information. The first output driving module is coupled to a first pin set. The second output driving module is coupled to a second pin set. The transmitting selecting module is coupled between the transforming module and the first and second output driving modules.

Description

USB晶片組 USB chipset

本創作係有關於一種USB晶片組,特別是有關於一種內建選擇模組應用在USB Type-C規格之領域的USB晶片組。 This creation is about a USB chipset, especially a USB chipset that is built into the USB Type-C specification for a built-in selection module.

隨著科技的進步,電子裝置的種類愈來愈多。電子裝置可透過一通訊介面與一主機裝置進行資料傳輸。在目前的許多通訊介面中,以通用串列匯流排(Universal Serial Bus;以下簡稱USB)介面最常使用。然而,習知的USB晶片係利用一輸出接腳組以及一輸入接腳組傳送及接收資料。 With the advancement of technology, there are more and more types of electronic devices. The electronic device can transmit data to and from a host device through a communication interface. In many of the current communication interfaces, the Universal Serial Bus (USB) interface is most commonly used. However, conventional USB chips utilize an output pin set and an input pin set to transmit and receive data.

為了提高USB晶片傳送及接收資料的彈性,本創作的目的在於提供一種USB晶片組,其可因應USB Type-C規格之連接器切換兩組輸出接腳與輸入接腳以傳送及接收資料。為達上述目的,本創作提供一種USB晶片組,耦接於一第一裝置與一第二裝置之間,並包括一資料處理單元以及一發送單元。資料處理單元根據第一裝置所提供一第一資訊,產生複數傳送資訊。發送單元將傳送資訊提供予第二裝置,並包括一轉換模組、一第一輸出驅動模組、一第二輸出驅動模組以及一發射端選擇模組。轉換模組並列地接收傳送資訊,並串列地輸出傳送資訊。 第一輸出驅動模組耦接一第一接腳組。第二輸出驅動模組耦接一第二接腳組。發射端選擇模組耦接於轉換模組與第一及第二輸出驅動模組之間。 In order to improve the flexibility of USB chip transfer and reception data, the purpose of this creation is to provide a USB chipset that can switch between two sets of output pins and input pins to transmit and receive data in response to the USB Type-C specification connector. To achieve the above objective, the present invention provides a USB chipset coupled between a first device and a second device, and includes a data processing unit and a transmitting unit. The data processing unit generates a plurality of transmission information according to the first information provided by the first device. The sending unit provides the transmission information to the second device, and includes a conversion module, a first output driving module, a second output driving module, and a transmitting end selection module. The conversion module receives the transmission information side by side and outputs the transmission information in series. The first output driving module is coupled to a first pin group. The second output driving module is coupled to a second pin group. The transmitting end selection module is coupled between the conversion module and the first and second output driving modules.

本創作另提供一種USB晶片組,包括一資料處理單元、一發送單元、一第一接腳組以及一第二接腳組。資料處理單元根據一第一裝置所提供一第一資訊,產生複數傳送資訊。發送單元處理傳送資訊,用以產生一輸出信號。第一及第二接腳組用以傳送輸出信號予一第二裝置。 The present invention further provides a USB chipset including a data processing unit, a transmitting unit, a first pin group and a second pin group. The data processing unit generates a plurality of transmission information according to a first information provided by the first device. The transmitting unit processes the transmitted information to generate an output signal. The first and second pin sets are used to transmit an output signal to a second device.

為讓本創作之特徵和優點能更明顯易懂,下文特舉出較佳實施例,並配合所附圖式,作詳細說明如下: In order to make the features and advantages of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:

100‧‧‧操作系統 100‧‧‧ operating system

110‧‧‧外部裝置 110‧‧‧External devices

120‧‧‧USB晶片組 120‧‧‧USB chipset

130‧‧‧主機裝置 130‧‧‧Host device

P1~P5‧‧‧接腳組 P 1 ~P 5 ‧‧‧ Pin set

121‧‧‧資料處理單元 121‧‧‧Data Processing Unit

124‧‧‧偵測單元 124‧‧‧Detection unit

SR‧‧‧處理信號 SR‧‧‧Processing signals

ST‧‧‧傳送資訊 ST‧‧‧Transfer information

SD‧‧‧偵測信號 S D ‧‧‧Detection signal

250、260‧‧‧預驅動模組 250, 260‧‧‧ pre-drive module

SE1~SE8‧‧‧增強信號 SE 1 ~SE 8 ‧‧‧Enhanced signal

SI‧‧‧輸入信號 SI‧‧‧ input signal

SD1、SD2‧‧‧差動信號 SD 1 , SD 2 ‧ ‧ differential signal

SS1、SS2‧‧‧設定值 SS 1 , SS 2 ‧‧‧ set value

342、345‧‧‧差動對 342, 345‧‧‧Differential pair

343、346‧‧‧電流模組 343, 346‧‧‧ Current Module

VOP1、VOP2‧‧‧操作電壓 V OP1 , V OP2 ‧‧‧ operating voltage

TXP1、TXN1、TXP2、TXN2、CC1、CC2、RXP1、RXN1、RXP2、RXN2‧‧‧接腳 TXP1, TXN1, TXP2, TXN2, CC1, CC2, RXP1, RXN1, RXP2, RXN2‧‧‧ pins

122、200A、200B、200C‧‧‧發送單元 122, 200A, 200B, 200C‧‧‧ sending unit

123、300A、300B、300C、300D、300E‧‧‧接收單元 123, 300A, 300B, 300C, 300D, 300E‧‧‧ receiving units

210A、210B、210C‧‧‧轉換模組 210A, 210B, 210C‧‧‧ conversion module

341、344‧‧‧電流轉換電壓模組 341, 344‧‧‧ Current conversion voltage module

220A、220B、220C‧‧‧發射端選擇模組 220A, 220B, 220C‧‧‧transmitter selection module

320A、320B、320C、320D、320E‧‧‧接收端選擇模組 320A, 320B, 320C, 320D, 320E‧‧‧ Receiver selection module

230A、240A、230B、240B、230C、240C‧‧‧輸出驅動模組 230A, 240A, 230B, 240B, 230C, 240C‧‧‧ Output Driver Module

311~314‧‧‧終端阻抗匹配模組 311~314‧‧‧Terminal impedance matching module

330A、330B、331C、332C、330D、330E‧‧‧位準調整模組 330A, 330B, 331C, 332C, 330D, 330E‧‧‧ level adjustment module

340A、340B、340C、331D、332D、340D、341E、342E‧‧‧可變增益調整模組 340A, 340B, 340C, 331D, 332D, 340D, 341E, 342E‧‧‧ Variable Gain Adjustment Module

331B、332B、331E、332E‧‧‧位準調整器 331B, 332B, 331E, 332E‧‧‧ level adjusters

348、349‧‧‧可變電阻單元 348, 349‧‧‧variable resistance unit

第1圖為本創作之操作系統的示意圖。 Figure 1 is a schematic diagram of the operating system of the author.

第2A~2C圖為本創作之發送單元之可能實施例。 2A~2C are diagrams of possible embodiments of the transmitting unit of the present invention.

第3A~3E圖為本創作之接收單元之可能實施例。 Figures 3A-3E are possible embodiments of the receiving unit of the present invention.

第1圖為本創作之操作系統的示意圖。如圖所示,操作系統100包括一外部裝置110、一USB晶片組120以及一主機裝置130。外部裝置110透過USB晶片組120接收來自主機裝置130的資訊或是提供資訊予主機裝置130。同樣地,主機裝置130也是透過USB晶片組120接收來自外部裝置110的資訊或是提供資訊予外部裝置110。在第1圖之實施例中,USB晶片組120係位於主機裝置130中,然不限於此。USB晶片組120亦可位於外部裝置110中(圖未示)。 Figure 1 is a schematic diagram of the operating system of the author. As shown, the operating system 100 includes an external device 110, a USB chipset 120, and a host device 130. The external device 110 receives information from the host device 130 or provides information to the host device 130 via the USB chipset 120. Similarly, the host device 130 also receives information from the external device 110 or provides information to the external device 110 via the USB chipset 120. In the embodiment of Fig. 1, the USB chip set 120 is located in the host device 130, but is not limited thereto. The USB chipset 120 can also be located in an external device 110 (not shown).

本創作並不限定USB晶片120的種類。在一可能實施例中,USB晶片組120係為一USB 3.0或是USB 3.1晶片組。如圖所示,晶片組120具有接腳組P1~P5,用以耦接外部裝置110。接腳組P1包括接腳TXP1與TXN1,用以傳送一輸出信號予外部裝置110。接腳組P2包括接腳TXP2與TXN2,用以傳送一輸出信號予外部裝置110。接腳組P3包括接腳CC1、CC2。接腳組P4包括接腳RXP1與RXN1,用以接收來自外部裝置110的一輸入信號。接腳組P5包括接腳RXP2與RXN2,用以接收來自外部裝置110的一輸入信號。 This creation does not limit the type of USB chip 120. In one possible embodiment, the USB chipset 120 is a USB 3.0 or USB 3.1 chipset. As shown, the chip set 120 has pin groups P 1 -P 5 for coupling to the external device 110. The pin group P 1 includes pins TXP1 and TXN1 for transmitting an output signal to the external device 110. The pin set P 2 includes pins TXP2 and TXN2 for transmitting an output signal to the external device 110. Pin set P 3 includes pins CC1, CC2. The pin set P 4 includes pins RXP1 and RXN1 for receiving an input signal from the external device 110. The pin set P 5 includes pins RXP2 and RXN2 for receiving an input signal from the external device 110.

在本實施例中,晶片組120包括一資料處理單元121、一發送單元122、一接收單元123以及一偵測單元124。資料處理單元121根據主機裝置130所提供的一資訊,產生複數傳送資訊ST。發送單元122轉換傳送資訊ST,用以產生一輸出信號,並透過接腳組P1或P2發送予外部裝置110。在一可能實施例中,發送單元122具有一解多工器(未顯示),用以透過接腳組P1或P2發送輸出信號予外部裝置110。 In this embodiment, the chipset 120 includes a data processing unit 121, a transmitting unit 122, a receiving unit 123, and a detecting unit 124. The data processing unit 121 generates a plurality of transmission information ST according to a piece of information provided by the host device 130. The transmitting unit 122 converts the transmission information ST for generating an output signal and transmits it to the external device 110 through the pin group P 1 or P 2 . In a possible embodiment, the transmitting unit 122 has a demultiplexer (not shown) for transmitting an output signal to the external device 110 through the pin group P 1 or P 2 .

接收單元123透過接腳組P4或P5接收外部裝置110所提供的一輸入信號,並處理該輸入信號,用以產生一處理信號SR。資料處理單元121根據處理信號SR,產生相對應的接收資訊予主機裝置130。在一可能實施例中,接收單元123具有一多工器(未顯示),用以接收來自接腳組P4或P5的輸入信號。 The receiving unit 123 receives an input signal provided by the external device 110 through the pin group P 4 or P 5 and processes the input signal to generate a processing signal SR. The data processing unit 121 generates corresponding reception information to the host device 130 based on the processing signal SR. In a possible embodiment, the receiving unit 123 has a multiplexer (not shown) for receiving input signals from the pin set P 4 or P 5 .

偵測單元124偵測接腳組P3的電壓位準,用以控制發送單元122的解多工器以及接收單元123的多工器。在本實施例中,發送單元122根據偵測單元124所產生的偵測信號SD,選 擇接腳組P1及P2之一者發送輸出信號。接收單元123根據偵測信號SD,選擇接腳組P4及P5之一者接收外部裝置110所提供的一輸入信號。 The detecting unit 124 detects the voltage level of the pin group P 3 for controlling the demultiplexer of the transmitting unit 122 and the multiplexer of the receiving unit 123. In the present embodiment, the transmission unit 122 according to the detection signal S D 124 produced by the detecting unit, selecting and pin set. 1 P 2 P sends one of the output signal. The receiving unit 123 selects one of the pin groups P 4 and P 5 to receive an input signal provided by the external device 110 according to the detection signal S D .

第2A圖為發送單元122的一可能實施例。在本實施例中,發送單元200A包括一轉換模組210A、一發射端選擇模組220A、輸出驅動模組(output driver)230A與240A。轉換模組210A並列地接收多筆傳送資訊ST,並差動方式串列地輸出傳送資訊ST。在一可能實施例中,轉換模組210A係為一並串列轉換器(serializer)。 FIG. 2A is a possible embodiment of the transmitting unit 122. In this embodiment, the sending unit 200A includes a conversion module 210A, a transmitter selection module 220A, and output driver modules 230A and 240A. The conversion module 210A receives the plurality of pieces of transmission information ST in parallel, and outputs the transmission information ST in a differential manner. In a possible embodiment, the conversion module 210A is a serializer.

發射端選擇模組220A根據偵測信號SD,將轉換模組210A的輸出提供予輸出驅動模組230A或240A。在一可能實施例中,發射端選擇模組220A係為一解多工器(demultiplexer),但並非用以限制本創作。在其它實施例中,發射端選擇模組220A係由電晶體或開關所構成。 The transmitting end selection module 220A provides the output of the conversion module 210A to the output driving module 230A or 240A according to the detection signal S D . In a possible embodiment, the transmitter selection module 220A is a demultiplexer, but is not intended to limit the creation. In other embodiments, the emitter selection module 220A is comprised of a transistor or a switch.

當發射端選擇模組220A將轉換模組210A的輸出提供予輸出驅動模組230A時,輸出驅動模組230A增加轉換模組210A的輸出資訊的驅動能力,用以產生一增強信號SE1,並透過接腳組P1輸出增強信號SE1。同樣地,當發射端選擇模組220A將轉換模組210A的輸出提供予輸出驅動模組240A時,輸出驅動模組240A增加轉換模組210A的輸出資訊的驅動能力,用以產生一增強信號SE2,並透過接腳組P2輸出增強信號SE2When the transmitting end selection module 220A provides the output of the conversion module 210A to the output driving module 230A, the output driving module 230A increases the driving capability of the output information of the conversion module 210A to generate an enhanced signal SE 1 , and enhanced signal SE 1 through the output pin group P 1. Similarly, when the transmitting terminal selection module 220A provides the output of the conversion module 210A to the output driving module 240A, the output driving module 240A increases the driving capability of the output information of the conversion module 210A to generate an enhanced signal SE. 2, and the enhanced signal SE 2 P 2 through the output pin set.

第2B圖係為本創作之發送單元的另一可能實施例。第2B圖相似第2A圖,不同之處在於第2B圖多了一預驅動模組(pre-driver)250B。預驅動模組250B耦接於發射端選擇模組 220B與轉換模組210B之間。預驅動模組250B增加轉換模組210B的輸出信號的驅動能力,用以產生一增強信號SE。在一可能實施例中,增強信號SE係為一差動信號。由於轉換模組210B的動作原理與轉換模組210A相似,故不再贅述。 Figure 2B is another possible embodiment of the transmitting unit of the present creation. Figure 2B is similar to Figure 2A, except that Figure 2B has a pre-driver 250B. The pre-drive module 250B is coupled to the transmitter selection module 220B is between the conversion module 210B. The pre-driver module 250B increases the driving capability of the output signal of the conversion module 210B to generate an enhanced signal SE. In a possible embodiment, the enhanced signal SE is a differential signal. Since the operation principle of the conversion module 210B is similar to that of the conversion module 210A, it will not be described again.

發射端選擇模組220B根據偵測信號SD,將增強信號SE提供予輸出驅動模組230B或240B。當發射端選擇模組220B將增強信號SE提供予輸出驅動模組230B時,輸出驅動模組230B再增加增強信號SE的驅動能力,用以產生一增強信號SE3,並透過接腳組P1輸出增強信號SE3。同樣地,當發射端選擇模組220B將增強信號SE提供予輸出驅動模組240B時,輸出驅動模組240B增加增強信號SE的驅動能力,用以產生一增強信號SE4,並透過接腳組P2輸出增強信號SE4The transmitting end selection module 220B provides the enhanced signal SE to the output driving module 230B or 240B according to the detection signal S D . When the transmitting end selection module 220B supplies the enhanced signal SE to the output driving module 230B, the output driving module 230B further increases the driving capability of the enhanced signal SE to generate an enhanced signal SE 3 and transmits the enhanced signal SE 3 through the pin group P 1 . The enhancement signal SE 3 is output. Similarly, when the transmitting end selection module 220B supplies the enhanced signal SE to the output driving module 240B, the output driving module 240B increases the driving capability of the enhanced signal SE to generate an enhanced signal SE 4 and transmits the enhanced signal SE 4 P 2 outputs an enhancement signal SE 4 .

第2C圖為本創作之發送單元的另一可能實施例。發射端選擇模組220C耦接於轉換模組210C與預驅動模組250與260之間。由於轉換模組210C的動作原理與轉換模組210A相似,故不再贅述。在本實施例中,發射端選擇模組220C根據偵測信號SD,將轉換模組210C的輸出提供予預驅動模組250或260。在一可能實施例中,發射端選擇模組220C係為一解多工器。 Figure 2C is another possible embodiment of the transmitting unit of the present invention. The transmitting end selection module 220C is coupled between the conversion module 210C and the pre-drive modules 250 and 260. Since the operation principle of the conversion module 210C is similar to that of the conversion module 210A, it will not be described again. In this embodiment, the transmitting end selection module 220C provides the output of the conversion module 210C to the pre-drive module 250 or 260 according to the detection signal S D . In a possible embodiment, the transmitter selection module 220C is a demultiplexer.

當預驅動模組250接收到轉換模組210C的輸出時,增加轉換模組210C的輸出信號的驅動能力,用以產生一增強信號SE5。輸出驅動模組230C再提升增強信號SE5的驅動能力,用以產生增強信號SE7,並透過接腳組P1提供增強信號SE7予外部裝置110。同樣地,當預驅動模組260接收到轉換模組210C的輸出時,增加轉換模組210C的輸出信號的驅動能力,用以產生一 增強信號SE6。輸出驅動模組240C再提升增強信號SE6的驅動能力,用以產生增強信號SE8,並透過接腳組P2提供增強信號SE8予外部裝置110。 When the pre-drive module 250 receives the output of the conversion module 210C, the driving capability of the output signal of the conversion module 210C is increased to generate an enhancement signal SE 5 . The output driving module 230C further boosts the driving capability of the enhanced signal SE 5 to generate the enhanced signal SE 7 and provides the enhanced signal SE 7 to the external device 110 through the pin group P 1 . Similarly, when the pre-drive module 260 receives the output of the conversion module 210C, the driving capability of the output signal of the conversion module 210C is increased to generate an enhancement signal SE 6 . The output driving module 240C further boosts the driving capability of the enhanced signal SE 6 to generate the enhanced signal SE 8 and provides the enhanced signal SE 8 to the external device 110 through the pin group P 2 .

第3A~3D圖為本創作之接收單元的可能實施例。在第3A圖中,接收單元300A包括,終端阻抗匹配模組311~314、一接收端選擇模組320A、一位準調整模組330A以及一可變增益調整模組(variable gain tuning module)340A。終端阻抗匹配模組311~314設置接收端選擇模組320A之前,並分別耦接接腳RXP1、RXN1、RXP2、RXN2,用以匹配接腳RXP1、RXN1、RXP2、RXN2的阻抗。 The 3A~3D diagram is a possible embodiment of the receiving unit of the present creation. In FIG. 3A, the receiving unit 300A includes a terminal impedance matching module 311-314, a receiving end selecting module 320A, a quasi-adjusting module 330A, and a variable gain tuning module 340A. . The terminal impedance matching modules 311-314 are disposed before the receiving end selection module 320A, and are respectively coupled to the pins RXP1, RXN1, RXP2, and RXN2 for matching the impedances of the pins RXP1, RXN1, RXP2, and RXN2.

接收端選擇模組320A根據偵測信號SD,將接腳組P4或P5上的信號作為一輸入信號SI傳送至位準調整模組330A。在一可能實施例中,接收端選擇模組320A係為一多工器,但並非用以限制本創作。在其它實施例中,接收端選擇模組320A係由電晶體所構成。 The receiving end selection module 320A transmits the signal on the pin group P 4 or P 5 as an input signal SI to the level adjusting module 330A according to the detecting signal S D . In a possible embodiment, the receiving end selection module 320A is a multiplexer, but is not intended to limit the creation. In other embodiments, the receiving end selection module 320A is comprised of a transistor.

位準調整模組330A用以調整輸入信號SI的共模(common mode)的電壓位準。在一可能實施例中,位準調整模組330A係為一高通濾波器(high pass filter)或是一位準轉換器(level shifter)。可變增益調整模組340A調整位準調整模組330A的輸出,用以產生處理信號SR予資料處理單元121。在一可能實施例中,處理信號SR係為一差動信號。在一可能實施例中,可變增益調整模組340A可為一等化器(equalizer)或是一可變增益放大器(variable gain amplifier),但並非用以限制本創作。 The level adjustment module 330A is configured to adjust the voltage level of the common mode of the input signal SI. In a possible embodiment, the level adjustment module 330A is a high pass filter or a level shifter. The variable gain adjustment module 340A adjusts the output of the level adjustment module 330A for generating the processing signal SR to the data processing unit 121. In a possible embodiment, the processed signal SR is a differential signal. In a possible embodiment, the variable gain adjustment module 340A can be an equalizer or a variable gain amplifier, but is not intended to limit the creation.

第3B圖為本創作之接收單元的另一可能實施例。 第3B圖相似第3A圖,不同之處在於第3B圖的接收端選擇模組320B係耦接於位準調整模組330B與可變增益調整模組340B之間。在本實施例中,位準調整模組330B具有位準調整器331B與332B。 Figure 3B is another possible embodiment of the receiving unit of the present invention. FIG. 3B is similar to FIG. 3A except that the receiving end selection module 320B of FIG. 3B is coupled between the level adjusting module 330B and the variable gain adjusting module 340B. In this embodiment, the level adjustment module 330B has level adjusters 331B and 332B.

位準調整器331B耦接接腳組P4,並調整接腳組P4上的信號的共模電壓位準,用以產生一差動信號SD1。位準調整器332B耦接接腳組P5,並調整接腳組P5上的信號的共模電壓位準,用以產生一差動信號SD2。接收端選擇模組320B根據偵測信號SD,將差動信號SD1或SD2提供予可變增益調整模組340B。在一可能實施例中,接收端選擇模組320B係為一多工器。可變增益調整模組340B調整接收端選擇模組320B的輸出,用以產生處理信號SR。 The level adjuster 331B is coupled to the pin group P 4 and adjusts the common mode voltage level of the signal on the pin group P 4 to generate a differential signal SD 1 . The level adjuster 332B is coupled to the pin group P 5 and adjusts the common mode voltage level of the signal on the pin group P 5 to generate a differential signal SD 2 . The receiving end selection module 320B provides the differential signal SD 1 or SD 2 to the variable gain adjustment module 340B according to the detection signal S D . In a possible embodiment, the receiving end selection module 320B is a multiplexer. The variable gain adjustment module 340B adjusts the output of the receiver selection module 320B to generate a processing signal SR.

在第3C圖中,接收單元300C包括複數終端阻抗匹配模組311~314、位準調整模組331C、332C、一接收端選擇模組320C以及一可變增益調整模組340C。位準調整模組331C耦接接腳組P4,並根據一設定值SS1調整接腳組P4上的信號的共模電壓位準,用以產生一差動信號SD1。位準調整模組332C耦接接腳組P5,並根據一設定值SS2調整接腳組P5上的信號的共模電壓位準,用以產生一差動信號SD2。在一可能實施例中,位準調整模組331C與332C係將設定值SS1與SS2作為差動信號SD1與SD2的共模電壓。 In FIG. 3C, the receiving unit 300C includes a plurality of terminal impedance matching modules 311 to 314, level adjusting modules 331C and 332C, a receiving end selecting module 320C, and a variable gain adjusting module 340C. The level adjustment module 331C is coupled to the pin group P 4 and adjusts the common mode voltage level of the signal on the pin group P 4 according to a set value SS 1 to generate a differential signal SD 1 . The level adjustment module 332C is coupled to the pin group P 5 and adjusts the common mode voltage level of the signal on the pin group P 5 according to a set value SS 2 to generate a differential signal SD 2 . In one possible embodiment, the level adjustment modules 331C and 332C use the set values SS 1 and SS 2 as the common mode voltages of the differential signals SD 1 and SD 2 .

可變增益調整模組340C調整位準調整模組331C或332C的輸出,用以產生處理信號SR。在一可能實例中,可變增益調整模組340C根據差動信號SD1與SD2的共模電壓的位準, 決定是否調整差動信號SD1與SD2。以差動信號SD1為例,當差動信號SD1的共模電壓的位準等於一預設值時,可變增益調整模組340C不調整差動信號SD1。相反地,當差動信號SD1的共模電壓的位準不等於預設值時,可變增益調整模組340C調整差動信號SD1The variable gain adjustment module 340C adjusts the output of the level adjustment module 331C or 332C for generating the processing signal SR. In one possible example, the variable gain adjustment module 340C according to the level of the common mode voltage differential signal SD SD 1 and 2, the decision whether to adjust the differential signal SD 1 and SD 2. Taking the differential signal SD 1 as an example, when the level of the common mode voltage of the differential signal SD 1 is equal to a predetermined value, the variable gain adjustment module 340C does not adjust the differential signal SD 1 . Conversely, when the level of the common mode voltage of the differential signal SD 1 is not equal to the preset value, the variable gain adjustment module 340C adjusts the differential signal SD 1 .

在本實施例中,可變增益調整模組340C包括電流轉換電壓模組341、344、差動對342、345、可變電阻單元348、349以及電流模組343、346,但並非用以限制本創作。如圖所示,電流轉換電壓模組341、差動對342與電流模組343串聯於操作電壓VOP1與VOP2之間。電流模組343用以提供至少二固定的電流。差動對342根據電流模組343所產生的電流處理差動信號SD1,用以產生一差動電流輸出。電流轉換電壓模組341根據差動對342所產生的差動電流輸出,產生一第一差動電壓,用以作為處理信號SR。可變電阻單元348耦接於差動對342與電流模組343之間,其會隨著差動對342之輸出端信號之頻率而改變其阻值。在一實施例中,電流模組343包括兩組電流源。每一電流源的一端耦接差動對342,另一端接收操作電壓VOP2。在一可能實施例中,操作電壓VOP2係為一接地電壓。 In this embodiment, the variable gain adjustment module 340C includes current conversion voltage modules 341, 344, differential pairs 342, 345, variable resistance units 348, 349, and current modules 343, 346, but is not intended to be limiting. This creation. As shown, the current conversion voltage module 341, the differential pair 342, and the current module 343 are connected in series between the operating voltages V OP1 and V OP2 . The current module 343 is configured to provide at least two fixed currents. The differential pair 342 processes the differential signal SD 1 according to the current generated by the current module 343 for generating a differential current output. The current conversion voltage module 341 generates a first differential voltage as the processing signal SR according to the differential current output generated by the differential pair 342. The variable resistance unit 348 is coupled between the differential pair 342 and the current module 343, and changes its resistance value according to the frequency of the output signal of the differential pair 342. In one embodiment, current module 343 includes two sets of current sources. One end of each current source is coupled to the differential pair 342, and the other end receives the operating voltage V OP2 . In a possible embodiment, the operating voltage V OP2 is a ground voltage.

同樣地,電流轉換電壓模組344、差動對345與電流模組346串聯於操作電壓VOP1與VOP2之間。電流模組346用以提供至少二固定的電流。差動對345根據電流模組346所產生的電流,處理差動信號SD2,用以產生一差動電流輸出。電流轉換電壓模組344根據差動對345所產生的差動電流輸出,產生一第二差動電壓,用以作為處理信號SR。可變電阻單元349耦接 於差動對345與電流模組346之間,其會隨著差動對345之輸出端信號之頻率而改變其阻值。可變電阻單元348、349可以其它主動元件或是被動元件來實現之。在一實施例中,電流模組346包括兩組電流源。每一電流源的一端耦接差動對345,另一端接收操作電壓VOP2。在一可能實施例中,操作電壓VOP2係為一接地電壓。 Similarly, the current conversion voltage module 344, the differential pair 345, and the current module 346 are connected in series between the operating voltages V OP1 and V OP2 . The current module 346 is configured to provide at least two fixed currents. The differential pair 345 processes the differential signal SD 2 according to the current generated by the current module 346 for generating a differential current output. The current conversion voltage module 344 generates a second differential voltage as the processing signal SR according to the differential current output generated by the differential pair 345. The variable resistance unit 349 is coupled between the differential pair 345 and the current module 346, and changes its resistance value according to the frequency of the output signal of the differential pair 345. The variable resistance units 348, 349 can be implemented by other active components or passive components. In an embodiment, the current module 346 includes two sets of current sources. One end of each current source is coupled to the differential pair 345, and the other end receives the operating voltage V OP2 . In a possible embodiment, the operating voltage V OP2 is a ground voltage.

接收端選擇模組320C根據偵測信號SD,提供設定值SS1及SS2予位準調整模組331C及332C,用以間接地不啟動差動對342或345。在本實施例中,接收端選擇模組320C根據偵測信號SD,將電壓V1與V2之一者作為設定值SS1,並且將電壓V1及V2之另一者作為設定值SS2。在一可能實施例中,接收端選擇模組320C係為一多工器。 The receiving end selection module 320C provides the set values SS 1 and SS 2 to the level adjusting modules 331C and 332C according to the detecting signal S D for indirectly not starting the differential pair 342 or 345. In the present embodiment, the receiving end selection module 320C uses one of the voltages V1 and V2 as the set value SS 1 and the other of the voltages V1 and V2 as the set value SS 2 according to the detection signal S D . In a possible embodiment, the receiving end selection module 320C is a multiplexer.

在第3D圖中,接收端選擇模組320D係設置在可變增益調整模組340D之中。由於第3D圖中的位準轉換模組330D的特性與第3B圖中的位準轉換模組330B相似,故不再贅述。 In the 3D diagram, the receiving end selection module 320D is disposed in the variable gain adjustment module 340D. Since the characteristics of the level conversion module 330D in the 3D drawing are similar to those of the level conversion module 330B in FIG. 3B, they will not be described again.

在本實施例中,可變增益調整模組340D包括電流轉換電壓模組341、344、差動對342、345、可變電阻單元348、349、電流模組343及346以及一接收端選擇模組320D。電流轉換電壓模組341、接收端選擇模組320D、差動對342與電流模組343串聯於操作電壓VOP1與VOP2之間,用以對差動信號SD1進行增益變化。差動對342處理差動信號SD1。電流模組343耦接於差動對342與操作電壓VOP2之間。電流轉換電壓模組341耦接於操作電壓VOP1與選擇模組320D之間。 In this embodiment, the variable gain adjustment module 340D includes current conversion voltage modules 341, 344, differential pairs 342, 345, variable resistance units 348, 349, current modules 343 and 346, and a receiving end selection mode. Group 320D. The current conversion voltage module 341, the receiving end selection module 320D, the differential pair 342 and the current module 343 are connected in series between the operating voltages V OP1 and V OP2 for performing gain variation on the differential signal SD 1 . The differential pair 342 processes the differential signal SD 1 . The current module 343 is coupled between the differential pair 342 and the operating voltage V OP2 . The current conversion voltage module 341 is coupled between the operating voltage V OP1 and the selection module 320D.

接收端選擇模組320D根據偵測信號SD,導通電流 轉換電壓模組341與差動對342之間的路徑或是導通電流轉換電壓模組344與差動對345之間的路徑。當電流轉換電壓模組341與差動對342之間的路徑導通時,電流轉換電壓模組341將差動對342的輸出信號由電流格式轉換成電壓格式,用以產生處理信號SR。可變電阻單元348耦接於差動對342與電流模組343之間,其會隨著差動對342之輸出端信號之頻率而改變本身的阻值。在一實施例中,電流模組343包括兩組電流源。每一電流源的一端耦接差動對342,另一端接收操作電壓VOP2。在一可能實施例中,操作電壓VOP2係為一接地電壓。同樣地,電流轉換電壓模組344、接收端選擇模組320D、差動對345與電流模組346串聯於操作電壓VOP1與VOP2之間,用以對差動信號SD2進行增益變化。差動對345處理差動信號SD2。電流模組346耦接於差動對345與操作電壓VOP2之間。電流轉換電壓模組344耦接於操作電壓VOP1與接收端選擇模組320D之間。當電流轉換電壓模組344與差動對345之間的路徑導通時,電流轉換電壓模組344將差動對345的輸出信號由電流格式轉換成電壓格式,用以產生處理信號SR。可變電阻單元349耦接於差動對345與電流模組346之間,其會隨著差動對345之輸出端信號之頻率而改變本身的阻值。可變電阻單元348、349可以主動元件或是被動元件來實現之。在一實施例中,電流模組346包括兩組電流源。每一電流源的一端耦接差動對345,另一端接收操作電壓VOP2。在一可能實施例中,操作電壓VOP2係為一接地電壓。 The receiving end selection module 320D turns on the path between the current conversion voltage module 341 and the differential pair 342 or turns on the path between the current conversion voltage module 344 and the differential pair 345 according to the detection signal S D . When the path between the current conversion voltage module 341 and the differential pair 342 is turned on, the current conversion voltage module 341 converts the output signal of the differential pair 342 into a voltage format from the current format for generating the processing signal SR. The variable resistance unit 348 is coupled between the differential pair 342 and the current module 343, and changes its resistance value according to the frequency of the output signal of the differential pair 342. In one embodiment, current module 343 includes two sets of current sources. One end of each current source is coupled to the differential pair 342, and the other end receives the operating voltage V OP2 . In a possible embodiment, the operating voltage V OP2 is a ground voltage. Similarly, the current conversion voltage module 344, the receiving end selection module 320D, the differential pair 345 and the current module 346 are connected in series between the operating voltages V OP1 and V OP2 for performing gain variation on the differential signal SD 2 . The differential pair 345 processes the differential signal SD 2 . The current module 346 is coupled between the differential pair 345 and the operating voltage V OP2 . The current conversion voltage module 344 is coupled between the operating voltage V OP1 and the receiving end selection module 320D. When the path between the current conversion voltage module 344 and the differential pair 345 is turned on, the current conversion voltage module 344 converts the output signal of the differential pair 345 into a voltage format from the current format for generating the processing signal SR. The variable resistance unit 349 is coupled between the differential pair 345 and the current module 346, which changes its resistance value with the frequency of the output signal of the differential pair 345. The variable resistance units 348, 349 can be implemented by active or passive components. In an embodiment, the current module 346 includes two sets of current sources. One end of each current source is coupled to the differential pair 345, and the other end receives the operating voltage V OP2 . In a possible embodiment, the operating voltage V OP2 is a ground voltage.

在本實施例中,接收端選擇模組320D用以導通電流轉換電壓模組341與差動對342之間的路徑或是電流轉換電 壓模組344與差動對345之間的路徑,但並非用以限制本創作。在其它實施例中,接收端選擇模組320D用以導通差動對342與電流模組343之間的路徑或是差動對345與電流模組346之間的路徑。在其它實施例中,接收端選擇模組320D用以導通電流轉換電壓模組341與操作電壓VOP1之間的路徑或是電流轉換電壓模組344與操作電壓VOP1之間的路徑。在其它實施例中,接收端選擇模組320D用以導通電流模組343與操作電壓VOP2之間的路徑或是導通電流模組346與操作電壓VOP2之間的路徑。 In this embodiment, the receiving end selection module 320D is used to turn on the path between the current conversion voltage module 341 and the differential pair 342 or the path between the current conversion voltage module 344 and the differential pair 345, but not Used to limit this creation. In other embodiments, the receiving end selection module 320D is used to turn on the path between the differential pair 342 and the current module 343 or the path between the differential pair 345 and the current module 346. In other embodiments, the receiving end selection module 320D is configured to turn on a path between the current conversion voltage module 341 and the operating voltage V OP1 or a path between the current converting voltage module 344 and the operating voltage V OP1 . In other embodiments, the receiving end selection module 320D is configured to turn on a path between the current module 343 and the operating voltage V OP2 or a path between the current module 346 and the operating voltage V OP2 .

第3E圖係為本創作之接收單元的另一可能實施例。在本實施例中,接收端選擇模組320E係設置在可變增益放大模組341E、342E與資料處理單元121之間。如圖所示,位準轉換模組330E具有位準轉換器331E與332E,分別對接腳組P4與P5上的信號的共模電壓的位準進行調整,並將調整後的差動信號分別提供予可變增益調整模組341E、342E。 Figure 3E is another possible embodiment of the receiving unit of the present creation. In the embodiment, the receiving end selection module 320E is disposed between the variable gain amplifying modules 341E and 342E and the data processing unit 121. As shown, the level conversion module 330E has level converters 331E and 332E for adjusting the level of the common mode voltage of the signals on the pin groups P 4 and P 5 , respectively, and adjusting the adjusted differential signals. The variable gain adjustment modules 341E and 342E are provided separately.

可變增益調整模組341E與342E分別對位準轉換器331E與332E的輸出信號進行增益變化調整。接收端選擇模組320E根據偵測信號SD將可變增益調整模組341E或342E的輸出信號作為處理信號SR。在一可能實施例中,接收端選擇模組320E係為一多工器。 The variable gain adjustment modules 341E and 342E perform gain change adjustment on the output signals of the level shifters 331E and 332E, respectively. The receiving end selection module 320E uses the output signal of the variable gain adjustment module 341E or 342E as the processing signal SR according to the detection signal S D . In a possible embodiment, the receiving end selection module 320E is a multiplexer.

除非另作定義,在此所有詞彙(包含技術與科學詞彙)均屬本創作所屬技術領域中具有通常知識者之一般理解。此外,除非明白表示,詞彙於一般字典中之定義應解釋為與其相關技術領域之文章中意義一致,而不應解釋為理想狀態或過分正式之語態。 Unless otherwise defined, all terms (including technical and scientific terms) are used in the ordinary language of the art to which this invention belongs. Moreover, unless expressly stated, the definition of a vocabulary in a general dictionary should be interpreted as consistent with the meaning of an article in its related art, and should not be interpreted as an ideal state or an overly formal voice.

雖然本創作已以較佳實施例揭露如上,然其並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作些許之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

100‧‧‧操作系統 100‧‧‧ operating system

110‧‧‧外部裝置 110‧‧‧External devices

120‧‧‧USB晶片組 120‧‧‧USB chipset

130‧‧‧主機裝置 130‧‧‧Host device

P1~P5‧‧‧接腳組 P 1 ~P 5 ‧‧‧ Pin set

121‧‧‧資料處理單元 121‧‧‧Data Processing Unit

122‧‧‧發送單元 122‧‧‧Send unit

123‧‧‧接收單元 123‧‧‧ Receiving unit

124‧‧‧偵測單元 124‧‧‧Detection unit

SR‧‧‧處理信號 SR‧‧‧Processing signals

ST‧‧‧傳送資訊 ST‧‧‧Transfer information

SD‧‧‧偵測信號 S D ‧‧‧Detection signal

TXP1、TXN1、TXP2、TXN2、CC1、CC2、RXP1、RXN1、RXP2、RXN2‧‧‧接腳 TXP1, TXN1, TXP2, TXN2, CC1, CC2, RXP1, RXN1, RXP2, RXN2‧‧‧ pins

Claims (20)

一種USB晶片組,耦接於一第一裝置與一第二裝置之間,並包括:一資料處理單元,耦接該第一裝置,並根據該第一裝置所提供一第一資訊,產生複數傳送資訊;一發送單元,耦接該資料處理單元,用以將該傳送資訊提供予該第二裝置,並包括:一轉換模組,耦接該資料處理單元,用以並列地接收該等傳送資訊,並串列地輸出該等傳送資訊;一第一輸出驅動模組,耦接一第一接腳組;一第二輸出驅動模組,耦接一第二接腳組;以及一發射端選擇模組,耦接於該轉換模組與該第一及第二輸出驅動模組之間。 A USB chipset is coupled between a first device and a second device, and includes: a data processing unit coupled to the first device, and generating a plurality of first information according to the first device Transmitting information; a transmitting unit coupled to the data processing unit for providing the transmission information to the second device, and comprising: a conversion module coupled to the data processing unit for receiving the transmissions in parallel Information, and outputting the transmission information in series; a first output driving module coupled to a first pin group; a second output driving module coupled to a second pin group; and a transmitting end The selection module is coupled between the conversion module and the first and second output driving modules. 如申請專利範圍第1項所述之USB晶片組,更包括一預驅動模組,耦接於該轉換模組與該發射端選擇模組之間,並增加該轉換模組的輸出信號,用以產生一增強信號,該發射端選擇模組將該增強信號提供予該第一或第二輸出驅動模組。 The USB chipset of claim 1 further includes a pre-driver module coupled between the conversion module and the transmitter selection module, and adding an output signal of the conversion module. To generate an enhanced signal, the transmitting end selection module provides the enhanced signal to the first or second output driving module. 如申請專利範圍第1項所述之USB晶片組,更包括:一第一預驅動模組,耦接於該發射端選擇模組與該第一輸出驅動模組之間;以及一第二預驅動模組,耦接於該發射端選擇模組與該第二輸出驅動模組之間,該發射端選擇模組將該轉換模組的輸出信號提供予該第一或第二預驅動模組。 The USB chipset of claim 1, further comprising: a first pre-drive module coupled between the transmitter selection module and the first output driver module; and a second pre- The driving module is coupled between the transmitting end selection module and the second output driving module, and the transmitting end selecting module provides the output signal of the conversion module to the first or second pre-driving module . 如申請專利範圍第1項所述之USB晶片組,其中該發射端選擇模組係為一解多工器。 The USB chipset of claim 1, wherein the transmitter selection module is a demultiplexer. 如申請專利範圍第1項所述之USB晶片組,更包括一偵測單元,根據一第三接腳組的電壓位準,產生一偵測信號,該發射端選擇模組根據該偵測信號,選擇性地傳送信號予該第一或第二輸出驅動模組。 The USB chipset of claim 1 further includes a detecting unit that generates a detection signal according to a voltage level of the third pin group, and the transmitting terminal selecting module is configured according to the detecting signal. And selectively transmitting a signal to the first or second output driving module. 如申請專利範圍第1項所述之USB晶片組,更包括一偵測單元,根據一第三接腳組的電壓位準,產生一偵測信號。 The USB chipset as described in claim 1 further includes a detecting unit that generates a detection signal according to a voltage level of a third pin group. 如申請專利範圍第6項所述之USB晶片組,更包括:一接收單元,包括:一接收端選擇模組,耦接於一第四接腳組以及一第五接腳組,用以根據該偵測信號選擇性地輸出該第四或第五接腳組上的信號;以及一位準調整模組,用以調整該接收端選擇模組的輸出信號的共模電壓位準。 The USB chipset of claim 6, further comprising: a receiving unit, comprising: a receiving end selection module coupled to a fourth pin group and a fifth pin group for The detection signal selectively outputs a signal on the fourth or fifth pin group; and a quasi-adjustment module is configured to adjust a common mode voltage level of an output signal of the receiving end selection module. 如申請專利範圍第7項所述之USB晶片組,其中該位準調整模組係為一高通濾波器。 The USB chipset of claim 7, wherein the level adjustment module is a high pass filter. 如申請專利範圍第6項所述之USB晶片組,更包括:一接收單元,包括:一位準調整模組,耦接一第四接腳組以及一第五接腳組,並調整該第四及第五接腳組上的信號的共模電壓位準,用以產生一第一差動信號以及一第二差動信號;以及一接收端選擇模組,根據該偵測信號選擇性地將該第一或第二差動信號提供予一可變增益調整模組。 The USB chipset of claim 6, further comprising: a receiving unit, comprising: a quasi-adjusting module coupled to a fourth pin group and a fifth pin group, and adjusting the a common mode voltage level of the signals on the fourth and fifth pin groups for generating a first differential signal and a second differential signal; and a receiving end selection module for selectively selecting according to the detection signal The first or second differential signal is provided to a variable gain adjustment module. 如申請專利範圍第6項所述之USB晶片組,更包括:一接收單元,包括:一第一位準調整模組,耦接一第四接腳組,並根據一第一設定值調整該第四接腳組上的信號的共模電壓位準,用以產生一第一差動信號;一第二位準調整模組,耦接一第五接腳組,並根據一第二設定值調整該第五接腳組上的信號的共模電壓位準,用以產生一第二差動信號;以及一接收端選擇模組,耦接該第一及第二位準調整模組,用以根據該偵測信號提供該第一及第二設定值予該第一及第二位準調整模組。 The USB chipset of claim 6, further comprising: a receiving unit, comprising: a first level adjusting module coupled to a fourth pin set, and adjusting the first set value according to a first set value The common mode voltage level of the signal on the fourth pin group is used to generate a first differential signal; a second level adjustment module is coupled to a fifth pin group, and according to a second set value Adjusting a common mode voltage level of the signal on the fifth pin group to generate a second differential signal; and a receiving end selection module coupled to the first and second level adjustment modules, And providing the first and second set values to the first and second level adjustment modules according to the detection signal. 如申請專利範圍第10項所述之USB晶片組,更包括:一可變增益調整模組,耦接該第一及第二位準調整模組,當該第一差動信號的共模電壓位準等於一預設值時,該可變增益調整模組不調整該第一差動信號,當該第一差動信號的共模電壓位準不等於該預設值時,該可變增益調整模組調整該第一差動信號。 The USB chipset of claim 10, further comprising: a variable gain adjustment module coupled to the first and second level adjustment modules, when the common differential voltage of the first differential signal When the level is equal to a preset value, the variable gain adjustment module does not adjust the first differential signal, and when the common mode voltage level of the first differential signal is not equal to the preset value, the variable gain The adjustment module adjusts the first differential signal. 如申請專利範圍第6項所述之USB晶片組,更包括:一接收單元,包括:一位準調整模組,耦接一第四接腳組以及一第五接腳組,並調整該第四及第五接腳組上的信號的共模電壓位準,用以產生一第一差動信號以及一第二差動信號;以及一可變增益調整模組,選擇性地調整該第一或第二差動信號。 The USB chipset of claim 6, further comprising: a receiving unit, comprising: a quasi-adjusting module coupled to a fourth pin group and a fifth pin group, and adjusting the a common mode voltage level of the signals on the fourth and fifth pin groups for generating a first differential signal and a second differential signal; and a variable gain adjustment module for selectively adjusting the first Or a second differential signal. 如申請專利範圍第12項所述之USB晶片組,其中該可變增益調整模組包括:一第一差動對,耦接該位準調整模組,用以接收並處理該第一差動信號,並產生一第一輸出信號組;一第一電流模組,耦接於該第一差動對與一第一操作電壓之間;一第一可變電阻單元,耦接該第一差動對以及該第一電流模組;一第一電流轉換電壓模組,耦接於一第二操作電壓與一接收端選擇模組之間,並轉換該第一輸出信號組,用以產生一第一處理信號;一第二差動對,耦接該位準調整模組,用以接收該第二差動信號,並產生一第二輸出信號組;一第二電流模組,耦接於該第二差動對與該第一操作電壓之間;一第二可變電阻單元,耦接該第二差動對以及該第二電流模組;以及一第二電流轉換電壓模組,耦接於該第二操作電壓與該接收端選擇模組之間,並轉換該第二輸出信號組,用以產生一第二處理信號;其中,該接收端選擇模組,用以根據該偵測信號選擇性地讓該第一電流轉換電壓模組轉換該第一輸出信號組或是讓該第二電流轉換電壓模組轉換該第二輸出信號組。 The USB chipset of claim 12, wherein the variable gain adjustment module comprises: a first differential pair coupled to the level adjustment module for receiving and processing the first differential And generating a first output signal group; a first current module coupled between the first differential pair and a first operating voltage; a first variable resistance unit coupled to the first difference And the first current conversion voltage module is coupled between a second operating voltage and a receiving end selection module, and converts the first output signal group to generate a a first processing signal; a second differential pair coupled to the level adjustment module for receiving the second differential signal and generating a second output signal group; a second current module coupled to Between the second differential pair and the first operating voltage; a second variable resistor unit coupled to the second differential pair and the second current module; and a second current converting voltage module coupled Connected between the second operating voltage and the receiving terminal selection module, and converts the second output signal The receiving end selection module is configured to selectively cause the first current conversion voltage module to convert the first output signal group according to the detection signal or to enable the first The two current conversion voltage modules convert the second output signal group. 如申請專利範圍第13項所述之USB晶片組,其中該資料處理 單元根據該第一或第二處理信號產生一接收資訊予該第二裝置。 Such as the USB chipset described in claim 13 of the patent scope, wherein the data processing The unit generates a receiving information to the second device according to the first or second processing signal. 如申請專利範圍第6項所述之USB晶片組,更包括:一接收單元,包括:一位準調整模組,耦接一第四接腳組以及一第五接腳組,並調整該第四及第五接腳組上的信號的共模電壓位準,用以產生一第一差動信號以及一第二差動信號;複數可變增益調整模組,調整該第一及第二差動信號,用以產生一第一處理信號以及一第二處理信號;以及一接收端選擇模組,根據該偵測信號選擇性地傳送該第一或第二處理信號予該資料處理單元。 The USB chipset of claim 6, further comprising: a receiving unit, comprising: a quasi-adjusting module coupled to a fourth pin group and a fifth pin group, and adjusting the The common mode voltage level of the signals on the fourth and fifth pin groups is used to generate a first differential signal and a second differential signal; the complex variable gain adjustment module adjusts the first and second differences The motion signal is used to generate a first processing signal and a second processing signal; and a receiving end selection module is configured to selectively transmit the first or second processing signal to the data processing unit according to the detection signal. 如申請專利範圍第15項所述之USB晶片組,其中該資料處理單元根據該第一或第二處理信號產生一接收資訊予該第二裝置。 The USB chipset of claim 15, wherein the data processing unit generates a receiving information to the second device based on the first or second processing signal. 一種USB晶片組,包括:一資料處理單元,根據一第一裝置所提供一第一資訊,產生複數傳送資訊;一發送單元,處理該等傳送資訊,用以產生一輸出信號;一第一接腳組,用以傳送該輸出信號予一第二裝置;以及一第二接腳組,用以傳送該輸出信號予該第二裝置。 A USB chipset, comprising: a data processing unit, generating a plurality of transmission information according to a first information provided by a first device; and a transmitting unit processing the transmission information for generating an output signal; a set of feet for transmitting the output signal to a second device; and a second set of pins for transmitting the output signal to the second device. 如申請專利範圍第17項所述之USB晶片組,更包括:一第三接腳組,耦接該第二裝置;以及一偵測單元,偵測該第三接腳組的電壓位準,用以產生一偵測信號,其中該發送單元根據該偵測信號並透過該第一 或第二接腳組發送該輸出信號。 The USB chipset of claim 17, further comprising: a third pin set coupled to the second device; and a detecting unit for detecting a voltage level of the third pin set, For generating a detection signal, wherein the transmitting unit transmits the first signal according to the detection signal Or the second pin group sends the output signal. 如申請專利範圍第18項所述之USB晶片組,更包括:一第四接腳組,耦接該第二裝置,用以接收一第一輸入信號;一第五接腳組,耦接該第二裝置,用以接收一第二輸入信號;以及一接收單元,根據該偵測信號,處理該第一或第二輸入信號,並將處理結果提供予該資料處理單元。 The USB chipset of claim 18, further comprising: a fourth pin set coupled to the second device for receiving a first input signal; a fifth pin set coupled to the a second device for receiving a second input signal; and a receiving unit that processes the first or second input signal according to the detection signal and provides the processing result to the data processing unit. 如申請專利範圍第19項所述之USB晶片組,其中該發送單元具有一解多工器,該接收單元具有一多工器。 The USB chip set of claim 19, wherein the transmitting unit has a demultiplexer, the receiving unit having a multiplexer.
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Publication number Priority date Publication date Assignee Title
TWI639922B (en) * 2016-09-08 2018-11-01 鈺群科技股份有限公司 Usb type-c connecting module

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* Cited by examiner, † Cited by third party
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TWI648636B (en) * 2016-11-28 2019-01-21 鈺群科技股份有限公司 Universal serial bus type c transmission line and transmission device
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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100423898B1 (en) * 2001-06-16 2004-03-22 삼성전자주식회사 Universal serial bus low speed transceiver with improved corssover performance
JP3609051B2 (en) * 2001-11-21 2005-01-12 Necエレクトロニクス株式会社 USB-HUB device and control method thereof
US20080065927A1 (en) * 2006-09-11 2008-03-13 Jin-Xiao Wu Circuit for controlling operations of universal serial bus (usb) device
US20120290761A1 (en) * 2011-05-10 2012-11-15 Jui-Yen Chen USB Converter and Related Method
US9195291B2 (en) * 2013-06-21 2015-11-24 Apple Inc. Digital power estimator to control processor power consumption

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639922B (en) * 2016-09-08 2018-11-01 鈺群科技股份有限公司 Usb type-c connecting module

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